CN105974622A - Liquid crystal display module and manufacturing method thereof and electronic device - Google Patents
Liquid crystal display module and manufacturing method thereof and electronic device Download PDFInfo
- Publication number
- CN105974622A CN105974622A CN201610556232.4A CN201610556232A CN105974622A CN 105974622 A CN105974622 A CN 105974622A CN 201610556232 A CN201610556232 A CN 201610556232A CN 105974622 A CN105974622 A CN 105974622A
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- Prior art keywords
- pad
- electrically connected
- module
- liquid crystal
- crystal display
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
Abstract
The invention provides a liquid crystal display module and a manufacturing method thereof. The liquid crystal display module comprises a display driving chip, a flexible printed circuit (FPC) and backlight module. The FPC is provided with a first bonding pad and a second bonding pad. The display driving chip is electrically connected with the first bonding pad through a safety resistance wire, the first bonding pad is electrically connected with the second bonding pad, and the backlight module is electrically connected with the second bonding pad. The invention further provides an electronic device adopting the liquid crystal display module. A bonding pad on the FPC is divided into the first bonding pad and the second bonding pad which are independent to each other. The first bonding pad is connected with the display driving chip through the safety resistance wire, and the display driving chip is tested through the first bonding pad; after the end of the test, the first bonding pad is electrically connected with the second bonding pad, the backlight module is electrically connected with the second bonding pad, so that after the backlight module is powered on, backlight driving voltage fuses the safety resistance wire, mobile phone interference signals in the working process of the display module are prevented from entering the display driving chip, and the display quality is improved.
Description
Technical field
The present invention relates to technical field of liquid crystal display, a kind of liquid crystal display with flexible printed circuit board
Module and manufacture method, electronic installation.
Background technology
FPC (Flexible Printed Circuit board, flexible printed circuit board) is electronic devices and components electrical connections
Carrier.In almost all of electronic installation, the electrical connection of the electronic devices and components such as integrated circuit is required for making
Use FPC.
Its display effect, electrical property must be tested before shipment by liquid crystal display module.Typically require
By in module liquid crystal display drive chip (Liquid Crystal Display Driver Integrated Circuit,
Hereinafter referred to as display driver chip) it is connected by wire with the test point on FPC, then by test point with outside
Test circuit communication is tested.These test points are still retained in FPC surface after test completes.Work as FPC
On when having interference signal, interference signal can enter in display driver chip via test point, therefore can be to liquid crystal
The display of display module interferes, and affects display quality.
Summary of the invention
It is an object of the invention to provide a kind of liquid crystal display module and manufacture method, this liquid crystal display module
External interference signals can be avoided to enter display driver chip, promote the display effect of liquid crystal display module.
Another object of the present invention is to provide a kind of electronic installation using above-mentioned liquid crystal display module.
To achieve these goals, the following technical scheme of embodiment of the present invention offer:
The present invention provides a kind of liquid crystal display module, including display driver chip, FPC and backlight module, institute
Stating and be provided with the first pad and the second pad on FPC, described display driver chip is electrically connected by insurance resistance wire
It is connected to described first pad, described first pad and described second pad be electrically connected with, described backlight module electricity
It is connected to described second pad.
Wherein, described first pad is arranged side by side with described second pad, described first pad and described second
Being electrically connected with by scolding tin between pad, described second pad is electrically connected to described backlight through described first pad
Module.
Wherein, described first pad includes that at least two the first golden finger, described second pad include at least two
Individual second golden finger, described first golden finger and described second golden finger are one-to-one relationship, each described
Second golden finger is connected to described first golden finger by scolding tin.
Wherein, described backlight module includes multiple pin, described pin and described first golden finger one_to_one corresponding,
The most described pin, described first golden finger and described second golden finger are sequentially connected in series.
Wherein, the backlight driving voltage of described backlight module is higher than the test voltage of described display driver chip.
The present invention provides a kind of electronic installation, wherein, including the liquid crystal display module described in above-mentioned any one.
The present invention provides the manufacture method of a kind of liquid crystal display module, wherein, comprises the steps:
Thering is provided a FPC and display driver chip, this FPC includes the first pad and the second pad;
Described display driver chip is electrically connected to described first pad through insurance resistance wire;
Thering is provided a test circuit, described test circuit measures display driver chip output through described first pad
Test voltage;
Described first pad and described second pad being electrically connected with, described backlight module is electrically connected to described the
Two pads.
Wherein, described first pad and described second pad being electrically connected with, described backlight module is electrically connected to
In described second pad step, described display driver chip is connected with described backlight module, described guarantor after energising
Danger resistance wire fusing so that described display driver chip and the first pad disconnect.
Wherein, described first pad and described second pad being electrically connected with, described backlight module is electrically connected to
In described second pad step, specifically include: described second pad is electrically connected with described first by scolding tin
Pad, described first pad is connected to backlight module by scolding tin.
Wherein, the test voltage that the backlight driving voltage of described backlight module exports with described display driver chip
Voltage difference more than the rated voltage of described insurance resistance wire.
The embodiment of the present invention has the advantage that or beneficial effect:
Pad on FPC is divided in the present invention the first independent pad and the second pad, and the first pad is with aobvious
Show that driving chip is connected by insurance resistance wire, by the first pad, display driver chip is tested, survey
First pad and the second pad are electrically connected with after terminating by examination, and backlight module and the second pad are connected, and make
Insurance resistance wire is fused by the voltage obtaining backlight module, it is to avoid the interference signal entrance of display module work process
Display driver chip, improves display quality.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to enforcement
In example or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below
In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying
On the premise of going out creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is that the present invention shows that module omits the structural representation of scolding tin.
Fig. 2 is that the present invention shows that module does not omits the structural representation of scolding tin.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly
Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the present invention, and not
It it is whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making wound
The all other embodiments obtained on the premise of the property made work, broadly fall into the scope of protection of the invention.
Additionally, the explanation of following embodiment is with reference to additional diagram, may be used to reality in order to illustrate the present invention
The specific embodiment executed.The direction term being previously mentioned in the present invention, such as, " on ", D score, "front", "rear",
"left", "right", " interior ", " outward ", " side " etc., be only the direction with reference to annexed drawings, therefore, use
Direction term in order to more preferably, be illustrated more clearly that and understand the present invention rather than instruction or infer indication
Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that
Limitation of the present invention.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " peace
Dress ", should be interpreted broadly " being connected ", " connection ", for example, it may be fix connection, it is also possible to be detachable
Ground connects, or is integrally connected;Can be to be mechanically connected;Can be to be joined directly together, it is also possible in by
Between medium be indirectly connected to, can be the connection of two element internals.For those of ordinary skill in the art
Speech, can understand above-mentioned term concrete meaning in the present invention with concrete condition.
Additionally, in describing the invention, except as otherwise noted, " multiple " are meant that two or more.
If occurring the term of " operation " in this specification, it refers not only to independent operation, cannot be bright with other operation
When really distinguishing, as long as the effect desired by this operation that can realize then is also included within this term.It addition, this theory
In bright book with "~" numerical range that represents refer to using "~" before and after the numerical value recorded as minima and maximum
The scope that value is included.In the accompanying drawings, similar or identical being indicated by the same numeral of structure.
Referring to Fig. 1, Fig. 1 is that the present invention shows that module omits the structural representation of scolding tin.Liquid crystal display module
100 include: display driver chip 10, FPC 20 and backlight module 30.Concrete, described display drives core
Sheet 10 is arranged with described backlight module 30 stacking, and described backlight module 30 is arranged on described display driver chip
Below 10.The first pad 21 and the second pad 22 it is provided with on described FPC 20.Described display driver chip
10 are electrically connected to described first pad 21 after insurance resistance wire 13.Incorporated by reference to being this refering to Fig. 2, Fig. 2
Invention display module does not omits the structural representation of scolding tin.Described first pad 21 and described second pad 22
Between be electrically connected with by conducting medium, described conducting medium can be scolding tin 14.Described backlight module 30 electricity
It is connected to described second pad 22.Described second pad 22 is also by the wire (scheming unnumbered) on FPC 20
It is connected to FPC input port (scheming unnumbered).
Concrete, referring to Fig. 1, described first pad 21 may be used for measuring described display driver chip 10
The test voltage signal of output, the voltage signal such as such as AVDD, AVEE.The most concrete, can be by
Probe and the first pad 21 in test circuit (not shown) contact.Now, display driver chip 10
The voltage signal of output measures in the first pad 21 enters test circuit.
After measurement terminates, incorporated by reference to refering to Fig. 2.By the first pad 21 and the second pad 22 short circuit.Specifically
, the first pad 21 and the second pad 22 can be connected by scolding tin 14.Now, described backlight module 30
It is electrically connected with described display driver chip 10 after described first pad 21 and the second pad 22.The generally back of the body
On light module 30 backlight driving voltage much larger than display driver chip 10 output test voltage.Therefore,
Backlight driving voltage on backlight module 30 can enter described display driver chip through described insurance resistance wire 13
10.Simultaneously as the backlight driving voltage on backlight module 30 and the output of described display driver chip 10
The voltage difference of test voltage can be blown more than the rated voltage of insurance resistance wire 13, insurance resistance wire 13,
Display driver chip 10 is disconnected with described first pad 21.After insurance resistance wire 13 fusing, i.e.
Having interference signal to produce in work process after being allowed on FPC 20, interference signal also cannot be through the first pad 21
Input display driver chip 10.Avoid the interference signal interference to liquid crystal display module 100, promote liquid crystal
The display effect of display module 100.
Pad on FPC is divided in the present invention the first independent pad and the second pad, and the first pad is with aobvious
Show that driving chip is electrically connected with after insurance resistance wire, by the first pad, display driver chip tested,
First pad and the second pad are electrically connected with after terminating by test, and backlight module and the second pad are connected,
Insurance resistance wire is fused by the output voltage making backlight module, it is to avoid the interference letter of display module work process
Number enter display driver chip, improve display quality.
In one specific embodiment of the present invention, described first pad 21 sets side by side with described second pad 22
Put, by scolding tin 14 by described second pad 22, described first pad 21 and described backlight module 30 successively
Connect.The present invention connects described second pad 22 and backlight module 30 by the first pad 21, in test
The first pad 21 has been reused so that the layout on FPC 20 is compacter after completing.
Preferably, described first pad 21 includes at least two the first golden finger (scheming unnumbered), described
Two pads include at least two the second golden finger (scheming unnumbered), described first golden finger and described second gold medal hands
Referring to be one-to-one relationship, each described second golden finger is connected to a described first gold medal hands by scolding tin 14
Refer to.In one specific embodiment of the present invention, the quantity of described first golden finger and described second golden finger is each
It it is three.Wherein, two in described first golden finger are by wire (scheming unnumbered), insurance resistance wire 13
It is electrically connected in described backlight module 30.
The most concrete, described backlight module 30 includes multiple pin (not shown), described pin with
Described first golden finger one_to_one corresponding, the most described pin, described first golden finger and described second
Golden finger is sequentially connected in series.Concrete, can by scolding tin 14 be sequentially connected with described second golden finger, described the
One golden finger and described pin.
The present invention also provides for a kind of electronic installation, and this electronic installation uses any one described liquid crystal above-mentioned
Show module.It is understood that this electronic installation can be, but not limited to as Electronic Paper, LCD TV, shifting
Any product with touch display function or the parts such as mobile phone, DPF, panel computer.
The present invention also provides for the manufacture method of a kind of liquid crystal display module, mainly comprises the steps:
S001: provide a FPC and display driver chip, this FPC include the first pad and the second pad.
Concrete, described first pad and described second pad are arranged side by side, described first pad and the second weldering
Dish is separate.
S003: described display driver chip is electrically connected to described first pad through insurance resistance wire.
After display driver chip and the first pad being connected, outside testing circuit can be through the first pad to aobvious
Show that the output voltage values of driving chip measures.
S005: provide a test circuit, described test circuit measures display driver chip through described first pad
Output voltage.
Concrete, probe and the first pad in test circuit contact.Measured described aobvious by test circuit
Show the voltage signal that driving chip exports, such as AVDD, the voltage signal such as AVEE.
S007: described first pad and described second pad being electrically connected with, described backlight module is electrically connected to
Described second pad.
Concrete, after display driver chip is measured by testing circuit, by described second pad, described the
One pad and described backlight module are electrically connected with successively by scolding tin.It is to say, described backlight module and institute
State the second pad to be electrically connected with.Now, owing to the first pad and the second pad are electrically connected with, thus described aobvious
Show that driving chip is also electrically connected with described backlight module, therefore, after energising, due to the back of the body on backlight module
Optical drive voltage is much larger than the test voltage of display driver chip, and the backlight driving voltage of backlight module can be through institute
State insurance resistance wire and enter described display driver chip.Simultaneously as the backlight driving voltage of backlight module with
The voltage difference of the test voltage of described display driver chip output is more than the rated voltage of insurance resistance wire, insurance
Resistance wire can be blown so that display driver chip disconnects with described first pad.Insurance resistance wire melts
Having no progeny, even if there being interference signal to produce in work process afterwards on FPC, interference signal also cannot be through first
Pad input display driver chip.Avoid the interference signal interference to liquid crystal display module, promote liquid crystal
Show the display effect of module.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " tool
Body example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure,
Material or feature are contained at least one embodiment or the example of the present invention.In this manual, to upper
The schematic representation stating term is not necessarily referring to identical embodiment or example.And, the concrete spy of description
Levy, structure, material or feature can in any one or more embodiments or example in an appropriate manner
In conjunction with.
Embodiments described above, is not intended that the restriction to this technical scheme protection domain.Any upper
Amendment, equivalent and the improvement etc. made within stating the spirit of embodiment and principle, should be included in this
Within the protection domain of technical scheme.
Claims (10)
1. a liquid crystal display module, it is characterised in that include display driver chip, FPC and backlight module,
Being provided with the first pad and the second pad on described FPC, described display driver chip is by insurance resistance wire electricity
It is connected to described first pad, described first pad and described second pad be electrically connected with, described backlight module
It is electrically connected to described second pad.
2. liquid crystal display module as claimed in claim 1, it is characterised in that described first pad and described the
Two pads are arranged side by side, and are electrically connected with by scolding tin between described first pad and described second pad, described
Second pad is electrically connected to described backlight module through described first pad.
3. liquid crystal display module as claimed in claim 2, it is characterised in that described first pad includes at least
Two the first golden fingers, described second pad includes at least two the second golden finger, described first golden finger with
Described second golden finger is one-to-one relationship, and each described second golden finger is connected to an institute by scolding tin
State the first golden finger.
4. liquid crystal display module as claimed in claim 3, it is characterised in that described backlight module includes multiple
Pin, described pin and described first golden finger one_to_one corresponding, the most described pin, described first
Golden finger and described second golden finger are sequentially connected in series.
5. liquid crystal display module as claimed in claim 1, it is characterised in that the backlight of described backlight module is driven
Dynamic output voltage is higher than the test voltage of described display driver chip.
6. an electronic installation, it is characterised in that include the liquid crystal display described in claim 1-5 any one
Module.
7. the manufacture method of a liquid crystal display module, it is characterised in that comprise the steps:
Thering is provided a FPC and display driver chip, this FPC includes the first pad and the second pad;
Described display driver chip is electrically connected to described first pad through insurance resistance wire;
Thering is provided a test circuit, described test circuit measures display driver chip output through described first pad
Test voltage;
Described first pad and described second pad being electrically connected with, described backlight module is electrically connected to described the
Two pads.
8. the manufacture method of liquid crystal display module as claimed in claim 7, it is characterised in that by described first
Pad and described second pad are electrically connected with, and described backlight module is electrically connected in described second pad step,
Described display driver chip is connected with described backlight module, described insurance resistance wire fusing after energising so that institute
State display driver chip and the first pad disconnects.
9. the manufacture method of liquid crystal display module as claimed in claim 7, it is characterised in that by described first
Pad and described second pad are electrically connected with, and described backlight module is electrically connected in described second pad step,
Specifically including: by scolding tin, described second pad is electrically connected with described first pad, described first pad leads to
Cross scolding tin and be connected to backlight module.
10. the manufacture method of liquid crystal display module as claimed in claim 7, it is characterised in that described backlight
The backlight driving voltage of module is more than described guarantor with the voltage difference of the test voltage of described display driver chip output
The rated voltage of danger resistance wire.
Priority Applications (1)
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CN201610556232.4A CN105974622B (en) | 2016-07-14 | 2016-07-14 | Liquid crystal display die set and its manufacturing method, electronic device |
Applications Claiming Priority (1)
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CN201610556232.4A CN105974622B (en) | 2016-07-14 | 2016-07-14 | Liquid crystal display die set and its manufacturing method, electronic device |
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CN105974622A true CN105974622A (en) | 2016-09-28 |
CN105974622B CN105974622B (en) | 2019-09-27 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190278124A1 (en) * | 2018-03-07 | 2019-09-12 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Liquid crystal display panel and mobile terminal |
WO2020097958A1 (en) * | 2018-11-14 | 2020-05-22 | 惠科股份有限公司 | Driving circuit and display device for display panel |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3733334B2 (en) * | 2002-02-12 | 2006-01-11 | セイコーエプソン株式会社 | Liquid crystal display device and pager and handy terminal equipped with the same |
JP4190998B2 (en) * | 2003-10-03 | 2008-12-03 | 三菱電機株式会社 | Display device |
US20120262886A1 (en) * | 2011-04-18 | 2012-10-18 | Yasuhiko Yamagishi | Display Device |
CN203691758U (en) * | 2013-12-31 | 2014-07-02 | 比亚迪股份有限公司 | Flexible printing circuit board |
CN103926767A (en) * | 2013-10-17 | 2014-07-16 | 成都天马微电子有限公司 | Liquid crystal display and detection method thereof |
CN204884525U (en) * | 2015-07-22 | 2015-12-16 | 深圳市亮晶晶电子有限公司 | Compatible multiple driver chip's LCD module |
CN105319787A (en) * | 2015-12-01 | 2016-02-10 | 武汉华星光电技术有限公司 | Liquid crystal display module |
-
2016
- 2016-07-14 CN CN201610556232.4A patent/CN105974622B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3733334B2 (en) * | 2002-02-12 | 2006-01-11 | セイコーエプソン株式会社 | Liquid crystal display device and pager and handy terminal equipped with the same |
JP4190998B2 (en) * | 2003-10-03 | 2008-12-03 | 三菱電機株式会社 | Display device |
US20120262886A1 (en) * | 2011-04-18 | 2012-10-18 | Yasuhiko Yamagishi | Display Device |
CN103926767A (en) * | 2013-10-17 | 2014-07-16 | 成都天马微电子有限公司 | Liquid crystal display and detection method thereof |
CN203691758U (en) * | 2013-12-31 | 2014-07-02 | 比亚迪股份有限公司 | Flexible printing circuit board |
CN204884525U (en) * | 2015-07-22 | 2015-12-16 | 深圳市亮晶晶电子有限公司 | Compatible multiple driver chip's LCD module |
CN105319787A (en) * | 2015-12-01 | 2016-02-10 | 武汉华星光电技术有限公司 | Liquid crystal display module |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190278124A1 (en) * | 2018-03-07 | 2019-09-12 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Liquid crystal display panel and mobile terminal |
WO2020097958A1 (en) * | 2018-11-14 | 2020-05-22 | 惠科股份有限公司 | Driving circuit and display device for display panel |
US11417255B2 (en) * | 2018-11-14 | 2022-08-16 | HKC Corporation Limited | Driving circuit for display panel and display device |
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CN105974622B (en) | 2019-09-27 |
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