CN106393909B - 一种高阻尼复合板 - Google Patents

一种高阻尼复合板 Download PDF

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CN106393909B
CN106393909B CN201610782986.1A CN201610782986A CN106393909B CN 106393909 B CN106393909 B CN 106393909B CN 201610782986 A CN201610782986 A CN 201610782986A CN 106393909 B CN106393909 B CN 106393909B
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李镇云
袁振宇
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Xi'an Li Yuan New Material Technology Development Co Ltd
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Abstract

本发明提供了一种高阻尼复合板，包括约束层和阻尼层；其中，约束层的一面叠加粘贴多层所述阻尼层。本发明的高阻尼复合板是专门为航空工业研制的一种新型全树脂体系，不含任何沥青成分，无有害挥发物，阻燃，频范宽、温范宽的新型复合阻尼板，解决了现有技术中用于航空工业的阻尼板不环保、阻尼效能低等问题。

Description

一种高阻尼复合板
技术领域
本发明涉及减振技术领域,尤其涉及一种高阻尼复合板。
背景技术
阻尼材料是指那些在振动中可以通过内部分子之间的摩擦来显著消耗振动能量的一类材料，它们主要是一些粘弹性高分子材料，这类材料同时具有粘性和弹性特征，即同时具有较高的材料损耗因子和较高的弹性模量；利用这种特性将它们制成特定的自由层或约束层构件，粘贴于振动结构上就可以显著耗散结构的振动能量，起到降低结构振动的作用。特别是对于壁板类结构，通过减振还可以起到很好的降噪作用。这种阻尼材料在航天、船舶、水下结构等减振降噪中应用极其广泛，能够起到很好的减振作用。
现今市场的用于航空工业的阻尼材料多为沥青橡胶型阻尼材料，由于受到材料自身特性的限制，此类阻尼材料本身易挥发有毒有害物质，阻燃性差，阻尼效能低(通常只有20％)，温宽、频宽范围狭窄。
发明内容
针对现有技术的上述缺陷和问题，本发明实施例的目的是提供一种高阻尼复合板，本发明的高阻尼复合板是专门为航空工业研制的一种新型全树脂体系，不含任何沥青成分，无有害挥发物，阻燃，频范宽、温范宽的新型复合阻尼板，解决了现有技术中用于航空工业的阻尼板不环保、阻尼效能低等问题。
为了达到上述目的，本发明提供如下技术方案：
本发明的一种高阻尼复合板，包括约束层和阻尼层，所述阻尼层粘结在所述约束层上；其中，按质量百分比，所述阻尼层由包括25-40％的高分子树脂、30-60％的石墨和15-30％的填料混合制成；其中，所述高分子树脂包括20-40％的聚氨酯和60-80％的聚氯乙烯；所述填料包括25-45％的金属粉末和55-75％的二氧化硅。
进一步地，按质量百分比，所述阻尼层由包括35％的高分子树脂、45％的石墨和20％的填料混合制成；其中，所述高分子树脂包括30％的聚氨酯和70％的聚氯乙烯；所述填料包括25％的金属粉末和75％的二氧化硅。
进一步地，所述阻尼层由包括高分子树脂、石墨和填料于捏合机中捏合制成；其中，捏合机桨速为60-80转/分钟，捏合时间为8-12分钟。
进一步地，所述阻尼层包括第一阻尼层和第二阻尼层；所述阻尼层的厚度为0.5-0.8mm。
优选地，所述阻尼层的厚度为0.5-0.6mm。
进一步地，还包括有机粘结层，所述约束层、第一阻尼层和第二阻尼层之间通过所述有机粘结层粘贴。
进一步地，所述约束层为铝质板材，其中，所述约束层的厚度为0.1-0.2mm。
优选地，所述约束层的厚度为0.15mm。
进一步地，所述约束层和第一阻尼层之间的有机粘结层厚度为0.1-0.15mm；所述第一阻尼层和第二阻尼层之间的有机粘结层厚度为0.2-0.25mm。
优选地，所述约束层和第一阻尼层之间的有机粘结层厚度为0.15mm；所述第一阻尼层和第二阻尼层之间的有机粘结层厚度为0.25mm。
进一步地，所述有机粘结层为丙烯酸树脂薄膜层。
进一步地，还包括底层有机粘结层，所述底层有机粘结层粘贴在所述第二阻尼层的另一面；其中，所述底层有机粘结层的厚度为0.25-0.3mm。
优选地，所述底层有机粘结层的厚度为0.25mm。
本发明提供的一种高阻尼复合板，从材料选型上回避了传统的以橡胶作为主要阻尼体的工艺，而是选用高分子树脂作为阻尼材料主体，以增强阻尼材料本身的弹性模量，同时辅以柔性石墨和其他无机填料，从而使阻尼层形成高弹性模量但又具有相应粘弹性的高效能阻尼层。同时，作为阻尼层整体结构，本发明设计了多效阻尼材料复合工艺，选用不同厚度的有机粘结层分别辅设于多层阻尼层与约束层之间，使其具有不同频效，从而形成结构和阻尼功能一体化的复合阻尼材料结构体。使阻尼层在不同频宽与温宽环境中都能获得优异的阻尼效果，本发明的阻尼效果高于75％。同时因为使用了大量的无机阻尼材料，使得阻尼层整体阻燃性能优异，耐高低温性能也得到了极大的提升，且本发明为全树脂体系，不含任何沥青成分，无有害物质溢散，且频范宽(200HZ-2000HZ)、温范宽(-50℃+120℃)，减振降噪效果更好。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明提供的一种高阻尼复合板的结构示意图。
具体实施方式
下面将结合本发明的实施例，对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1
本实施例1的阻尼层由35％的高分子树脂、45％的石墨和20％的填料混合制成；其中，上述高分子树脂包括30％的聚氨酯和70％的聚氯乙烯，填料包括25％的铝粉和75％的二氧化硅。
将上述配方量的聚氨酯材料、聚氯乙烯、石墨、铝粉和二氧化硅于捏合机中捏合即得本实施例的阻尼层。其中，捏合机桨速为65转/分钟，捏合时间为8分钟。
本实施例的一种高阻尼复合板，具体如图1所示，本实施例的高阻尼复合板，在约束层1的一面叠加粘贴两层阻尼层，分别为第一阻尼层2和第二阻尼层21；且阻尼层的厚度为0.5mm。约束层1、第一阻尼层2和第二阻尼层21之间通过丙烯酸树脂薄膜层3粘结；
上述约束层1为铝质板材，约束层1的厚度为0.15mm，通过在第一阻尼层2上粘贴约束层1，形成剪切耗能的约束阻尼层；上述约束层1和第一阻尼层2之间的丙烯酸树脂薄膜层厚度为0.15mm；所述第一阻尼层2和第二阻尼层21之间的丙烯酸树脂薄膜层厚度为0.25mm。
上述第二阻尼层21的另一面还粘贴底层有机粘结层31，底层有机粘结层31的厚度为0.25mm。这种结构的复合板粘贴于振动结构上就可以显著耗散结构的振动能量，可以起到很好的减振降噪作用。
实施例2
本发明实施例2是在实施例1的高阻尼复合板结构的基础上将约束层1的厚度设置为0.2mm，阻尼层厚度设置为0.6mm，约束层1和第一阻尼层2之间的丙烯酸树脂薄膜层3厚度为0.1mm，第一阻尼层2和第二阻尼层21之间的丙烯酸树脂薄膜层3厚度为0.2mm，底层有机粘结层31的厚度为0.3mm。
本实施例2的阻尼层组分及制备方法同实施例1。
实施例3
本发明实施例3是在实施例1的高阻尼复合板结构的基础上，改变其阻尼层的组分；本实施例的阻尼层由40％的高分子树脂、30％的石墨和30％的填料混合制成；其中，上述高分子树脂包括25％的聚氨酯和75％的聚氯乙烯，填料包括40％的铝粉和60％的二氧化硅。
将上述配方量的聚氨酯材料、聚氯乙烯、石墨、铝粉和二氧化硅于捏合机中捏合即得本实施例的阻尼层。其中，捏合机桨速为80转/分钟，捏合时间为10分钟。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (9)

1.一种高阻尼复合板，其特征在于：包括约束层和阻尼层，所述阻尼层粘结在所述约束层上；其中，按质量百分比，所述阻尼层由包括35％的高分子树脂、45％的石墨和20％的填料混合制成；其中，所述高分子树脂包括30％的聚氨酯和70％的聚氯乙烯；所述填料包括25％的金属粉末和75％的二氧化硅。
2.根据权利要求1所述的一种高阻尼复合板，其特征在于：所述阻尼层由包括高分子树脂、石墨和填料于捏合机中捏合后制成；其中，捏合机桨速为60-80转/分钟，捏合时间为8-12分钟。
3.根据权利要求1所述的一种高阻尼复合板，其特征在于：所述阻尼层包括第一阻尼层和第二阻尼层；所述阻尼层的厚度为0.5-0.8mm。
4.根据权利要求3所述的一种高阻尼复合板，其特征在于：所述阻尼层的厚度为0.5-0.6mm。
5.根据权利要求3所述的一种高阻尼复合板，其特征在于：还包括有机粘结层，所述约束层、第一阻尼层和第二阻尼层之间通过所述有机粘结层粘贴。
6.根据权利要求5所述的一种高阻尼复合板，其特征在于：所述约束层为铝质板材，其中，所述约束层的厚度为0.1-0.2mm。
7.根据权利要求5所述的一种高阻尼复合板，其特征在于：所述约束层和第一阻尼层之间的有机粘结层厚度为0.1-0.15mm；所述第一阻尼层和第二阻尼层之间的有机粘结层厚度为0.2-0.25mm。
8.根据权利要求5所述的一种高阻尼复合板，其特征在于：所述有机粘结层为丙烯酸树脂薄膜层。
9.根据权利要求5所述的一种高阻尼复合板，其特征在于：还包括底层有机粘结层，所述底层有机粘结层粘贴在所述第二阻尼层的另一面；其中，所述底层有机粘结层的厚度为0.25-0.3mm。
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