CN106463379B - 具有细长切割边缘的化学机械平坦化垫调节器 - Google Patents

具有细长切割边缘的化学机械平坦化垫调节器 Download PDF

Info

Publication number
CN106463379B
CN106463379B CN201580026005.4A CN201580026005A CN106463379B CN 106463379 B CN106463379 B CN 106463379B CN 201580026005 A CN201580026005 A CN 201580026005A CN 106463379 B CN106463379 B CN 106463379B
Authority
CN
China
Prior art keywords
protrusions
elongated
substrate
elongated protrusions
cmp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580026005.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN106463379A (zh
Inventor
安德鲁·加尔平
丹尼尔·韦尔斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of CN106463379A publication Critical patent/CN106463379A/zh
Application granted granted Critical
Publication of CN106463379B publication Critical patent/CN106463379B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201580026005.4A 2014-03-21 2015-03-20 具有细长切割边缘的化学机械平坦化垫调节器 Expired - Fee Related CN106463379B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461968846P 2014-03-21 2014-03-21
US61/968,846 2014-03-21
PCT/US2015/021679 WO2015143278A1 (en) 2014-03-21 2015-03-20 Chemical mechanical planarization pad conditioner with elongated cutting edges

Publications (2)

Publication Number Publication Date
CN106463379A CN106463379A (zh) 2017-02-22
CN106463379B true CN106463379B (zh) 2019-08-06

Family

ID=54145367

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580026005.4A Expired - Fee Related CN106463379B (zh) 2014-03-21 2015-03-20 具有细长切割边缘的化学机械平坦化垫调节器

Country Status (6)

Country Link
US (1) US10293463B2 (https=)
JP (1) JP6542793B2 (https=)
KR (1) KR102304574B1 (https=)
CN (1) CN106463379B (https=)
TW (1) TWI666091B (https=)
WO (1) WO2015143278A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10105812B2 (en) * 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
CN108472789B (zh) * 2016-01-08 2020-06-05 阪东化学株式会社 研磨材
DE112017001938T5 (de) * 2016-04-06 2019-01-17 M Cubed Technologies, Inc. Diamantverbundwerkstoff-Konditionierer für ein CMP-Tuch
US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
US20190351527A1 (en) * 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
US12208487B2 (en) * 2018-10-29 2025-01-28 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
EP3924146A4 (en) 2019-02-13 2022-11-09 3M Innovative Properties Company ABRASIVES WITH PRECISELY SHAPED FEATURES, ABRASIVES MADE THEREOF AND PROCESSES FOR THEIR MANUFACTURE
EP3953106A4 (en) * 2019-04-09 2022-12-21 Entegris, Inc. SEGMENT DESIGNS FOR DISCS
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
US12370648B2 (en) * 2020-01-30 2025-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Surface clean system and method
US11833638B2 (en) * 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
JP2024535447A (ja) * 2021-09-29 2024-09-30 インテグリス・インコーポレーテッド 両面パッドコンディショナー

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527424A (en) * 1995-01-30 1996-06-18 Motorola, Inc. Preconditioner for a polishing pad and method for using the same
US6302770B1 (en) * 1998-07-28 2001-10-16 Nikon Research Corporation Of America In-situ pad conditioning for CMP polisher
JP2001157967A (ja) 1999-11-29 2001-06-12 Mitsubishi Materials Corp 単層砥石
US6439986B1 (en) 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
KR100387954B1 (ko) 1999-10-12 2003-06-19 (주) 휴네텍 연마패드용 컨디셔너와 이의 제조방법
US6390909B2 (en) * 2000-04-03 2002-05-21 Rodel Holdings, Inc. Disk for conditioning polishing pads
JP2002337050A (ja) * 2001-03-13 2002-11-26 Mitsubishi Materials Corp Ｃｍｐコンディショナ
US7585703B2 (en) 2002-11-19 2009-09-08 Ishikawa Seisakusho, Ltd. Pixel control element selection transfer method, pixel control device mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element transfer, and planar display substrate
KR20050092743A (ko) * 2003-01-15 2005-09-22 미츠비시 마테리알 가부시키가이샤 연질재 가공용 절삭 공구
US7367872B2 (en) * 2003-04-08 2008-05-06 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
CN1938128A (zh) 2004-03-31 2007-03-28 三菱综合材料株式会社 Cmp调节器
US7799375B2 (en) 2004-06-30 2010-09-21 Poco Graphite, Inc. Process for the manufacturing of dense silicon carbide
JP4145273B2 (ja) * 2004-07-14 2008-09-03 株式会社ノリタケスーパーアブレーシブ Ｃｍｐパッドコンディショナー
US7066795B2 (en) * 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
EP1944125B1 (en) * 2005-08-25 2012-01-25 Hiroshi Ishizuka Tool with sintered body polishing surface and method of manufacturing the same
US7300338B2 (en) * 2005-09-22 2007-11-27 Abrasive Technology, Inc. CMP diamond conditioning disk
TW200726582A (en) * 2005-10-04 2007-07-16 Mitsubishi Materials Corp Rotary tool for processing flexible materials
JP4441552B2 (ja) * 2006-07-31 2010-03-31 メゾテクダイヤ株式会社 ダイヤモンドコンディショナ
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
US20170232576A1 (en) * 2006-11-16 2017-08-17 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
JP2008229820A (ja) * 2007-03-23 2008-10-02 Elpida Memory Inc Ｃｍｐ加工用のドレッサ及びｃｍｐ加工装置並びにｃｍｐ加工用の研磨パッドのドレッシング処理方法
KR20100106328A (ko) * 2007-11-13 2010-10-01 치엔 민 성 Ｃｍｐ 패드 드레서
JP2009241200A (ja) * 2008-03-31 2009-10-22 Mitsubishi Materials Corp Ｃｍｐコンディショナ
EP2474025A2 (en) * 2009-09-01 2012-07-11 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
JP5871904B2 (ja) 2010-04-12 2016-03-01 イコニクス コーポレーションＩｋｏｎｉｃｓ Ｃｏｒｐｏｒａｔｉｏｎ アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法
CN101972995B (zh) 2010-06-08 2013-05-01 沈阳理工大学 一种仿生表面结构抛光垫及制造方法
KR101916492B1 (ko) * 2011-03-07 2018-11-07 엔테그리스, 아이엔씨. 화학 및 기계적 평탄화 패드 컨디셔너
KR101211138B1 (ko) * 2011-03-07 2012-12-11 이화다이아몬드공업 주식회사 연약패드용 컨디셔너 및 그 제조방법
KR101144981B1 (ko) * 2011-05-17 2012-05-11 삼성전자주식회사 Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법
SG11201407232YA (en) 2012-05-04 2014-12-30 Entegris Inc Cmp conditioner pads with superabrasive grit enhancement
TWI564116B (zh) * 2013-08-12 2017-01-01 Sapphire polishing pad dresser with multiple trimmed pellets

Also Published As

Publication number Publication date
TW201600241A (zh) 2016-01-01
WO2015143278A1 (en) 2015-09-24
KR102304574B1 (ko) 2021-09-27
JP6542793B2 (ja) 2019-07-10
CN106463379A (zh) 2017-02-22
JP2017509500A (ja) 2017-04-06
KR20160136404A (ko) 2016-11-29
US10293463B2 (en) 2019-05-21
TWI666091B (zh) 2019-07-21
US20170095903A1 (en) 2017-04-06

Similar Documents

Publication Publication Date Title
CN106463379B (zh) 具有细长切割边缘的化学机械平坦化垫调节器
US9616547B2 (en) Chemical mechanical planarization pad conditioner
US8622787B2 (en) CMP pad dressers with hybridized abrasive surface and related methods
US9067301B2 (en) CMP pad dressers with hybridized abrasive surface and related methods
KR101091030B1 (ko) 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
EP2845221B1 (en) Cmp conditioner pads with superabrasive grit enhancement
TW200821092A (en) Conditioning disk having uniform structures
US6852016B2 (en) End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
TW200914202A (en) Polishing pad conditioner and method for conditioning polishing pad
US20150017884A1 (en) CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods
KR101178281B1 (ko) 감소된 마찰력을 갖는 패드 컨디셔너
TW202529948A (zh) 化學機械研磨墊修整器及其製備方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190806