CN107807317B - Electronic component testing device - Google Patents
Electronic component testing device Download PDFInfo
- Publication number
- CN107807317B CN107807317B CN201610796275.XA CN201610796275A CN107807317B CN 107807317 B CN107807317 B CN 107807317B CN 201610796275 A CN201610796275 A CN 201610796275A CN 107807317 B CN107807317 B CN 107807317B
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- CN
- China
- Prior art keywords
- electronic component
- tested
- pins
- heat
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012360 testing method Methods 0.000 title claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims description 39
- 238000002955 isolation Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims 2
- 238000004891 communication Methods 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- 239000013013 elastic material Substances 0.000 abstract description 3
- 238000005057 refrigeration Methods 0.000 description 7
- 238000000098 azimuthal photoelectron diffraction Methods 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention belongs to the technical field of electronic component testing, and particularly relates to an electronic component testing device which comprises an electronic component to be tested and a driving circuit board, wherein a plurality of conductive holes matched with all pins of the electronic component to be tested are formed in the driving circuit board, the pins of the electronic component to be tested are inserted into the conductive holes, an elastic unit is further arranged between each pin and the driving circuit board, and the elastic unit can tighten the pins so that the pins are tightly attached to the inner walls of the conductive holes, and electric connection between the electronic component to be tested and the driving circuit board is realized. The invention abandons the welding test mode in the common test, realizes the electrical communication between the PCB and the pins of the electronic components by adopting the tensile force generated by the elastic material, is convenient and quick, and has no damage to the components.
Description
Technical Field
The invention belongs to the technical field of electronic component testing, and particularly relates to an electronic component testing device.
Background
The device widely used for the single photon detector at present is an Avalanche Photodiode (APD), which is a photovoltaic detector element used in the detector field, when the working voltage of the diode is higher than the avalanche breakdown voltage of the diode, the diode can respond TO single photon incidence and generate macroscopic avalanche current pulse, so that the conversion output of photoelectric signals is realized, and the refrigeration type INGAAS APD is a device with refrigeration package which is specially applied TO the single photon detector, is more complex than the common APD TO-46 package structure without refrigeration function, and adopts a TO-8 package structure. In order to ensure the performance of the detector, the APDs are required to be fixed on the PCB, and the performance is tested, and because the number of pins of the refrigeration type APDs is 12, the most commonly used fixing mode at present is to directly weld the APDs on the PCB for testing in order to ensure the reliability of the performance test.
In the prior art, an APD is fixed on a PCB (printed circuit board) in a welding mode to perform performance test of the APD, because the number of APD pins of a refrigeration type is 12, the pin spacing is only a few millimeters, the multiple welding mode can not only cause the blockage of PCB holes, so that the PCB is wasted, but also the processing difficulty of soldering tin on the detached APD pins is high, and the APD pins are not beneficial to being installed in normal production equipment.
Disclosure of Invention
The invention aims to provide an electronic component testing device which is convenient to assemble and disassemble and does not damage pins in the assembling and disassembling process.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides an electronic components testing arrangement, includes electronic components and drive circuit board to be tested, be equipped with on the drive circuit board with each pin assorted a plurality of conductive holes of electronic components to be tested, the pin of electronic components to be tested is inserted in the conductive hole, and still is equipped with the elastic element between each pin and the drive circuit board, and the elastic element can be taut with the pin, makes its and conductive hole inner wall closely laminate, realizes the electricity between electronic components to be tested and the drive circuit board and is connected.
Preferably, a heat dissipation plate made of high heat conduction materials is further arranged between the electronic component to be tested and the driving circuit board, and pins of the electronic component to be tested penetrate through holes which are formed in the heat dissipation plate and correspond to the pins one by one; and a radiating fin is connected to the position, adjacent to the electronic component to be tested, on the radiating plate.
Preferably, a pin isolation pad made of insulating materials is arranged between the driving circuit board and the heat dissipation plate, the pin isolation pad comprises a plate-shaped body and a plurality of isolation sleeves which are arranged on the plate-shaped body in a protruding mode and correspond to the pins one by one, the pipe holes of the isolation sleeves penetrate through the plate-shaped body, the plate-shaped body is clamped between the heat dissipation plate and the driving circuit board, the isolation sleeves are inserted into through holes of the heat dissipation plate, and pins of an electronic component to be tested penetrate through the pipe holes of the isolation sleeves to insulate the pins from the heat dissipation plate.
Preferably, a heat conducting pad made of elastic heat conducting materials is arranged between the electronic component to be tested and the heat dissipation plate, and two sides of the heat conducting pad are respectively and tightly attached to the electronic component to be tested and the heat dissipation plate and are used for conducting heat generated by the electronic component to be tested to the heat dissipation plate.
Preferably, the heat dissipation plate and the driving circuit board are fixedly connected through bolts, the elastic unit is an elastic band, and two ends of the elastic unit are respectively sleeved on the pins and the bolts.
Preferably, a threaded column is arranged at the bottom of the electronic component to be tested, and the threaded column sequentially penetrates through the heat conduction pad, the heat dissipation plate and the through holes formed in the driving circuit board and is screwed by nuts, so that the electronic component to be tested is fixedly connected with the heat dissipation plate and the driving circuit board.
Preferably, the heat dissipation plate is a copper plate.
Preferably, the pin isolation pad is made of heat-insulating rubber or heat-insulating ceramic; the heat conducting pad is made of heat conducting rubber.
Preferably, the radiating fin is fixedly connected with the radiating plate through a screw.
Preferably, a limit sleeve is further arranged at the top end of the pin of the electronic component to be tested, the limit sleeve and the pin form interference fit, friction force between the limit sleeve and the pin can enable the limit sleeve and the pin to be relatively fixed, and when an operator pulls the limit sleeve with a little force, the limit sleeve can be enabled to fall off from the pin; an annular groove for clamping and fixing the rubber band is arranged on the outer annular surface of the limit sleeve.
The invention has the technical effects that: the invention abandons the welding test mode in the common test, realizes the electrical communication between the PCB and the pins of the electronic components by adopting the tensile force generated by the elastic material, is convenient and quick, and has no damage to the components. The elastic material of the heat conducting pad can be adjusted in real time according to the contact condition of the pins of the electronic components, and is convenient to control. The pin isolation pad effectively avoids the problem of communication between pin short circuits possibly caused by contact between the device tube shell and the heat sink. The invention can be widely used for various electronic components, is convenient for carrying out factory performance test on the components, and does not damage the components.
Drawings
FIG. 1 is a cross-sectional view provided by an embodiment of the present invention;
FIG. 2 is an enlarged partial view of I of FIG. 1;
FIG. 3 is a schematic perspective view of an embodiment of the present invention;
Fig. 4 is a rear view provided by an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 4, in the present embodiment, the detection of an avalanche diode (APD) 10 is taken as an example, and the technical scheme of the present invention will be described in detail.
The utility model provides an electronic components testing arrangement, includes APD10 and drive circuit board 11, be equipped with on the drive circuit board 11 with APD10 each pin 101 assorted a plurality of conductive holes, APD 10's pin 101 inserts in the conductive hole, and still is equipped with the elasticity unit between each pin 101 and the drive circuit board 11, and the elasticity unit can be taut pin 101 makes its and conductive hole inner wall closely laminating, realizes the electric connection between APD10 and the drive circuit board 11. The invention abandons the welding test mode in the common test, realizes the electrical communication between the drive circuit board 11 and the APD10 pin 101 by adopting the tension force generated by the elastic unit, is convenient and quick, and has no damage to devices.
Preferably, a heat dissipation plate 12 made of high heat conduction material is further arranged between the APD10 and the driving circuit board 11, and pins 101 of the APD10 pass through holes which are formed in the heat dissipation plate 12 and correspond to the pins 101 one by one; and a radiating fin 19 is connected to the position, adjacent to the APD10, of the radiating plate 12, and an exhaust fan 20 can be installed on the radiating fin 19, so that the radiating efficiency is improved. The heat dissipation plate 12 can timely conduct heat generated during the refrigeration of the APD10 to the heat dissipation plate 19, so that the APD10 can work at a lower temperature.
Preferably, a pin isolation pad made of an insulating material is arranged between the driving circuit board 11 and the heat dissipation plate 12, the pin isolation pad comprises a plate-shaped body 13, and a plurality of isolation sleeves 131 protruding from the plate-shaped body 13 and corresponding to the pins 101 one by one, the pipe holes of the isolation sleeves 131 penetrate through the plate-shaped body 13, the plate-shaped body 13 is clamped between the heat dissipation plate 12 and the driving circuit board 11, the isolation sleeves 131 are inserted into the through holes of the heat dissipation plate 12, and the pins 101 of the APD10 penetrate through the pipe holes of the isolation sleeves 131 to insulate the pins 101 from the heat dissipation plate 12. Since the heat sink 12 is conductive, the pins 101 of the APD10 are short-circuited between the pins 101 due to direct contact with the heat sink 12, and thus a pin isolation pad made of an insulating material is added to the heat sink 12, so that the electrical communication characteristics between the pins 101 can be effectively isolated.
Preferably, a thermal pad 14 made of an elastic thermal conductive material is disposed between the APD10 and the heat dissipation plate 12, and two sides of the thermal pad 14 are respectively and closely attached to the APD10 and the heat dissipation plate 12, so as to conduct heat generated by the APD10 to the heat dissipation plate 12. Because the refrigeration type APD10 needs to ensure good heat conductivity of the device when in use, in order to ensure that the bottom of the tube shell is tightly attached to the heat dissipation plate 12 and the heat conductivity is ensured, a heat conduction pad 14 is added between the APD10 and the heat sink, and the elasticity of the heat conduction pad 14 can ensure the heat conductivity of the bottom of the tube shell of the device.
Preferably, the heat dissipation plate 12 and the driving circuit board 11 are fixedly connected through bolts 16, the elastic unit is an elastic band 15, and two ends of the elastic unit are respectively sleeved on the pins 101 and the bolts 16. The bottom of the APD10 is provided with a threaded column, and the threaded column sequentially passes through the heat conducting pad 14, the heat dissipation plate 12 and the through holes formed in the driving circuit board 11 and is screwed by adopting a nut 21, so that the APD10 is fixedly connected with the heat dissipation plate 12 and the driving circuit board 11. The threaded column is integrally formed with the base of APD 10. The nut 21 of this embodiment is preferably a copper pillar nut with a larger length, so that the nut 21 protrudes out of the outer end of the pin 101, and interference with the pin 101 during the assembly and disassembly of the nut 21 is avoided.
Preferably, the heat dissipation plate 12 is a copper plate, and the pin isolation pad is made of heat insulation rubber or heat insulation ceramic; the heat conducting pad 14 is made of heat conducting rubber, and the heat radiating fin 19 is fixedly connected with the heat radiating plate 12 through a screw 18.
Preferably, a limit sleeve 17 is further arranged at the top end of the pin 101 of the APD10, the limit sleeve 17 and the pin 101 form interference fit, friction force between the limit sleeve 17 and the pin 101 can enable the limit sleeve 17 and the pin 101 to be relatively fixed, and when an operator pulls the limit sleeve 17 with a little force, the limit sleeve 17 can be separated from the pin 101; an annular groove 171 for clamping the rubber band 15 is arranged on the outer annular surface of the limit sleeve 17.
In use, the heat sink 12, the driving circuit board 11, the pin spacer, and the heat sink 19 are fixed by bolts 16 and screws 18. And then the APD10 is arranged on a test tool according to the definition of a pin 101 of the APD10 on the driving circuit board 11, the APD10 is fixed through a nut 21, and the bottom of a tube shell of the APD10, the heat conducting pad 14 and the heat radiating plate 12 are ensured to be in full contact. After the APD10 is fixed, the pin 101 of the APD10 is fixed through the rubber band 15, the rubber band 15 is respectively fixed on the pin 101 and the bolt 16, and the purpose of electrical connectivity connection between the pin 101 and the APD10 is achieved through the tensile force of the rubber band 15.
When the APD10 is disassembled, the APD10 can be directly taken out only by disassembling the rubber band 15 and the nut 21 in the middle of fixing the APD10, and the pin 101 is not damaged, so that the performance of the APD10 and the later use in the research, development and production processes are not affected.
The rubber band 15 can be adjusted in real time according to the contact condition of the pins 101 of the APD10, and the control is convenient.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (4)
1. An electronic component testing arrangement, its characterized in that: the electronic component to be tested is inserted into the conductive holes, and rubber bands are arranged between the pins and the driving circuit board and can tighten the pins so as to be tightly attached to the inner walls of the conductive holes, so that the electronic component to be tested is electrically connected with the driving circuit board;
A heat radiation plate made of high heat conduction materials is further arranged between the electronic component to be tested and the driving circuit board, and pins of the electronic component to be tested penetrate through holes which are formed in the heat radiation plate and correspond to the pins one by one; a radiating fin is connected to the position, adjacent to the electronic component to be tested, on the radiating plate;
The pin isolation pad is made of insulating materials and comprises a plate-shaped body and a plurality of isolation sleeves which are arranged on the plate-shaped body in a protruding mode and correspond to the pins one by one, the pipe holes of the isolation sleeves penetrate through the plate-shaped body, the plate-shaped body is clamped between the heat dissipation plate and the driving circuit board, the isolation sleeves are inserted into through holes of the heat dissipation plate, and pins of an electronic component to be tested penetrate through the pipe holes of the isolation sleeves to insulate the pins from the heat dissipation plate;
A heat conduction pad made of elastic heat conduction materials is arranged between the electronic component to be tested and the heat dissipation plate, and two sides of the heat conduction pad are respectively and tightly attached to the electronic component to be tested and the heat dissipation plate and are used for conducting heat generated by the electronic component to be tested to the heat dissipation plate;
the heat dissipation plate is fixedly connected with the driving circuit board through bolts, and two ends of the rubber band are respectively sleeved on the pins and the bolts;
The bottom of the electronic component to be tested is provided with a threaded column, and the threaded column sequentially penetrates through the heat conduction pad, the heat dissipation plate and the through holes formed in the driving circuit board and is screwed by nuts, so that the electronic component to be tested is fixedly connected with the heat dissipation plate and the driving circuit board;
The top end of the pin of the electronic component to be tested is also provided with a limit sleeve, the limit sleeve and the pin form interference fit, the friction force between the limit sleeve and the pin can enable the limit sleeve and the pin to be relatively fixed, and when an operator pulls the limit sleeve with a little force, the limit sleeve can be separated from the pin; an annular groove for clamping and fixing the rubber band is arranged on the outer annular surface of the limit sleeve.
2. The electronic component testing apparatus according to claim 1, wherein: the heat dissipation plate is a copper plate.
3. The electronic component testing apparatus according to claim 1, wherein: the pin isolation pad is made of heat-insulating rubber or heat-insulating ceramic; the heat conducting pad is made of heat conducting rubber.
4. The electronic component testing apparatus according to claim 1, wherein: the radiating fins are fixedly connected with the radiating plate through screws.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410412369.7A CN118362851A (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
| CN201610796275.XA CN107807317B (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610796275.XA CN107807317B (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410412369.7A Division CN118362851A (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107807317A CN107807317A (en) | 2018-03-16 |
| CN107807317B true CN107807317B (en) | 2024-05-28 |
Family
ID=61575910
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410412369.7A Pending CN118362851A (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
| CN201610796275.XA Active CN107807317B (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410412369.7A Pending CN118362851A (en) | 2016-08-31 | 2016-08-31 | Electronic component testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN118362851A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110618370B (en) * | 2018-06-04 | 2022-02-01 | 苏州能讯高能半导体有限公司 | Testing device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1508859A (en) * | 2002-12-17 | 2004-06-30 | 丽台科技股份有限公司 | Integrated circuit testing device |
| CN2898575Y (en) * | 2006-04-28 | 2007-05-09 | 吴毅超 | High-density and directed-connected LED illuminating module |
| CN101629710A (en) * | 2008-07-18 | 2010-01-20 | 富士迈半导体精密工业（上海）有限公司 | Illuminating device |
| KR20100138348A (en) * | 2009-06-25 | 2010-12-31 | 이상경 | A variable box for pcb loading |
| JP2014006097A (en) * | 2012-06-22 | 2014-01-16 | Advantest Corp | Socket, tray, substrate assembly, and electronic part testing device |
| CN105445506A (en) * | 2015-12-24 | 2016-03-30 | 贵州航天计量测试技术研究所 | Welding-free self-clamping interconnection structure |
| CN206074755U (en) * | 2016-08-31 | 2017-04-05 | 科大国盾量子技术股份有限公司 | A kind of electronic devices and components test device |
-
2016
- 2016-08-31 CN CN202410412369.7A patent/CN118362851A/en active Pending
- 2016-08-31 CN CN201610796275.XA patent/CN107807317B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1508859A (en) * | 2002-12-17 | 2004-06-30 | 丽台科技股份有限公司 | Integrated circuit testing device |
| CN2898575Y (en) * | 2006-04-28 | 2007-05-09 | 吴毅超 | High-density and directed-connected LED illuminating module |
| CN101629710A (en) * | 2008-07-18 | 2010-01-20 | 富士迈半导体精密工业（上海）有限公司 | Illuminating device |
| KR20100138348A (en) * | 2009-06-25 | 2010-12-31 | 이상경 | A variable box for pcb loading |
| JP2014006097A (en) * | 2012-06-22 | 2014-01-16 | Advantest Corp | Socket, tray, substrate assembly, and electronic part testing device |
| CN105445506A (en) * | 2015-12-24 | 2016-03-30 | 贵州航天计量测试技术研究所 | Welding-free self-clamping interconnection structure |
| CN206074755U (en) * | 2016-08-31 | 2017-04-05 | 科大国盾量子技术股份有限公司 | A kind of electronic devices and components test device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107807317A (en) | 2018-03-16 |
| CN118362851A (en) | 2024-07-19 |
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