CN103364710B - A kind of bga chip screening plant and screening technique - Google Patents
A kind of bga chip screening plant and screening technique Download PDFInfo
- Publication number
- CN103364710B CN103364710B CN201310294442.7A CN201310294442A CN103364710B CN 103364710 B CN103364710 B CN 103364710B CN 201310294442 A CN201310294442 A CN 201310294442A CN 103364710 B CN103364710 B CN 103364710B
- Authority
- CN
- China
- Prior art keywords
- chip
- dsp
- ddr2
- test
- screening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention belongs to avionics field, especially relate to a kind of bga chip screening plant and screening technique.The test circuit board that device includes the box body with lid, is arranged in box body, test circuit board connects test cable.First a piece of qualified DDR2 chip is inserted in DDR2 test jack by method, is then inserted in dsp chip test jack by first piece of dsp chip, by judging whether properly functioning judgement chip quality after powering on.Apparatus of the present invention test speed is fast, substantially increases screening efficiency, and can intuitively reflect chip testing result；Use this device to carry out cDNA microarray, after connecting power supply and holding wire, power on after only chip to be measured need to being placed in corresponding test jack, simple, convenient.This method operation is convenient, the little light weight of volume of device, it is simple to mobile and preservation.
Description
Technical field
The invention belongs to avionics field, especially relate to a kind of bga chip screening plant and screening
Method.
Background technology
CDNA microarray is requisite ingredient before chip uses, due to Highgrade integration, BGA device
Use more and more extensive, but because it encapsulates reason, bring certain difficulty to BGA device screening.Use one
It is the most qualified that bga chip screening system tests device.
Chip needs before entering factory to screen it, and chip is mainly carried out once by the cDNA microarray method used
Screening and postsearch screening, chip is simply tested by both approaches at physical layer, it is impossible in test chip
Portion's break-make and function, the most helpless particularly with bga device.Therefore we use manual testing's
Method, mainly according to the pin figure of chip, the impedance over the ground of each pin of test chip.If tested
Impedance infinitely great, then it represents that this pin disconnects, and impedance is close to zero, then it represents that this pin shorted to earth.For
Its soldered ball of the chip of BGA package is the least, and lead pin pitch is the shortest, carries out manual testing with conventional circuit tester and is difficult to
Contact pin, and be also possible to because of the most excessive solder ball damage that causes, thus the method operates the most tired
Difficult.It addition, the pin of bga chip typically compares many, tens pins at least, the most hundreds of pin, as
The most each pin is tested one time and can be taken considerable time, this method testing efficiency is the lowest.For this test
Also have one disadvantage in that for method, it is simply that even if the pin earth impedance tested is correct, but may not be tested
Chip just can normally work, and therefore the accuracy of this method of testing is substantially reduced again.
Summary of the invention
Goal of the invention: it is an object of the invention to provide a kind of a kind of devices and methods therefor screening bga chip, energy
Enough performances to chip are quickly screened.
Technical scheme: a kind of bga chip screening plant, including with lid 101 box body 1, be arranged on box
Test circuit board 11 in body 1, test circuit board 11 connects test cable 12, described test cable 12
Including Serial Port Line 14 and audio signal wire 130, video signal cable 131, power line 132, described test circuit
Plate 11 includes DSP test jack 110 and DDR2 test jack 111, respectively with DSP test jack 110 even
FLASH storage chip 112, audio coding decoding chip 113, coding and decoding video chip 114 and the PC connect
115；Described audio coding decoding chip 113 is used for gathering audio signal and being transferred to dsp chip, described video
Codec chip 114 is used for gathering video signal and being transferred to dsp chip, described FLASH storage chip 112
For storing execution program, dsp chip or DDR2 chip are inserted correspondingly into DSP test jack 110 or DDR2
Test jack 111 after powering on, dsp chip reads the execution program in FLASH storage chip 112 and deposits
Storage, to DDR2 chip, then brings into operation from the initial address of program, observes test result on PC 115.
A kind of BAG cDNA microarray method, uses above-mentioned BAG cDNA microarray device, comprises the following steps:
The step of dsp chip screening: first a piece of qualified DDR2 chip is inserted into DDR2 test jack 111
In, then first piece of dsp chip is inserted in dsp chip test jack 110, after powering on, DSP reads
Take the execution program pre-deposited in FLASH storage chip 112 and store to DDR2 chip and run, logical
Cross PC 115 observe test result and then judge that this dsp chip is the most qualified；Repeat this step, until will
All dsp chips have been tested, and complete the screening of dsp chip；
The step of DDR2 cDNA microarray: a piece of qualified dsp chip is inserted in DSP test jack 110,
Then being inserted in DDR2 chip testing socket 111 by first piece of DDR2 chip, after powering on, DSP reads
Pre-deposit the execution program in FLASH storage chip 112 and be stored into DDR2 chip and run, passing through
PC 115 is observed test result and then judges that this DDR2 chip is the most qualified；Repeat this step, until by institute
There is DDR2 chip testing to complete, complete the screening of DDR2 chip.
The step of dsp chip screening can be exchanged with the step of DDR2 cDNA microarray.
Beneficial effect: apparatus of the present invention test speed is fast, substantially increases screening efficiency, and can intuitively reflect
Chip testing result；This device is used to carry out cDNA microarray, after connecting power supply and holding wire, only need to be by core to be measured
Sheet powers on after being placed in corresponding test jack, simple, convenient.This method operation is convenient, device
The little light weight of volume, it is simple to mobile and preservation.This device and method can carry out the test under room temperature and high/low temperature,
And can prevent air flowing from chip temperature producing impact, true temperature during reduction chip operation, improve chip
The accuracy of test.
Accompanying drawing explanation
Fig. 1 is one bga chip screening plant structural representation of the present invention；
Fig. 2 is test circuit board theory diagram in one bga chip screening plant of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings the present invention is described in further detail, refers to Fig. 1 to Fig. 2.
As shown in Figures 1 and 2, a kind of bga chip screening plant, including with lid 101 box body 1,
The test circuit board 11 being arranged in box body 1, test circuit board 11 connects test cable 12, described test
Cable 12 includes Serial Port Line 14 and audio signal wire 130, video signal cable 131, power line 132, described
Test circuit board 11 includes DSP test jack 110 and DDR2 test jack 111, inserts with DSP test respectively
The FLASH storage chip 112 of seat 110 connection, audio coding decoding chip 113, coding and decoding video chip 114
And PC 115；Described audio coding decoding chip 113 is used for gathering audio signal and being transferred to dsp chip,
Described coding and decoding video chip 114 is used for gathering video signal and being transferred to dsp chip, and described FLASH stores
Chip 112 is used for storing execution program, dsp chip or DDR2 chip and is inserted correspondingly into DSP test jack
110 or DDR2 test jacks 111 after powering on, dsp chip reads holding in FLASH storage chip 112
Line program also stores DDR2 chip, then brings into operation from the initial address of program, sees on PC 115
Examine test result.
This screening plant is metal shell, cuboid profile, renovates.Test circuit board 11 is positioned at bottom of device,
Internal power cord and signal wire via cable 12 are drawn, and connect 1 tunnel audio signal, the 1 single-ended PAL in tunnel respectively
Standard video signal, 28V power supply and PC.In test circuit board 11, DSP test jack and DDR2
That test jack is selected is BPF529-0890-23AA55L and BPF084-0890-15RD55L of E-tec company
Contact type socket, respectively the TMS320DM648ZUTA8 chip of corresponding 529 feet and 84 feet
MT47H128M16HG-3IT chip, receptacle pin pin spacing is 0.8mm, and one_to_one corresponding identical with inter-chip pitch,
Operating temperature range-55～+125 DEG C.Two kinds of chips are put into after socket is tightened, test chip and circuit board
Can realize seamless link, the latter two that powers on chip is operable.
28V power supply can be produced by power source generator, and regulating power source voltage is 28V, and electric current is 2A, then by perfume (or spice)
Any of several broadleaf plants plug inserts corresponding power pin respectively, is test device and provides power supply.
Audio signal is produced by waveform generator, and frequency is 2kHz, peak-to-peak value 2V, and signal accesses audio frequency and compiles
Decoding chip 113 carries out A/D conversion, and data and the peripheral hardware MCASP of DSP after conversion swap, then
Through EDMA, data are left in corresponding internal memory.Wherein, audio coding decoding chip 113 model is:
TLV320AIC22, its register value is configured by the I2C of DSP, and sample rate is set to 16k.
Video signal is produced by photographic head, and this video is pal mode analogue signal, and frame per second is 25f/s, letter
Number access coding and decoding video chip 114 carry out A/D conversion, the data after conversion and the peripheral hardware VIDEO of DSP
PORTS swaps, and then the video data gathered is placed in fifo through EDMA, and by H.264
Compression algorithm, compression ratio utilizes software adjustment, the method to be set to 70:1, and it is right that the data after compression leave in
In the internal memory answered.Wherein, coding and decoding video chip 114 model is: ADV7403BSTZ-110, its depositor
Value is also configured by the I2C of DSP.
Serial Port Line 14 connects screening plant and PC, and DSP data processed result passes through hyper terminal at PC
Upper printing.Wherein, it is 115200,8 bit data positions that hyper terminal port arranges baud rate, no parity,
1 stops position, no data flow control.
After powering on, DSP is first carried out the Bootloader code being solidificated in sheet, this then code be responsible for from outward
Portion's Flash memory chip 112 moves 1k size code at address 0, then perform.Performed generation
Code again by target program in FLASH storage chip 112 and data-moving to DSP off-chip DDR2 internal memory, and
Running from section start, whole device is i.e. started working according to pre-set program.Powering on period, DSP leads to
Cross and judge that the read-write to DDR2 chip is the most consistent, and judge that gathering outside audio-video signal the most correctly comes
Test chip the most normally works, and by test result by serially printing to PC.Wherein, Flash
Storage chip model is: JS28F128J3D-75.
A kind of BAG cDNA microarray method, uses above-mentioned BAG cDNA microarray device, comprises the following steps:
The step of dsp chip screening: first a piece of qualified DDR2 chip is inserted into DDR2 test jack 111
In, then first piece of dsp chip is inserted in dsp chip test jack 110, after powering on, DSP reads
Take the execution program pre-deposited in FLASH storage chip 112 store DDR2 chip and run, pass through
PC 115 is observed test result and then judges that this dsp chip is the most qualified；Repeat this step, until by institute
There is dsp chip to test, complete the screening of dsp chip；
The step of DDR2 cDNA microarray: a piece of qualified dsp chip is inserted in DSP test jack 110,
Then being inserted in DDR2 chip testing socket 111 by first piece of DDR2 chip, after powering on, DSP reads
The execution program storage pre-deposited in FLASH storage chip 112 to DDR2 chip and runs, and passes through PC
Machine 115 is observed test result and then judges that this DDR2 chip is the most qualified；Repeat this step, until will be all
DDR2 chip testing completes, and completes the screening of DDR2 chip.
The step of dsp chip screening can be exchanged with the step of DDR2 cDNA microarray.
Incoming audio signal source, video signal source, serial ports and 28V DC source, and by qualified DSP (or
DDR2), during chip puts into the test jack of correspondence, DDR2 (or DSP) chip to be measured put into by another one socket,
And the device lid that closes, then chip is carried out the test under room temperature and under high/low temperature.
During room temperature, after powering on, DSP reads and pre-deposits the execution program in FLASH storage chip 112
It is stored into DDR2 chip and runs, can normally be worked by display chip by PC.If it is aobvious on PC
Show " wrong ", then it represents that chip to be measured is defective, if PC shows " right ", show core to be measured
Sheet is the most qualified.
Room temperature is screened qualified chip and carries out high and low temperature environment test (high temperature 70 DEG C, low temperature-50 DEG C) again.Will
High-low temperature chamber is inserted in this device respective socket and put into chip to be measured, sets high temperature or cryogenic temperature.Work as case
When interior temperature arrives design temperature, device re-powers, and DSP reads and pre-deposits FLASH storage chip 112
In execution program storage to DDR2 chip and run, can normally be worked by display chip by PC.As
Really show " wrong " on PC, then it represents that chip to be measured is defective, if PC shows " right ",
Show that chip to be measured is qualified.After high/low temperature is completed, PC shows that the chip of " right " is only final acceptance inspection
Demonstrate,proving qualified chip, chip the most to be measured is the most defective.
Embodiment: 100 dsp chips and 100 are carried out room temperature screening respectively.
Incoming audio signal source, video signal source, serial ports and 28V DC source.
The DDR2 chip that 1 is qualified is put in DDR2 test jack in 111, then dsp chip to be measured
Put in DSP test jack in 110, on PC, after powering on, observe test result.First is completed
Rear power-off, then another dsp chip to be measured is put in DSP test jack in 110, at PC after powering on
Upper observation test result, repeats this process until whole DSP to be measured is completed always.All chip testings are complete
Bi Hou, finds that 97 chips are qualified, and 3 chips are defective, share time 3.3 hours, average monolithic test
Time-consuming about 2 minutes.
Equally, the dsp chip that 1 is qualified is put in DSP test jack in 110, then DDR2 to be measured
Chip is put in DDR2 test jack in 111, observes test result after powering on PC.First is tested
After power-off, then another DDR2 chip to be measured is put in DDR2 test jack in 111, after powering on
Observe test result on PC, repeat this process until whole DDR2 to be measured is completed always.All chips
After being completed, 98 chips are qualified, and 2 chips are defective, share time 3.4 hours, average monolithic survey
Try time-consuming about 2 minutes.
Traditional manual testing's method uses test pin break-make proof chip the most qualified, and monolithic dsp chip is surveyed
Try time-consuming 20 minutes, monolithic DDR2 chip testing 4 minutes, even and if the method test correctly can not demonstrate,prove
Bright chip can normally work.But dsp chip testing efficiency can be improved 10 times by this test device, DDR2 core
Built-in testing efficiency improves 2 times, and proves that chip can normally work by test function.Therefore this device ratio
Efficiency and the accuracy of manual testing are greatly improved.
Claims (1)
1. a bga chip screening technique, use a kind of bga chip screening plant, this screening plant, including the box body (1) with lid (101), the test circuit board (11) being arranged in box body (1), test circuit board (11) connects test cable (12), described test cable (12) includes Serial Port Line (14) and audio signal wire (130), video signal cable (131), power line (132), described test circuit board (11) includes DSP test jack (110) and DDR2 test jack (111), FLASH storage chip (112), audio coding decoding chip (113), coding and decoding video chip (114) is connected with DSP test jack (110) respectively, also include PC (115)；Described audio coding decoding chip (113) is used for gathering audio signal and being transferred to dsp chip, described coding and decoding video chip (114) is used for gathering video signal and being transferred to dsp chip, the execution program that described FLASH storage chip (112) is worked out according to following bga chip screening technique for storage, after dsp chip or DDR2 chip are inserted correspondingly into DSP test jack (110) or DDR2 test jack (111) and power on, dsp chip reads the execution program in FLASH storage chip (112) and stores DDR2 chip, then the initial address from the program of execution brings into operation, test result observed by PC (115)；It is characterized in that, comprise the following steps:
The step of dsp chip screening: first a piece of qualified DDR2 chip is inserted in DDR2 test jack (111), then first piece of dsp chip is inserted in DSP test jack (110), after powering on, dsp chip reads the execution program in FLASH storage chip (112) that pre-deposits and stores to DDR2 chip and run, and observes test result by PC (115) and then judges that this dsp chip is the most qualified；Repeating this step, until having been tested by all dsp chips, completing the screening of dsp chip；
The step of DDR2 cDNA microarray: a piece of qualified dsp chip is inserted in DSP test jack (110), then first piece of DDR2 chip is inserted in DDR2 test jack (111), after powering on, dsp chip reads and pre-deposits the execution program in FLASH storage chip (112) and be stored into DDR2 chip and run, and observes test result by PC (115) and then judges that this DDR2 chip is the most qualified；Repeating this step, until all DDR2 chip testings being completed, completing the screening of DDR2 chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310294442.7A CN103364710B (en) | 2013-07-12 | 2013-07-12 | A kind of bga chip screening plant and screening technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310294442.7A CN103364710B (en) | 2013-07-12 | 2013-07-12 | A kind of bga chip screening plant and screening technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103364710A CN103364710A (en) | 2013-10-23 |
| CN103364710B true CN103364710B (en) | 2016-08-10 |
Family
ID=49366500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310294442.7A Active CN103364710B (en) | 2013-07-12 | 2013-07-12 | A kind of bga chip screening plant and screening technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103364710B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106227194A (en) * | 2016-08-26 | 2016-12-14 | 天津市英贝特航天科技有限公司 | A kind of DSP main control module test cabinet |
| CN106597251B (en) * | 2016-11-30 | 2023-07-18 | 无锡华测电子系统有限公司 | Microwave chip screening device and screening method thereof |
| CN108919091B (en) * | 2018-06-20 | 2021-02-19 | 中国科学院西安光学精密机械研究所 | Aging screen lifting system of video ADC device |
| CN109116061A (en) * | 2018-09-10 | 2019-01-01 | 上海泽丰半导体科技有限公司 | A kind of socket based on chip testing |
-
2013
- 2013-07-12 CN CN201310294442.7A patent/CN103364710B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103364710A (en) | 2013-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103364710B (en) | A kind of bga chip screening plant and screening technique | |
| CN106771974B (en) | Display module lighting test device and method | |
| CN105336287B (en) | Test method, the device and system of display screen | |
| CN103823698A (en) | Method and device for programming and starting FPGA target program and DSP target program | |
| US8356215B2 (en) | Testing apparatus and method for analyzing a memory module operating within an application system | |
| CN105372536B (en) | Aviation electronics general-utility test platform | |
| US11828787B2 (en) | Eye diagram capture test during production | |
| CN104515951A (en) | Board-level embedded test controller and board-level embedded test method | |
| CN207595296U (en) | A kind of integrated test system | |
| CN107390394B (en) | Liquid crystal module testing system based on SOPC | |
| CN109426594A (en) | A kind of chip debugging apparatus, method and computer readable storage medium | |
| CN105989900B (en) | The measurement of on-chip system chip and its minimum operating voltage of in-line memory | |
| CN107782208A (en) | A kind of the all-electronin fuse tester and its method of testing of more set fuse concurrent testings | |
| CN206369789U (en) | A kind of multifunctional digital wafer prober | |
| CN106448569A (en) | Control apparatus of liquid crystal display | |
| CN113589142A (en) | Optical chip testing device and method based on FPGA | |
| CN109889407A (en) | A kind of managed switches production test method | |
| CN113204456A (en) | Test method, tool, device and equipment for VPP interface of server | |
| CN106814276A (en) | Order of cables detection method and device | |
| CN203761452U (en) | Cell phone platform test applied engine system | |
| CN208537630U (en) | LCR board On-line self-diagnosis control device | |
| CN113985321B (en) | Cable connection performance testing device and method with intelligent self-learning capability | |
| CN109507571A (en) | A kind of test device and test macro | |
| CN106526458B (en) | Communication detection device for wafer test and detection method thereof | |
| RU2685063C1 (en) | System for programming and testing usb devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |