CN103364710A - BGA chip screening device and BGA chip screening method - Google Patents
BGA chip screening device and BGA chip screening method Download PDFInfo
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- CN103364710A CN103364710A CN 201310294442 CN201310294442A CN103364710A CN 103364710 A CN103364710 A CN 103364710A CN 201310294442 CN201310294442 CN 201310294442 CN 201310294442 A CN201310294442 A CN 201310294442A CN 103364710 A CN103364710 A CN 103364710A
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Abstract
The invention belongs to the field of avionics technologies, and particularly relates to a BGA chip screening device and a BGA chip screening method. The device comprises a box body and a testing circuit board, the box body is provided with a cover, and the testing circuit board is arranged in the box body and is connected with a testing cable. The method includes the steps of firstly, inserting a qualified DDR2 chip into a DDR2 testing socket, then inserting a first DSP chip into a DSP chip testing socket, and lastly judging the condition of the chips through judgment on whether the chips operate normally after electricity is supplied. According to the BGA chip screening device and the BGA chip screening method, testing speed is high, screening efficiency is improved greatly, and chip testing results can be reflected visually. When the BGA chip screening device is used for screening the chips, after a power source and signal lines are communicated, the chips to be tested only need to be placed in the corresponding testing sockets, then the electricity is supplied, and therefore the operation is simple and convenient. By means of the BGA chip screening method, operation is convenient, the device is small in size, light in weight and convenient to move and store.
Description
Technical field
The invention belongs to the avionics field, particularly relate to a kind of bga chip screening plant and screening technique.
Background technology
CDNA microarray is requisite ingredient before chip uses, because Highgrade integration, the use of BGA device is more and more extensive, but because of its encapsulation reason, brings certain difficulty for the BGA device screening.Adopt a kind of bga chip screening system to come test component whether qualified.
Chip needs it is screened before entering factory, the cDNA microarray method that adopts mainly is that chip is carried out primary screening and postsearch screening, these two kinds of methods are just tested chip at physical layer, and can not test chip inner break-make and function are especially helpless especially for bga device.Therefore we adopt manual testing's method, mainly are the pin figures according to chip, each pin impedance over the ground of test chip.If the impedance of testing is infinitely great, represent that then this pin disconnects, impedance approaches zero, then represents this pin shorted to earth.Its soldered ball of chip for BGA encapsulation is very little, and lead pin pitch is very short, and carry out the manual testing with conventional multimeter and be difficult to the contact pin, and might be because of exerting oneself the excessive solder ball damage that causes, thereby the method operates very difficult.In addition, the pin of bga chip is generally many, tens pins at least, and a hundreds of pin can expend the plenty of time if each pin is tested one time at most, and this method testing efficiency is very low.Also have a shortcoming for this method of testing, even the pin earth impedance of testing exactly is correct, but the chip that may not test just can work, so the again greatly reduction of the accuracy of this method of testing.
Summary of the invention
Goal of the invention: the purpose of this invention is to provide a kind of a kind of devices and methods therefor that screens bga chip, can screen fast the performance of chip.
Technical scheme: a kind of bga chip screening plant, comprise box body 1 with lid 101, be arranged on the testing circuit board 11 in the box body 1, testing circuit board 11 is connected with test cable 12, described test cable 12 comprises Serial Port Line 14 and audio signal wire 130, video signal cable 131, power lead 132, described testing circuit board 11 comprises DSP test jack 110 and DDR2 test jack 111, the FLASH storage chip 112 that is connected with DSP test jack 110 respectively, audio coding decoding chip 113, coding and decoding video chip 114 and PC 115; Described audio coding decoding chip 113 is used for gathering sound signal and being transferred to dsp chip, described coding and decoding video chip 114 is used for gathering vision signal and being transferred to dsp chip, described FLASH storage chip 112 is used for storage execute program, after dsp chip or DDR2 chip are inserted into accordingly DSP test jack 110 or DDR2 test jack 111 and power on, dsp chip reads the executive routine in the FLASH storage chip 112 and stores the DDR2 chip into, then the start address from program brings into operation, observation test result on PC 115.
A kind of BAG cDNA microarray method uses above-mentioned BAG cDNA microarray device, may further comprise the steps:
The step of dsp chip screening: at first that a slice is qualified DDR2 chip is inserted in the DDR2 test jack 111, then first dsp chip is inserted in the dsp chip test jack 110, after powering on, DSP reads and pre-deposits the executive routine in the FLASH storage chip 112 and store the DDR2 chip into and operation, by PC 115 observation test results and then judge whether this dsp chip is qualified; Repeat this step, until all dsp chip tests are finished, finish the screening of dsp chip;
The step of DDR2 cDNA microarray: the dsp chip that a slice is qualified is inserted in the DSP test jack 110, then first DDR2 chip is inserted in the DDR2 chip testing socket 111, after powering on, DSP reads and pre-deposits the executive routine in the FLASH storage chip 112 and be stored into the DDR2 chip and operation, by PC 115 observation test results and then judge whether this DDR2 chip is qualified; Repeat this step, until all DDR2 chip testings are finished, finish the screening of DDR2 chip.
The step of dsp chip screening and the step of DDR2 cDNA microarray can be exchanged.
Beneficial effect: apparatus of the present invention test speed is fast, has greatly improved screening effeciency, and can intuitively reflect the chip testing result; Use this device to carry out cDNA microarray, connect power supply and signal wire after, only need chip to be measured placed to power on after the corresponding test jack to get final product, simple, convenient.This method operation is convenient, and the little quality of the volume of device is light, is convenient to mobile and preservation.This device and method can carry out the test under normal temperature and the high low temperature, and can prevent that Air Flow from exerting an influence to chip temperature, and the true temperature during the reduction chip operation improves the accuracy of chip testing.
Description of drawings
Fig. 1 is a kind of bga chip screening plant of the present invention structural representation;
Fig. 2 is testing circuit board theory diagram in a kind of bga chip screening plant of the present invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is done to describe in further detail, see also Fig. 1 to Fig. 2.
As shown in Figures 1 and 2, a kind of bga chip screening plant, comprise box body 1 with lid 101, be arranged on the testing circuit board 11 in the box body 1, testing circuit board 11 is connected with test cable 12, described test cable 12 comprises Serial Port Line 14 and audio signal wire 130, video signal cable 131, power lead 132, described testing circuit board 11 comprises DSP test jack 110 and DDR2 test jack 111, the FLASH storage chip 112 that is connected with DSP test jack 110 respectively, audio coding decoding chip 113, coding and decoding video chip 114 and PC 115; Described audio coding decoding chip 113 is used for gathering sound signal and being transferred to dsp chip, described coding and decoding video chip 114 is used for gathering vision signal and being transferred to dsp chip, described FLASH storage chip 112 is used for storage execute program, after dsp chip or DDR2 chip are inserted into accordingly DSP test jack 110 or DDR2 test jack 111 and power on, dsp chip reads the executive routine in the FLASH storage chip 112 and stores the DDR2 chip into, then the start address from program brings into operation, observation test result on PC 115.
This screening plant is metal shell, the rectangular parallelepiped profile, renovates.Testing circuit board 11 is positioned at bottom of device, and internal power cord and signal wire via cable 12 are drawn, and connects respectively 1 tunnel sound signal, 1 tunnel single-ended pal mode vision signal, 28V power supply and PC.In testing circuit board 11, what DSP test jack and DDR2 test jack were selected is BPF529-0890-23AA55L and the BPF084-0890-15RD55L contact type socket of E-tec company, the TMS320DM648ZUTA8 chip of corresponding 529 pin of difference and the MT47H128M16HG-3IT chip of 84 pin, the receptacle pin pin spacing is 0.8mm, identical with inter-chip pitch and corresponding one by one, operating temperature range-55～+ 125 ℃.After two kinds of chips were put into socket and tighten, test chip and circuit board can be realized seamless link, and the rear two kinds of chips that power on can carry out work.
The 28V power supply can be produced by power source generator, and regulating power source voltage is 28V, and electric current is 2A, then banana plug is inserted respectively the corresponding power pin, is proving installation power supply is provided.
Sound signal produces by waveform generator, and frequency is 2kHz, and peak-to-peak value 2V, signal accessing to audio codec chip 113 carry out A/D conversion, and the peripheral hardware MCASP of the data after the conversion and DSP exchanges, then pass through EDMA deposit data in corresponding internal memory.Wherein, audio coding decoding chip 113 models are: TLV320AIC22, and its register value is configured by the I2C of DSP, and sampling rate is set to 16k.
Vision signal produces by camera, this video is the pal mode simulating signal, frame per second is 25f/s, signal access coding and decoding video chip 114 carries out the A/D conversion, and the peripheral hardware VIDEOPORTS of the data after the conversion and DSP exchanges, and then the video data that gathers is placed among the fifo through EDMA, and by compression algorithm H.264, ratio of compression utilizes software adjustment, and the method is set to 70:1, and the deposit data after the compression is in the internal memory of correspondence.Wherein, coding and decoding video chip 114 models are: ADV7403BSTZ-110, its register value also is configured by the I2C of DSP.
Serial Port Line 14 connects screening plant and PC, and the DSP data processed result is printed at PC by hyper terminal.Wherein, it is 115200,8 bit data positions that the hyper terminal port arranges baud rate, no parity, and 1 position of rest, countless according to current control.
After powering on, DSP at first carries out the Bootloader code that is solidificated in the sheet, this then code be responsible for from outside Flash storage chip 112, moving 1k size code to the address 0, then carry out.Performed code again with target program and data-moving in the FLASH storage chip 112 outside the DSP sheet in the DDR2 internal memory, and from the section start operation, whole device is namely started working according to pre-set program.During powering on, whether DSP consistent to the read-write of DDR2 chip by judging, and judges whether gather outside audio-video signal correctly comes test chip whether to work, and with test result by serially printing to PC.Wherein, Flash storage chip model is: JS28F128J3D-75.
A kind of BAG cDNA microarray method uses above-mentioned BAG cDNA microarray device, may further comprise the steps:
The step of dsp chip screening: at first that a slice is qualified DDR2 chip is inserted in the DDR2 test jack 111, then first dsp chip is inserted in the dsp chip test jack 110, after powering on, DSP reads the executive routine that pre-deposits in the FLASH storage chip 112 and stores DDR2 chip and operation into, by PC 115 observation test results and then judge whether this dsp chip is qualified; Repeat this step, until all dsp chip tests are finished, finish the screening of dsp chip;
The step of DDR2 cDNA microarray: the dsp chip that a slice is qualified is inserted in the DSP test jack 110, then first DDR2 chip is inserted in the DDR2 chip testing socket 111, after powering on, DSP reads the executive routine that pre-deposits in the FLASH storage chip 112 and is stored into DDR2 chip and operation, by PC 115 observation test results and then judge whether this DDR2 chip is qualified; Repeat this step, until all DDR2 chip testings are finished, finish the screening of DDR2 chip.
The step of dsp chip screening and the step of DDR2 cDNA microarray can be exchanged.
Incoming audio signal source, video signal source, serial ports and 28V direct supply, and the test jack of qualified DSP (or DDR2) chip being put into correspondence, the another one socket is put into DDR2 to be measured (or DSP) chip, and the device lid that closes, then chip is carried out under the normal temperature and high low temperature under test.
During normal temperature, after powering on, can DSP reads the executive routine that pre-deposits in the FLASH storage chip 112 and is stored into DDR2 chip and operation, but work by the PC display chip.If show on the PC " wrong ", then represent chip to be measured defective, if PC shows " right " then shows that chip to be measured is qualified at normal temperatures.
The qualified chip of normal temperature screening is carried out high and low temperature environment test (70 ℃ of high temperature, low temperature-50 ℃) again.Insert chip to be measured in this device respective socket and put into high-low temperature chamber, set high temperature or cryogenic temperature.When the temperature inside the box arrived design temperature, device re-powered, and can DSP reads the executive routine that pre-deposits in the FLASH storage chip 112 and is stored into DDR2 chip and operation, but work by the PC display chip.If show on the PC " wrong ", represent that then chip to be measured is defective, if PC shows " right " then shows that chip to be measured is qualified.After high low temperature was completed, PC showed that the chip of " right " is only the qualified chip of final checking, otherwise chip to be measured is still defective.
Embodiment: 100 dsp chips and 100 are carried out respectively the normal temperature screening.
Incoming audio signal source, video signal source, serial ports and 28V direct supply.
1 qualified DDR2 chip is put into DDR2 test jack 111, again dsp chip to be measured is put into DSP test jack 110, afterwards observation test result on PC powers on.First is completed rear outage, again another dsp chip to be measured is put into DSP test jack 110, and the afterwards observation test result on PC that powers on repeats this process until whole DSP to be measured is completed always.After all chip testings are complete, find that 97 chips are qualified, 3 chips are defective, and when sharing 3.3 hours, average monolithic was tested about 2 minutes consuming time.
Equally, 1 qualified dsp chip is put into DSP test jack 110, again DDR2 chip to be measured is put into DDR2 test jack 111, afterwards observation test result on PC powers on.First is completed rear outage, again another DDR2 chip to be measured is put into DDR2 test jack 111, and the afterwards observation test result on PC that powers on repeats this process until whole DDR2 to be measured is completed always.After all chip testings were complete, 98 chips were qualified, and 2 chips are defective, and when sharing 3.4 hours, average monolithic was tested about 2 minutes consuming time.
Whether traditional manual testing's method adopts test pin break-make proof chip qualified, and the monolithic dsp chip was tested 20 minutes consuming time, monolithic DDR2 chip testing 4 minutes, even and the method test can not prove that correctly chip can work.But this proving installation can improve 10 times with the dsp chip testing efficiency, and the DDR2 chip testing efficiency improves 2 times, and proves that by test function chip can work.Therefore this device improves greatly than manual testing's efficient and accuracy.
Claims (3)
1. bga chip screening plant, it is characterized in that, comprise the box body [1] with lid [101], be arranged on the testing circuit board [11] in the box body [1], testing circuit board [11] is connected with test cable [12], described test cable [12] comprises Serial Port Line [14] and audio signal wire [130], video signal cable [131], power lead [132], described testing circuit board [11] comprises DSP test jack [110] and DDR2 test jack [111], the FLASH storage chip [112] that is connected with DSP test jack [110] respectively, audio coding decoding chip [113], coding and decoding video chip [114] and PC [115]; Described audio coding decoding chip [113] is used for gathering sound signal and being transferred to dsp chip, described coding and decoding video chip [114] is used for gathering vision signal and being transferred to dsp chip, described FLASH storage chip [112] is used for storage execute program, after dsp chip or DDR2 chip are inserted into accordingly DSP test jack [110] or DDR2 test jack [111] and power on, dsp chip reads the executive routine in the FLASH storage chip [112] and stores the DDR2 chip into, then the start address from program brings into operation, in the upper observation test result of PC [115].
2. BAG cDNA microarray method uses the BAG cDNA microarray device among the claims, it is characterized in that, may further comprise the steps:
The step of dsp chip screening: at first that a slice is qualified DDR2 chip is inserted in the DDR2 test jack [111], then first dsp chip is inserted in the dsp chip test jack [110], after powering on, DSP reads and pre-deposits the executive routine in the FLASH storage chip [112] and store the DDR2 chip into and operation, by PC [115] observation test result and then judge whether this dsp chip is qualified; Repeat this step, until all dsp chip tests are finished, finish the screening of dsp chip;
The step of DDR2 cDNA microarray: the dsp chip that a slice is qualified is inserted in the DSP test jack [110], then first DDR2 chip is inserted in the DDR2 chip testing socket [111], after powering on, DSP reads and pre-deposits the executive routine in the FLASH storage chip [112] and be stored into the DDR2 chip and operation, by PC [115] observation test result and then judge whether this DDR2 chip is qualified; Repeat this step, until all DDR2 chip testings are finished, finish the screening of DDR2 chip.
3. a kind of BAG cDNA microarray method according to claim 2 is characterized in that, the step of dsp chip screening and the step of DDR2 cDNA microarray can be exchanged.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106227194A (en) * | 2016-08-26 | 2016-12-14 | 天津市英贝特航天科技有限公司 | A kind of DSP main control module test cabinet |
| CN106597251A (en) * | 2016-11-30 | 2017-04-26 | 无锡华测电子系统有限公司 | Microwave chip screening device and screening method therefor |
| CN108919091A (en) * | 2018-06-20 | 2018-11-30 | 中国科学院西安光学精密机械研究所 | A kind of seasoned liter of screen system of video AD C device |
| CN109116061A (en) * | 2018-09-10 | 2019-01-01 | 上海泽丰半导体科技有限公司 | A kind of socket based on chip testing |
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2013
- 2013-07-12 CN CN201310294442.7A patent/CN103364710B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106227194A (en) * | 2016-08-26 | 2016-12-14 | 天津市英贝特航天科技有限公司 | A kind of DSP main control module test cabinet |
| CN106597251A (en) * | 2016-11-30 | 2017-04-26 | 无锡华测电子系统有限公司 | Microwave chip screening device and screening method therefor |
| CN106597251B (en) * | 2016-11-30 | 2023-07-18 | 无锡华测电子系统有限公司 | Microwave chip screening device and screening method thereof |
| CN108919091A (en) * | 2018-06-20 | 2018-11-30 | 中国科学院西安光学精密机械研究所 | A kind of seasoned liter of screen system of video AD C device |
| CN109116061A (en) * | 2018-09-10 | 2019-01-01 | 上海泽丰半导体科技有限公司 | A kind of socket based on chip testing |
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| CN103364710B (en) | 2016-08-10 |
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