CN212904990U - Ball planting type circuit packaging test rapid compression tool - Google Patents
Ball planting type circuit packaging test rapid compression tool Download PDFInfo
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- CN212904990U CN212904990U CN202020939290.7U CN202020939290U CN212904990U CN 212904990 U CN212904990 U CN 212904990U CN 202020939290 U CN202020939290 U CN 202020939290U CN 212904990 U CN212904990 U CN 212904990U
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Abstract
The utility model relates to a plant ball formula circuit encapsulation test and compress tightly frock fast, its structure is including installing the vertical type pressure pincers on the base and pressing the briquetting of being connected with the vertical type pressure pincers expansion end, and the briquetting below is from last to being the encapsulation of ball-planting formula circuit, electrically conductive cloth and test circuit board down in proper order, and the test circuit board sets up on the base. The utility model has the advantages that: simple and compact structure, quick, convenient and safe use, wide application range, strong practicability, convenient manufacture and high cost performance. The compression surface is stressed uniformly, and the parallelism and the pressing force of the compression surface are adjustable, so that the ball-planting type circuit packaging and testing circuit board can obtain good conductivity through the conductive cloth.
Description
Technical Field
The utility model relates to a plant ball formula circuit packaging test and compress tightly frock fast, concretely relates to BGA tin ball circuit packaging and test circuit board switch on the frock that compresses tightly fast.
Background
The BGA ball-mounting technology is widely used in the field of chips at present and becomes the best choice for high-density, high-performance and multi-pin packaging. However, when the package is packaged by the BGA ball mounting technique, good conduction with the test circuit board is ensured during testing. This is because the diameters of the BGA solder balls are not consistent, so that some solder balls cannot be completely attached to the test circuit board, and the conductivity is affected.
In the prior art, most of tools adopt a probe technology, and although the test requirements of the tools are guaranteed, the expensive price of the tools greatly increases the burden of research and development cost.
SUMMERY OF THE UTILITY MODEL
The utility model provides a plant ball formula circuit encapsulation test and compress tightly frock fast, its purpose aims at overcoming the above-mentioned not enough that prior art exists, adopts rectilinear pressure pincers and main compression spring to realize compressing tightly fast, effective reduce cost.
The technical solution of the utility model is as follows: the utility model provides a plant ball formula circuit encapsulation test and compress tightly frock fast, its structure is including installing the vertical type pressure pincers on the base and the briquetting of being connected with vertical type pressure pincers expansion end, and briquetting below is from last to being down for planting ball formula circuit encapsulation, electrically conductive cloth and test circuit board in proper order, and the test circuit board sets up on the base.
Preferably, the movable end of the vertical pressing tongs is connected with the top of the pressing block through a fixing screw rod, the top end of the fixing screw rod protrudes out of the top surface of the movable end of the vertical pressing tongs, fastening nuts are arranged on the top surface of the movable end of the vertical pressing tongs and the fixing screw rod on the bottom surface of the movable end of the vertical pressing tongs, a pressure adjusting nut is arranged on the fixing screw rod below the fastening nut on the bottom surface of the movable end of the vertical pressing tongs, a main pressure spring is arranged on the fixing screw rod between the pressure adjusting nut and the top of the pressing block, and pressure fine-.
Preferably, pressure fine-tuning include pressure fine-tuning screw and primary and secondary screw group, the through-hole setting on the briquetting is passed to primary and secondary screw group, pressure fine-tuning screw sets up at primary and secondary screw group top, is equipped with pressure fine setting spring on the primary and secondary screw group of briquetting below.
The utility model has the advantages that: simple and compact structure, quick, convenient and safe use, wide application range, strong practicability, convenient manufacture and high cost performance. The compression surface is stressed uniformly, and the parallelism and the pressing force of the compression surface are adjustable, so that the ball-planting type circuit packaging and testing circuit board can obtain good conductivity through the conductive cloth.
Drawings
Fig. 1 is the structure schematic diagram of the utility model discloses plant ball type circuit encapsulation test rapid compression frock.
Fig. 2 is the schematic diagram of the explosion structure of the fixture for the ball-planting type circuit packaging test.
In the figure, 1 is a vertical pressing clamp, 2 is a base, 3 is a pressing block, 4 is a ball-planting type circuit package, 5 is conductive cloth, 6 is a test circuit board, 7 is a fixing screw rod, 8 is a fastening nut, 9 is a pressure adjusting nut, 10 is a main pressure spring, 11 is a pressure fine adjustment screw, 12 is a primary and secondary screw group, and 13 is a pressure fine adjustment spring.
Detailed Description
The present invention will be described in further detail with reference to examples and embodiments.
As shown in fig. 1 and 2, the ball-planting type circuit packaging test rapid compressing tool structurally comprises a vertical pressing clamp 1 installed on a base 2 and a pressing block 3 connected with the movable end of the vertical pressing clamp 1, wherein a ball-planting type circuit package 4, conductive cloth 5 and a test circuit board 6 are sequentially arranged below the pressing block 3 from top to bottom, and the test circuit board 6 is arranged on the base 2.
The movable end of the vertical pressing pliers 1 is connected with the top of a pressing block 3 through a fixing screw rod 7, the top ends of the fixing screw rods 7 protrude out of the top surface of the movable end of the vertical pressing pliers 1, fastening nuts 8 are arranged on the top surface of the movable end of the vertical pressing pliers 1 and the fixing screw rods 7 on the bottom surface of the movable end of the vertical pressing pliers 1, a pressure adjusting nut 9 is arranged on the fixing screw rod 7 below the fastening nut 8 on the bottom surface of the movable end of the vertical pressing pliers 1, a main pressure spring 10 is arranged on the fixing screw rod 7 between the pressure adjusting nut 9 and the top of the pressing block 3, and pressure fine.
Pressure fine-tuning include pressure fine setting screw 11 and primary and secondary screw group 12, primary and secondary screw group 12 passes the through-hole setting on the briquetting 3, pressure fine setting screw 11 sets up at primary and secondary screw group 12 tops, is equipped with pressure fine setting spring 13 on the primary and secondary screw group 12 of briquetting 3 below.
According to the structure, when the device works, the pressing block 3 compresses the main pressure spring 10 through the vertical pressing pliers 1 to obtain pressure, so that the ball-planting circuit package 4, the conductive cloth 5 and the test circuit board 6 are in close contact, the circuit conductivity is good, and the purpose of testing the ball-planting circuit package 4 is achieved.
Pressing force generation principle: the pressing force required by the ball-planting type circuit package 4 is calculated according to the parameters of the conductive cloth 5, and the main pressure spring 10 is selected according to the calculated pressing force required by the ball-planting type circuit package 4. When the vertical pressing pliers 1 is in a pressing state, the pressure required for pressing the ball-implanted circuit package 4 is obtained through the deformation of the main pressure spring 10.
All the components are standard components in the prior art, and any model and existing design capable of realizing the corresponding functions can be used by a person skilled in the art.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, many modifications and improvements can be made without departing from the inventive concept, and all of them belong to the protection scope of the present invention.
Claims (3)
1. The utility model provides a plant ball formula circuit encapsulation test and compress tightly frock fast which characterized in that is including installing vertical pressure pincers (1) on base (2) and briquetting (3) of being connected with vertical pressure pincers (1) expansion end, briquetting (3) below is from last to being down for planting ball formula circuit encapsulation (4), electrically conductive cloth (5) and test circuit board (6) in proper order, and test circuit board (6) set up on base (2).
2. The fixture for ball-implanted circuit packaging test rapid compaction according to claim 1, wherein the movable end of the vertical pressing clamp (1) is connected with the top of the pressing block (3) through a fixing screw (7), the top end of the fixing screw (7) protrudes out of the top surface of the movable end of the vertical pressing clamp (1), the fixing screws (7) on the top surface and the bottom surface of the movable end of the vertical pressing clamp (1) are respectively provided with a fastening nut (8), a pressure adjusting nut (9) is arranged on the fixing screw (7) below the fastening nut (8) on the bottom surface of the movable end of the vertical pressing clamp (1), a main pressure spring (10) is arranged on the fixing screw (7) between the pressure adjusting nut (9) and the top of the pressing block (3), and four corners of the pressing block (3) are respectively provided with a pressure fine adjustment mechanism.
3. The ball-implanted circuit packaging test rapid pressing tool as claimed in claim 2, wherein the pressure fine adjustment mechanism comprises a pressure fine adjustment screw (11) and a primary and secondary screw set (12), the primary and secondary screw set (12) is arranged through a through hole on the pressing block (3), the pressure fine adjustment screw (11) is arranged at the top of the primary and secondary screw set (12), and a pressure fine adjustment spring (13) is arranged on the primary and secondary screw set (12) below the pressing block (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020939290.7U CN212904990U (en) | 2020-05-29 | 2020-05-29 | Ball planting type circuit packaging test rapid compression tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020939290.7U CN212904990U (en) | 2020-05-29 | 2020-05-29 | Ball planting type circuit packaging test rapid compression tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212904990U true CN212904990U (en) | 2021-04-06 |
Family
ID=75266119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020939290.7U Active CN212904990U (en) | 2020-05-29 | 2020-05-29 | Ball planting type circuit packaging test rapid compression tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212904990U (en) |
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2020
- 2020-05-29 CN CN202020939290.7U patent/CN212904990U/en active Active
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