CN106463259A - 加热电容器和形成加热电容器的方法 - Google Patents

加热电容器和形成加热电容器的方法 Download PDF

Info

Publication number
CN106463259A
CN106463259A CN201580025493.7A CN201580025493A CN106463259A CN 106463259 A CN106463259 A CN 106463259A CN 201580025493 A CN201580025493 A CN 201580025493A CN 106463259 A CN106463259 A CN 106463259A
Authority
CN
China
Prior art keywords
metal structure
voltage
conductive layer
heating capacitor
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580025493.7A
Other languages
English (en)
Chinese (zh)
Inventor
H·郭
B·L·威廉姆斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of CN106463259A publication Critical patent/CN106463259A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08Cooling arrangements; Heating arrangements; Ventilating arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306Polyimides or polyesterimides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/14Organic dielectrics
    • H01G4/18Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Surface Heating Bodies (AREA)
CN201580025493.7A 2014-05-28 2015-05-28 加热电容器和形成加热电容器的方法 Pending CN106463259A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/288,433 2014-05-28
US14/288,433 US9293254B2 (en) 2014-05-28 2014-05-28 Heated capacitor and method of forming the heated capacitor
PCT/US2015/032993 WO2015184148A1 (en) 2014-05-28 2015-05-28 Heated capacitor and method of forming the heated capacitor

Publications (1)

Publication Number Publication Date
CN106463259A true CN106463259A (zh) 2017-02-22

Family

ID=54699809

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580025493.7A Pending CN106463259A (zh) 2014-05-28 2015-05-28 加热电容器和形成加热电容器的方法

Country Status (5)

Country Link
US (3) US9293254B2 (cg-RX-API-DMAC7.html)
EP (1) EP3149752B1 (cg-RX-API-DMAC7.html)
JP (2) JP6843624B6 (cg-RX-API-DMAC7.html)
CN (1) CN106463259A (cg-RX-API-DMAC7.html)
WO (1) WO2015184148A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1026876B1 (nl) * 2018-11-28 2020-07-22 Tilkoblede Belgium Bvba Een sensor, systeem en werkwijze voor het detecteren of registreren van de vochtigheid of natheid van een artikel
FR3098914B1 (fr) * 2019-07-19 2021-09-24 St Microelectronics Rousset Procede de detection d’humidite dans un circuit integre et circuit integre associe
US11784212B2 (en) 2020-08-31 2023-10-10 Texas Instruments Incorporated Standalone high voltage galvanic isolation capacitors

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04364014A (ja) * 1991-06-11 1992-12-16 Rohm Co Ltd 積層セラミックコンデンサ
TW200721453A (en) * 2005-09-12 2007-06-01 Ibm Integration of a MIM capacitor over a metal gate or silicide with high-k dielectric materials
US20110051309A1 (en) * 2008-05-08 2011-03-03 Nxp B.V. Tunable capacitor
CN102667979A (zh) * 2009-12-21 2012-09-12 爱普科斯公司 与温度有关的电容器和电容器模块
US20130126012A1 (en) * 2007-08-15 2013-05-23 Cardiodex Ltd. Systems and methods for puncture closure
CN103134837A (zh) * 2011-12-02 2013-06-05 意法半导体亚太私人有限公司 具有集成加热器的可调湿度传感器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601437U (ja) * 1983-06-17 1985-01-08 日本特殊陶業株式会社 電界装置
JPH05166578A (ja) * 1991-12-12 1993-07-02 Ngk Spark Plug Co Ltd 沿面コロナ放電素子及びその放電面生成物の除去方法
JP3597334B2 (ja) * 1996-12-17 2004-12-08 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
US6411491B2 (en) * 1997-06-05 2002-06-25 Ceramphysics, Inc. Capacitive energy storage device and method of producing the same
RU28279U1 (ru) 2002-08-29 2003-03-10 Акционерное общество закрытого типа "ЭЛИТ" Конденсаторный накопитель энергии
US8154850B2 (en) * 2007-05-11 2012-04-10 Paratek Microwave, Inc. Systems and methods for a thin film capacitor having a composite high-k thin film stack
CA2725460C (en) * 2008-05-15 2017-11-07 Kovio, Inc. Surveillance devices with multiple capacitors
CN105679766A (zh) * 2009-09-16 2016-06-15 株式会社半导体能源研究所 晶体管及显示设备
US8753952B2 (en) * 2011-09-08 2014-06-17 Texas Instruments Incorporated Integrated circuit with integrated decoupling capacitors
US9019688B2 (en) * 2011-12-02 2015-04-28 Stmicroelectronics Pte Ltd. Capacitance trimming with an integrated heater
KR20140039736A (ko) * 2012-09-25 2014-04-02 삼성전자주식회사 스택 패키지 및 그 제조 방법
KR101462725B1 (ko) * 2012-09-28 2014-11-17 삼성전기주식회사 기판 내장용 수동소자 및 수동소자 내장 기판
US8963622B2 (en) * 2013-03-10 2015-02-24 Microchip Technology Incorporated Method and apparatus for generating regulated isolation supply voltage

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04364014A (ja) * 1991-06-11 1992-12-16 Rohm Co Ltd 積層セラミックコンデンサ
TW200721453A (en) * 2005-09-12 2007-06-01 Ibm Integration of a MIM capacitor over a metal gate or silicide with high-k dielectric materials
US20130126012A1 (en) * 2007-08-15 2013-05-23 Cardiodex Ltd. Systems and methods for puncture closure
US20110051309A1 (en) * 2008-05-08 2011-03-03 Nxp B.V. Tunable capacitor
CN102667979A (zh) * 2009-12-21 2012-09-12 爱普科斯公司 与温度有关的电容器和电容器模块
CN103134837A (zh) * 2011-12-02 2013-06-05 意法半导体亚太私人有限公司 具有集成加热器的可调湿度传感器

Also Published As

Publication number Publication date
JP6843624B6 (ja) 2021-07-14
US9293254B2 (en) 2016-03-22
US20180102216A1 (en) 2018-04-12
EP3149752A4 (en) 2017-11-29
EP3149752A1 (en) 2017-04-05
JP6843624B2 (ja) 2021-03-17
US9875846B2 (en) 2018-01-23
US20160163452A1 (en) 2016-06-09
JP7275422B2 (ja) 2023-05-18
JP2017525137A (ja) 2017-08-31
US20150348708A1 (en) 2015-12-03
JP2021068908A (ja) 2021-04-30
EP3149752B1 (en) 2025-09-10
WO2015184148A1 (en) 2015-12-03

Similar Documents

Publication Publication Date Title
TWI535352B (zh) 內嵌電子元件之基板及其製造方法
JP7275422B2 (ja) 加熱されたキャパシタ、及び加熱されたキャパシタを形成する方法
US10636730B2 (en) Semiconductor package and semiconductor manufacturing process
CN102034741B (zh) 制造半导体组件和结构的方法
TWI566350B (zh) Semiconductor device
CN104916623B (zh) 半导体封装和制造半导体封装基底的方法
JP2020535636A (ja) ハイブリッド・ランド・グリッド・アレイ・コネクタを製造するための方法およびそのコネクタ
JP2018532260A5 (cg-RX-API-DMAC7.html)
US9761465B2 (en) Systems and methods for mechanical and electrical package substrate issue mitigation
EP3886126A1 (en) Thin-film inductor and manufacturing method therefor, integrated circuit and terminal device
CN105097757A (zh) 芯片封装基板、芯片封装结构及制作方法
TWI630689B (zh) 抗短路晶片級封裝及其方法
US10115704B2 (en) Semiconductor device
US20150333029A1 (en) Package substrate and method for fabricating the same
JP5414219B2 (ja) ウエハレベルcspにおける絶縁性テスト方法及びこれに用いるtegパターン
TWI246380B (en) Fabrication method of a printed circuit board
TW571419B (en) Semiconductor device and manufacturing method thereof
US20230065075A1 (en) Wafer chip scale packages with visible solder fillets
CN208706584U (zh) 薄膜元件
EP3131118B1 (en) Semiconductor device allowing metal layer routing formed directly under metal pad
CN100416810C (zh) 半导体元件及其制造方法
CN102496616A (zh) 具有整合被动元件的半导体元件及其制造方法
CN102412250A (zh) 半导体封装结构、整合式无源元件及其制造方法
US20120241196A1 (en) Circuit board and method of manufacturing same
TWM478329U (zh) 全屏蔽元件

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170222