CN106898667A - 车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法 - Google Patents

车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法 Download PDF

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CN106898667A
CN106898667A CN201710175398.6A CN201710175398A CN106898667A CN 106898667 A CN106898667 A CN 106898667A CN 201710175398 A CN201710175398 A CN 201710175398A CN 106898667 A CN106898667 A CN 106898667A
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substrate
solar chip
solar
groove
chip
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明巧红
高卫民
徐康聪
萧寒松
严艇
郭光喜
俞翔
周伟
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Eastern Han New Energy Automotive Technology Co Ltd
Donghan New Energy Automotive Technology Co Ltd
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Eastern Han New Energy Automotive Technology Co Ltd
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Priority to CN201710175398.6A priority Critical patent/CN106898667A/zh
Publication of CN106898667A publication Critical patent/CN106898667A/zh
Priority to US16/083,495 priority patent/US20190363205A1/en
Priority to EP17897226.1A priority patent/EP3422420A4/en
Priority to PCT/CN2017/101482 priority patent/WO2018171129A1/zh
Priority to KR1020187020624A priority patent/KR20180116240A/ko
Priority to SG11201807237YA priority patent/SG11201807237YA/en
Priority to AU2017398662A priority patent/AU2017398662A1/en
Priority to MX2018014976A priority patent/MX2018014976A/es
Priority to RU2018134153A priority patent/RU2018134153A/ru
Priority to BR112018071446A priority patent/BR112018071446A2/pt
Priority to JP2018538191A priority patent/JP2019513338A/ja
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Abstract

本发明提供了一种车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法，该集成装置包括：基板，其上开设有贯通孔，正面设置有第一沟槽，背面设置有第二沟槽；太阳能芯片，固定在基板的正面；多根导电带，设置在第一沟槽中，且每根导电带的第一端与太阳能芯片相连，第二端从贯通孔中引出至所述基板的背面；旁路二极管和防反二极管，设置在所述第二沟槽中，且与所述导电带的第二端相连。本发明提供的车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法通过在基板上开设沟槽和贯通孔来对旁路二极管、防反二极管和导电带进行布置，解决了现有技术中电气布线控制不精的问题，提高了太阳能芯片的进光量，简化了工艺，提高了电气布置精度。

Description

车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法
技术领域
本发明涉及太阳能电池技术，尤其涉及一种车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法。
背景技术
太阳能芯片是太阳能汽车的重要组成部分，用于将光能转换为电能，从而为汽车提供动力。
为了保护太阳能芯片不受毁损，现有技术中的太阳能芯片都会经过封装处理，目前大多太阳能芯片封装处理是采用压合的方式在太阳能芯片上铺盖保护材料，如玻璃、亚克力、PC或塑料膜等，这些封装方式具有如下缺陷：
1、集成太阳芯片系统后车顶重量增加不少，不利于车辆轻量化设计；
2、太阳能芯片的电气系统集成操作、施工难度大；
3、太阳能芯片集成相关二极管、导电带、电气线束布置位置精度难控制、难施工；
4、封装材料本身的透光率限制，导致太阳能芯片封装效率降低；
5、这些封装材料与芯片间存在间隙，导致水汽、空气、热膨胀等外界因素影响芯片封装效果，对封装工艺的密封性要求极高。
发明内容
本发明的目的是提供一种车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法，以解决现有技术中的问题，提高太阳能芯片的进光量，简化工艺，提高电气布置精度。
本发明提供了一种车顶太阳能芯片集成装置，其中，包括：
基板，所述基板上开设有贯通孔，所述基板的正面设置有第一沟槽，所述基板的背面设置有第二沟槽；
太阳能芯片，固定在所述基板的正面；
多根导电带，设置在所述第一沟槽中，且每根导电带的第一端与所述太阳能芯片相连，第二端从所述贯通孔中引出至所述基板的背面；
旁路二极管和防反二极管，均设置在所述第二沟槽中，且与所述导电带的第二端相连。
如上所述的车顶太阳能芯片集成装置，其中，优选的是，所述贯通孔的内壁设置有绝缘层。
如上所述的车顶太阳能芯片集成装置，其中，优选的是，所述太阳能芯片为薄膜电池，粘贴在所述基板的正面。
如上所述的车顶太阳能芯片集成装置，其中，优选的是，所述基板由上下两层玻璃纤维中间包覆蜂窝状纤维形成。
如上所述的车顶太阳能芯片集成装置，其中，优选的是，所述太阳能芯片上设置有保护层。
如上所述的车顶太阳能芯片集成装置，其中，优选的是，所述保护层为玻璃纤维带环氧树脂保护层。
如上所述的车顶太阳能芯片集成装置，其中，优选的是，所述保护层上设置有掩盖漆，所述掩盖漆正对所述贯通孔设置。
本发明还提供了一种太阳能汽车，其中，包括本发明提供的车顶太阳能芯片集成装置，多个基板拼接后作为太阳能汽车的车顶。
本发明又提供了一种太阳能芯片的封装方法，其中，包括如下步骤：
步骤S100、在基板的正面开设第一沟槽，在基板的背面开设第二沟槽，并在基板上开设贯通孔；
步骤S200、在第一沟槽中布置导电带，在第二沟槽中布置旁路二极管和防反二极管；
步骤S300、在基板上固定太阳能芯片，使导电带的第一端与太阳能芯片相连，第二端从贯通孔中引出至基板的背面；
步骤S400、在太阳能芯片上铺设保护层；
步骤S500、在保护层上设置掩盖漆。
如上所述的封装方法，其中，优选的是，步骤S100中还包括：步骤S110、对贯通孔作绝缘处理。
如上所述的封装方法，其中，优选的是，步骤S500之后，还包括：
步骤S600、对太阳能芯片与保护层之间的间隙作抽真空处理。
本发明提供的车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法通过在基板上开设沟槽和贯通孔来对旁路二极管、防反二极管和导电带进行布置，解决了现有技术中电气布线控制不精的问题，提高了太阳能芯片的进光量，简化了工艺，提高了电气布置精度。
附图说明
图1为本发明实施例提供的车顶太阳能芯片集成装置的主剖视图；
图2为旁路二极管在第二沟槽上的引线状态示意图；
图3为太阳能芯片的结构示意图；
图4为本发明实施例提供的一种车顶太阳能芯片集成装置的电气原理图；
图5为本发明实施例提供的另一种车顶太阳能芯片集成装置的电气原理图。
附图标记说明：
1-基板 11-贯通孔 2-太阳能芯片 3-导电带 4-旁路二极管 5-保护层 6-掩盖漆7-正极 8-负极 9-连接端 10-防反二极管 12-MPPT
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能解释为对本发明的限制。
图1为本发明实施例提供的车顶太阳能芯片集成装置的主剖视图，本发明实施例提供了一种车顶太阳能芯片集成装置，包括基板1、太阳能芯片2、多根导电带3和旁路二极管4和防反二极管。
其中，多个基板1相互拼接后作为太阳能汽车的车顶。基板1上开设有贯通孔11，基板1的正面设置有第一沟槽，基板1的背面设置有第二沟槽。太阳能芯片2固定在基板的正面，多根导电带3设置在第一沟槽中，且每根导电带3的第一端与太阳能芯片2相连，第二端从贯通孔11中引出至基板1的背面，旁路二极管4和防反二极管均设置在第二沟槽中，且与导电带3的第二端相连。图2为旁路二极管在第二沟槽上的引线状态示意图，参照图2所示，导电带3从贯通孔11中引出，与旁路二极管4相连。
第一沟槽和第二沟槽可以使用精密设备精准定位打槽，从而有利于相关部件在车顶的布置定位。导电带、旁路二极管和防反二极管均通过贯通孔延伸到基板的背面，从而利于线束的连接，也保证了太阳能芯片封装表面的平整度。为了保证贯通孔与导电线之间的绝缘，优选的是，在贯通孔的内壁设置有绝缘层。
优选的是，太阳能芯片2为薄膜电池，粘贴在基板1的正面。图3为太阳能芯片的结构示意图，如图3所示，太阳能芯片上设置有正极7和负极8，以及用于与旁路二极管4(或防反二极管)相连的连接端9，旁路二极管4(或防反二极管)通过导电带3与太阳能芯片2的正极7和负极8分别相连，并汇集后从基板1的背面引出，与MPPT相连。
基板1可以由上下两层玻璃纤维中间包覆蜂窝状纤维形成，在保证强度的同时，又有较轻的重量，有利于车身的轻量化设计。
本领域技术人员可以理解的是，本实施例中涉及的基板的“正面”指的是朝向太阳光的一面，“背面”指的是背离太阳光的一面。
优选的是，在太阳能芯片2上设置有保护层5，从而对太阳能芯片2起到保护的作用。该保护层5优选的是玻璃纤维带环氧树脂保护层，也可以是其他材质，只要能对太阳能芯片2起到保护的作用，并且不影响透光性即可。
如图1所示，在上述保护层5上还优选地设置有掩盖漆6，该掩盖漆6正对所述贯通孔11设置，当基板1之间相互拼接后，基板与基板之间会留有间隙，通过设置该掩盖漆6来将该间隙掩盖。掩盖漆6的颜色可以根据太阳能芯片的颜色来进行匹配。
图4为本发明实施例提供的车顶太阳能芯片集成装置的电气原理图，如图4所示，每个太阳能芯片2均由独立的旁路二极管4控制，四个太阳能芯片2串联形成一组阵列，该阵列的两端连接一个防反二极管10。当单个太阳能芯片出现热斑效应不能发电时，旁路二极管4起旁路作用，让其它太阳能芯片所产生的电流从旁路二极管流出，输入到MPPT 12中，使太阳能发电系统继续发电，不会因为某一片太阳能芯片出现问题而产生发电电路不通的情况。
防反二极管的作用之一是防止太阳能芯片或阵列在不发电时，蓄电池的电流反过来向太阳能芯片或阵列倒送，不仅消耗能量，而且会使太阳能芯片或阵列发热甚至损坏；防反二极管的作用之二是在阵列中，防止阵列各支路之间的电流倒送。这是因为串联各支路的输出电压不可能绝对相等，各支路电压总有高低之差，或者某一支路故障、阴影遮蔽等使该支路的输出电压降低，高电压支路的电流就会流向低电压支路，甚至会使阵列总体输出电压降低。在各支路中串联接入防反二极管就避免了这一现象的发生。
图5为本发明实施例提供的另一种车顶太阳能芯片集成装置的电气原理图，如图5所示，每个太阳能芯片2均由独立的旁路二极管4控制，四个太阳能芯片串联形成一组阵列，该阵列的两端连接一个防反二极管10。MPPT 12共有四组输入端，最顶端的一组输入端所连接的是多个阵列，每个阵列由四个太阳能芯片2串联形成，该阵列的两端连接一个防反二极管10；其余三组输入端所连接的阵列中，每个阵列由三个太阳能芯片2串联而成，该阵列的两端连接一个防反二级管10。
本发明实施例还提供了一种太阳能汽车，包括本发明任意实施例提供的车顶太阳能芯片集成装置，多个基板拼接后作为太阳能汽车的车顶。
本发明实施例又提供了一种太阳能芯片的封装方法，其中包括如下步骤：
步骤S100、在基板的正面开设第一沟槽，在基板的背面开设第二沟槽，并在基板上开设贯通孔。
在该步骤中优选地还包括：
步骤S110、对贯通孔作绝缘处理。
步骤S200、在第一沟槽中布置导电带，在第二沟槽中布置旁路二极管和防反二极管。
步骤S300、在基板上固定太阳能芯片，使导电带的第一端与太阳能芯片相连，第二端从贯通孔中引出至基板的背面。
步骤S400、在太阳能芯片上铺设保护层，从而使太阳能芯片的封装表面防水、防刮擦、耐化学腐蚀且易清洗。
步骤S500、在保护层上设置掩盖漆。
在步骤S500之后，该封装方法还包括：
步骤S600、对太阳能芯片与保护层之间的间隙作抽真空处理，从而保证了封装材料与太阳能芯片间无间隙、封装材料透光率高，封装效率高且密封效果良好。
本发明实施例提供的车顶太阳能芯片集成装置、太阳能汽车及芯片封装方法具有以下优点：
1、基板拼接后直接作为车顶结构，利于车身轻量化设计；进一步地，基板采用由玻璃纤维，蜂窝状纤维，纤维层叠构成的封装基底，既有很好的强度，又有很轻的重量，利于车身轻量化设计；
2、独立车顶，方便操作施工。具体地，所有太阳能芯片的封装在线下完成之后，再安装于车身上，利于精密定位、打孔设备精确定位操作，可实现批量化流水线作业；
3、线下安装布置旁路二极管、线束，易于操作、易于实现规范化作业；
4、封装过程太阳能芯片表面几乎无受力不均，封装完成后芯片表面不受外力压制，太阳能芯片不易损坏；
5、封装材料与太阳能芯片间无间隙、封装材料透光率高，封装效率高且密封效果良好；
6、封装表面防水、防擦刮、耐化学腐蚀、易清洗。
以上依据图式所示的实施例详细说明了本发明的构造、特征及作用效果，以上所述仅为本发明的较佳实施例，但本发明不以图面所示限定实施范围，凡是依照本发明的构想所作的改变，或修改为等同变化的等效实施例，仍未超出说明书与图示所涵盖的精神时，均应在本发明的保护范围内。

Claims (11)

1.一种车顶太阳能芯片集成装置，其特征在于，包括：
基板，所述基板上开设有贯通孔，所述基板的正面设置有第一沟槽，所述基板的背面设置有第二沟槽；
太阳能芯片，固定在所述基板的正面；
多根导电带，设置在所述第一沟槽中，且每根导电带的第一端与所述太阳能芯片相连，第二端从所述贯通孔中引出至所述基板的背面；
旁路二极管和防反二极管，均设置在所述第二沟槽中，且与所述导电带的第二端相连。
2.根据权利要求1所述的车顶太阳能芯片集成装置，其特征在于，所述贯通孔的内壁设置有绝缘层。
3.根据权利要求1所述的车顶太阳能芯片集成装置，其特征在于，所述太阳能芯片为薄膜电池，粘贴在所述基板的正面。
4.根据权利要求1-3任一项所述的车顶太阳能芯片集成装置，其特征在于，所述基板由上下两层玻璃纤维中间包覆蜂窝状纤维形成。
5.根据权利要求4所述的车顶太阳能芯片集成装置，其特征在于，所述太阳能芯片上设置有保护层。
6.根据权利要求5所述的车顶太阳能芯片集成装置，其特征在于，所述保护层为玻璃纤维带环氧树脂保护层。
7.根据权利要求6所述的车顶太阳能芯片集成装置，其特征在于，所述保护层上设置有掩盖漆，所述掩盖漆正对所述贯通孔设置。
8.一种太阳能汽车，其特征在于，包括权利要求1-7任一项所述的车顶太阳能芯片集成装置，多个基板拼接后作为太阳能汽车的车顶。
9.一种太阳能芯片的封装方法，其特征在于，包括如下步骤：
步骤S100、在基板的正面开设第一沟槽，在基板的背面开设第二沟槽，并在基板上开设贯通孔；
步骤S200、在第一沟槽中布置导电带，在第二沟槽中布置旁路二极管和防反二极管；
步骤S300、在基板上固定太阳能芯片，使导电带的第一端与太阳能芯片相连，第二端从贯通孔中引出至基板的背面；
步骤S400、在太阳能芯片上铺设保护层；
步骤S500、在保护层上设置掩盖漆。
10.根据权利要求9所述的封装方法，其特征在于，步骤S100中还包括：步骤S110、对贯通孔作绝缘处理。
11.根据权利要求9或10所述的封装方法，其特征在于，步骤S500之后，还包括：
步骤S600、对太阳能芯片与保护层之间的间隙作抽真空处理。
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Application publication date: 20170627