CN206074755U - A kind of electronic devices and components test device - Google Patents
A kind of electronic devices and components test device Download PDFInfo
- Publication number
- CN206074755U CN206074755U CN201621032214.8U CN201621032214U CN206074755U CN 206074755 U CN206074755 U CN 206074755U CN 201621032214 U CN201621032214 U CN 201621032214U CN 206074755 U CN206074755 U CN 206074755U
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- electronic devices
- pin
- components
- measured
- heat sink
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Abstract
This utility model belongs to electronic devices and components technical field of measurement and test, specifically related to a kind of electronic devices and components test device, including electronic devices and components to be measured and drive circuit board, the drive circuit board is provided with the multiple conductive holes matched with each pin of electronic devices and components to be measured, the pin of the electronic devices and components to be measured is inserted in conductive hole, and Flexible element is additionally provided between each pin and drive circuit board, pin can be tensed by Flexible element, which is brought into close contact with conductive hole inwall, realize the electrical connection between electronic devices and components to be measured and drive circuit board.The test mode that this utility model is welded in abandoning conventional test, the pulling force produced using elastomeric material realize the electrical communication of pcb board and electronic devices and components pin, convenient and swift, and do not have any damage to device.
Description
Technical field
This utility model belongs to electronic devices and components technical field of measurement and test, and in particular to a kind of electronic devices and components test device.
Background technology
The device for being now widely used in single-photon detector is avalanche photodide (APD), and it is that detector field makes
Photovoltaic detector element, when the running voltage of diode is higher than its avalanche breakdown voltage, incident to single photon can produce
Raw response, produces the avalanche current pulse of macroscopic view, it is achieved thereby that the conversion of photosignal is exported, refrigeration mode InGaAs APD are
The device with refrigeration encapsulation of single-photon detector is specifically applied to, compared with commonly without refrigerating function APD TO-46 encapsulation
Structure is complex, and which adopts TO-8 encapsulating structures.In order to ensure the performance of detector, need APD is fixed on PCB, it is right
Its performance is tested, as refrigeration mode APD number of pins is 12, in order to ensure the reliability of performance test, the most frequently used at present
Fixed form be still to be soldered directly to be tested on pcb board using APD.
APD is mainly fixed on pcb board the performance test for carrying out APD by way of welding by existing technology, by
It it is 12 in the APD number of pins of refrigeration mode, and the mode that lead pin pitch only has several millimeters, multiple welding not only results in PCB aperture
Obstruction, cause the scolding tin intractability in the waste of PCB, and the APD pins for disassembling also larger, be unfavorable for its installation
In normal production equipment.
Utility model content
The purpose of this utility model is to provide one kind and is easy to dismounting, and the electronics unit device of pin will not be damaged in disassembly process
Part test device.
For achieving the above object, this utility model provides technical scheme below：A kind of electronic devices and components test device, bag
Electronic devices and components to be measured and drive circuit board are included, the drive circuit board is provided with each pin phase with electronic devices and components to be measured
The multiple conductive holes matched somebody with somebody, the pin of the electronic devices and components to be measured are inserted in conductive hole, and between each pin and drive circuit board
Flexible element is additionally provided with, pin can be tensed by Flexible element so as to be brought into close contact with conductive hole inwall, realizes electronics unit to be measured
Electrical connection between device and drive circuit board.
Preferably, it is additionally provided between the electronic devices and components to be measured and drive circuit board made by highly heat-conductive material and radiates
Plate, what the pin of the electronic devices and components to be measured was opened up from heat sink are passed through with the one-to-one through hole of pin；The radiating
Fin is connected with neighbouring electronic devices and components position to be measured on plate.
Preferably, pin isolating pad made by insulated heat material, institute are provided between the drive circuit board and heat sink
State that pin isolating pad includes protruding out setting in plate-like body, and plate-like body with the one-to-one multiple separation sleeves of each pin
Pipe, the pore of each disrance sleeve are arranged through plate-like body, and the plate-like body is clipped between heat sink and drive circuit board, respectively
Disrance sleeve is inserted in the through hole of the heat sink, and the pin of electronic devices and components to be measured is passed through from the pore of disrance sleeve, is made each
Insulate between pin and heat sink.
Preferably, heat conductive pad made by elastic heat conducting material, institute are provided between the electronic devices and components to be measured and heat sink
State heat conductive pad both sides to be brought into close contact with electronic devices and components to be measured and heat sink respectively, for the heat for producing electronic devices and components to be measured
Amount conduction is to heat sink.
Preferably, the heat sink and drive circuit board are bolted to connection, the Flexible element be rubber band, bullet
Property unit two ends are respectively fitted on pin and bolt.
Preferably, the bottom of the electronic devices and components to be measured is provided with threaded post, and the threaded post sequentially passes through heat conductive pad, radiating
The through hole opened up on plate and drive circuit board, and nut screwing clamping is adopted, electronic devices and components to be measured are made with heat sink and drive circuit
Plate is affixed.
Preferably, the heat sink is copper coin.
Preferably, the pin isolating pad is made up of insulating rubber or thermal insulation ceramicses；The heat conductive pad is by heat conductive rubber system
Into.
Preferably, it is fixedly connected by screw between the fin and heat sink.
Preferably, the pin top of the electronic devices and components to be measured is additionally provided with limit casing, the limit casing and pin
Interference fit is constituted, the frictional force between limit casing and pin can be such that limit casing is relatively fixed with pin, and as behaviour
When making personnel's pulling limit casing, limit casing can be just made to come off from pin；The outer ring surface of the limit casing is provided with use
In the cannelure for fixing rubber band.
It is of the present utility model to have technical effect that：The test mode that this utility model is welded in abandoning conventional test, adopts
The pulling force that elastomeric material is produced realizes the electrical communication of pcb board and electronic devices and components pin, convenient and swift, and device is not had
There is any damage.The elastomeric material of the heat conductive pad in this utility model can be adjusted in real time according to electronic devices and components pins contact situation
It is whole, it is easy to control.Pin isolating pad in this utility model efficiently avoid device package and may cause with during heat sink contact
Pin short circuit between the problem that connects.This utility model can be commonly used to various electronic devices and components, convenient that device is carried out
Enter factory's performance test but device itself will not be destroyed.
Description of the drawings
Fig. 1 is the sectional view provided by embodiment of the present utility model；
Fig. 2 is the I partial enlarged views of Fig. 1；
Fig. 3 is the dimensional structure diagram provided by embodiment of the present utility model；
Fig. 4 is the rearview provided by embodiment of the present utility model.
Specific embodiment
This utility model is described in detail below in conjunction with accompanying drawing.
As shown in figures 1-4, the present embodiment is by taking the detection of avalanche diode (APD) 10 as an example, to technology of the present utility model
Scheme is described in detail.
A kind of electronic devices and components test device, including APD10 and drive circuit board 11, the drive circuit board 11 are provided with
The multiple conductive holes matched with each pin 101 of APD10, the pin 101 of the APD10 are inserted in conductive hole, and each pin
Flexible element is additionally provided between 101 and drive circuit board 11, pin 101 can be tensed by Flexible element so as in conductive hole
Wall is brought into close contact, and realizes the electrical connection between APD10 and drive circuit board 11.What this utility model was welded in abandoning conventional test
Test mode, the pulling force produced using Flexible element realize the electrical communication of drive circuit board 11 and APD10 pins 101, side
Just it is quick, and there is no any damage to device.
Preferably, heat sink 12 made by highly heat-conductive material are additionally provided between the APD10 and drive circuit board 11, it is described
What the pin 101 of APD10 was opened up from heat sink 12 is passed through with 101 one-to-one through hole of pin；It is adjacent on the heat sink 12
Fin 19 is connected with nearly APD10 positions, an exhaust fan 20 can also be installed on fin 19, improve radiating efficiency.Heat sink
12 heats produced when can freeze APD10 are conducted in time to fin 19, enable APD10 to work at a lower temperature.
Preferably, be provided with insulated heat material between the drive circuit board 11 and heat sink 12 made by pin isolate
Pad, the pin isolating pad include corresponding with each pin 101 for setting is protruded out in plate-like body 13, and plate-like body 13
Multiple disrance sleeves 131, the pore of each disrance sleeve 131 arranged through plate-like body 13, and the plate-like body 13 is clipped in scattered
Between hot plate 12 and drive circuit board 11, each disrance sleeve 131 is inserted in the through hole of the heat sink 12, the pin 101 of APD10
Pass through from the pore of disrance sleeve 131, make to insulate between each pin 101 and heat sink 12.Due to heat sink 12 be it is conductive,
The pin 101 of APD10 directly contacts heat sink 12 can cause between pin 101 short circuit, thus with the addition of in heat sink 12 by
The pin isolating pad that the material of insulated heat is made, the electrical communication characteristic that can be effectively isolated between each pin 101.
Preferably, heat conductive pad 14 made by elastic heat conducting material, the heat conduction are provided between the APD10 and heat sink 12
14 both sides of pad are brought into close contact with APD10 and heat sink 12 respectively, and the heat for APD10 is produced is conducted to heat sink 12.By
Need when in use to ensure the heat conductivity that device is good in refrigeration mode APD10, in order to ensure that tube shell bottom is closely pasted with heat sink 12
Close, it is ensured that heat conductivity, APD10 and it is heat sink between increase heat conductive pad 14, the elasticity of heat conductive pad 14 can ensure that the pipe of device
The heat conductivity of shell bottom.
Preferably, the heat sink 12 is fixedly connected by bolt 16 with drive circuit board 11, and the Flexible element is rubber
Rubber band 15, Flexible element two ends are respectively fitted on pin 101 and bolt 16.The bottom of APD10 is provided with threaded post, the threaded post according to
The secondary through hole opened up through on heat conductive pad 14, heat sink 12 and drive circuit board 11, and being tightened using nut 21, make APD10 with
Heat sink 12 and drive circuit board 11 are affixed.The base integral type machine-shaping of the threaded post and APD10.The spiral shell of the present embodiment
Female 21 preferably using the copper post nuts that length is larger, make 101 outer end of the protrusion pin of nut 21, it is to avoid during dismounting nut 21 and pin
101 produce interference.
Preferably, the heat sink 12 is copper coin, and the pin isolating pad is made up of insulating rubber or thermal insulation ceramicses；It is described
Heat conductive pad 14 is made up of heat conductive rubber, is fixedly connected by screw 18 between the fin 19 and heat sink 12.
Preferably, 101 top of pin of the APD10 is additionally provided with limit casing 17, the limit casing 17 and pin 101
Interference fit is constituted, the frictional force between limit casing 17 and pin 101 can make limit casing 17 relative solid with pin 101
It is fixed, and when operator pull limit casing 17, can just make limit casing 17 come off from pin 101；The stop collar
The outer ring surface of pipe 17 is provided with for fixing the cannelure 171 of rubber band 15.
During use, first by heat sink 12, drive circuit board 11, pin isolating pad, fin 19 bolt 16 and screw
18 fix.Define APD10 is installed on test fixture according still further to the pin 101 of APD10 on drive circuit board 11, and pass through
Nut 21 is fixed to APD10, and ensures that the tube shell bottom of APD10, heat conductive pad 14, heat sink 12 are completely attached to.Fix
After APD10, then by the pin 101 of the fixation APD10 of rubber band 15, rubber band 15 is individually fixed on pin 101 and bolt 16,
The purpose that pin 101 is connected with the electrical connectivity of APD10 is reached by the tensile force of rubber band 15.
During dismounting, APD10 is directly taken out by the nut 21 of the centre that need to only dismantle rubber band 15 and fixed APD10,
And pin 101 will not be damaged, so as to do not interfere with yet APD10 performance and the later stage research and development and production process in
Use.
Rubber band 15 can contact situation real-time adjustment according to APD10 pins 101, easy to control.
Preferred embodiment of the present utility model is the foregoing is only, it is not to limit this utility model, all at this
Any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in this utility model
Protection domain within.
Claims (10)
1. a kind of electronic devices and components test device, it is characterised in that：Including electronic devices and components to be measured and drive circuit board, the drive
Dynamic circuit board is provided with the multiple conductive holes matched with each pin of electronic devices and components to be measured, the electronic devices and components to be measured
Pin is inserted in conductive hole, and Flexible element is additionally provided between each pin and drive circuit board, and pin can be drawn by Flexible element
Tightly so as to be brought into close contact with conductive hole inwall, realize the electrical connection between electronic devices and components to be measured and drive circuit board.
2. electronic devices and components test device according to claim 1, it is characterised in that：The electronic devices and components to be measured and drive
Heat sink made by highly heat-conductive material is additionally provided between dynamic circuit board, the pin of the electronic devices and components to be measured is opened from heat sink
If pass through with the one-to-one through hole of pin；Fin is connected with neighbouring electronic devices and components position to be measured on the heat sink.
3. electronic devices and components test device according to claim 2, it is characterised in that：The drive circuit board and heat sink
Between be provided with pin isolating pad made by insulated heat material, the pin isolating pad includes plate-like body, and plate-like body
On protrude out setting with the one-to-one multiple disrance sleeves of each pin, the pore of each disrance sleeve through plate-like body setting,
The plate-like body is clipped between heat sink and drive circuit board, and each disrance sleeve is inserted in the through hole of the heat sink, to be measured
The pin of electronic devices and components is passed through from the pore of disrance sleeve, makes to insulate between each pin and heat sink.
4. the electronic devices and components test device according to Claims 2 or 3, it is characterised in that：The electronic devices and components to be measured
Be provided with heat conductive pad made by elastic heat conducting material between heat sink, the heat conductive pad both sides respectively with electronic devices and components to be measured and
Heat sink is brought into close contact, for the heat that electronic devices and components to be measured are produced is conducted to heat sink.
5. electronic devices and components test device according to claim 4, it is characterised in that：The heat sink and drive circuit board
It is bolted to connection, the Flexible element is rubber band, and Flexible element two ends are respectively fitted on pin and bolt.
6. electronic devices and components test device according to claim 5, it is characterised in that：The bottom of the electronic devices and components to be measured
Portion is provided with threaded post, and the threaded post sequentially passes through the through hole opened up on heat conductive pad, heat sink and drive circuit board, and adopts nut
Tighten, make electronic devices and components to be measured affixed with heat sink and drive circuit board.
7. electronic devices and components test device according to claim 2, it is characterised in that：The heat sink is copper coin.
8. electronic devices and components test device according to claim 4, it is characterised in that：The pin isolating pad is by heat-insulated rubber
Glue or thermal insulation ceramicses are made；The heat conductive pad is made up of heat conductive rubber.
9. electronic devices and components test device according to claim 2, it is characterised in that：Between the fin and heat sink
It is fixedly connected by screw.
10. electronic devices and components test device according to claim 5, it is characterised in that：The electronic devices and components to be measured
Pin top is additionally provided with limit casing, and the limit casing constitutes interference fit, rubbing between limit casing and pin with pin
Wiping power can be such that limit casing is relatively fixed with pin, and when operator pull limit casing, can just make limit casing
Come off from pin；The outer ring surface of the limit casing is provided with for fixing the cannelure of rubber band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621032214.8U CN206074755U (en) | 2016-08-31 | 2016-08-31 | A kind of electronic devices and components test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621032214.8U CN206074755U (en) | 2016-08-31 | 2016-08-31 | A kind of electronic devices and components test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206074755U true CN206074755U (en) | 2017-04-05 |
Family
ID=58436548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621032214.8U Active CN206074755U (en) | 2016-08-31 | 2016-08-31 | A kind of electronic devices and components test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206074755U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107807317A (en) * | 2016-08-31 | 2018-03-16 | 科大国盾量子技术股份有限公司 | A kind of electronic component test device |
| CN110736938A (en) * | 2019-10-23 | 2020-01-31 | 中国电子科技集团公司第四十四研究所 | detection structure and method for judging whether wire bonding is short-circuited |
-
2016
- 2016-08-31 CN CN201621032214.8U patent/CN206074755U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107807317A (en) * | 2016-08-31 | 2018-03-16 | 科大国盾量子技术股份有限公司 | A kind of electronic component test device |
| CN107807317B (en) * | 2016-08-31 | 2024-05-28 | 科大国盾量子技术股份有限公司 | Electronic component testing device |
| CN110736938A (en) * | 2019-10-23 | 2020-01-31 | 中国电子科技集团公司第四十四研究所 | detection structure and method for judging whether wire bonding is short-circuited |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Shen Huiyan Inventor after: Ma Rui Inventor after: Dai Yunqi Inventor after: Zhang Zhigang Inventor before: Ma Rui Inventor before: Dai Yunqi Inventor before: Zhang Zhigang |