CN106898583B - 一种便于激光切割的覆铜陶瓷基板 - Google Patents
一种便于激光切割的覆铜陶瓷基板 Download PDFInfo
- Publication number
- CN106898583B CN106898583B CN201510957956.5A CN201510957956A CN106898583B CN 106898583 B CN106898583 B CN 106898583B CN 201510957956 A CN201510957956 A CN 201510957956A CN 106898583 B CN106898583 B CN 106898583B
- Authority
- CN
- China
- Prior art keywords
- copper
- ceramic substrate
- technique edges
- copper ceramic
- laser cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510957956.5A CN106898583B (zh) | 2015-12-18 | 2015-12-18 | 一种便于激光切割的覆铜陶瓷基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510957956.5A CN106898583B (zh) | 2015-12-18 | 2015-12-18 | 一种便于激光切割的覆铜陶瓷基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106898583A CN106898583A (zh) | 2017-06-27 |
CN106898583B true CN106898583B (zh) | 2019-06-21 |
Family
ID=59188892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510957956.5A Active CN106898583B (zh) | 2015-12-18 | 2015-12-18 | 一种便于激光切割的覆铜陶瓷基板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106898583B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108069386B (zh) * | 2017-12-22 | 2024-04-16 | 深圳华美澳通传感器有限公司 | 一种陶瓷基板结构及切割方法 |
CN111385962A (zh) * | 2018-12-29 | 2020-07-07 | 广东生益科技股份有限公司 | 一种pcb板及其制备方法 |
CN110993507B (zh) * | 2019-11-22 | 2021-05-25 | 江苏富乐德半导体科技有限公司 | 一种减少覆铜陶瓷基板母板翘曲的方法 |
CN114899154B (zh) * | 2022-06-02 | 2023-05-30 | 江苏富乐华功率半导体研究院有限公司 | 一种高效率双面散热功率模块封装方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102164464A (zh) * | 2010-02-16 | 2011-08-24 | 日本特殊陶业株式会社 | 多层布线基板的制造方法及多层布线基板 |
CN104112734A (zh) * | 2013-04-18 | 2014-10-22 | 中芯国际集成电路制造(上海)有限公司 | 双嵌套铜互连结构及其制作方法 |
CN205319142U (zh) * | 2015-12-18 | 2016-06-15 | 上海申和热磁电子有限公司 | 一种便于激光切割的覆铜陶瓷基板 |
-
2015
- 2015-12-18 CN CN201510957956.5A patent/CN106898583B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102164464A (zh) * | 2010-02-16 | 2011-08-24 | 日本特殊陶业株式会社 | 多层布线基板的制造方法及多层布线基板 |
CN104112734A (zh) * | 2013-04-18 | 2014-10-22 | 中芯国际集成电路制造(上海)有限公司 | 双嵌套铜互连结构及其制作方法 |
CN205319142U (zh) * | 2015-12-18 | 2016-06-15 | 上海申和热磁电子有限公司 | 一种便于激光切割的覆铜陶瓷基板 |
Also Published As
Publication number | Publication date |
---|---|
CN106898583A (zh) | 2017-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106898583B (zh) | 一种便于激光切割的覆铜陶瓷基板 | |
CN103367549B (zh) | 一种带图案彩色太阳能电池组件制备方法 | |
JP6024750B2 (ja) | 半導体モジュール | |
CN103814439B (zh) | 模块基板 | |
CN106098831B (zh) | 一种背接触太阳能电池串及其制备方法和组件、系统 | |
CN104347553A (zh) | 一种挖槽阻焊型igbt模块底板 | |
CN107799616A (zh) | 一种叉指背接触太阳能电池片及其制作方法 | |
WO2023077820A1 (zh) | 电池片组件的制作方法和叠瓦光伏组件 | |
CN107749399B (zh) | 一种功率芯片封装方法和结构 | |
CN205319142U (zh) | 一种便于激光切割的覆铜陶瓷基板 | |
CN110505719A (zh) | 发热膜及其制备方法 | |
CN209104165U (zh) | 太阳能电池片及太阳能电池组件 | |
CN102811554A (zh) | 大功率电子器件模组用基板及其制备方法 | |
CN103094127B (zh) | 用于封装igbt模块的直接键合铜基板的贴装夹具 | |
CN104616986A (zh) | 一种快恢复二极管的制备方法 | |
CN107452824A (zh) | 一种新型太阳能半片电池片及其制备方法和应用 | |
CN103594458A (zh) | 一种衬板结构 | |
CN106900140B (zh) | 一种保持覆铜陶瓷基板上铜粒间距尺寸均匀的方法及基板 | |
CN105552137A (zh) | 一种背接触式太阳能电池的小芯片电极引出方法 | |
CN203774187U (zh) | 一种内引线接地部位设有一定角度的固体继电器外壳 | |
TWI517416B (zh) | 異質接面太陽能電池及其製造方法 | |
CN104952815A (zh) | 半导体模块以及半导体模块的制造方法 | |
CN104701440A (zh) | 发光二极管封装元件及其制造方法 | |
CN105448900B (zh) | 一种高频低压降功率半导体模块 | |
CN105679851B (zh) | 精密加工背接触式太阳能电池成电池芯片及电极引出方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190211 Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Applicant after: Jiangsu Fule De Semiconductor Technology Co., Ltd. Address before: No. 181 Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai, 2004 Applicant before: Shanghai Shenhe Thermo-magenetic Electronic Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee after: Jiangsu fulehua Semiconductor Technology Co.,Ltd. Address before: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee before: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |