CN218937964U

CN218937964U - Test fixture for power semiconductor module test

Info

Publication number: CN218937964U
Application number: CN202222708363.3U
Authority: CN
Inventors: 林艺宾
Original assignee: Suzhou Industrial Park District High Tech Electronic Technology Co ltd
Current assignee: Suzhou Industrial Park District High Tech Electronic Technology Co ltd
Priority date: 2022-10-14
Filing date: 2022-10-14
Publication date: 2023-04-28
Anticipated expiration: 2032-10-14

Abstract

The utility model discloses a test fixture for testing an electric power semiconductor module, which comprises a first fixture connecting piece and a second fixture connecting piece, wherein the first fixture connecting piece is connected with a substrate fixing block, the second fixture connecting piece is connected with a push head, an adhesive tape groove is formed in the push head, a fixed clamping piece and a movable clamping piece are arranged in the adhesive tape groove, the movable clamping piece is movably connected with a first fastening bolt, and the first fastening bolt is in threaded connection with the push head. The adhesive tape is matched in the adhesive tape groove and is positioned between the fixed clamping piece and the movable clamping piece, a detector acts on the first fastening bolt to drive the movable clamping piece to move towards the fixed clamping piece, and the movable clamping piece and the fixed clamping piece clamp the adhesive tape. According to the test fixture for the electric power semiconductor module test, when the pushing head is provided with the adhesive tape, no glue remains on the pushing head, and the flatness of the force application surface of the pushing block is affected; the adhesive tape is convenient to replace, and the steps of gluing, adhesive tape alignment and adhesive removal are not needed.

Description

Test fixture for power semiconductor module test

Technical Field

The utility model relates to electronic product detection, in particular to semiconductor detection equipment.

Background

The power semiconductor is a high-power device for power conversion and control, and can be directly used in a main circuit for processing electric energy to realize conversion or control of the electric energy. The method is mainly used for rectifier, inverter, chopper, AC voltage regulator and the like, and is widely used in various fields of industrial and agricultural production, national defense, traffic and the like.

The power semiconductor can be arranged on the substrate by a sintering patch technology, and the mounting quality of the surface-mounted element can be realized by three means of welding appearance inspection, shearing force and metallographic sectioning and grinding. The shear strength test of the semiconductor chip is to determine the quality of the substrate attached to the chip by measuring the shear force applied to the chip and observing the failure type.

In order to meet the requirements of the shearing strength part of the chip on the chip contact tool in the method 2019.2 in GJB548B-2005 'microelectronic device test method and program', the clamp in the test needs to ensure that the force is uniformly applied to one edge of the chip, and the contact plane of the clamp and the chip is perpendicular to the plane of the chip attached on the substrate.

The application publication number CN 111426554A discloses a semiconductor chip high temperature shear test fixture, including connecting in output actuating mechanism's first anchor clamps connecting piece and second anchor clamps connecting piece, first anchor clamps connecting piece is connected with the base plate fixed block, and the second anchor clamps connecting piece is connected with the push head. The pushing head is used for applying force to the semiconductor chip, the force application end face of the pushing head is perpendicular to the substrate, and the lower surface of the pushing head is parallel to the substrate. The adhesive tape is fixed on the force application end face of the pushing head and is used for contacting the semiconductor chip, so that the force application of the semiconductor chip is uniform, and the test reliability is ensured.

The adhesive tape is made of high temperature resistant plastic or rubber. The adhesive tape can deform to a certain extent according to the shape of the direct stress surface of the semiconductor chip in the test process, which is beneficial to the uniform stress of the semiconductor chip and prevents uneven stress caused by irregular edge shapes of the semiconductor chip contacted with the push head. And the adhesive tape is required to be replaced after the test is finished, so that insufficient contact between the deformed adhesive tape and the semiconductor chip during secondary use is prevented.

The adhesive tape is adhered to the force application end surface of the push head, and cannot be used secondarily, and when the adhesive tape is replaced, the adhesive tape needs to be removed from the push head. If the adhesive tape is not firmly adhered to the push head, the situation of falling off can occur. If the adhesive tape is firmly glued with the push head, the worker is not easy to take off the adhesive tape from the push head.

Disclosure of Invention

The technical problems solved by the utility model are as follows: the connection and the separation of the adhesive tape and the push head are convenient.

In order to solve the technical problems, the utility model provides the following technical scheme: the test fixture for the power semiconductor module test comprises a first fixture connecting piece and a second fixture connecting piece, wherein the first fixture connecting piece is connected with a substrate fixing block, the second fixture connecting piece is connected with a push head, an adhesive tape groove is formed in the push head, a fixed clamping piece and a movable clamping piece are arranged in the adhesive tape groove, the movable clamping piece is movably connected with a first fastening bolt, and the first fastening bolt is in threaded connection with the push head.

One end of the first clamp connecting piece is fixed on a load sensor of the output actuating mechanism through a fastening screw, and the other end of the first clamp connecting piece is connected with the substrate fixing block. One end of the second clamp connecting piece is fixed on a clamp connecting frame of the output actuating mechanism, and the other end of the second clamp connecting piece is connected with the push head.

The substrate of the power semiconductor module to be tested is fixed on the substrate fixing block, and the surface of the push head facing the semiconductor chip of the power semiconductor module is a force application end surface, and the area of the force application end surface is close to the direct stress surface of the semiconductor chip. The force application end surface of the pusher acts on the side surface of the semiconductor chip to apply a shearing force to the power semiconductor module under the drive of the output actuating mechanism. When the semiconductor chip is separated from the substrate, the load sensor detects the maximum shearing force applied by the test fixture to the power semiconductor module. The inspector determines whether the power semiconductor module is a qualified product based on the maximum shearing force.

When the force application end surface of the push head acts on the side surface of the semiconductor chip, the adhesive tape is in direct contact with the semiconductor chip. The adhesive tape is matched in the adhesive tape groove and is positioned between the fixed clamping piece and the movable clamping piece, a detector acts on the first fastening bolt to drive the movable clamping piece to move towards the fixed clamping piece, and the movable clamping piece and the fixed clamping piece clamp the adhesive tape.

The adhesive tape can deform to a certain extent according to the shape of the direct stress surface of the semiconductor chip in the test process, which is beneficial to the uniform stress of the semiconductor chip and prevents uneven stress caused by irregular edge shapes of the semiconductor chip contacted with the push head. And the adhesive tape is required to be replaced after the test is finished, so that insufficient contact between the deformed adhesive tape and the semiconductor chip during secondary use is prevented.

When the adhesive tape is replaced, a detector loosens the first fastening bolt, the movable clamping piece is far away from the fixed clamping piece, the detector takes out the adhesive tape from the adhesive tape groove, and then a new adhesive tape is installed.

The structure of the push head assembly adhesive tape of the test clamp for the electric power semiconductor module test has the following technical effects: firstly, no glue remains on the push head, which affects the flatness of the force application surface of the push block; second, it is convenient to change the adhesive tape, need not rubberizing, adhesive tape counterpoint, remove the gluey step.

Drawings

The utility model is further described with reference to the accompanying drawings:

FIG. 1 is a schematic diagram of a test fixture for testing power semiconductor modules;

FIG. 2 is a schematic illustration of a pusher;

FIG. 3 is an exploded view of FIG. 2;

fig. 4 is a schematic view of the movable clamp plate in fig. 3.

The symbols in the drawings illustrate:

10. a first clamp connection;

20. a second clamp connection;

30. a substrate fixing block;

40. pushing heads; 401. a first threaded hole mated with the first fastening bolt; 402. a second threaded hole mated with the second fastening bolt; 41. a rubber strip groove; 42. an adhesive tape;

50. fixing the clamping piece;

60. a movable clamping piece; 601. a chute; 61. a first fastening bolt; 62. a second fastening bolt; 63. a slide block; 630. a pin joint hole; 64. a limit bar;

71. a substrate of the power semiconductor module; 72. a semiconductor chip.

Detailed Description

Referring to fig. 1 to 3, the test fixture for testing the power semiconductor module comprises a first fixture connecting piece 10 and a second fixture connecting piece 20, wherein the first fixture connecting piece is connected with a substrate fixing block 30, the second fixture connecting piece is connected with a push head 40, an adhesive tape groove 41 is formed in the push head, a fixed clamping piece 50 and a movable clamping piece 60 are arranged in the adhesive tape groove, the movable clamping piece is movably connected with a first fastening bolt 61, and the first fastening bolt is in threaded connection with the push head.

One end of the first clamp connector 10 is fixed to the load sensor of the output actuating mechanism by a fastening screw, and the other end is connected to the substrate fixing block 30. One end of the second clamp connector 20 is fixed to the clamp connecting frame of the output actuating mechanism, and the other end is connected to the push head 40. The substrate 71 of the power semiconductor module to be tested is fixed on the substrate fixing block 30 by a screw connection, and the side of the pusher 40 facing the semiconductor chip 72 of the power semiconductor module is a force application end surface. The force application end surface of the pusher 40 acts on the side surface of the semiconductor chip 72 by the drive of the output actuator, and applies a shearing force to the power semiconductor module. When the semiconductor chip 72 is detached from the substrate 71, the load sensor detects the maximum shear force applied to the power semiconductor module by the test jig. The inspector determines whether the power semiconductor module is a qualified product based on the maximum shearing force.

When the urging end surface of the pusher 40 acts on the side surface of the semiconductor chip 72, the adhesive tape 42 directly contacts the semiconductor chip. The adhesive tape 42 is matched in the adhesive tape groove 41 and is positioned between the fixed clamping piece 50 and the movable clamping piece 60, and a detector acts on the first fastening bolt 61 to drive the movable clamping piece to move towards the fixed clamping piece, and the movable clamping piece and the fixed clamping piece clamp the adhesive tape 42.

When the adhesive tape 42 is replaced, the inspector loosens the first fastening bolt 61, the movable clamping piece 60 is far away from the fixed clamping piece 50, and the inspector takes out the adhesive tape from the adhesive tape groove 41 and installs a new adhesive tape.

The fixed clip 50 and the movable clip 60 are each L-shaped. The L-shaped fixed holding piece and the L-shaped movable holding piece are rectangular in shape as a whole in the adhesive tape groove 41. The glue strip 42 is located in the rectangle.

The push head 40 is screwed with a second fastening bolt 62, which abuts against the movable clamping piece 60, and the second fastening bolt is perpendicular to the first fastening bolt 61. The L-shaped movable holding piece 60 has a right-angle side as a long side and the other right-angle side as a short side. Then, the first fastening bolt 61 is movably connected to the long side, and the second fastening bolt 62 abuts against the short side. The first fastening bolt 61 clamps the adhesive tape 42 laterally and the second fastening bolt 62 clamps the adhesive tape longitudinally.

As shown in fig. 4, the movable clamping piece 60 is provided with a sliding groove 601, a sliding block 63 is matched in the sliding groove, the sliding block is provided with a pivot hole 630, and the first fastening bolt 61 is pivoted in the pivot hole through a bearing. In this way, the first fastening bolt 61 is operated by the inspector, the long side of the movable clip 60 is displaced laterally to the long side of the fixed clip 50, and the second fastening bolt 62 is operated by the inspector, and the slider 63 is slidable in the slide groove 601, so that the second fastening bolt 62 can drive the short side of the movable clip 60 to displace longitudinally to the short side of the fixed clip 50. In this way, the movable holding piece 60 cooperates with the fixed holding piece 50 to clamp the adhesive tape 42 from both the longitudinal and transverse directions, and the position of the adhesive tape is stabilized.

The push head 40 is provided with a limit bar 64 for limiting the slide block 63 in the slide groove 601. When the slider is installed, the slider is first fitted in the sliding groove 601, and then the limiting bar 64 is installed on the push head 40 again, so as to limit the slider in the sliding groove.

The fixing and clamping piece 50 is fixed in the adhesive tape groove 41, and the fixing mode can be welding, gluing or fixing through a threaded connecting piece.

The foregoing is merely illustrative of the preferred embodiments of the present utility model, and modifications in detail will readily occur to those skilled in the art based on the teachings herein without departing from the spirit and scope of the utility model.

Claims

1. Test fixture for power semiconductor module test, including first anchor clamps connecting piece (10) and second anchor clamps connecting piece (20), first anchor clamps connecting piece is connected with base plate fixed block (30), and second anchor clamps connecting piece is connected with push head (40), its characterized in that: the push head is provided with an adhesive tape groove (41), a fixed clamping piece (50) and a movable clamping piece (60) are arranged in the adhesive tape groove, the movable clamping piece is movably connected with a first fastening bolt (61), and the first fastening bolt is in threaded connection with the push head.

2. The test fixture for testing a power semiconductor module according to claim 1, wherein: the fixed clamping piece (50) and the movable clamping piece (60) are L-shaped.

3. The test fixture for testing a power semiconductor module according to claim 2, wherein: the push head (40) is in threaded connection with a second fastening bolt (62), the second fastening bolt is propped against the movable clamping piece (60), and the second fastening bolt is perpendicular to the first fastening bolt (61).

4. The test fixture for testing a power semiconductor module according to claim 1, wherein: a sliding groove (601) is formed in the movable clamping piece (60), a sliding block (63) is matched in the sliding groove, and the sliding block is pivoted with the first fastening bolt (61).

5. The test fixture for testing a power semiconductor module according to claim 4, wherein: the push head (40) is provided with a limit bar (64) for limiting the slide block (63) in the chute (601).

6. The test fixture for testing a power semiconductor module according to claim 1, wherein: the fixed clamping piece (50) is fixed in the adhesive tape groove (41).