CN106597251B - Microwave chip screening device and screening method thereof - Google Patents
Microwave chip screening device and screening method thereof Download PDFInfo
- Publication number
- CN106597251B CN106597251B CN201611081856.1A CN201611081856A CN106597251B CN 106597251 B CN106597251 B CN 106597251B CN 201611081856 A CN201611081856 A CN 201611081856A CN 106597251 B CN106597251 B CN 106597251B
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- chip
- bottom plate
- circuit component
- base
- pressing plate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a microwave chip screening device and a screening method thereof, the device comprises a base, a clamping tool with a circuit component and a plurality of power supply modules for powering up are respectively arranged on the base, the circuit component is electrically connected with a signal end and a load end of the power supply modules, a power supply output port is arranged at the tail part of the base, and a control box is connected with the power supply output port. The invention realizes nondestructive testing, high-low temperature screening and power-resistant screening of microwave chip components; compared with other methods, the device reduces the scrappage of chips caused by damage; the device can ensure that various microwave chip components are well grounded and has strong applicability. Meanwhile, the clamping tool and the circuit component arranged on the clamping tool can be finely adjusted according to the size of the microwave chip, and redesign of each chip is not needed, so that the clamping tool has the advantages of convenience in operation, good universality, low cost and the like.
Description
Technical Field
The invention relates to the field of microwave chip testing, in particular to a microwave chip screening device and a screening method thereof.
Background
Currently, the existing microwave chip testing method is probe testing or loading into a temporary packaging carrier for testing. However, with the development of industry, performance indexes of a single microwave chip are more and more, and if the full indexes are tested only by using probes, the cost of the microwave chip is increased undoubtedly. Also, the probe method cannot perform low temperature and power resistant screening. In addition, the conventional temporary packaging carrier method is mainly used for elastically pressing the point contact of the chip bonding pad, the acting force is very small, the convex points contacted with the chip are deformed after being tested for many times, and the force acted on the chip by the elastic device is smaller at the moment, so that the high-power microwave chip is not beneficial to ground contact heat dissipation. If the method of vacuum adsorption chip is adopted, an external vacuum pipeline is needed, the equipment cost is increased, and the movement is not facilitated.
The microwave chips are various, the microwave chips are thin and fragile, the testing and screening processes are extremely easy to damage, the problem that various testing devices are not universal is usually encountered during testing, the consumption of single microwave chips is not large, and great waste is caused if a large amount of funds are spent for manufacturing special testing devices.
Disclosure of Invention
The applicant has made research and improvement to the above existing problems, and provides a microwave chip screening device and a screening method thereof, which realize nondestructive testing, high-low temperature screening and power-resistant screening of microwave chip components, and reduce the scrapping condition of chips caused by damage.
The technical scheme adopted by the invention is as follows:
the utility model provides a microwave chip sieving mechanism, includes the base, in set up respectively on the base have the centre gripping frock of circuit part and be used for a plurality of power modules of power on, circuit part is connected with power module's signal end and load end electricity, in the afterbody of base sets up the power output port, the control box with the power output port is connected.
The further technical scheme is as follows:
the specific structure of the clamping tool is as follows:
the device comprises a bottom plate for bearing and positioning a chip component, wherein a plurality of limit sliding grooves are formed in the bottom plate, sliding blocks are slidably arranged in the limit sliding grooves, the sliding blocks are matched with one end of a screw rod with a nut head, the other end of the screw rod penetrates through an adjusting plate and is connected with a bolt, a first pressing plate is further arranged on the surface of the bottom plate, and the first pressing plate is connected with the sliding blocks through fasteners; a second pressing plate for abutting against one end of the chip component is fixedly connected to the surface of the bottom plate;
an opening for extending into the screw rod is formed in the sliding block;
the chip component is formed by eutectic welding of a microwave chip and a tungsten copper carrier;
the end, contacted with the chip component, of the first pressing plate and the end, contacted with the chip component, of the second pressing plate are provided with inclined planes, and an inclined plane of 60+/-1 DEG is formed between the inclined planes and the horizontal plane;
the bottom plate is made of brass materials and is of a U-shaped structure;
the method for screening by using the microwave chip screening device comprises the following steps:
the first step: the first pressing plate 402, the second pressing plate 408, the bolts 403, the adjusting plate 404, the bottom plate 406, the plurality of screws 405 and the plurality of sliding blocks 401 are assembled to form the clamping tool 4;
and a second step of: bonding the circuit component 2 on the bottom plate 406 of the clamping tool 4 by using H20E conductive adhesive, and oven-curing the circuit component 2;
and a third step of: placing the chip part 407 in a limit chute of a bottom plate 406, adjusting the clamping tightness of a screw 405 through a bolt 403, and clamping the chip part 407 through a first pressing plate 402;
fourth step: the chip part 407 and the circuit part 2 are interconnected by gold wires using a gold wire bonder;
fifth step: mounting the power module 6 on the base 3;
connecting the output of the power module 6 to the circuit part 2;
seventh step: loading the clamping fixture 4 with the chip component 407 and the circuit component 2 and the base 3 with the power module 6 into a test box;
eighth step: the external signal end 1 extends into the test box to be electrically connected with the circuit component 2, the input end of the control box 5 is connected with the control end of the power module 6 through a connector, and then the switch of the control box 5 is turned on;
ninth step: if the chip component 407 is normal, the current normal indicator lamp on the control box 5 is normally on; if the chip part 407 burns out, the current normal indicator lamp on the control box 5 is not on.
The beneficial effects of the invention are as follows:
the invention has simple structure and convenient use, can realize simultaneous screening of eight chip components at most, can realize the compaction of the chip components by utilizing the sliding blocks, the screw rods and the pressing plates with the inclined planes in the clamping tool, and can provide downward pressure by the arrangement of the inclined planes so as to provide good grounding performance for the chip components. The invention realizes nondestructive testing, high-low temperature screening and power-resistant screening of microwave chip components; compared with other methods, the device reduces the scrappage of chips caused by damage; the device can ensure that various microwave chip components are well grounded and has strong applicability. Meanwhile, the clamping tool and the circuit component arranged on the clamping tool can be finely adjusted according to the size of the microwave chip, and redesign of each chip is not needed, so that the clamping tool has the advantages of convenience in operation, good universality, low cost and the like.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a front view of the present invention.
Fig. 3 is a top view of the present invention.
Fig. 4 is a schematic diagram of a partial cross-sectional structure of a clamping tool according to the present invention.
Fig. 5 is a schematic cross-sectional structure of the clamping tool in the present invention.
Fig. 6 is a schematic perspective view of a slider according to the present invention.
Wherein; 1. externally connecting a signal end; 2. a circuit component; 3. a base; 4. clamping a tool; 401. a slide block; 4011. an opening; 402. a first platen; 403. a bolt; 404. an adjusting plate; 405. a screw; 406. a bottom plate; 407. a chip component; 408. a second pressing plate; 5. a control box; 6. and a power supply module.
Detailed Description
The following describes specific embodiments of the present invention.
As shown in fig. 1, 2 and 3, a microwave chip screening device and a screening method thereof include a base 3, a clamping tool 4 with a circuit component 2 and a plurality of power modules 6 for powering up are respectively arranged on the base 3, the circuit component 2 is electrically connected with a signal end and a load end of the power modules 6, a power output port is arranged at the tail of the base 3, and a control box 5 is connected with the power output port.
As shown in fig. 2, 4, 5 and 6, the specific structure of the clamping tool 4 is as follows:
the chip component 407 is arranged on a base plate 406, the base plate 406 is provided with a plurality of limiting sliding grooves, a sliding block 401 is slidably arranged in each limiting sliding groove, the sliding block 401 is matched with one end of a screw rod 405 with a nut head, the other end of the screw rod 405 penetrates through an adjusting plate 404 and is connected with a bolt 403, a first pressing plate 402 is further arranged on the surface of the base plate 406, and the first pressing plate 402 is connected with the sliding block 401 through a fastener; a second pressing plate 408 for abutting against one end of the chip component 407 is fixedly connected to the surface of the bottom plate 406. As shown in fig. 6, an opening 4011 for extending into the screw 405 is formed in the slider 401. The chip member 407 is formed by eutectic soldering of a microwave chip and a tungsten copper carrier. The end of the first pressing plate 402 contacted with the chip component 407 and the end of the second pressing plate 408 contacted with the chip component 407 are both provided with inclined planes, an inclined plane of 60+/-1 degrees (given a range value) is formed between the inclined planes and the horizontal plane, the chip component 407 can be effectively clamped by the inclined planes arranged on the first pressing plate 402 and the second pressing plate 408, and the inclined planes simultaneously provide downward pressure during clamping, so that good grounding performance is provided for the chip component 407. The bottom plate 406 is made of brass, the bottom plate 406 is of a U-shaped structure, the power module 6 at least provides stable power supply for the two chip components 407, the circuit component 2 can ensure stable input of electric signals and microwave signals of the 8 chip components 407, the control box 5 can ensure detection of electric signals and currents of the 4 power modules 6, and the base 3 can at least fix the 4 power modules 6 and the clamping tool 4.
A method for chip screening with a microwave chip screening apparatus, comprising the steps of:
the first step: as shown in fig. 1, 2, 3 and 4, a first pressing plate 402 and a sliding block 401 are fixedly connected through a fastener, a plurality of threaded holes for installing the fastener are formed in the sliding block 401, and clamping of chip components with different lengths is met; each screw 405 is then passed through the adjustment plate 404, and a bolt 403 is attached to one end of each screw 405. Then, the sliding block 401 with the first pressing plate 402 is placed in the limit chute of the bottom plate 406, meanwhile, the adjusting plate 404 is placed in the opening of the bottom plate 406, the nut heads of all the screws 405 on the adjusting plate 404 extend into the opening 4011 of the sliding block 401, the sliding block 401 can slide in the limit chute through the rotating bolts 403, and as the sliding block 401 is fixedly connected with the first pressing plate 402, the clamping tightness of the first pressing plate 402 on the chip part 407 can be adjusted, meanwhile, the second pressing plate 408 is fixedly connected in the surface groove of the bottom plate 406 through screws, and when the chip part 407 is clamped, the inclined plane of the second pressing plate 408 is also abutted against the chip part 407.
And a second step of: bonding the circuit part 2 on the bottom plate 406 of the clamping tool 4 by using H20E conductive adhesive, and oven-curing the circuit part 2;
and a third step of: placing the chip part 407 in a limit chute of a bottom plate 406, adjusting the clamping tightness of a screw 405 through a bolt 403, and clamping the chip part 407 through a first pressing plate 402;
fourth step: the chip part 407 and the circuit part 2 are interconnected by gold wires using a gold wire bonder;
fifth step: the power module 6 is mounted on the base 3.
Connecting the output of the power module 6 to the circuit part 2;
seventh step: loading the clamping fixture 4 with the chip component 407 and the circuit component 2 and the base 3 with the power module 6 into a test box;
eighth step: the external signal end 1 extends into the test box to be electrically connected with the circuit component 2, the input end of the control box 5 is connected with the control end of the power module 6 through a connector, and then the switch of the control box 5 is turned on;
ninth step: the current normal indicator lamp on the control box 5 is normally on; if the chip part 407 burns out, the current normal indicator lamp on the control box 5 is not on.
The invention has simple structure and convenient use, can realize simultaneous screening of eight chip components at most, can realize the compaction of the chip components by utilizing the sliding blocks, the screw rods and the pressing plates with the inclined planes in the clamping tool, and can provide downward pressure by the arrangement of the inclined planes so as to provide good grounding performance for the chip components. The invention realizes nondestructive testing, high-low temperature screening and power-resistant screening of microwave chip components; compared with other methods, the device reduces the scrappage of chips caused by damage; the device can ensure that various microwave chip components are well grounded and has strong applicability. Meanwhile, the clamping tool and the circuit component arranged on the clamping tool can be finely adjusted according to the size of the microwave chip, and redesign of each chip is not needed, so that the clamping tool has the advantages of convenience in operation, good universality, low cost and the like.
The above description is illustrative of the invention and not limiting, the scope of the invention being defined by the appended claims, which may be modified in any manner without departing from the basic structure of the invention.
Claims (4)
1. A microwave chip sieving mechanism, its characterized in that: the power supply device comprises a base (3), wherein a clamping tool (4) with a circuit component (2) and a plurality of power supply modules (6) for power up are respectively arranged on the base (3), the circuit component (2) is electrically connected with a signal end and a load end of the power supply modules (6), a power supply output port is arranged at the tail part of the base (3), and a control box (5) is connected with the power supply output port;
the specific structure of the clamping tool (4) is as follows: the device comprises a bottom plate (406) for bearing and positioning a chip component (407), wherein a plurality of limit sliding grooves are formed in the bottom plate (406), a sliding block (401) is slidably arranged in each limit sliding groove, the sliding block (401) is matched with one end of a screw rod (405) with a nut head, the other end of the screw rod (405) penetrates through an adjusting plate (404) and is connected with a bolt (403), a first pressing plate (402) is further arranged on the surface of the bottom plate (406), and the first pressing plate (402) is connected with the sliding block (401) through a fastener; a second pressing plate (408) for abutting against one end of the chip component (407) is fixedly connected to the surface of the bottom plate (406);
an opening 4011 for extending into the screw rod 405 is formed in the sliding block 401;
the chip component (407) is formed by eutectic soldering of a microwave chip and a tungsten copper carrier.
2. A microwave chip screening apparatus according to claim 1, wherein: an inclined plane is formed between the inclined plane and the horizontal plane, wherein the inclined plane is formed at one end of the first pressing plate (402) contacted with the chip component (407) and one end of the second pressing plate (402) contacted with the chip component (407).
3. A microwave chip screening apparatus according to claim 1, wherein: the bottom plate (406) is made of brass materials, and the bottom plate (406) is of a U-shaped structure.
4. A method of screening using the microwave chip screening apparatus according to claim 1, comprising the steps of:
the first step: the first pressing plate 402, the second pressing plate 408, the bolts 403, the adjusting plate 404, the bottom plate 406, the plurality of screws 405 and the plurality of sliding blocks 401 are assembled to form the clamping tool 4;
and a second step of: bonding the circuit component 2 on the bottom plate 406 of the clamping tool 4 by using H20E conductive adhesive, and oven-curing the circuit component 2;
and a third step of: placing the chip part 407 in a limit chute of a bottom plate 406, adjusting the clamping tightness of a screw 405 through a bolt 403, and clamping the chip part 407 through a first pressing plate 402;
fourth step: the chip part 407 and the circuit part 2 are interconnected by gold wires using a gold wire bonder;
fifth step: mounting the power module 6 on the base 3;
sixth step: the clamping tool 4 with the chip component 407 and the circuit component 2 is fixedly connected to the base 3 through a fastener, and the output end of the power module 6 is connected with the circuit component 2;
seventh step: loading the clamping fixture 4 with the chip component 407 and the circuit component 2 and the base 3 with the power module 6 into a test box;
eighth step: the external signal end 1 extends into the test box to be electrically connected with the circuit component 2, the input end of the control box 5 is connected with the control end of the power module 6 through a connector, and then the switch of the control box 5 is turned on;
ninth step: if the chip component 407 is normal, the current normal indicator lamp on the control box 5 is normally on; if the chip part 407 burns out, the current normal indicator lamp on the control box 5 is not on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611081856.1A CN106597251B (en) | 2016-11-30 | 2016-11-30 | Microwave chip screening device and screening method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611081856.1A CN106597251B (en) | 2016-11-30 | 2016-11-30 | Microwave chip screening device and screening method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106597251A CN106597251A (en) | 2017-04-26 |
| CN106597251B true CN106597251B (en) | 2023-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611081856.1A Active CN106597251B (en) | 2016-11-30 | 2016-11-30 | Microwave chip screening device and screening method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186656B (en) * | 2018-09-05 | 2021-08-27 | 北京特种机械研究所 | Method for realizing sensor stability detection by utilizing sensor characteristic detection and screening device |
| CN111398790A (en) * | 2020-04-29 | 2020-07-10 | 苏州创瑞机电科技有限公司 | Optical chip module testing device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2748923Y (en) * | 2004-11-30 | 2005-12-28 | 四川微迪数字技术有限公司 | Test tool set up for integrated circuit chip |
| JP2012228638A (en) * | 2011-04-25 | 2012-11-22 | Young Tek Electronics Corp | Mounted chip test/selection device |
| CN103364710A (en) * | 2013-07-12 | 2013-10-23 | 陕西千山航空电子有限责任公司 | BGA chip screening device and BGA chip screening method |
| CN206223929U (en) * | 2016-11-30 | 2017-06-06 | 无锡华测电子系统有限公司 | A kind of microwave chip screening plant |
-
2016
- 2016-11-30 CN CN201611081856.1A patent/CN106597251B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2748923Y (en) * | 2004-11-30 | 2005-12-28 | 四川微迪数字技术有限公司 | Test tool set up for integrated circuit chip |
| JP2012228638A (en) * | 2011-04-25 | 2012-11-22 | Young Tek Electronics Corp | Mounted chip test/selection device |
| CN103364710A (en) * | 2013-07-12 | 2013-10-23 | 陕西千山航空电子有限责任公司 | BGA chip screening device and BGA chip screening method |
| CN206223929U (en) * | 2016-11-30 | 2017-06-06 | 无锡华测电子系统有限公司 | A kind of microwave chip screening plant |
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| CN106597251A (en) | 2017-04-26 |
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