CN109116061A - A kind of socket based on chip testing - Google Patents
A kind of socket based on chip testing Download PDFInfo
- Publication number
- CN109116061A CN109116061A CN201811053247.4A CN201811053247A CN109116061A CN 109116061 A CN109116061 A CN 109116061A CN 201811053247 A CN201811053247 A CN 201811053247A CN 109116061 A CN109116061 A CN 109116061A
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- printed circuit
- socket
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The invention discloses a kind of for testing the socket of chip, comprising: lid, pedestal；The side of the pedestal towards the lid is provided with the station for accommodating the chip to be tested；The pedestal is provided with connector backwards to the side of the lid；It further include printed circuit board, the lower section of the station is arranged in the printed circuit board；The connector passes through the printed circuit board and the pin of the chip to be tested is electrically connected；And capacitor is provided on the printed circuit board.The application changes the inductance of connector by the increase of capacitor by the printed circuit board of the pedestal setting welding capacitor in test chip carrier socket, thus provides the performance of power supply.
Description
Technical field
The present invention relates to chip testing field more particularly to a kind of sockets based on chip testing.
Background technique
During chip production, need to guarantee that the various functions of chip meet design requirement by means of testing.And core
Built-in testing can be divided into 2 class testings again, and the first kind is the test before die package, and the second class is the test behind die package.This its
In, the first class testing needs to be tested using probe card (probe), and the second class testing needs to use support plate
(loadboard).When support plate is tested, sieve is carried out for convenience, it will usually be increased a socket (socket) on support plate, be used
Chip to be tested is needed in storage.One end of Socket needle and PCB contact, the other end and the contact of chip stitch.
Since current chip is based on BGA package, Socket needle is also at BGA shape array arrangement, as chip becomes
Small, the pitch of chip BGA is also smaller and smaller, this causes socket needle to become carefully, and the inductance of needle is also increasing.With big
The influence for being directed to Power Integrity of inductance is very big, and source impedance can be obviously improved, and power source performance is decreased obviously.
Based on above there are technical problem, this application provides the technical solutions for solving the above technical problem.
Summary of the invention
The object of the present invention is to provide a kind of socket based on chip testing, the application passes through at the bottom of test chip carrier socket
The printed circuit board of seat setting welding capacitor changes the inductance of connector, thus provides power supply by the increase of capacitor
Performance.
Technical solution provided by the invention is as follows:
It is a kind of for testing the socket of chip, comprising: lid, pedestal；The pedestal is arranged towards the side of the lid
There is the station for accommodating the chip to be tested；The pedestal is provided with connector backwards to the side of the lid；Further include
The lower section of the station is arranged in printed circuit board, the printed circuit board；The connector pass through the printed circuit board with
The pin of the chip to be tested is electrically connected；And capacitor is provided on the printed circuit board.
Preferably, comprising: the quantity of the printed circuit board is one piece or muti-piece.
Preferably, comprising: multiple through-holes, the quantity of the through-hole and the connector are provided on the printed circuit board
Quantity it is identical and correspond.
Preferred: the through-hole being arranged on the printed circuit board is metal or nonmetallic middle one or two.
Preferably, the connector is connect in a manner of point contact with the through-hole on the printed circuit board, or is led
Electric glue mode connects.
Preferably, comprising: the pin of the connector and the chip to be tested corresponds.
Preferably, the pin of described connector one end and the chip to be tested is electrically connected, the connector it is another
End is electrically connected with the logic card for testing chip to be tested.
Preferably, the bottom of the printed circuit board is further arranged in the capacitor being arranged on the printed circuit board.
Preferably, the printed circuit board is arranged on the pedestal.
A kind of socket based on chip testing provided by the invention, has the beneficial effect that:
The application passes through the increasing of capacitor by the printed circuit board of the pedestal setting welding capacitor in test chip carrier socket
Add, change the inductance of connector, thus provides the performance of power supply.
The change in structure design is carried out by the pedestal to socket in the application, increases relevant capacitor setting, makes electricity
Source performance is able to good improvement；The inductance of needle can be significantly reduced, so that the impedance parameter of electric power network is reduced, power supply line
Wave can be also substantially reduced.
Detailed description of the invention
Below by clearly understandable mode, preferred embodiment is described with reference to the drawings, to a kind of for testing chip
Above-mentioned characteristic, technical characteristic, advantage and its implementation of socket are further described.
Fig. 1 is that the present invention is based on a kind of for testing the structural schematic diagram of socket one embodiment of chip；
Fig. 2 is the schematic diagram of the pedestal of socket of the present invention；
Fig. 3 is the through-hole structure schematic diagram of printed circuit board of the present invention.
Drawing reference numeral explanation:
1. lid, 2. stations, 3. pedestals, 3.1. connector, 3.2. capacitor, 3.3. printed circuit board, 4. through-holes.
Specific embodiment
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, Detailed description of the invention will be compareed below
A specific embodiment of the invention.It should be evident that drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, and obtain other embodiments.
To make simplified form, part related to the present invention is only schematically shown in each figure, their not generations
Its practical structures as product of table.
The present invention provides a kind of for testing the socket of chip, comprising: lid 1, pedestal 3；The pedestal 3 is towards described
The side of lid 1 is provided with the station for accommodating the chip to be tested；The pedestal 3 is set backwards to the side of the lid 1
It is equipped with connector 3.1；It further include printed circuit board, the lower section of the station is arranged in the printed circuit board；The connector
3.1 pass through the pin electrical connection of the printed circuit board and the chip to be tested；And it is provided on the printed circuit board
Capacitor 3.2.
In this application, the present invention, can be according to the adjustment of the size and model adaptability of chip for testing chip
The jack sizes of the application and the quantity of connector 3.1；Lid 1 on socket is fastened on the pedestal 3 of socket, chip is made
Good contact is realized with the connector 3.1 being arranged on pedestal 3；Since current chip is based on BGA package, Socket needle
At BGA shape array arrangement, as chip becomes small, increasingly exquisiter, the pitch of chip BGA is also smaller and smaller, this causes
Socket needle becomes carefully, and the inductance of needle is also increasing.The influence for being directed to Power Integrity with big inductance is very big,
Source impedance can be obviously improved, and power source performance is decreased obviously.In order to change source impedance in the application, power source performance is improved,
Therefore the application tries hard to change the size of inductance, reduces the inductance value of connector 3.1 by increasing capacitor 3.2；The application's
Printed circuit board is added with the reversed one end of lid 1 in 3 rear end of pedestal, while welding capacitor 3.2, connector 3.1 on circuit boards
It is electrically connected with circuit board, can then realize that the power pin of chip is communicated with circuit board；Therefore there is needle on PCB
The design of capacitor 3.2 is increased to sensitive power supply to property, increased 3.2 quantity of capacitor, the size of specific capacitance is according to connector
3.1 length parameter, the relevant parameters such as diameter parameters are related；The big of its capacitor 3.2 is adjusted according to the concrete condition used
It is small.
Therefore, the application is passed through by the printed circuit board of the setting welding capacitor 3.2 of pedestal 3 in test chip carrier socket
The increase of capacitor 3.2 changes the inductance of connector 3.1, thus provides the performance of power supply.
Preferably, comprising: the quantity of the printed circuit board 3.3 is one piece or muti-piece.
According to the wiring requirements of the demand and circuit board that use, multilayer circuit board can be set.
Preferably, comprising: multiple through-holes are provided on the printed circuit board 3.3, the quantity of the through-hole connects with described
The quantity of plug-in unit 3.1 is identical and corresponds.
Multiple through-holes are provided on printed circuit namely increase pcb board, what is be arranged on the position of through-hole and pedestal 3 patches
The position of part 3.1 is one-to-one, while quantity is also consistent.
Preferred: the through-hole 4 being arranged on the printed circuit board 3.3 is metal or nonmetallic middle one or two.
Preferably, the connector 3.1 is connect in a manner of point contact with the through-hole 4 on the printed circuit board 3.3,
Or conducting resinl mode connects.
Preferably, comprising: the pin of the connector 3.1 and the chip to be tested corresponds.
Preferably, the pin of described 3.1 one end of connector and the chip to be tested is electrically connected, the connector 3.1
The other end with for test chip to be tested logic card be electrically connected.
Preferably, the capacitor 3.2 being arranged on the printed circuit board 3.3 is further arranged in the printed circuit board
3.3 bottom.
Preferably, the card of printed circuit board 3.3 is arranged on the pedestal 3.
Specifically, the through-hole 4 on printed circuit board 3.3 includes two kinds in this application, a kind of for metal, another kind is
Nonmetallic, power hole is plated through-hole, and the connection type with socket needle is to connect, and is contemplated that if contact is undesirable
Using the reinforcement connection type such as conducting resinl.For the needle (such as signal) for not needing to connect with PCB, corresponding hole is non-metallic
Hole.The connector 3.1 being arranged on the chip testing socket of the application, one end are connected on the pedestal 3 of connector 3.1, and with
The pin of chip to be detected is arranged in a one-to-one correspondence, the other end and logic card information of connector 3.1, logic electricity
It is encoded with the test program for chip on the middle control chip of road plate, completes to the power supply of chip and the correlative measurement of signaling module
Examination.
The change in structure design is carried out by the pedestal 3 to socket in the application, increases relevant capacitor 3.2 and is arranged,
Enable the good improvement of power source performance；The inductance of needle can be significantly reduced, so that the impedance parameter of electric power network is reduced, electricity
Source ripple can be also substantially reduced.
The application does not destroy the design of original socket, is the design of the further improvement to original socket, therefore this Shen
Please save the cost, avoid the waste of resource.The positive resource using the prior art improves prior art problem, solves
A great problem in the prior art.
It should be noted that above-described embodiment can be freely combined as needed.The above is only of the invention preferred
Embodiment, it is noted that for those skilled in the art, in the premise for not departing from the principle of the invention
Under, several improvements and modifications can also be made, these modifications and embellishments should also be considered as the scope of protection of the present invention.
Claims (9)
1. a kind of for testing the socket of chip characterized by comprising
Lid, pedestal；
The side of the pedestal towards the lid is provided with the station for accommodating the chip to be tested；
The pedestal is provided with connector backwards to the side of the lid；
It further include printed circuit board, the lower section of the station is arranged in the printed circuit board；The connector passes through the print
The pin of circuit board processed and the chip to be tested is electrically connected；And capacitor is provided on the printed circuit board.
2. as described in claim 1 for testing the socket of chip characterized by comprising
The quantity of the printed circuit board is one piece or muti-piece.
3. as described in claim 1 for testing the socket of chip characterized by comprising
It is provided with multiple through-holes on the printed circuit board, the quantity of the through-hole is identical as the quantity of the connector and one by one
It is corresponding.
4. as claimed in claim 3 for testing the socket of chip, it is characterised in that:
The through-hole being arranged on the printed circuit board is metal or nonmetallic middle one or two.
5. as claimed in claim 3 for testing the socket of chip, it is characterised in that:
The connector is connect in a manner of point contact with the through-hole on the printed circuit board or conducting resinl mode connects
It connects.
6. as described in claim 1 for testing the socket of chip characterized by comprising
The pin of the connector and the chip to be tested corresponds.
7. as described in claim 1 for testing the socket of chip, it is characterised in that:
The pin of described connector one end and the chip to be tested is electrically connected, the other end of the connector be used to test
The logic card of chip to be tested is electrically connected.
8. as described in claim 1 for testing the socket of chip, it is characterised in that:
The bottom of the printed circuit board is further arranged in the capacitor being arranged on the printed circuit board.
9. as described in claim 1 for testing the socket of chip, it is characterised in that:
The printed circuit board is arranged on the pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811053247.4A CN109116061A (en) | 2018-09-10 | 2018-09-10 | A kind of socket based on chip testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811053247.4A CN109116061A (en) | 2018-09-10 | 2018-09-10 | A kind of socket based on chip testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109116061A true CN109116061A (en) | 2019-01-01 |
Family
ID=64859054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811053247.4A Pending CN109116061A (en) | 2018-09-10 | 2018-09-10 | A kind of socket based on chip testing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109116061A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103364710A (en) * | 2013-07-12 | 2013-10-23 | 陕西千山航空电子有限责任公司 | BGA chip screening device and BGA chip screening method |
| CN104267218A (en) * | 2014-10-11 | 2015-01-07 | 中国航天科工集团第三研究院第八三五七研究所 | BGA package test socket with pin testing function |
| CN205484691U (en) * | 2015-12-30 | 2016-08-17 | 深圳市科美集成电路有限公司 | Device for testing integrated electric apparatus |
| CN106199385A (en) * | 2016-07-20 | 2016-12-07 | 苏州韬盛电子科技有限公司 | A kind of test jack for chip and test circuit thereof |
| CN106796252A (en) * | 2014-08-22 | 2017-05-31 | 李诺工业股份有限公司 | Test jack |
-
2018
- 2018-09-10 CN CN201811053247.4A patent/CN109116061A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103364710A (en) * | 2013-07-12 | 2013-10-23 | 陕西千山航空电子有限责任公司 | BGA chip screening device and BGA chip screening method |
| CN106796252A (en) * | 2014-08-22 | 2017-05-31 | 李诺工业股份有限公司 | Test jack |
| CN104267218A (en) * | 2014-10-11 | 2015-01-07 | 中国航天科工集团第三研究院第八三五七研究所 | BGA package test socket with pin testing function |
| CN205484691U (en) * | 2015-12-30 | 2016-08-17 | 深圳市科美集成电路有限公司 | Device for testing integrated electric apparatus |
| CN106199385A (en) * | 2016-07-20 | 2016-12-07 | 苏州韬盛电子科技有限公司 | A kind of test jack for chip and test circuit thereof |
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