WO2018171129A1 - 车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法 - Google Patents
车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法 Download PDFInfo
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- WO2018171129A1 WO2018171129A1 PCT/CN2017/101482 CN2017101482W WO2018171129A1 WO 2018171129 A1 WO2018171129 A1 WO 2018171129A1 CN 2017101482 W CN2017101482 W CN 2017101482W WO 2018171129 A1 WO2018171129 A1 WO 2018171129A1
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Definitions
- the invention relates to a solar cell technology, in particular to a roof solar chip integrated device, a solar car and a chip packaging method.
- Solar chips are an important part of solar cars that convert light energy into electrical energy to power the car.
- the object of the present invention is to provide a roof solar chip integrated device, a solar car and a chip packaging method to solve the problems in the prior art, improve the light amount of the solar chip, simplify the process, and improve the electrical arrangement precision.
- the invention provides a roof solar chip integrated device, which comprises:
- the substrate is provided with a through hole, a front surface of the substrate is provided with a first trench, and a back surface of the substrate is provided with a second trench;
- a plurality of conductive strips disposed in the first trench, and a first end of each of the conductive strips is connected to the solar chip, and a second end is drawn from the through hole to a back surface of the substrate;
- a bypass diode and an anti-reverse diode are disposed in the second trench and connected to the second end of the conductive strip.
- the inner wall of the through hole is provided with an insulating layer.
- the solar chip is a thin film battery attached to a front surface of the substrate.
- the substrate is formed by coating the honeycomb fibers with the upper and lower layers of glass fibers.
- the protective layer is a glass fiber with an epoxy resin protective layer.
- the protective layer is provided with a masking varnish, and the masking varnish is disposed opposite to the through hole.
- the invention also provides a solar automobile, which comprises the roof solar chip integrated device provided by the invention, and the plurality of substrates are spliced to be the roof of the solar automobile.
- the invention further provides a method for packaging a solar chip, comprising the following steps:
- Step S100 opening a first trench on the front surface of the substrate, opening a second trench on the back surface of the substrate, and forming a through hole in the substrate;
- Step S200 disposing a conductive strip in the first trench, and arranging a bypass diode and a anti-reverse diode in the second trench;
- Step S300 fixing a solar chip on the substrate, connecting the first end of the conductive strip to the solar chip, and the second end is led out from the through hole to the back surface of the substrate;
- Step S400 laying a protective layer on the solar chip
- Step S500 providing a masking paint on the protective layer.
- the step S100 further includes: step S110, performing an insulation treatment on the through holes.
- step S500 it is preferable to further include:
- Step S600 vacuuming the gap between the solar chip and the protective layer.
- the roof solar chip integrated device, the solar automobile and the chip packaging method provided by the invention solve the prior art electric circuit by arranging the bypass diode, the anti-reverse diode and the conductive tape by forming grooves and through holes on the substrate.
- the problem of poor wiring control improves the amount of light entering the solar chip, simplifies the process, and improves the electrical layout accuracy.
- FIG. 1 is a front cross-sectional view of a roof solar chip integrated device according to an embodiment of the present invention
- FIG. 2 is a schematic view showing a state of a lead of a bypass diode on a second trench
- FIG. 3 is a schematic structural view of a solar chip
- FIG. 4 is an electrical schematic diagram of a roof solar chip integrated device according to an embodiment of the present invention.
- FIG. 5 is an electrical schematic diagram of another roof solar chip integrated device according to an embodiment of the present invention.
- FIG. 1 is a front cross-sectional view of a roof solar chip integrated device according to an embodiment of the present invention.
- the embodiment of the present invention provides a roof solar chip integrated device, including a substrate 1, a solar chip 2, a plurality of conductive strips 3, and a bypass. Diode 4 and anti-reverse diode.
- a plurality of substrates 1 are spliced to each other and used as a roof of a solar automobile.
- a through hole 11 is defined in the substrate 1, a first groove is disposed on the front surface of the substrate 1, and a second groove is disposed on the back surface of the substrate 1. groove.
- the solar chip 2 is fixed on the front surface of the substrate, a plurality of conductive strips 3 are disposed in the first trench, and the first end of each conductive strip 3 is connected to the solar chip 2, and the second end is led out from the through hole 11 to the substrate 1.
- the back side of the bypass diode 4 and the anti-reverse diode are both disposed in the second trench and connected to the second end of the conductive strip 3.
- 2 is a schematic view showing the state of the lead of the bypass diode on the second trench. Referring to FIG. 2, the conductive strip 3 is taken out from the through hole 11 and connected to the bypass diode 4.
- the first groove and the second groove can be accurately positioned and grooved using precision equipment, thereby facilitating the positioning of the relevant components on the roof.
- the conductive strip, the bypass diode and the anti-reverse diode all extend through the through hole to the back surface of the substrate, thereby facilitating the connection of the wire harness and ensuring the flatness of the surface of the solar chip package.
- an insulating layer is provided on the inner wall of the through hole.
- the solar chip 2 is a thin film battery and is attached to the front surface of the substrate 1.
- 3 is a schematic structural view of a solar chip. As shown in FIG. 3, a solar cell is provided with a positive electrode 7 and a negative electrode 8, and a connection terminal 9 for connecting with a bypass diode 4 (or an anti-reverse diode), and a bypass diode 4 The (or anti-reverse diode) is connected to the positive electrode 7 and the negative electrode 8 of the solar chip 2 via the conductive strip 3, and is collected and taken out from the back surface of the substrate 1 to be connected to the MPPT.
- a bypass diode 4 or an anti-reverse diode
- the substrate 1 can be formed by coating the honeycomb fibers with the upper and lower layers of glass fibers, which ensures the strength and the light weight, which is beneficial to the lightweight design of the vehicle body.
- front side of the substrate referred to in this embodiment refers to the side facing the sunlight
- back side refers to the side facing away from the sunlight
- the protective layer 5 is provided on the solar chip 2 to protect the solar chip 2.
- the protective layer 5 is preferably a glass fiber with an epoxy resin protective layer, and may be other materials as long as it can protect the solar chip 2 and does not affect the light transmittance.
- a masking paint 6 is also disposed on the protective layer 5 , and the masking paint 6 is disposed opposite to the through hole 11 .
- the substrates 1 are spliced to each other, the substrate and the substrate remain. There is a gap, and the gap is covered by providing the masking paint 6.
- the color of the masking paint 6 can be matched according to the color of the solar chip.
- each solar chip 2 is controlled by an independent bypass diode 4, four suns.
- the chip 2 can be connected in series to form a set of arrays, and an anti-reverse diode 10 is connected to both ends of the array.
- the bypass diode 4 acts as a bypass, allowing the current generated by other solar chips to flow out of the bypass diode and input into the MPPT 12, so that the solar power generation system continues to generate electricity, and will not Because of the problem of a certain solar chip, the power generation circuit is unreasonable.
- One of the functions of the anti-reverse diode is to prevent the current of the battery from being reversed to the solar chip or array when the solar chip or array is not generating electricity, which not only consumes energy, but also causes the solar chip or array to generate heat or even damage;
- the second effect is to prevent current reversal between the branches of the array in the array. This is because the output voltages of the series branches cannot be absolutely equal, and the voltage of each branch always has a difference between high and low, or a branch fault, shadow shading, etc., which lowers the output voltage of the branch, and the current of the high voltage branch. It will flow to the low voltage branch and even reduce the overall output voltage of the array. This phenomenon is avoided by connecting anti-reverse diodes in series in each branch.
- FIG. 5 is an electrical schematic diagram of another roof solar chip integrated device according to an embodiment of the present invention.
- each solar chip 2 is controlled by an independent bypass diode 4, and four solar chips are connected in series.
- MPPT 12 has four sets of inputs. The topmost set of inputs is connected to multiple arrays.
- Each array is formed by four solar chips 2 connected in series. The two ends of the array are connected with one anti-reverse diode 10; the other three groups In the array to which the input terminals are connected, each array is formed by three solar chips 2 connected in series, and an anti-reverse diode 10 is connected to both ends of the array.
- the embodiment of the invention further provides a solar vehicle, comprising the roof solar chip integrated device provided by any embodiment of the invention, wherein the plurality of substrates are spliced and used as the roof of the solar vehicle.
- the embodiment of the invention further provides a method for packaging a solar chip, which comprises the following steps:
- step S100 a first trench is opened on the front surface of the substrate, a second trench is formed on the back surface of the substrate, and a through hole is formed in the substrate.
- this step further comprising:
- step S110 the through hole is insulated.
- Step S200 disposing a conductive strip in the first trench, and arranging a bypass diode and a anti-reverse diode in the second trench.
- Step S300 fixing the solar chip on the substrate, connecting the first end of the conductive strip to the solar chip, and the second end is led out from the through hole to the back surface of the substrate.
- Step S400 laying a protective layer on the solar chip, so that the packaging surface of the solar chip is waterproof, scratch-resistant, chemically resistant, and easy to clean.
- Step S500 providing a masking paint on the protective layer.
- the encapsulation method further includes:
- Step S600 vacuuming the gap between the solar chip and the protective layer, thereby ensuring no gap between the packaging material and the solar chip, high transmittance of the packaging material, high packaging efficiency, and good sealing effect.
- the roof solar chip integrated device, the solar automobile and the chip packaging method provided by the embodiments of the invention have the following advantages:
- the substrate After the substrate is spliced, it directly serves as the roof structure, which is beneficial to the lightweight design of the vehicle body. Further, the substrate adopts a package base composed of glass fiber, honeycomb fiber and fiber laminate, which has good strength and light weight. For the lightweight design of the body;
- the surface of the solar chip has almost no uneven force on the surface of the packaging process. After the package is completed, the surface of the chip is not pressed by external force, and the solar chip is not easily damaged;
- the surface of the package is waterproof, scratch-resistant, chemically resistant and easy to clean.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
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Abstract
Description
Claims (11)
- 一种车顶太阳能芯片集成装置,其特征在于,包括:基板,所述基板上开设有贯通孔,所述基板的正面设置有第一沟槽,所述基板的背面设置有第二沟槽;太阳能芯片,固定在所述基板的正面;多根导电带,设置在所述第一沟槽中,且每根导电带的第一端与所述太阳能芯片相连,第二端从所述贯通孔中引出至所述基板的背面;旁路二极管和防反二极管,均设置在所述第二沟槽中,且与所述导电带的第二端相连。
- 根据权利要求1所述的车顶太阳能芯片集成装置,其特征在于,所述贯通孔的内壁设置有绝缘层。
- 根据权利要求1所述的车顶太阳能芯片集成装置,其特征在于,所述太阳能芯片为薄膜电池,粘贴在所述基板的正面。
- 根据权利要求1-3任一项所述的车顶太阳能芯片集成装置,其特征在于,所述基板由上下两层玻璃纤维中间包覆蜂窝状纤维形成。
- 根据权利要求4所述的车顶太阳能芯片集成装置,其特征在于,所述太阳能芯片上设置有保护层。
- 根据权利要求5所述的车顶太阳能芯片集成装置,其特征在于,所述保护层为玻璃纤维带环氧树脂保护层。
- 根据权利要求6所述的车顶太阳能芯片集成装置,其特征在于,所述保护层上设置有掩盖漆,所述掩盖漆正对所述贯通孔设置。
- 一种太阳能汽车,其特征在于,包括权利要求1-7任一项所述的车顶太阳能芯片集成装置,多个基板拼接后作为太阳能汽车的车顶。
- 一种太阳能芯片的封装方法,其特征在于,包括如下步骤:步骤S100、在基板的正面开设第一沟槽,在基板的背面开设第二沟槽,并在基板上开设贯通孔;步骤S200、在第一沟槽中布置导电带,在第二沟槽中布置旁路二极管和防反二极管;步骤S300、在基板上固定太阳能芯片,使导电带的第一端与太阳能芯片相连,第二端从贯通孔中引出至基板的背面;步骤S400、在太阳能芯片上铺设保护层;步骤S500、在保护层上设置掩盖漆。
- 根据权利要求9所述的封装方法,其特征在于,步骤S100中还包括:步骤S110、对贯通孔作绝缘处理。
- 根据权利要求9或10所述的封装方法,其特征在于,步骤S500之后,还包括:步骤S600、对太阳能芯片与保护层之间的间隙作抽真空处理。
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EP17897226.1A EP3422420A4 (en) | 2017-03-22 | 2017-09-13 | INTEGRATED VEHICLE ROOF SOLAR CHIP DEVICE, SOLAR CAR, AND CHIP ENCAPSULATION METHOD |
SG11201807237YA SG11201807237YA (en) | 2017-03-22 | 2017-09-13 | Roof-mounted solar modules integration device, solar power vehicle and encapsulation method for modules |
RU2018134153A RU2018134153A (ru) | 2017-03-22 | 2017-09-13 | Монтируемое на крышу устройство интеграции солнечного модуля, транспортное средство на солнечной энергии и способ инкапсуляции для модулей |
AU2017398662A AU2017398662A1 (en) | 2017-03-22 | 2017-09-13 | Roof-mounted solar modules integration device, solar power vehicle and encapsulation method for modules |
BR112018071446A BR112018071446A2 (pt) | 2017-03-22 | 2017-09-13 | dispositivo de integração de módulos solares de montagem no telhado, veículo movido a energia solar e método de encapsulamento para módulos. |
MX2018014976A MX2018014976A (es) | 2017-03-22 | 2017-09-13 | Dispositivo de integracion de modulos solares sobre un techo, vehiculo impulsado por energia solar y metodo para modulos. |
JP2018538191A JP2019513338A (ja) | 2017-03-22 | 2017-09-13 | 車両ルーフソーラーチップの集積装置、ソーラーカー及びチップのパッケージング方法 |
KR1020187020624A KR20180116240A (ko) | 2017-03-22 | 2017-09-13 | 자동차 천정 태양 에너지 칩 집적장치, 태양 에너지 자동차 및 칩 패키지 하는 방법 |
US16/083,495 US20190363205A1 (en) | 2017-03-22 | 2017-09-13 | Roof-mounted Solar Modules Integration Device, Solar Power Vehicle and Encapsulation Method for Modules |
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CN201710175398.6A CN106898667A (zh) | 2017-03-22 | 2017-03-22 | 车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法 |
CN201710175398.6 | 2017-03-22 |
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US (1) | US20190363205A1 (zh) |
EP (1) | EP3422420A4 (zh) |
JP (1) | JP2019513338A (zh) |
KR (1) | KR20180116240A (zh) |
CN (1) | CN106898667A (zh) |
AU (1) | AU2017398662A1 (zh) |
BR (1) | BR112018071446A2 (zh) |
MX (1) | MX2018014976A (zh) |
RU (1) | RU2018134153A (zh) |
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CN106898667A (zh) * | 2017-03-22 | 2017-06-27 | 东汉新能源汽车技术有限公司 | 车顶太阳能芯片集成装置、太阳能汽车及芯片的封装方法 |
JP6985133B2 (ja) * | 2017-12-20 | 2021-12-22 | トヨタ自動車株式会社 | 太陽電池モジュール |
CN116314410B (zh) * | 2023-05-17 | 2023-08-22 | 赫里欧新能源有限公司 | 太阳能板的封装结构及其封装方法 |
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2017
- 2017-03-22 CN CN201710175398.6A patent/CN106898667A/zh active Pending
- 2017-09-13 AU AU2017398662A patent/AU2017398662A1/en not_active Abandoned
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- 2017-09-13 EP EP17897226.1A patent/EP3422420A4/en not_active Withdrawn
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- 2017-09-13 JP JP2018538191A patent/JP2019513338A/ja active Pending
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- 2017-09-13 US US16/083,495 patent/US20190363205A1/en not_active Abandoned
- 2017-09-13 KR KR1020187020624A patent/KR20180116240A/ko not_active Application Discontinuation
- 2017-09-13 WO PCT/CN2017/101482 patent/WO2018171129A1/zh active Application Filing
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CN101355107A (zh) * | 2007-07-26 | 2009-01-28 | 上海太阳能工程技术研究中心有限公司 | 聚光太阳电池的组装结构 |
CN101419990A (zh) * | 2007-10-25 | 2009-04-29 | 上海空间电源研究所 | 柔性薄膜太阳电池组件 |
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SG11201807237YA (en) | 2018-10-30 |
BR112018071446A2 (pt) | 2020-01-28 |
JP2019513338A (ja) | 2019-05-23 |
AU2017398662A1 (en) | 2018-10-11 |
RU2018134153A3 (zh) | 2020-04-01 |
EP3422420A4 (en) | 2019-09-18 |
EP3422420A1 (en) | 2019-01-02 |
MX2018014976A (es) | 2019-04-25 |
US20190363205A1 (en) | 2019-11-28 |
RU2018134153A (ru) | 2020-04-01 |
KR20180116240A (ko) | 2018-10-24 |
CN106898667A (zh) | 2017-06-27 |
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