CN106415863A - 经封装的经波长转换的发光器件 - Google Patents
经封装的经波长转换的发光器件 Download PDFInfo
- Publication number
- CN106415863A CN106415863A CN201580034191.6A CN201580034191A CN106415863A CN 106415863 A CN106415863 A CN 106415863A CN 201580034191 A CN201580034191 A CN 201580034191A CN 106415863 A CN106415863 A CN 106415863A
- Authority
- CN
- China
- Prior art keywords
- luminescent device
- layer
- wavelength converting
- light
- wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462016708P | 2014-06-25 | 2014-06-25 | |
| US62/016708 | 2014-06-25 | ||
| PCT/IB2015/054700 WO2015198220A1 (en) | 2014-06-25 | 2015-06-23 | Packaged wavelength converted light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106415863A true CN106415863A (zh) | 2017-02-15 |
Family
ID=53718057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580034191.6A Pending CN106415863A (zh) | 2014-06-25 | 2015-06-23 | 经封装的经波长转换的发光器件 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10998473B2 (enExample) |
| EP (1) | EP3161880B1 (enExample) |
| JP (2) | JP6703494B2 (enExample) |
| KR (1) | KR102467614B1 (enExample) |
| CN (1) | CN106415863A (enExample) |
| TW (1) | TW201616689A (enExample) |
| WO (1) | WO2015198220A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712931A (zh) * | 2017-12-20 | 2020-09-25 | 亮锐有限责任公司 | 具有玻璃层的转换器 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8384105B2 (en) * | 2010-03-19 | 2013-02-26 | Micron Technology, Inc. | Light emitting diodes with enhanced thermal sinking and associated methods of operation |
| DE102015102460A1 (de) * | 2015-02-20 | 2016-08-25 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines lichtemittierenden Bauteils und lichtemittierendes Bauteil |
| KR102417181B1 (ko) * | 2015-11-09 | 2022-07-05 | 삼성전자주식회사 | 발광 패키지, 반도체 발광 소자, 발광 모듈 및 발광 패키지의 제조 방법 |
| US10797209B2 (en) | 2016-02-05 | 2020-10-06 | Maven Optronics Co., Ltd. | Light emitting device with beam shaping structure and manufacturing method of the same |
| TWI583028B (zh) * | 2016-02-05 | 2017-05-11 | 行家光電股份有限公司 | 具有光形調整結構之發光裝置及其製造方法 |
| CN107154453B (zh) * | 2016-03-04 | 2021-11-16 | 日东电工(上海松江)有限公司 | 元件集合体临时固定片及其制造方法 |
| JP6928437B2 (ja) * | 2016-03-04 | 2021-09-01 | 日東電工(上海松江)有限公司 | 封止光半導体素子の製造方法 |
| JP6940740B2 (ja) * | 2016-05-06 | 2021-09-29 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| US20170345983A1 (en) * | 2016-05-26 | 2017-11-30 | Epistar Corporation | Light-emitting device and light-emitting apparatus comprising the same |
| CN105957943A (zh) * | 2016-06-17 | 2016-09-21 | 深圳市兆驰节能照明股份有限公司 | 芯片级封装发光装置及其制造方法 |
| CN105938869A (zh) * | 2016-06-21 | 2016-09-14 | 深圳市兆驰节能照明股份有限公司 | 双层结构芯片级封装光源及其制造方法 |
| CN111712936B (zh) * | 2017-12-22 | 2023-10-20 | 亮锐有限责任公司 | 对光散射进行调谐的多孔微米尺寸颗粒 |
| CN118591897A (zh) * | 2021-11-18 | 2024-09-03 | 亮锐有限责任公司 | 具有反射涂层的发光二极管(led)封装及其制造方法 |
| JP2025146385A (ja) * | 2024-03-22 | 2025-10-03 | スタンレー電気株式会社 | 半導体発光装置 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050173708A1 (en) * | 2004-02-06 | 2005-08-11 | Toyoda Gosei Co., Ltd. | Light emitting device and sealing material |
| CN1753170A (zh) * | 2004-09-22 | 2006-03-29 | 夏普株式会社 | 光半导体装置、光通信装置和电子设备 |
| CN101047221A (zh) * | 2006-03-20 | 2007-10-03 | 奇菱科技股份有限公司 | 发光二极管的封装结构与其制造方法 |
| CN101208811A (zh) * | 2005-08-05 | 2008-06-25 | 松下电器产业株式会社 | 半导体发光装置 |
| CN102714261A (zh) * | 2009-11-23 | 2012-10-03 | 皇家飞利浦电子股份有限公司 | 波长转换半导体发光二极管 |
| CN102893078A (zh) * | 2010-05-17 | 2013-01-23 | 株式会社小糸制作所 | 照明装置 |
| CN103003966A (zh) * | 2010-05-18 | 2013-03-27 | 首尔半导体株式会社 | 具有波长变换层的发光二级管芯片及其制造方法,以及包括其的封装件及其制造方法 |
| US20130187178A1 (en) * | 2012-01-24 | 2013-07-25 | Michael A. Tischler | Light-emitting dies incorporating wavelength-conversion materials and related methods |
| CN103650179A (zh) * | 2011-07-19 | 2014-03-19 | 松下电器产业株式会社 | 发光装置及该发光装置的制造方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3589187B2 (ja) | 2000-07-31 | 2004-11-17 | 日亜化学工業株式会社 | 発光装置の形成方法 |
| DE10156386B4 (de) | 2001-11-16 | 2007-08-09 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiterchips |
| US6870311B2 (en) * | 2002-06-07 | 2005-03-22 | Lumileds Lighting U.S., Llc | Light-emitting devices utilizing nanoparticles |
| TWI280673B (en) | 2004-09-22 | 2007-05-01 | Sharp Kk | Optical semiconductor device, optical communication device, and electronic equipment |
| EP1919000A1 (en) | 2005-08-05 | 2008-05-07 | Matsushita Electric Industries Co., Ltd. | Semiconductor light-emitting device |
| JP2007243056A (ja) * | 2006-03-10 | 2007-09-20 | Matsushita Electric Works Ltd | 発光装置 |
| US7842960B2 (en) | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
| JP5578597B2 (ja) * | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
| DE102009018087A1 (de) * | 2008-04-30 | 2009-12-17 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Diode mit erhöhter Farbstabilität |
| JP2010103522A (ja) * | 2008-10-21 | 2010-05-06 | Seoul Opto Devices Co Ltd | 遅延蛍光体を備える交流駆動型の発光素子及び発光素子モジュール |
| JP4724222B2 (ja) | 2008-12-12 | 2011-07-13 | 株式会社東芝 | 発光装置の製造方法 |
| US8507300B2 (en) * | 2008-12-24 | 2013-08-13 | Ledengin, Inc. | Light-emitting diode with light-conversion layer |
| US20110012147A1 (en) | 2009-07-15 | 2011-01-20 | Koninklijke Philips Electronics N.V. | Wavelength-converted semiconductor light emitting device including a filter and a scattering structure |
| DE102009036621B4 (de) * | 2009-08-07 | 2023-12-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauteil |
| US8329482B2 (en) * | 2010-04-30 | 2012-12-11 | Cree, Inc. | White-emitting LED chips and method for making same |
| WO2011145794A1 (ko) * | 2010-05-18 | 2011-11-24 | 서울반도체 주식회사 | 파장변환층을 갖는 발광 다이오드 칩과 그 제조 방법, 및 그것을 포함하는 패키지 및 그 제조 방법 |
| JP5390472B2 (ja) | 2010-06-03 | 2014-01-15 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
| JP5511524B2 (ja) * | 2010-06-07 | 2014-06-04 | 日東電工株式会社 | 光半導体用封止シート |
| JP2012019062A (ja) * | 2010-07-08 | 2012-01-26 | Shin Etsu Chem Co Ltd | 発光半導体装置、実装基板及びそれらの製造方法 |
| DE102010034913B4 (de) * | 2010-08-20 | 2023-03-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlung emittierendes Bauelement und Verfahren zur Herstellung des Strahlung emittierenden Bauelements |
| EP2653502A4 (en) * | 2010-12-13 | 2014-04-30 | Toray Industries | PHOSPHORUS FILM, LED AND LIGHT EMITTING DEVICE AND METHOD FOR PRODUCING AN LED |
| JP5619680B2 (ja) | 2011-06-03 | 2014-11-05 | シチズンホールディングス株式会社 | 半導体発光素子の製造方法 |
| US9222648B2 (en) * | 2011-11-03 | 2015-12-29 | Cooledge Lighting, Inc. | Broad-area lighting systems |
| US8957429B2 (en) * | 2012-02-07 | 2015-02-17 | Epistar Corporation | Light emitting diode with wavelength conversion layer |
| CN103311380A (zh) * | 2012-03-08 | 2013-09-18 | 展晶科技(深圳)有限公司 | 半导体封装制程及其封装结构 |
| KR101291092B1 (ko) | 2012-04-06 | 2013-08-01 | 주식회사 씨티랩 | 반도체 소자 구조물을 제조하는 방법 |
| US8889439B2 (en) * | 2012-08-24 | 2014-11-18 | Tsmc Solid State Lighting Ltd. | Method and apparatus for packaging phosphor-coated LEDs |
| DE102012113003A1 (de) * | 2012-12-21 | 2014-04-03 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
| DE102013103416A1 (de) * | 2013-04-05 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierende Baugruppe und Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe |
| WO2014167458A1 (en) * | 2013-04-08 | 2014-10-16 | Koninklijke Philips N.V. | Led with high thermal conductivity particles in phosphor conversion layer and the method of fabricating the same |
-
2015
- 2015-06-22 TW TW104120031A patent/TW201616689A/zh unknown
- 2015-06-23 CN CN201580034191.6A patent/CN106415863A/zh active Pending
- 2015-06-23 WO PCT/IB2015/054700 patent/WO2015198220A1/en not_active Ceased
- 2015-06-23 KR KR1020177002103A patent/KR102467614B1/ko active Active
- 2015-06-23 US US15/319,095 patent/US10998473B2/en active Active
- 2015-06-23 JP JP2016575094A patent/JP6703494B2/ja active Active
- 2015-06-23 EP EP15741340.2A patent/EP3161880B1/en active Active
-
2020
- 2020-05-08 JP JP2020082366A patent/JP7086133B2/ja active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050173708A1 (en) * | 2004-02-06 | 2005-08-11 | Toyoda Gosei Co., Ltd. | Light emitting device and sealing material |
| CN1753170A (zh) * | 2004-09-22 | 2006-03-29 | 夏普株式会社 | 光半导体装置、光通信装置和电子设备 |
| CN101208811A (zh) * | 2005-08-05 | 2008-06-25 | 松下电器产业株式会社 | 半导体发光装置 |
| CN101047221A (zh) * | 2006-03-20 | 2007-10-03 | 奇菱科技股份有限公司 | 发光二极管的封装结构与其制造方法 |
| CN102714261A (zh) * | 2009-11-23 | 2012-10-03 | 皇家飞利浦电子股份有限公司 | 波长转换半导体发光二极管 |
| CN102893078A (zh) * | 2010-05-17 | 2013-01-23 | 株式会社小糸制作所 | 照明装置 |
| CN103003966A (zh) * | 2010-05-18 | 2013-03-27 | 首尔半导体株式会社 | 具有波长变换层的发光二级管芯片及其制造方法,以及包括其的封装件及其制造方法 |
| CN103650179A (zh) * | 2011-07-19 | 2014-03-19 | 松下电器产业株式会社 | 发光装置及该发光装置的制造方法 |
| US20130187178A1 (en) * | 2012-01-24 | 2013-07-25 | Michael A. Tischler | Light-emitting dies incorporating wavelength-conversion materials and related methods |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712931A (zh) * | 2017-12-20 | 2020-09-25 | 亮锐有限责任公司 | 具有玻璃层的转换器 |
| CN111712931B (zh) * | 2017-12-20 | 2024-04-23 | 亮锐有限责任公司 | 具有玻璃层的转换器 |
| US11973168B2 (en) | 2017-12-20 | 2024-04-30 | Lumileds Llc | Converter with glass layers |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6703494B2 (ja) | 2020-06-03 |
| EP3161880A1 (en) | 2017-05-03 |
| US10998473B2 (en) | 2021-05-04 |
| KR20170020914A (ko) | 2017-02-24 |
| JP7086133B2 (ja) | 2022-06-17 |
| US20170133560A1 (en) | 2017-05-11 |
| EP3161880B1 (en) | 2022-06-29 |
| JP2020145453A (ja) | 2020-09-10 |
| KR102467614B1 (ko) | 2022-11-16 |
| JP2017520926A (ja) | 2017-07-27 |
| WO2015198220A1 (en) | 2015-12-30 |
| TW201616689A (zh) | 2016-05-01 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180404 Address after: Holland Schiphol Applicant after: LUMILEDS HOLDING B.V. Address before: Holland Ian Deho Finn Applicant before: Koninkl Philips Electronics NV |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170215 |