CN216209266U - TEC test fixture - Google Patents

TEC test fixture Download PDF

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Publication number
CN216209266U
CN216209266U CN202121782103.XU CN202121782103U CN216209266U CN 216209266 U CN216209266 U CN 216209266U CN 202121782103 U CN202121782103 U CN 202121782103U CN 216209266 U CN216209266 U CN 216209266U
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China
Prior art keywords
tec
upper bracket
probe
bracket
intermediate shaft
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Active
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CN202121782103.XU
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Chinese (zh)
Inventor
谢晋毅
陈玉成
曾广锋
高涛
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Dongguan Forerunner Advanced Technology Co Ltd
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Dongguan Forerunner Advanced Technology Co Ltd
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Abstract

The utility model belongs to the technical field of semiconductors, and particularly discloses a TEC test fixture, which comprises an upper bracket, a lower bracket and an intermediate shaft, wherein the upper bracket is rotatably arranged on the lower bracket through the intermediate shaft, and the TEC test fixture is arranged on one side of the intermediate shaft: a spring is arranged between the upper bracket and the lower bracket; on the other side of the intermediate shaft: be equipped with between upper bracket and the lower carriage and adjust strutting arrangement, the tip of keeping away from the jackshaft direction on the upper bracket is provided with the probe, and the tip edge of probe protrusion upper bracket, the tip of keeping away from the jackshaft direction on the lower carriage is provided with spacing steel sheet, is equipped with the spacing groove that holds the TEC that awaits measuring on the spacing steel sheet, and when the TEC that awaits measuring arranges the spacing inslot in, the probe on the upper bracket is aimed at to the pad of the TEC that awaits measuring. The TEC test clamp provided by the utility model can realize the electrical contact of the miniature TEC without a wire, and the rapid test or calibration test of the miniature TEC can be realized by matching with different test modules, and the TEC test clamp has high precision and good connection reliability.

Description

TEC test fixture
Technical Field
The utility model belongs to the technical field of semiconductors, and particularly relates to a TEC test fixture.
Background
With the rapid development of communication equipment, the integration degree and the assembly density of the communication equipment are continuously improved, and the power consumption and the heat productivity of the communication equipment are also increased rapidly while the communication equipment provides strong use functions. As is well known, the LD optical power is very sensitive to temperature, the increase in temperature will cause the decrease in optical power output (while the wavelength shifts forward), the requirement of space contraction, pluggable capability and low temperature specification provide challenges for the heat dissipation of the optical module, and the TEC must be used for precise temperature control to ensure the effective operation of the laser. The current 5G communication promotion puts higher requirements on the heat dissipation of the optical module, and the semiconductor active refrigeration module is more important and urgent.
As the power density of chips is continuously upgraded, the size of semiconductor coolers (TEC) used for active cooling of chips is also continuously shrinking. The size of a part of light-passing chips and laser chips is only about 1-3 mm, and the size of a semiconductor refrigerator used in a matched mode is about 1-3 mm correspondingly.
The miniaturization of the TEC external dimension puts higher requirements on the product process precision and the testing technology. Part of the micro TECs for the light-transmitting device are led out without a lead, and only positive and negative gold-plated bonding pads are reserved. Pad sizes are typically within 0.5mm by 0.5mm, and manual or automated wire bonding is not possible. When the TEC is used or tested, a wire-bonding device is needed to lead gold wires from the positive and negative electrode bonding pads of the micro TEC to the PCB so as to realize the electrical connection of the micro TEC. The bonded bonding pads can leave gold balls or scratches, and cannot be bonded again, so that the shipment is influenced.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems in the prior art, the utility model provides a TEC test clamp. The clamp can perform nondestructive contact on the TEC, and simultaneously ensures the integrity of a wire-bonding pad on the TEC and the reliability of electrical connection on the TEC.
In order to achieve the purpose, the technical scheme adopted by the utility model for solving the technical problems is as follows:
a TEC test fixture is characterized by comprising an upper bracket and a lower bracket, wherein an intermediate shaft is arranged between the upper bracket and the lower bracket, the upper bracket is rotatably arranged on the lower bracket through the intermediate shaft, the intermediate shaft is used as a boundary to divide the upper bracket and the lower bracket into two sides,
on one side of the intermediate shaft: a spring is arranged between the upper bracket and the lower bracket;
on the other side of the intermediate shaft: an adjusting and supporting device is arranged between the upper support and the lower support, the length from the end part of the upper support far away from the direction of the middle shaft to the middle shaft is smaller than the length from the end part of the lower support far away from the direction of the middle shaft to the middle shaft, a probe is arranged on the end part of the upper support far away from the direction of the middle shaft, the probe protrudes out of the end part edge of the upper support, a limiting steel sheet is arranged on the end part of the lower support far away from the direction of the middle shaft, a limiting groove for accommodating the TEC to be tested is arranged on the limiting steel sheet, and when the TEC to be tested is arranged in the limiting groove, a pad of the TEC to be tested is opposite to the top end of the probe on the upper support.
Preferably, each probe is insulated from each other. Preferably, the probe is fixedly arranged on the inner side surface of the upper bracket through an insulating gasket and a plastic screw.
Preferably, the probes are L-shaped probes, the probes are divided into two groups, and the top ends of the two groups of probes are flush.
Preferably, the probe body is made of stainless steel, and the top end of the probe is treated by nickel plating, palladium or gold.
Preferably, the tail end of the probe is connected with a wire in a switching mode, the wire is combined into a connecting cable, and the wire is combined into the connecting cable and is electrically connected with the testing device.
Preferably, the adjusting and supporting device is a threaded supporting rod arranged on the upper bracket, and the distance between the upper bracket and the lower bracket on the side can be adjusted by rotating the threaded supporting rod. The clamp uses the adjustable threaded support rod, firstly, the safety height of the upper bracket component and the lower bracket component on the side is set, and the probe on the opposite side is prevented from being pressed and deformed by the overlarge supporting force of the spring through the intermediate shaft. Secondly, the contact force of the probe contacting the micro TEC wire-bonding pad can be finely adjusted by rotating the threaded support rod, so that good electrical connection between the probe and the pad is ensured.
Preferably, the two ends of the middle part of the upper support are provided with upper supporting points, the two ends of the middle part of the lower support are provided with lower supporting points corresponding to the lower supporting points, and the upper supporting points and the lower supporting points are both provided with through holes through which the common intermediate shaft passes.
Preferably, the limiting steel sheet is arranged on the lower support through a positioning screw. And a matched limiting steel sheet is arranged for the TECs to be tested with different sizes.
Preferably, the limiting steel sheet can be designed into various specifications in a replaceable mode and is compatible with TECs of different sizes. By designing the limiting steel sheet, the probe is naturally lapped on a wire-bonding pad of the TEC to be tested when falling down, and the operation steps of reusing optical equipment for identification and using a mechanical arm for alignment are avoided.
The utility model is especially suitable for the TEC with the bonding pad size within 0.5mm multiplied by 0.5 mm. The TEC is preferably a micro TEC with the size of less than 3 mm.
The beneficial effects produced by the utility model are as follows:
(1) the TEC test clamp provided by the utility model can realize the electrical contact of the miniature TEC without a wire, and the rapid test or calibration test of the miniature TEC can be realized by matching with different test modules, and the TEC test clamp has high precision and good connection reliability.
(2) The TEC test clamp provided by the utility model has a self-protection design, and the possibility of damaging the clamp by misoperation is greatly reduced through the design of an elastic structure and a limiting support design.
(4) The TEC test clamp provided by the utility model is simple to operate and strong in compatibility. The micro TEC with different sizes can be compatible by replacing the limiting steel sheet. After the clamp spring is released, the probe naturally contacts the wire-bonding pad to form contact, and an optical alignment system and mechanical arm equipment are not needed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model.
Fig. 1 is a schematic structural perspective view of a TEC test fixture in embodiment 1 of the present invention.
Fig. 2 is an exploded view of a TEC test fixture in embodiment 1 of the present invention.
Fig. 3 is a structural side view of a TEC test jig according to embodiment 1 of the present invention.
Detailed Description
The utility model is further described below with reference to the drawings and specific preferred embodiments of the description, without thereby limiting the scope of protection of the utility model.
Example 1
Referring to fig. 1 to 3, the embodiment discloses a miniature TEC test fixture, the TEC test fixture is in a spring clamp shape, the fixture main body includes an upper bracket 1 and a lower bracket 2, an intermediate shaft 3 is disposed between the upper bracket 1 and the lower bracket 2, upper support points are disposed at two ends of the middle portion of the upper bracket 1, lower support points corresponding to the lower support points are disposed at two ends of the middle portion of the lower bracket 2, and through holes through which the intermediate shaft 3 passes are disposed on the upper support points and the lower support points. The upper frame 1 is rotatably disposed on the lower frame 2 through an intermediate shaft 3, as is apparent from fig. 3, and the upper frame 1 and the lower frame 2 are connected to each other in a seesaw manner. The middle shaft 3 is used as a boundary, and the upper support 1 and the lower support 2 are divided into two sides:
on one side of the intermediate shaft 3: and a spring 5 is arranged between the upper bracket 1 and the lower bracket 2, and the elasticity of the spring 5 plays a role in supporting the part of the middle shaft 3 on the side outwards and plays a role in compressing the other side of the middle shaft 3 inwards.
On the other side of the intermediate shaft 3: an adjusting and supporting device is arranged between the upper support 1 and the lower support 2, the adjusting and supporting device is a rotatable flat-head threaded supporting rod 4 arranged on the upper support 1, and the threaded supporting rod 4 is used for exerting opposite supporting force on the upper support and the lower support on the side of the middle shaft 3. The flat-head threaded support rod 4 is provided with an inner hexagonal nut, and the distance between the upper bracket and the lower bracket on the side of the intermediate shaft 3 can be adjusted by rotating the threaded support rod 4. The length from the end part, far away from the middle shaft direction, of the upper support 1 to the middle shaft 3 is smaller than the length from the end part, far away from the middle shaft direction, of the lower support 2 to the middle shaft 3, four probes 8 are arranged at the end part, far away from the middle shaft direction, of the upper support 1, the probes 8 protrude out of the edge of the end part of the upper support 3, every two probes 8 form a group, the probes 8 close to the outer side are used for conducting current, and the probes 8 close to the inner side are used for sampling voltage signals. The four probes 8 are matched with a test circuit, and Kelvin detection can be carried out on the device to be detected. The ends of the two groups of probes 8 are equal in length and are assembled in a crab claw type. The probe 8 body is made of stainless steel, and the tail end of the probe is processed by nickel plating, palladium and gold. The four probes 8 are mutually insulated and fixedly arranged on the inner side surface of the upper bracket 1 by using an insulating gasket and a plastic screw 10. In this embodiment, the four probes 8 fixed on the upper bracket 1 are connected to wires in a transition manner, and extend to the lower bracket by bypassing the intermediate shaft, and are sealed at the end of the lower bracket to form the connection cable 6. The device is used for connecting an LCR instrument, a thermoelectric module performance testing circuit and the like. The end part, far away from the middle shaft, of the lower support 2 is provided with a limiting steel sheet 7, the limiting steel sheet 7 is arranged on the lower support 2 through a positioning screw 9, a limiting groove 11 for accommodating the TEC to be tested is formed in the limiting steel sheet 7, and the limiting groove 11 can limit the hot end ceramic of the micro TEC. When the micro TEC is placed in the limiting steel sheet 7, the spring 5 is released, and the height of the threaded supporting rod 4 is adjusted, so that the two groups of probes 8 fall and are lapped on two wire-bonding pads of the micro TEC, and good electrical connection is realized.
In this embodiment, the micro TECs with different sizes can be tested by using different limiting steel sheets 7. Every spacing steel sheet 7 realizes designing according to miniature TEC's size, the mathematical relationship of position and 7 locking screws of spacing steel sheet to use laser to carry out high-accuracy processing, avoid burr and error, spacing steel sheet 7 generally adopts stainless steel.
The foregoing is merely a preferred embodiment of the utility model and is not intended to limit the utility model in any manner. Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make many possible variations and modifications to the disclosed embodiments, or equivalent modifications, without departing from the spirit and scope of the utility model, using the methods and techniques disclosed above. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention.

Claims (9)

1. The TEC test fixture is characterized by comprising an upper support (1) and a lower support (2), wherein an intermediate shaft (3) is arranged between the upper support (1) and the lower support (2), the upper support (1) is rotatably arranged on the lower support (2) through the intermediate shaft (3), the intermediate shaft (3) is used as a boundary to divide the upper support (1) and the lower support (2) into two sides,
on one side of the intermediate shaft (3): a spring (5) is arranged between the upper bracket (1) and the lower bracket (2);
on the other side of the intermediate shaft (3): be equipped with between upper bracket (1) and lower carriage (2) and adjust strutting arrangement, the tip of keeping away from the jackshaft direction on upper bracket (1) arrives the length of jackshaft (3) is less than the tip of keeping away from the jackshaft direction on lower carriage (2) arrives the length of jackshaft (3), the tip of keeping away from the jackshaft direction on upper bracket (1) is provided with 4 probes (8), probe (8) top protrusion the tip of upper bracket (3), the tip of keeping away from the jackshaft direction on the lower carriage (2) is provided with spacing steel sheet (7), be equipped with on spacing steel sheet (7) and hold spacing groove (11) of the TEC that awaits measuring, when the TEC that awaits measuring arranges in spacing groove (11), the pad of the TEC that awaits measuring with probe (8) top on upper bracket (1) are relative.
2. The TEC test fixture of claim 1, wherein each probe (8) is arranged insulated from each other.
3. The TEC test clamp of claim 1, wherein the probe (8) is fixed to the inner side of the upper bracket (1) by an insulating washer and a plastic screw (10).
4. The TEC test clamp of any one of claims 1 to 3, wherein the probes (8) are L-shaped probes, one group of every two probes (8), and the top ends of the two groups of probes (8) are flush.
5. The TEC test clamp of any one of claims 1 to 3, wherein the probe (8) body is made of stainless steel, and the top of the probe (8) is treated with Ni, Pd or Au.
6. The TEC test clamp of any one of claims 1 to 3, wherein the tail end of the probe (8) is adapted to be a wire, and the wire is combined with a connecting cable to be electrically connected with the test device.
7. The TEC test clamp of claim 1, wherein both ends of the middle of the upper bracket (1) are provided with upper supporting points, both ends of the middle of the lower bracket (2) are provided with lower supporting points corresponding to the lower supporting points, and both the upper supporting points and the lower supporting points are provided with through holes for passing the common intermediate shaft (3).
8. The TEC test clamp of claim 1, wherein the adjustment support means is a threaded support rod (4) arranged on the upper bracket (1).
9. The TEC test clamp of claim 1, wherein the limiting steel plate (7) is arranged on the lower bracket (2) through a set screw (9).
CN202121782103.XU 2021-08-02 2021-08-02 TEC test fixture Active CN216209266U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121782103.XU CN216209266U (en) 2021-08-02 2021-08-02 TEC test fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121782103.XU CN216209266U (en) 2021-08-02 2021-08-02 TEC test fixture

Publications (1)

Publication Number Publication Date
CN216209266U true CN216209266U (en) 2022-04-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115684675A (en) * 2022-11-17 2023-02-03 镭神技术(深圳)有限公司 Miniature semiconductor refrigerating sheet aging clamp and power-on and temperature acquisition method
CN116165413A (en) * 2023-03-06 2023-05-26 镭神技术(西安)有限公司 Four-wire system probe testing device and method for semiconductor refrigeration piece detection equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115684675A (en) * 2022-11-17 2023-02-03 镭神技术(深圳)有限公司 Miniature semiconductor refrigerating sheet aging clamp and power-on and temperature acquisition method
CN116165413A (en) * 2023-03-06 2023-05-26 镭神技术(西安)有限公司 Four-wire system probe testing device and method for semiconductor refrigeration piece detection equipment
CN116165413B (en) * 2023-03-06 2023-08-04 镭神技术(西安)有限公司 Four-wire system probe testing device and method for semiconductor refrigeration piece detection equipment

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