CN105974622A - Liquid crystal display module and manufacturing method thereof and electronic device - Google Patents

Liquid crystal display module and manufacturing method thereof and electronic device Download PDF

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Publication number
CN105974622A
CN105974622A CN201610556232.4A CN201610556232A CN105974622A CN 105974622 A CN105974622 A CN 105974622A CN 201610556232 A CN201610556232 A CN 201610556232A CN 105974622 A CN105974622 A CN 105974622A
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CN
China
Prior art keywords
pad
electrically connected
module
liquid crystal
crystal display
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610556232.4A
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Chinese (zh)
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CN105974622B (en
Inventor
左清成
袁小玲
陈娟
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to CN201610556232.4A priority Critical patent/CN105974622B/en
Publication of CN105974622A publication Critical patent/CN105974622A/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306Details
    • G02F1/1309Repairing; Testing
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306Circuit arrangements or driving methods for the control of single liquid crystal cells

Abstract

The invention provides a liquid crystal display module and a manufacturing method thereof. The liquid crystal display module comprises a display driving chip, a flexible printed circuit (FPC) and backlight module. The FPC is provided with a first bonding pad and a second bonding pad. The display driving chip is electrically connected with the first bonding pad through a safety resistance wire, the first bonding pad is electrically connected with the second bonding pad, and the backlight module is electrically connected with the second bonding pad. The invention further provides an electronic device adopting the liquid crystal display module. A bonding pad on the FPC is divided into the first bonding pad and the second bonding pad which are independent to each other. The first bonding pad is connected with the display driving chip through the safety resistance wire, and the display driving chip is tested through the first bonding pad; after the end of the test, the first bonding pad is electrically connected with the second bonding pad, the backlight module is electrically connected with the second bonding pad, so that after the backlight module is powered on, backlight driving voltage fuses the safety resistance wire, mobile phone interference signals in the working process of the display module are prevented from entering the display driving chip, and the display quality is improved.

Description

Liquid crystal display module and manufacture method, electronic installation
Technical field
The present invention relates to technical field of liquid crystal display, a kind of liquid crystal display with flexible printed circuit board Module and manufacture method, electronic installation.
Background technology
FPC (Flexible Printed Circuit board, flexible printed circuit board) is electronic devices and components electrical connections Carrier.In almost all of electronic installation, the electrical connection of the electronic devices and components such as integrated circuit is required for making Use FPC.
Its display effect, electrical property must be tested before shipment by liquid crystal display module.Typically require By in module liquid crystal display drive chip (Liquid Crystal Display Driver Integrated Circuit, Hereinafter referred to as display driver chip) it is connected by wire with the test point on FPC, then by test point with outside Test circuit communication is tested.These test points are still retained in FPC surface after test completes.Work as FPC On when having interference signal, interference signal can enter in display driver chip via test point, therefore can be to liquid crystal The display of display module interferes, and affects display quality.
Summary of the invention
It is an object of the invention to provide a kind of liquid crystal display module and manufacture method, this liquid crystal display module External interference signals can be avoided to enter display driver chip, promote the display effect of liquid crystal display module.
Another object of the present invention is to provide a kind of electronic installation using above-mentioned liquid crystal display module.
To achieve these goals, the following technical scheme of embodiment of the present invention offer:
The present invention provides a kind of liquid crystal display module, including display driver chip, FPC and backlight module, institute Stating and be provided with the first pad and the second pad on FPC, described display driver chip is electrically connected by insurance resistance wire It is connected to described first pad, described first pad and described second pad be electrically connected with, described backlight module electricity It is connected to described second pad.
Wherein, described first pad is arranged side by side with described second pad, described first pad and described second Being electrically connected with by scolding tin between pad, described second pad is electrically connected to described backlight through described first pad Module.
Wherein, described first pad includes that at least two the first golden finger, described second pad include at least two Individual second golden finger, described first golden finger and described second golden finger are one-to-one relationship, each described Second golden finger is connected to described first golden finger by scolding tin.
Wherein, described backlight module includes multiple pin, described pin and described first golden finger one_to_one corresponding, The most described pin, described first golden finger and described second golden finger are sequentially connected in series.
Wherein, the backlight driving voltage of described backlight module is higher than the test voltage of described display driver chip.
The present invention provides a kind of electronic installation, wherein, including the liquid crystal display module described in above-mentioned any one.
The present invention provides the manufacture method of a kind of liquid crystal display module, wherein, comprises the steps:
Thering is provided a FPC and display driver chip, this FPC includes the first pad and the second pad;
Described display driver chip is electrically connected to described first pad through insurance resistance wire;
Thering is provided a test circuit, described test circuit measures display driver chip output through described first pad Test voltage;
Described first pad and described second pad being electrically connected with, described backlight module is electrically connected to described the Two pads.
Wherein, described first pad and described second pad being electrically connected with, described backlight module is electrically connected to In described second pad step, described display driver chip is connected with described backlight module, described guarantor after energising Danger resistance wire fusing so that described display driver chip and the first pad disconnect.
Wherein, described first pad and described second pad being electrically connected with, described backlight module is electrically connected to In described second pad step, specifically include: described second pad is electrically connected with described first by scolding tin Pad, described first pad is connected to backlight module by scolding tin.
Wherein, the test voltage that the backlight driving voltage of described backlight module exports with described display driver chip Voltage difference more than the rated voltage of described insurance resistance wire.
The embodiment of the present invention has the advantage that or beneficial effect:
Pad on FPC is divided in the present invention the first independent pad and the second pad, and the first pad is with aobvious Show that driving chip is connected by insurance resistance wire, by the first pad, display driver chip is tested, survey First pad and the second pad are electrically connected with after terminating by examination, and backlight module and the second pad are connected, and make Insurance resistance wire is fused by the voltage obtaining backlight module, it is to avoid the interference signal entrance of display module work process Display driver chip, improves display quality.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to enforcement In example or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying On the premise of going out creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is that the present invention shows that module omits the structural representation of scolding tin.
Fig. 2 is that the present invention shows that module does not omits the structural representation of scolding tin.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the present invention, and not It it is whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making wound The all other embodiments obtained on the premise of the property made work, broadly fall into the scope of protection of the invention.
Additionally, the explanation of following embodiment is with reference to additional diagram, may be used to reality in order to illustrate the present invention The specific embodiment executed.The direction term being previously mentioned in the present invention, such as, " on ", D score, "front", "rear", "left", "right", " interior ", " outward ", " side " etc., be only the direction with reference to annexed drawings, therefore, use Direction term in order to more preferably, be illustrated more clearly that and understand the present invention rather than instruction or infer indication Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that Limitation of the present invention.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " peace Dress ", should be interpreted broadly " being connected ", " connection ", for example, it may be fix connection, it is also possible to be detachable Ground connects, or is integrally connected;Can be to be mechanically connected;Can be to be joined directly together, it is also possible in by Between medium be indirectly connected to, can be the connection of two element internals.For those of ordinary skill in the art Speech, can understand above-mentioned term concrete meaning in the present invention with concrete condition.
Additionally, in describing the invention, except as otherwise noted, " multiple " are meant that two or more. If occurring the term of " operation " in this specification, it refers not only to independent operation, cannot be bright with other operation When really distinguishing, as long as the effect desired by this operation that can realize then is also included within this term.It addition, this theory In bright book with "~" numerical range that represents refer to using "~" before and after the numerical value recorded as minima and maximum The scope that value is included.In the accompanying drawings, similar or identical being indicated by the same numeral of structure.
Referring to Fig. 1, Fig. 1 is that the present invention shows that module omits the structural representation of scolding tin.Liquid crystal display module 100 include: display driver chip 10, FPC 20 and backlight module 30.Concrete, described display drives core Sheet 10 is arranged with described backlight module 30 stacking, and described backlight module 30 is arranged on described display driver chip Below 10.The first pad 21 and the second pad 22 it is provided with on described FPC 20.Described display driver chip 10 are electrically connected to described first pad 21 after insurance resistance wire 13.Incorporated by reference to being this refering to Fig. 2, Fig. 2 Invention display module does not omits the structural representation of scolding tin.Described first pad 21 and described second pad 22 Between be electrically connected with by conducting medium, described conducting medium can be scolding tin 14.Described backlight module 30 electricity It is connected to described second pad 22.Described second pad 22 is also by the wire (scheming unnumbered) on FPC 20 It is connected to FPC input port (scheming unnumbered).
Concrete, referring to Fig. 1, described first pad 21 may be used for measuring described display driver chip 10 The test voltage signal of output, the voltage signal such as such as AVDD, AVEE.The most concrete, can be by Probe and the first pad 21 in test circuit (not shown) contact.Now, display driver chip 10 The voltage signal of output measures in the first pad 21 enters test circuit.
After measurement terminates, incorporated by reference to refering to Fig. 2.By the first pad 21 and the second pad 22 short circuit.Specifically , the first pad 21 and the second pad 22 can be connected by scolding tin 14.Now, described backlight module 30 It is electrically connected with described display driver chip 10 after described first pad 21 and the second pad 22.The generally back of the body On light module 30 backlight driving voltage much larger than display driver chip 10 output test voltage.Therefore, Backlight driving voltage on backlight module 30 can enter described display driver chip through described insurance resistance wire 13 10.Simultaneously as the backlight driving voltage on backlight module 30 and the output of described display driver chip 10 The voltage difference of test voltage can be blown more than the rated voltage of insurance resistance wire 13, insurance resistance wire 13, Display driver chip 10 is disconnected with described first pad 21.After insurance resistance wire 13 fusing, i.e. Having interference signal to produce in work process after being allowed on FPC 20, interference signal also cannot be through the first pad 21 Input display driver chip 10.Avoid the interference signal interference to liquid crystal display module 100, promote liquid crystal The display effect of display module 100.
Pad on FPC is divided in the present invention the first independent pad and the second pad, and the first pad is with aobvious Show that driving chip is electrically connected with after insurance resistance wire, by the first pad, display driver chip tested, First pad and the second pad are electrically connected with after terminating by test, and backlight module and the second pad are connected, Insurance resistance wire is fused by the output voltage making backlight module, it is to avoid the interference letter of display module work process Number enter display driver chip, improve display quality.
In one specific embodiment of the present invention, described first pad 21 sets side by side with described second pad 22 Put, by scolding tin 14 by described second pad 22, described first pad 21 and described backlight module 30 successively Connect.The present invention connects described second pad 22 and backlight module 30 by the first pad 21, in test The first pad 21 has been reused so that the layout on FPC 20 is compacter after completing.
Preferably, described first pad 21 includes at least two the first golden finger (scheming unnumbered), described Two pads include at least two the second golden finger (scheming unnumbered), described first golden finger and described second gold medal hands Referring to be one-to-one relationship, each described second golden finger is connected to a described first gold medal hands by scolding tin 14 Refer to.In one specific embodiment of the present invention, the quantity of described first golden finger and described second golden finger is each It it is three.Wherein, two in described first golden finger are by wire (scheming unnumbered), insurance resistance wire 13 It is electrically connected in described backlight module 30.
The most concrete, described backlight module 30 includes multiple pin (not shown), described pin with Described first golden finger one_to_one corresponding, the most described pin, described first golden finger and described second Golden finger is sequentially connected in series.Concrete, can by scolding tin 14 be sequentially connected with described second golden finger, described the One golden finger and described pin.
The present invention also provides for a kind of electronic installation, and this electronic installation uses any one described liquid crystal above-mentioned Show module.It is understood that this electronic installation can be, but not limited to as Electronic Paper, LCD TV, shifting Any product with touch display function or the parts such as mobile phone, DPF, panel computer.
The present invention also provides for the manufacture method of a kind of liquid crystal display module, mainly comprises the steps:
S001: provide a FPC and display driver chip, this FPC include the first pad and the second pad.
Concrete, described first pad and described second pad are arranged side by side, described first pad and the second weldering Dish is separate.
S003: described display driver chip is electrically connected to described first pad through insurance resistance wire.
After display driver chip and the first pad being connected, outside testing circuit can be through the first pad to aobvious Show that the output voltage values of driving chip measures.
S005: provide a test circuit, described test circuit measures display driver chip through described first pad Output voltage.
Concrete, probe and the first pad in test circuit contact.Measured described aobvious by test circuit Show the voltage signal that driving chip exports, such as AVDD, the voltage signal such as AVEE.
S007: described first pad and described second pad being electrically connected with, described backlight module is electrically connected to Described second pad.
Concrete, after display driver chip is measured by testing circuit, by described second pad, described the One pad and described backlight module are electrically connected with successively by scolding tin.It is to say, described backlight module and institute State the second pad to be electrically connected with.Now, owing to the first pad and the second pad are electrically connected with, thus described aobvious Show that driving chip is also electrically connected with described backlight module, therefore, after energising, due to the back of the body on backlight module Optical drive voltage is much larger than the test voltage of display driver chip, and the backlight driving voltage of backlight module can be through institute State insurance resistance wire and enter described display driver chip.Simultaneously as the backlight driving voltage of backlight module with The voltage difference of the test voltage of described display driver chip output is more than the rated voltage of insurance resistance wire, insurance Resistance wire can be blown so that display driver chip disconnects with described first pad.Insurance resistance wire melts Having no progeny, even if there being interference signal to produce in work process afterwards on FPC, interference signal also cannot be through first Pad input display driver chip.Avoid the interference signal interference to liquid crystal display module, promote liquid crystal Show the display effect of module.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " tool Body example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, Material or feature are contained at least one embodiment or the example of the present invention.In this manual, to upper The schematic representation stating term is not necessarily referring to identical embodiment or example.And, the concrete spy of description Levy, structure, material or feature can in any one or more embodiments or example in an appropriate manner In conjunction with.
Embodiments described above, is not intended that the restriction to this technical scheme protection domain.Any upper Amendment, equivalent and the improvement etc. made within stating the spirit of embodiment and principle, should be included in this Within the protection domain of technical scheme.

Claims (10)

1. a liquid crystal display module, it is characterised in that include display driver chip, FPC and backlight module, Being provided with the first pad and the second pad on described FPC, described display driver chip is by insurance resistance wire electricity It is connected to described first pad, described first pad and described second pad be electrically connected with, described backlight module It is electrically connected to described second pad.
2. liquid crystal display module as claimed in claim 1, it is characterised in that described first pad and described the Two pads are arranged side by side, and are electrically connected with by scolding tin between described first pad and described second pad, described Second pad is electrically connected to described backlight module through described first pad.
3. liquid crystal display module as claimed in claim 2, it is characterised in that described first pad includes at least Two the first golden fingers, described second pad includes at least two the second golden finger, described first golden finger with Described second golden finger is one-to-one relationship, and each described second golden finger is connected to an institute by scolding tin State the first golden finger.
4. liquid crystal display module as claimed in claim 3, it is characterised in that described backlight module includes multiple Pin, described pin and described first golden finger one_to_one corresponding, the most described pin, described first Golden finger and described second golden finger are sequentially connected in series.
5. liquid crystal display module as claimed in claim 1, it is characterised in that the backlight of described backlight module is driven Dynamic output voltage is higher than the test voltage of described display driver chip.
6. an electronic installation, it is characterised in that include the liquid crystal display described in claim 1-5 any one Module.
7. the manufacture method of a liquid crystal display module, it is characterised in that comprise the steps:
Thering is provided a FPC and display driver chip, this FPC includes the first pad and the second pad;
Described display driver chip is electrically connected to described first pad through insurance resistance wire;
Thering is provided a test circuit, described test circuit measures display driver chip output through described first pad Test voltage;
Described first pad and described second pad being electrically connected with, described backlight module is electrically connected to described the Two pads.
8. the manufacture method of liquid crystal display module as claimed in claim 7, it is characterised in that by described first Pad and described second pad are electrically connected with, and described backlight module is electrically connected in described second pad step, Described display driver chip is connected with described backlight module, described insurance resistance wire fusing after energising so that institute State display driver chip and the first pad disconnects.
9. the manufacture method of liquid crystal display module as claimed in claim 7, it is characterised in that by described first Pad and described second pad are electrically connected with, and described backlight module is electrically connected in described second pad step, Specifically including: by scolding tin, described second pad is electrically connected with described first pad, described first pad leads to Cross scolding tin and be connected to backlight module.
10. the manufacture method of liquid crystal display module as claimed in claim 7, it is characterised in that described backlight The backlight driving voltage of module is more than described guarantor with the voltage difference of the test voltage of described display driver chip output The rated voltage of danger resistance wire.
CN201610556232.4A 2016-07-14 2016-07-14 Liquid crystal display die set and its manufacturing method, electronic device Active CN105974622B (en)

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CN105974622B CN105974622B (en) 2019-09-27

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190278124A1 (en) * 2018-03-07 2019-09-12 Wuhan China Star Optoelectronics Technology Co., Ltd. Liquid crystal display panel and mobile terminal
WO2020097958A1 (en) * 2018-11-14 2020-05-22 惠科股份有限公司 Driving circuit and display device for display panel

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3733334B2 (en) * 2002-02-12 2006-01-11 セイコーエプソン株式会社 Liquid crystal display device and pager and handy terminal equipped with the same
JP4190998B2 (en) * 2003-10-03 2008-12-03 三菱電機株式会社 Display device
US20120262886A1 (en) * 2011-04-18 2012-10-18 Yasuhiko Yamagishi Display Device
CN203691758U (en) * 2013-12-31 2014-07-02 比亚迪股份有限公司 Flexible printing circuit board
CN103926767A (en) * 2013-10-17 2014-07-16 成都天马微电子有限公司 Liquid crystal display and detection method thereof
CN204884525U (en) * 2015-07-22 2015-12-16 深圳市亮晶晶电子有限公司 Compatible multiple driver chip's LCD module
CN105319787A (en) * 2015-12-01 2016-02-10 武汉华星光电技术有限公司 Liquid crystal display module

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3733334B2 (en) * 2002-02-12 2006-01-11 セイコーエプソン株式会社 Liquid crystal display device and pager and handy terminal equipped with the same
JP4190998B2 (en) * 2003-10-03 2008-12-03 三菱電機株式会社 Display device
US20120262886A1 (en) * 2011-04-18 2012-10-18 Yasuhiko Yamagishi Display Device
CN103926767A (en) * 2013-10-17 2014-07-16 成都天马微电子有限公司 Liquid crystal display and detection method thereof
CN203691758U (en) * 2013-12-31 2014-07-02 比亚迪股份有限公司 Flexible printing circuit board
CN204884525U (en) * 2015-07-22 2015-12-16 深圳市亮晶晶电子有限公司 Compatible multiple driver chip's LCD module
CN105319787A (en) * 2015-12-01 2016-02-10 武汉华星光电技术有限公司 Liquid crystal display module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190278124A1 (en) * 2018-03-07 2019-09-12 Wuhan China Star Optoelectronics Technology Co., Ltd. Liquid crystal display panel and mobile terminal
WO2020097958A1 (en) * 2018-11-14 2020-05-22 惠科股份有限公司 Driving circuit and display device for display panel
US11417255B2 (en) * 2018-11-14 2022-08-16 HKC Corporation Limited Driving circuit for display panel and display device

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