CN106898573A - 一种转盘式晶圆自动分片装载机 - Google Patents

一种转盘式晶圆自动分片装载机 Download PDF

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CN106898573A
CN106898573A CN201510958534.XA CN201510958534A CN106898573A CN 106898573 A CN106898573 A CN 106898573A CN 201510958534 A CN201510958534 A CN 201510958534A CN 106898573 A CN106898573 A CN 106898573A
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CN106898573B (zh
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宁永铎
盛方毓
程凤伶
边永智
徐继平
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Youyan semiconductor silicon materials Co.,Ltd.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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Abstract

本发明公开了一种转盘式晶圆自动分片装载机，包括主机平台、上料台、驱动机构、传动杆、分片载具、滑片坡道、载具升降机构、晶圆载具、以及晶圆载具保存水箱；其中，主机平台具有漏片孔；分片载具设置在主机平台上，通过传动杆与驱动机构相连；分片载具具有用于容纳晶圆的圆孔；上料台位于主机平台上方靠近边缘一侧；驱动机构位于主机平台中部上方；滑片坡道的上端位于主机平台的漏片孔下方，下端对准晶圆载具的卡槽；晶圆载具置于晶圆载具保存水箱内，并由载具升降机构控制升降。本发明结构精巧简单，可实现成叠晶圆的自动分片，并实现自动装入载具卡槽中，大大降低了操作人员的工作强度，提高工作效率，降低人工失误造成晶圆损失的风险。

Description

一种转盘式晶圆自动分片装载机
技术领域
本发明涉及一种转盘式晶圆自动分片装载机，适用于4-8英寸晶圆切割研磨后晶圆分片装入晶圆载具的过程，属于半导体材料晶圆制造设备技术领域。
背景技术
在半导体晶圆加工制造过程中，有些加工工序如单晶线切割、晶片研磨等工序，需要将成叠放置的晶圆一片一片的分开，装入晶圆载具中，转移至其他工序。在工厂中通常是由操作人员手工完成分离，晶圆装载具的工作，人工操作工作效率低下，容易会出现晶圆放错卡槽等情况。这样的人工操作极容易造成晶圆破碎，造成产品损失。
发明内容
本发明的目的在于提供一种转盘式晶圆自动分片装载机，适用于4-8英寸晶圆切割研磨后晶圆分片装入晶圆载具的过程，可以实现设备自动分片，晶圆装载具的工作。
为实现上述目的，本发明采取以下技术方案：
一种转盘式晶圆自动分片装载机，包括主机平台、上料台、驱动机构、传动杆、分片载具、滑片坡道、载具升降机构、晶圆载具、以及晶圆载具保存水箱；其中，主机平台具有漏片孔；分片载具设置在主机平台上，通过传动杆与驱动机构相连；分片载具具有用于容纳晶圆的圆孔；上料台位于主机平台上方靠近边缘一侧；驱动机构位于主机平台中部上方；滑片坡道的上端位于主机平台的漏片孔下方，下端对准晶圆载具的卡槽；晶圆载具置于晶圆载具保存水箱内，并由载具升降机构控制升降。
其中，所述上料台设有厚度挡板和防翻挡板，其中厚度挡板控制每次仅有一片晶圆进入圆孔，其余晶圆被厚度挡板挡住；所述防翻挡板压住即将进入漏片孔的晶圆，直到整个晶圆完全进入漏片孔，落在下方的滑片坡道上。
优选地，所述上料台还设有厚度标尺，该厚度标尺用于调节厚度挡板的厚度。
所述滑动坡道的上端开有流水孔，该流水孔通过水泵和管道与晶圆载具保存水箱相连。
载具升降机构主体包括支撑丝杠、伺服电机、载具放置平台，伺服电机驱动支撑丝杠，支撑丝杠支撑载具放置平台。
本发明的优点在于：
本发明结构精巧简单，可实现成叠晶圆的自动分片，并实现自动装入载具卡槽中，大大降低了操作人员的工作强度，提高工作效率，降低人工失误造成晶圆损失的风险。
附图说明
图1为本发明的整机结构立体示意图。
图2为本发明的装载部分立体示意图。
具体实施方式
下面结合附图对本发明做进一步说明，但并不意味着对本发明保护范围的限制。
如图所示，转盘式晶圆自动分片装载机包括主机平台1、上料台2、驱动机构3、传动杆4、分片载具5、滑片坡道6、载具升降机构7、晶圆载具14、以及晶圆载具保存水箱8。其中，主机平台1具有漏片孔；分片载具5设置在主机平台1上，通过传动杆4与驱动机构3相连；分片载具5具有用于容纳晶圆的圆孔；上料台2位于主机平台上方靠近边缘一侧；驱动机构3位于主机平台1的中部上方；滑片坡道6的上端位于主机平台1的漏片孔下方，下端对准晶圆载具14的卡槽；晶圆载具14置于晶圆载具保存水箱8内，并由载具升降机构7控制升降。
上料台2设有厚度挡板11和防翻挡板12，其中厚度挡板11控制每次仅有一片晶圆进入圆孔，其余晶圆被厚度挡板挡住；防翻挡板12压住即将进入漏片孔的晶圆，直到整个晶圆完全进入漏片孔，落在下方的滑片坡道上。
滑动坡道16的上端开有流水孔9，该流水孔9通过水泵10和管道与晶圆载具保存水箱8相连。
本发明在工作过程中，操作人员将成叠的晶圆放在上料台内，晶圆在自然重力作用下接触到分片载具，当分片载具顺时针旋转时，晶圆滑入分片载具上的圆孔中，每个圆孔刚好容纳一片晶圆，其余晶圆被厚度挡板11挡住，只能等待下一个圆孔，实现每次只有一片晶圆能够经过厚度挡板。落入分片载具的圆孔中的晶圆被带向漏片孔方向，通过防翻挡板12防止晶圆在进入漏片孔前发生倾斜，压住即将进入漏片孔的晶圆，直到整个晶圆完全进入漏片孔，落在下方的滑片坡道上。
滑动坡道水泵开启，坡道顶部会有水流下，在活动坡道上形成一层水膜。坡道下方的载具升降机构7的支架13上放置有晶圆载具14，晶圆载具14的卡槽与滑动坡道对齐。在水膜作用下，晶圆会沿着滑动坡道滑到放置在载具升降机构上的晶圆载具的第一个卡槽内。第一片晶圆装入后，载具升降机构自动下降一格，将第二个卡槽位置正对滑动坡道，这样下一片晶圆会划入第二个卡槽之中。这样，本发明实现了晶圆自动分片并装入晶圆载具的动作。
当需要更换另一厚度和直径的产品时，只需要对设备进行简单调整。更换直径时，抬起防翻挡板，取下传动杆抽出分片载具，更换相应直径的分片载具后，将传动杆卡头对准分片载具上的卡口，重新装回即可。更换厚度时，松开固定厚度挡板螺丝，根据参考厚度调节厚度标尺15位置，重新固定螺丝。

Claims (5)

1.一种转盘式晶圆自动分片装载机，其特征在于，包括主机平台、上料台、驱动机构、传动杆、分片载具、滑片坡道、载具升降机构、晶圆载具、以及晶圆载具保存水箱；其中，主机平台具有漏片孔；分片载具设置在主机平台上，通过传动杆与驱动机构相连；分片载具具有用于容纳晶圆的圆孔；上料台位于主机平台上方靠近边缘一侧；驱动机构位于主机平台中部上方；滑片坡道的上端位于主机平台的漏片孔下方，下端对准晶圆载具的卡槽；晶圆载具置于晶圆载具保存水箱内，并由载具升降机构控制升降。
2.根据权利要求1所述的转盘式晶圆自动分片装载机，其特征在于，所述上料台设有厚度挡板和防翻挡板，其中厚度挡板控制每次仅有一片晶圆进入圆孔，其余晶圆被厚度挡板挡住；所述防翻挡板压住即将进入漏片孔的晶圆，直到整个晶圆完全进入漏片孔，落在下方的滑片坡道上。
3.根据权利要求3所述的转盘式晶圆自动分片装载机，其特征在于，所述上料台还设有厚度标尺，该厚度标尺用于调节厚度挡板的厚度。
4.根据权利要求1所述的转盘式晶圆自动分片装载机，其特征在于，所述滑动坡道的上端开有流水孔，该流水孔通过水泵和管道与晶圆载具保存水箱相连。
5.根据权利要求1所述的转盘式晶圆自动分片装载机，其特征在于，载具升降机构主体包括支撑丝杠、伺服电机、载具放置平台，伺服电机驱动支撑丝杠，支撑丝杠支撑载具放置平台。
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CN109590705A (zh) * 2018-12-26 2019-04-09 上海福赛特机器人有限公司 一种晶圆自动装配装置及自动装配方法
CN111627792A (zh) * 2020-07-29 2020-09-04 山东元旭光电股份有限公司 一种晶圆自动装盘装置

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CN102360975A (zh) * 2011-10-11 2012-02-22 天津市津荣天宇精密机械有限公司 灭弧室自动装配机
CN104241186A (zh) * 2014-09-19 2014-12-24 上海集成电路研发中心有限公司 一种晶圆提取装置
CN204441268U (zh) * 2015-02-09 2015-07-01 张家港市超声电气有限公司 硅片分片机构

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Publication number Priority date Publication date Assignee Title
CN109590705A (zh) * 2018-12-26 2019-04-09 上海福赛特机器人有限公司 一种晶圆自动装配装置及自动装配方法
CN109590705B (zh) * 2018-12-26 2020-09-04 上海福赛特机器人有限公司 一种晶圆自动装配装置及自动装配方法
CN111627792A (zh) * 2020-07-29 2020-09-04 山东元旭光电股份有限公司 一种晶圆自动装盘装置
CN111627792B (zh) * 2020-07-29 2020-10-16 山东元旭光电股份有限公司 一种晶圆自动装盘装置

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Patentee after: Youyan semiconductor silicon materials Co.,Ltd.

Address before: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing

Patentee before: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd.