CN106898583A - 一种便于激光切割的覆铜陶瓷基板 - Google Patents
一种便于激光切割的覆铜陶瓷基板 Download PDFInfo
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- CN106898583A CN106898583A CN201510957956.5A CN201510957956A CN106898583A CN 106898583 A CN106898583 A CN 106898583A CN 201510957956 A CN201510957956 A CN 201510957956A CN 106898583 A CN106898583 A CN 106898583A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108069386A (zh) * | 2017-12-22 | 2018-05-25 | 深圳华美澳通传感器有限公司 | 一种陶瓷基板结构及切割方法 |
CN110993507A (zh) * | 2019-11-22 | 2020-04-10 | 上海申和热磁电子有限公司 | 一种减少覆铜陶瓷基板母板翘曲的方法 |
CN111385962A (zh) * | 2018-12-29 | 2020-07-07 | 广东生益科技股份有限公司 | 一种pcb板及其制备方法 |
CN114899154A (zh) * | 2022-06-02 | 2022-08-12 | 江苏富乐华功率半导体研究院有限公司 | 一种高效率双面散热功率模块封装方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102164464A (zh) * | 2010-02-16 | 2011-08-24 | 日本特殊陶业株式会社 | 多层布线基板的制造方法及多层布线基板 |
CN104112734A (zh) * | 2013-04-18 | 2014-10-22 | 中芯国际集成电路制造(上海)有限公司 | 双嵌套铜互连结构及其制作方法 |
CN205319142U (zh) * | 2015-12-18 | 2016-06-15 | 上海申和热磁电子有限公司 | 一种便于激光切割的覆铜陶瓷基板 |
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- 2015-12-18 CN CN201510957956.5A patent/CN106898583B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102164464A (zh) * | 2010-02-16 | 2011-08-24 | 日本特殊陶业株式会社 | 多层布线基板的制造方法及多层布线基板 |
CN104112734A (zh) * | 2013-04-18 | 2014-10-22 | 中芯国际集成电路制造(上海)有限公司 | 双嵌套铜互连结构及其制作方法 |
CN205319142U (zh) * | 2015-12-18 | 2016-06-15 | 上海申和热磁电子有限公司 | 一种便于激光切割的覆铜陶瓷基板 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108069386A (zh) * | 2017-12-22 | 2018-05-25 | 深圳华美澳通传感器有限公司 | 一种陶瓷基板结构及切割方法 |
CN108069386B (zh) * | 2017-12-22 | 2024-04-16 | 深圳华美澳通传感器有限公司 | 一种陶瓷基板结构及切割方法 |
CN111385962A (zh) * | 2018-12-29 | 2020-07-07 | 广东生益科技股份有限公司 | 一种pcb板及其制备方法 |
CN110993507A (zh) * | 2019-11-22 | 2020-04-10 | 上海申和热磁电子有限公司 | 一种减少覆铜陶瓷基板母板翘曲的方法 |
CN110993507B (zh) * | 2019-11-22 | 2021-05-25 | 江苏富乐德半导体科技有限公司 | 一种减少覆铜陶瓷基板母板翘曲的方法 |
CN114899154A (zh) * | 2022-06-02 | 2022-08-12 | 江苏富乐华功率半导体研究院有限公司 | 一种高效率双面散热功率模块封装方法 |
CN114899154B (zh) * | 2022-06-02 | 2023-05-30 | 江苏富乐华功率半导体研究院有限公司 | 一种高效率双面散热功率模块封装方法 |
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Effective date of registration: 20190211 Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Applicant after: Jiangsu Fule De Semiconductor Technology Co., Ltd. Address before: No. 181 Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai, 2004 Applicant before: Shanghai Shenhe Thermo-magenetic Electronic Co., Ltd. |
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Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee after: Jiangsu fulehua Semiconductor Technology Co.,Ltd. Address before: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee before: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |