CN210376092U - Wafer adhesion force testing machine - Google Patents
Wafer adhesion force testing machine Download PDFInfo
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- CN210376092U CN210376092U CN201921283044.4U CN201921283044U CN210376092U CN 210376092 U CN210376092 U CN 210376092U CN 201921283044 U CN201921283044 U CN 201921283044U CN 210376092 U CN210376092 U CN 210376092U
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Abstract
The utility model provides a wafer adhesion test machine, utilize the cylinder to drive the rotatory chuck and press from both sides tight material, because the step distance of cylinder is fixed controllable, so utilize such an automatic equipment to press from both sides tight material and be firm and have the reliability, thus can improve the stability of centre gripping and the credibility of experiment, and set up the blotter in the head end of rotatory chuck, can well contact with the material to be tested and can press from both sides tight material, and can not produce excessive injury to the material, reduce the influence that the human factor brought to the test experiment; the clamping of the material to be tested is realized by arranging the rotary pressure head, so that the influence of human factors on the experiment is eliminated to the maximum extent; the positions of the thrust shaft and the material to be tested are adjusted by utilizing the micrometer adjusting block, and observation is assisted by a microscope, so that the thrust tester and the material to be tested are in contact with each other with the relative acting force close to zero to the maximum extent, and the reliability of an experiment is ensured.
Description
Technical Field
The utility model relates to a wafer detection technology field especially relates to a wafer adhesive force test machine.
Background
In the current production technology, a wafer is adhered to an antenna sheet by using specific glue, for example, a chip structure in a bus card is that a chip is adhered to the antenna sheet by using glue. Obviously, the method is influenced by factors such as the dispensing position, the contact area between the chip and the antenna sheet, the glue quality and the like, so that the adhesion test of the wafer is required before mass production after proofing. Also for example, some wafers fixed by bonding wires need quality inspection, and adhesion testing is one of the more critical experiments.
But some testing arrangement at present need the manual work place test material back turn round tight frock and reach fixed effect, but everybody's gimmick and dynamics of using and to require to be different to firm assembly, so lead to the credibility of test can not ensure to reach the requirement, and degree of automation is not high.
SUMMERY OF THE UTILITY MODEL
To the weak point that exists in the above-mentioned technique, the utility model provides a wafer adhesive force test machine utilizes mechanical automation's control to realize compressing tightly the material that awaits measuring, lets thrust experiment reduce the influence of human factor, makes it have more the credibility.
The utility model discloses specifically do: the utility model provides a wafer adhesion test machine, includes the mounting panel, still includes:
the device comprises a thrust tester, a servo drive screw rod module, an extension rod, a thrust shaft and a test piece, wherein the thrust tester is connected with the servo drive screw rod module, a push head of the thrust tester is connected with the extension rod arranged above a mounting plate, the tail end of the extension rod is connected with the thrust shaft, and the tail end of the thrust shaft is contacted with a material to be tested;
the pressure head assembly: the device comprises a rotary pressure head and an air cylinder, wherein an output shaft of the air cylinder is connected with the tail end of the rotary pressure head, and the output shaft of the air cylinder reciprocates in the vertical direction to drive the head end of the rotary pressure head to be close to the surface of an installation plate or far away from the surface of the installation plate;
the output shaft of the air cylinder drives the rotary pressure head to compress a material to be tested, and the servo driving screw rod module pushes the thrust tester to perform testing action.
Preferably, the indenter assembly further includes a fixing portion; the fixing part is fixed on the lower surface of the mounting plate and is provided with a bearing, the rotary pressure head is arranged above the mounting plate and is provided with a protruding part, the mounting plate is provided with a first through hole for the protruding part to pass through, the protruding part is provided with a second through hole, and the bearing passes through the second through hole to form a structure that the rotary pressure head rotates around the bearing; the head end of the rotary pressure head is provided with a groove for the thrust shaft to pass through, the tail end of the rotary pressure head is provided with a third through hole, and the third through hole accommodates the output shaft of the cylinder and is abutted against each other; the output shaft drives the head end of the rotary pressure head to compress the material to be tested.
Preferably, the area, where the material to be tested is placed, of the mounting plate is provided with a vacuum adsorption hole, the vacuum adsorption hole is connected with a vacuum machine to provide negative pressure, the vacuum adsorption hole adsorbs the material to be tested, and the rotary pressure head compresses the material to be tested.
Preferably, the mounting plate further comprises a bottom plate, and the bottom plate and the mounting plate enclose to form a cavity; the thrust tester also comprises a micrometer adjusting block, the micrometer adjusting block is connected with the servo drive lead screw module, the servo drive lead screw module is connected with the bottom plate, and the thrust tester is connected with the micrometer adjusting block to adjust the position of the thrust tester.
Preferably, the micrometer adjusting block is connected with an induction sheet, the bottom plate is fixed with two U-shaped photoelectric switches, the induction sheet moves between the first U-shaped photoelectric switch and the second U-shaped photoelectric switch, the position of the thrust tester is adjusted, the induction sheet moves along with the induction sheet, and the first U-shaped photoelectric switch and the second U-shaped photoelectric switch sense the induction sheet to give an alarm.
Preferably, a rubber pad is arranged on one side, close to the mounting plate, of the head end of the rotary pressure head and compresses materials to be tested.
Preferably, the mounting plate is further provided with a microscope, and the microscope lens is aligned to the material to be tested.
Preferably, the mounting plate is further provided with a display screen, and the display screen is connected with the thrust tester.
The utility model has the advantages that: in the prior art, a tool clamp similar to a chuck is generally used for clamping a material to be tested, and then a thrust meter is used for a thrust test; however, when the fixture is used for fixing, the workpiece needs to be screwed manually to clamp the material to be tested, so that different test results can be obtained due to inconsistent clamping degrees of different personnel when the same batch of materials are tested, and the reliability of the experiment is influenced;
and the utility model discloses in, utilize the cylinder to drive rotatory chuck and press from both sides tight material, because the step-by-step distance of cylinder is fixed controllable, so utilize the equipment of so an automation to come to press from both sides tight material and be firm and have the reliability again promptly to can improve the stability of centre gripping and the credibility of experiment, and set up the blotter at the head end of rotatory chuck, can be good with the material contact that awaits measuring also can press from both sides tight material, and can not produce excessive injury to the material, reduce the influence that the human factor brought for the test experiment.
Drawings
Fig. 1 is a perspective view of the present invention;
FIG. 2 is a schematic structural view of the thrust tester of the present invention;
FIG. 3 is a side view of the thrust tester of the present invention;
fig. 4 is a schematic structural view of the pressure head assembly of the present invention;
FIG. 5 is a schematic structural view of the pressing head assembly when the mounting plate is not installed in the present invention;
fig. 6 is a front view schematically illustrating the present invention.
The main element symbols are as follows:
1. mounting a plate; 11. a first through hole; 12. a vacuum adsorption hole; 13. a microscope; 14. a display screen; 2. a thrust tester; 21. an extension rod; 22. a thrust shaft; 23. a micrometer adjusting block; 231. an induction sheet; 3. a ram assembly; 31. rotating the pressure head; 312. a third through hole; 32. a cylinder; 321. an output shaft; 33. a fixed part; 34. a protrusion; 341. a second through hole; 35. a rubber pad; 4. a base plate; 41. a first U-shaped photoelectric switch; 42. a second U-shaped photoelectric switch; 5. the servo drive screw rod module.
Detailed Description
In order to make the present invention clearer, the present invention will be further described with reference to the accompanying drawings.
The utility model provides a wafer adhesion test machine, please refer to fig. 1-3, include mounting panel 1 specifically, still include thrust tester 2, thrust tester 2 is connected with servo drive lead screw module, and the pusher of thrust tester 2 is connected with the extension rod 21 that sets up above the mounting panel, and the tail end of extension rod 21 is connected with thrust shaft 22, and the end of thrust shaft 22 contacts the material to be tested; the pressure head assembly 3 comprises a rotary pressure head 31 and a cylinder 32, an output shaft 321 of the cylinder 32 is connected with the tail end of the rotary pressure head 31, and the output shaft 321 of the cylinder reciprocates in the vertical direction to drive the head end of the rotary pressure head 31 to be close to the surface of the mounting plate or to be far away from the surface of the mounting plate 1; the output shaft 321 of cylinder drives rotatory pressure head 31 and compresses tightly the material that awaits measuring, and servo drive lead screw module 5 promotes the thrust tester and tests, and thrust shaft 22 is promoted by thrust tester 21 and is tested the action, and the horizontal direction pushes away the wafer to peeling off, and the thrust tester shows the thrust peak value, also is exactly the adhesive force of wafer. The thrust tester is taken as the existing equipment, wherein the principle is not repeated, but the application mode is very various, and the thrust tester is applied to the adhesion test of products such as wafers, chips or LED wafers, and the like, and the degree of the adhesion test is not satisfactory, because in the prior art, the adhesion test of most wafers usually adopts two modes: firstly, a hand-held thrust tester is utilized, so that a rough measurement mode is only suitable for products with low requirements; secondly, utilize frock clamp to grasp the wafer that awaits measuring, then test by the thrust tester, but this frock clamp often needs the artifical clamp plate of screwing, and this condition that will cause the centre gripping unstable appears, and then also have the human factor that can't avoid to produce the influence to the reliability of experiment. And the utility model discloses having utilized the cylinder to realize the clamp of rotatory pressure head tightly and relaxing, stopped the influence of human factor completely, can be artificial settlement because the step volume of cylinder, just go on according to same displacement volume in the experimentation many times, it is all on the material that awaits measuring is applyed to same dynamics on the rotatory chuck to react to the needs clamp tightly when the material, can guarantee firmly, also can stop the influence that the human factor brought.
In the present embodiment, referring to fig. 4-5, the pressing head assembly 3 further includes a fixing portion 33; the fixing part 33 is fixed on the lower surface of the mounting plate 1 and is provided with a bearing 331, the rotary pressure head 31 is arranged above the mounting plate 1 and is provided with a protruding part 34, the mounting plate 1 is provided with a first through hole 11 for the protruding part to pass through, the protruding part 34 is provided with a second through hole 341, and the bearing 332 is arranged by passing through the second through hole 341, so that the structure that the rotary pressure head 31 rotates around the bearing 332 is formed; the head end of the rotary pressure head 31 is provided with a groove 311 for the thrust shaft 22 to pass through, the tail end is provided with a third through hole 312, and the third through hole 312 accommodates an output shaft 321 of the cylinder 32 and is abutted against each other; the output shaft 321 drives the head end of the rotary pressure head to compress the material to be tested. As the scheme of optimizing more, utilize the structure of a similar lever to realize the function, more stable also more save the resource, and set up fixed bearing's place at the lower surface of mounting panel, be favorable to practicing thrift the space promptly, also can let rotatory pressure head need not rotate too big angle and just can compress tightly the material that awaits measuring, and set up the recess that supplies the thrust shaft to pass at the head end of rotatory pressure head, the thrust shaft does not contact with rotary joint, and can set up and carry out the test experiment in same side, because the length of pressure head is limited, if the effort direction of thrust shaft is to rotatory pressure head, need to open very long groove on the pressure head and guarantee the experimentation, the atress of the material that awaits measuring is stable even, the setting can practice thrift overall structure's design space in the syntropy.
In this embodiment, please refer to fig. 3-4, the bottom of the head end of the rotary press head 31 is provided with the rubber pad 35, and the rubber pad 35 compresses the material to be tested, so that the rubber pad has excellent flexibility for the rotary press head made of rubber metal material, and the material to be tested can be compressed by the rotary press head only by doing a rotary motion, so as to achieve better compression, only the head end of the rotary press head can be ground into a round corner or a chamfer, but a sharp edge may also have higher pressure, and for some materials, the antenna sheet of the material to be tested may be broken first, so that the test effect cannot be achieved, so that a rubber pad is provided, which not only increases friction, but also makes the stress more uniform during clamping, and also achieves the whole experiment better.
In this embodiment, please refer to fig. 1-6, a vacuum absorption hole 12 is formed in a region where a material to be tested is placed on a mounting plate 1, the vacuum absorption hole 12 is connected to a vacuum machine to provide negative pressure, the vacuum absorption hole 12 absorbs the material to be tested, a rotary pressure head compresses the material to be tested, the vacuum absorption hole can well ensure that no dust or other protrusions exist when the material to be tested contacts the surface of the mounting plate, and can help an operator to place the material smoothly and provide clamping force synchronously with the rotary pressure head.
In the present embodiment, please refer to fig. 2-4, further comprising a bottom plate 4, wherein the bottom plate 4 and the mounting plate 1 enclose to form a cavity; the thrust tester 2 also comprises a micrometer adjusting block 23, the micrometer adjusting block 23 is connected with the servo driving lead screw module 5, the servo driving lead screw module 5 is connected with the bottom plate 4, and the thrust tester 2 is connected with the micrometer adjusting block 23; and controlling the micrometer adjusting block 23 to adjust the position of the thrust tester 2. Because in actual operation, need earlier carry out the contact with thrust shaft and tested material and reset, but this process is very difficult to one step adjustment accuracy that targets in place, so need use the micrometer to carry out the adjustment that the precision is higher, makes the preparation work of whole experiment accomplish the accuracy.
In this embodiment, please refer to fig. 3, the micrometer adjustment block 23 is connected with a sensing piece 231, two U-shaped photoelectric switches are fixed on the bottom plate 4, the sensing piece moves between the first U-shaped photoelectric switch 41 and the second U-shaped photoelectric switch 42, the position sensing piece of the thrust tester is adjusted to move along with the movement of the sensing piece, and the first U-shaped photoelectric switch and the second U-shaped photoelectric switch sense the sensing piece 231 to alarm.
In this embodiment, please refer to fig. 6, a microscope 13 is further disposed on the mounting plate 1, a lens of the microscope 13 is aligned to the material to be tested, the thrust shaft can be better contacted with the chip to be tested by using the microscope, and the whole process can be continuously observed in the testing process, that is, the process that the chip is slowly pushed away from the antenna sheet, which is beneficial to summarizing the testing structure and performing subsequent work.
In this embodiment, mounting panel 1 still is provided with display screen 14, and display screen 14 and 21 electric connection of thrust tester still are equipped with the control mainboard in the thrust tester, and the man-machine interaction's that chooses for use display screen and control mainboard connection, operating personnel can operate the thrust tester through this display screen, and the display screen can also show the reading of thrust tester, makes things convenient for the staff to observe the experimentation.
Examples
The installed thrust tester is SJ-100 model of Japan three-volume company, the maximum load of the tester is 100N, the division value is 0.1N, and the division value is 0.01 KG. The method comprises the following steps of firstly starting a vacuum machine to perform vacuum air extraction, providing negative pressure for a vacuum adsorption hole, flatly placing a material on the vacuum adsorption hole, then starting an air cylinder, jacking a rotary pressure head by using an output shaft of the air cylinder, and enabling the head end of the rotary pressure head to compress the material and lock the air cylinder; at the moment, the position of the thrust tester is adjusted through a micrometer, so that the tail end of the thrust shaft is also contacted with the chip, a microscope is used for observing the detail position in the process, the light contact is ensured, but no interaction force is generated, the thrust tester is reset after the adjustment is finished, and then the servo driving screw rod module is started to push the thrust tester, so that the thrust experiment test is carried out; and observing the whole thrust testing process through a microscope, ending the experiment until the chip completely falls off, wherein the peak value of the thrust is the adhesive force of the wafer, and observing the recorded data on the display screen for analysis. The above actions are then repeated for the next material test.
The utility model has the advantages that:
1) the rotary pressure head is arranged to clamp the material to be tested, so that the influence of human factors on the experiment is eliminated to the maximum extent;
2) the positions of the thrust shaft and the material to be tested are adjusted by utilizing the micrometer adjusting block, and observation is assisted by a microscope, so that the thrust tester and the material to be tested are in contact with each other with the relative acting force close to zero to the maximum extent, and the reliability of an experiment is ensured.
The above disclosure is only for the specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be made by those skilled in the art should fall within the protection scope of the present invention.
Claims (8)
1. The utility model provides a wafer adhesion test machine, includes the mounting panel, its characterized in that still includes:
the device comprises a thrust tester, a servo drive screw rod module, an extension rod, a thrust shaft and a test piece, wherein the thrust tester is connected with the servo drive screw rod module, a push head of the thrust tester is connected with the extension rod arranged above a mounting plate, the tail end of the extension rod is connected with the thrust shaft, and the tail end of the thrust shaft is contacted with a material to be tested;
the pressure head assembly: the device comprises a rotary pressure head and an air cylinder, wherein an output shaft of the air cylinder is connected with the tail end of the rotary pressure head, and the output shaft of the air cylinder reciprocates in the vertical direction to drive the head end of the rotary pressure head to be close to the surface of an installation plate or far away from the surface of the installation plate;
the output shaft of the air cylinder drives the rotary pressure head to compress a material to be tested, and the servo driving screw rod module pushes the thrust tester to perform testing action.
2. The wafer adhesion testing machine of claim 1, wherein the indenter assembly further comprises a securing portion; the fixing part is fixed on the lower surface of the mounting plate and is provided with a bearing, the rotary pressure head is arranged above the mounting plate and is provided with a protruding part, the mounting plate is provided with a first through hole for the protruding part to pass through, the protruding part is provided with a second through hole, and the bearing passes through the second through hole to form a structure that the rotary pressure head rotates around the bearing; the head end of the rotary pressure head is provided with a groove for the thrust shaft to pass through, the tail end of the rotary pressure head is provided with a third through hole, and the third through hole accommodates the output shaft of the cylinder and is abutted against each other; the output shaft drives the head end of the rotary pressure head to compress the material to be tested.
3. The wafer adhesion testing machine of claim 1 or 2, wherein a vacuum adsorption hole is formed in a region of the mounting plate where the material to be tested is placed, the vacuum adsorption hole is connected with a vacuum machine to provide negative pressure, the vacuum adsorption hole adsorbs the material to be tested, and the rotary pressure head presses the material to be tested.
4. The wafer adhesion testing machine of claim 1, further comprising a base plate enclosing the mounting plate to form a cavity; the thrust tester also comprises a micrometer adjusting block, the micrometer adjusting block is connected with the servo drive lead screw module, the servo drive lead screw module is connected with the bottom plate, and the thrust tester is connected with the micrometer adjusting block to adjust the position of the thrust tester.
5. The wafer adhesion testing machine of claim 4, wherein the micrometer adjustment block is connected with a sensing piece, the bottom plate is fixed with two U-shaped photoelectric switches, namely a first U-shaped photoelectric switch and a second U-shaped photoelectric switch, the sensing piece moves between the first U-shaped photoelectric switch and the second U-shaped photoelectric switch, the thrust tester moves the sensing piece to move along with the first U-shaped photoelectric switch, and the first U-shaped photoelectric switch and the second U-shaped photoelectric switch sense the sensing piece to give an alarm.
6. The wafer adhesion testing machine of claim 1, wherein a rubber pad is arranged on one side of the head end of the rotary pressure head close to the mounting plate, and the rubber pad compresses a material to be tested.
7. The wafer adhesion testing machine of claim 1, wherein a microscope is further disposed on the mounting plate, and the microscope lens is aligned with the material to be tested.
8. The wafer adhesion testing machine of claim 1, wherein the thrust tester further comprises a mounting plate and a display screen, and the display screen is connected with the thrust tester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921283044.4U CN210376092U (en) | 2019-08-09 | 2019-08-09 | Wafer adhesion force testing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921283044.4U CN210376092U (en) | 2019-08-09 | 2019-08-09 | Wafer adhesion force testing machine |
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| Publication Number | Publication Date |
|---|---|
| CN210376092U true CN210376092U (en) | 2020-04-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921283044.4U Active CN210376092U (en) | 2019-08-09 | 2019-08-09 | Wafer adhesion force testing machine |
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| CN (1) | CN210376092U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111982807A (en) * | 2020-09-27 | 2020-11-24 | 东莞市钰成精密机械有限公司 | LOGO adhesive force testing equipment |
| CN116106214A (en) * | 2023-04-11 | 2023-05-12 | 四川富乐华半导体科技有限公司 | Method for testing adhesive force of dispensing of copper-clad ceramic carrier plate |
-
2019
- 2019-08-09 CN CN201921283044.4U patent/CN210376092U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111982807A (en) * | 2020-09-27 | 2020-11-24 | 东莞市钰成精密机械有限公司 | LOGO adhesive force testing equipment |
| CN116106214A (en) * | 2023-04-11 | 2023-05-12 | 四川富乐华半导体科技有限公司 | Method for testing adhesive force of dispensing of copper-clad ceramic carrier plate |
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