CN106502047B - 压印装置、物品的制造方法及供给装置 - Google Patents

压印装置、物品的制造方法及供给装置 Download PDF

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Publication number
CN106502047B
CN106502047B CN201610751494.6A CN201610751494A CN106502047B CN 106502047 B CN106502047 B CN 106502047B CN 201610751494 A CN201610751494 A CN 201610751494A CN 106502047 B CN106502047 B CN 106502047B
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China
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space
tank
imprint
gas
imprint material
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English (en)
Chinese (zh)
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CN106502047A (zh
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浅田邦彦
新井刚
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Canon Inc
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Canon Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3071—Process control means, e.g. for replenishing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Public Health (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201610751494.6A 2015-09-03 2016-08-29 压印装置、物品的制造方法及供给装置 Active CN106502047B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015174017A JP6702672B2 (ja) 2015-09-03 2015-09-03 インプリント装置、物品の製造方法及び供給装置
JP2015-174017 2015-09-03

Publications (2)

Publication Number Publication Date
CN106502047A CN106502047A (zh) 2017-03-15
CN106502047B true CN106502047B (zh) 2021-02-05

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CN201610751494.6A Active CN106502047B (zh) 2015-09-03 2016-08-29 压印装置、物品的制造方法及供给装置

Country Status (5)

Country Link
US (1) US10331029B2 (https=)
JP (1) JP6702672B2 (https=)
KR (1) KR102049240B1 (https=)
CN (1) CN106502047B (https=)
TW (1) TWI645955B (https=)

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JP6400090B2 (ja) * 2014-05-29 2018-10-03 キヤノン株式会社 塗布装置、インプリント装置および物品の製造方法
US10998190B2 (en) 2017-04-17 2021-05-04 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
KR102298973B1 (ko) * 2017-08-10 2021-09-06 현대자동차주식회사 에어필터 일체형 연료펌프 컨트롤러
JP7041483B2 (ja) * 2017-09-22 2022-03-24 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
JP2025065992A (ja) * 2023-10-10 2025-04-22 キヤノン株式会社 成形方法、成形装置、および物品製造方法

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CN101393840B (zh) * 2007-09-17 2010-08-11 中芯国际集成电路制造(上海)有限公司 涂底的方法及光刻胶的涂布方法
NL1036769A1 (nl) * 2008-04-23 2009-10-26 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, cleaning system and method for cleaning a patterning device.
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JP6116128B2 (ja) 2011-04-11 2017-04-19 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置および方法
JP5864934B2 (ja) * 2011-07-21 2016-02-17 キヤノン株式会社 インプリントシステム及び物品の製造方法
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JP6362109B2 (ja) * 2013-10-04 2018-07-25 キヤノン株式会社 インプリント装置および部品の製造方法
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JP6584074B2 (ja) 2014-02-26 2019-10-02 キヤノン株式会社 光硬化性組成物、硬化物、これを用いた、パターン形状を有する膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
TWI613095B (zh) * 2015-05-22 2018-02-01 佳能股份有限公司 排液設備，壓印設備及製造構件的方法
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US10627728B2 (en) * 2017-06-14 2020-04-21 Taiwan Semiconductor Manufacturing Co., Ltd. Method for creating vacuum in load lock chamber

Also Published As

Publication number Publication date
JP2017050466A (ja) 2017-03-09
KR20170028253A (ko) 2017-03-13
JP6702672B2 (ja) 2020-06-03
CN106502047A (zh) 2017-03-15
US10331029B2 (en) 2019-06-25
TW201710055A (zh) 2017-03-16
KR102049240B1 (ko) 2019-11-28
US20170068160A1 (en) 2017-03-09
TWI645955B (zh) 2019-01-01

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