CN106283097A - 清洗液组合物 - Google Patents
清洗液组合物 Download PDFInfo
- Publication number
- CN106283097A CN106283097A CN201610448914.3A CN201610448914A CN106283097A CN 106283097 A CN106283097 A CN 106283097A CN 201610448914 A CN201610448914 A CN 201610448914A CN 106283097 A CN106283097 A CN 106283097A
- Authority
- CN
- China
- Prior art keywords
- cleaning liquid
- liquid composition
- mentioned
- chemical formula
- ammonium hydroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 73
- 239000000203 mixture Substances 0.000 title claims abstract description 66
- 239000007788 liquid Substances 0.000 title claims abstract description 52
- 239000000126 substance Substances 0.000 claims description 57
- 150000001875 compounds Chemical class 0.000 claims description 52
- -1 benzyl diethylenediamine Chemical compound 0.000 claims description 49
- 150000001412 amines Chemical class 0.000 claims description 27
- 239000000908 ammonium hydroxide Substances 0.000 claims description 18
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 18
- 125000000217 alkyl group Chemical group 0.000 claims description 15
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- 125000004429 atom Chemical group 0.000 claims description 13
- 125000000524 functional group Chemical group 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical group NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 8
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 7
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 7
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 6
- 230000004807 localization Effects 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 5
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 5
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 5
- 229910052727 yttrium Inorganic materials 0.000 claims description 5
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N diethylenediamine Natural products C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 4
- UOJIFOZIWVKHNW-UHFFFAOYSA-M ethoxy(trimethyl)azanium;hydroxide Chemical compound [OH-].CCO[N+](C)(C)C UOJIFOZIWVKHNW-UHFFFAOYSA-M 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 4
- HMYSZCUBPFGRRO-UHFFFAOYSA-N O-ethylhydroxylamine hydrate Chemical compound CCON.O HMYSZCUBPFGRRO-UHFFFAOYSA-N 0.000 claims description 3
- SQFWQHCKCDSOJK-UHFFFAOYSA-N 1-(1h-imidazol-2-yl)ethanol Chemical compound CC(O)C1=NC=CN1 SQFWQHCKCDSOJK-UHFFFAOYSA-N 0.000 claims description 2
- JPIGSMKDJQPHJC-UHFFFAOYSA-N 1-(2-aminoethoxy)ethanol Chemical compound CC(O)OCCN JPIGSMKDJQPHJC-UHFFFAOYSA-N 0.000 claims description 2
- IRTOOLQOINXNHY-UHFFFAOYSA-N 1-(2-aminoethylamino)ethanol Chemical compound CC(O)NCCN IRTOOLQOINXNHY-UHFFFAOYSA-N 0.000 claims description 2
- JCBPETKZIGVZRE-UHFFFAOYSA-N 2-aminobutan-1-ol Chemical compound CCC(N)CO JCBPETKZIGVZRE-UHFFFAOYSA-N 0.000 claims description 2
- QZXIXSZVEYUCGM-UHFFFAOYSA-N 2-aminopropan-2-ol Chemical compound CC(C)(N)O QZXIXSZVEYUCGM-UHFFFAOYSA-N 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 2
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 2
- DJFBJKSMACBYBD-UHFFFAOYSA-N phosphane;hydrate Chemical group O.P DJFBJKSMACBYBD-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 42
- 239000002184 metal Substances 0.000 abstract description 42
- 239000012530 fluid Substances 0.000 abstract description 17
- 239000002245 particle Substances 0.000 abstract description 14
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 11
- 150000004706 metal oxides Chemical class 0.000 abstract description 10
- 238000000227 grinding Methods 0.000 abstract description 6
- 238000010668 complexation reaction Methods 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 description 22
- 239000010949 copper Substances 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 21
- 230000007797 corrosion Effects 0.000 description 15
- 238000005260 corrosion Methods 0.000 description 15
- 239000003112 inhibitor Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 11
- 239000002585 base Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 239000004094 surface-active agent Substances 0.000 description 11
- 239000005751 Copper oxide Substances 0.000 description 10
- 150000003851 azoles Chemical class 0.000 description 10
- 229910000431 copper oxide Inorganic materials 0.000 description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 10
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 238000007254 oxidation reaction Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Natural products OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 229960003237 betaine Drugs 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 150000005846 sugar alcohols Polymers 0.000 description 6
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 239000012964 benzotriazole Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229940043237 diethanolamine Drugs 0.000 description 5
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 5
- 150000003852 triazoles Chemical class 0.000 description 5
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 4
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 235000010323 ascorbic acid Nutrition 0.000 description 4
- 229960005070 ascorbic acid Drugs 0.000 description 4
- 239000011668 ascorbic acid Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 4
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 4
- 150000002460 imidazoles Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002736 nonionic surfactant Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 description 4
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 3
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 3
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000003093 cationic surfactant Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000007046 ethoxylation reaction Methods 0.000 description 3
- KVFVBPYVNUCWJX-UHFFFAOYSA-M ethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)C KVFVBPYVNUCWJX-UHFFFAOYSA-M 0.000 description 3
- 230000033116 oxidation-reduction process Effects 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 150000003217 pyrazoles Chemical class 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 3
- 150000003457 sulfones Chemical class 0.000 description 3
- 150000003573 thiols Chemical class 0.000 description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 2
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- IQXXEPZFOOTTBA-UHFFFAOYSA-N 1-benzylpiperazine Chemical compound C=1C=CC=CC=1CN1CCNCC1 IQXXEPZFOOTTBA-UHFFFAOYSA-N 0.000 description 2
- MBDUIEKYVPVZJH-UHFFFAOYSA-N 1-ethylsulfonylethane Chemical compound CCS(=O)(=O)CC MBDUIEKYVPVZJH-UHFFFAOYSA-N 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 2
- MKFWRKQWPNGLAU-UHFFFAOYSA-N 4-methanimidoylphenol Chemical class OC1=CC=C(C=N)C=C1 MKFWRKQWPNGLAU-UHFFFAOYSA-N 0.000 description 2
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 description 2
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000004471 Glycine Substances 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 150000003973 alkyl amines Chemical class 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 239000002280 amphoteric surfactant Substances 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- OTJZCIYGRUNXTP-UHFFFAOYSA-N but-3-yn-1-ol Chemical compound OCCC#C OTJZCIYGRUNXTP-UHFFFAOYSA-N 0.000 description 2
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 2
- 150000007942 carboxylates Chemical class 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- YXVFQADLFFNVDS-UHFFFAOYSA-N diammonium citrate Chemical compound [NH4+].[NH4+].[O-]C(=O)CC(O)(C(=O)O)CC([O-])=O YXVFQADLFFNVDS-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- JQDCIBMGKCMHQV-UHFFFAOYSA-M diethyl(dimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)CC JQDCIBMGKCMHQV-UHFFFAOYSA-M 0.000 description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 2
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000004312 hexamethylene tetramine Substances 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 229960003151 mercaptamine Drugs 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- UKODFQOELJFMII-UHFFFAOYSA-N pentamethyldiethylenetriamine Chemical compound CN(C)CCN(C)CCN(C)C UKODFQOELJFMII-UHFFFAOYSA-N 0.000 description 1
- WQWMYQCMTRPXSJ-UHFFFAOYSA-N pentane-1,4-diol Chemical compound CC(O)CCCO.CC(O)CCCO WQWMYQCMTRPXSJ-UHFFFAOYSA-N 0.000 description 1
- YSPXNJODCGZWPD-UHFFFAOYSA-N pentane-1,5-diol Chemical compound OCCCCCO.OCCCCCO YSPXNJODCGZWPD-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229960003742 phenol Drugs 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052699 polonium Inorganic materials 0.000 description 1
- HZEBHPIOVYHPMT-UHFFFAOYSA-N polonium atom Chemical compound [Po] HZEBHPIOVYHPMT-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229960005335 propanol Drugs 0.000 description 1
- IOXGEAHHEGTLMQ-UHFFFAOYSA-N pyridazine Chemical compound C1=CC=NN=C1.C1=CC=NN=C1 IOXGEAHHEGTLMQ-UHFFFAOYSA-N 0.000 description 1
- BXEMXLDMNMKWPV-UHFFFAOYSA-N pyridine Chemical group C1=CC=NC=C1.C1=CC=NC=C1 BXEMXLDMNMKWPV-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229940043230 sarcosine Drugs 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000003352 sequestering agent Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 125000002769 thiazolinyl group Chemical group 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- GRNRCQKEBXQLAA-UHFFFAOYSA-M triethyl(2-hydroxyethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CCO GRNRCQKEBXQLAA-UHFFFAOYSA-M 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
- C23G5/036—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds having also nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/32—Amides; Substituted amides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
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Abstract
本发明涉及清洗液组合物,具体地,提供一种能够清洗在金属的化学机械平坦化工程等中产生的金属氧化物与金属研磨粒子的清洗液组合物。根据本发明提供的清洗液组合物,由于能够增强对金属研磨粒子的络合力,并能够维持还原力,因此能够改善清洗液的稳定性,对金属表面进行高防腐蚀力的清洗工程。
Description
技术领域
本发明涉及清洗液,更具体涉及在半导体制造工程中,在用于实现基板的平坦化的化学机械研磨工程之后,除去残留物时使用的清洗液。
背景技术
半导体装置通过复杂的多层工序制造。现在,半导体制造工程中,化学-机械平坦化(CMP)工程是一种这样的技术,用于使半导体装置制造所用的各种基板平坦化为未满0.35微米的几何图形排列。
CMP工程包含在适合的压力及温度条件下,使半导体材料的薄且平的基板固定于被湿润研磨的表面,并使其旋转的步骤。另外,可使用含有氧化铝或二氧化硅之类的粒子的化学泥浆(slurry)作为研磨材料。这种化学泥浆含有被选择的化学物质,其能够在加工期间蚀刻基板的各表面。这种研磨工程中,材料的机械性除去与化学性除去结合起来,适合用于实现平坦化优异的表面。
然而,CMP工程有可能在半导体基板的表面上留下污染物质,该污染物质大部分为氧化铝或二氧化硅与添加于研磨泥浆中的反应性化学物质所组成的研磨粒子。另外,这种污染层还可能包含研磨泥浆与研磨表面间的反应生成物。因此,为了避免导致半导体装置的可信度下降及制造工程的收率减少的缺陷,在进行半导体基板的后续工程之前,需要除去污染源。因此,为了清洗存在CMP残留物的基板表面,开发了后-CMP(post-CMP)清洗溶液。
以往,作为这种后-CMP清洗液,一直以来通常使用氢氧化铵(Ammonium hydroxide)基质的碱性溶液,它们大部分为用于含有铝、钨、钽及它们的氧化物的表面的CMP清洗液。
最近,联络线路(Interconnector)的制造中,用铜取代铝作为最合适的物质。在对使用铜的基板进行CMP工程之后,铜、氧化铜及研磨液的泥浆粒子可能存在于铜表面。由于这种铜表面可快速扩散到硅元素及二氧化硅中,因此,为了防止装置故障,必须将全部粒子从晶片表面除去。
然而,这种以氧化铝或二氧化硅为基材的、在通常CMP工程有效的后-CMP清洗溶液,对于含铜表面效果并不佳。另外,经证明,铜容易被上述清洗溶液损伤,上述后-CMP清洗溶液的清洗效率在无法接受的范围内。
作为这种用于后-CMP工程的清洗液,大韩民国公开第10-2003-0025238号中公开了一种清洗溶液,其包含有氢氧化季铵(quaternary ammonium hydroxide)、C2-C5的极性有机胺、腐蚀抑制剂及水,且溶液的碱度为1g溶液对应超过0.073毫当量的碱基。然而,这种清洗液对铜/氧化铜膜的选择性蚀刻量并不大,因此,存在清洗力低的缺点。
因此,需要一种能保护半导体所使用的铜金属膜之类的纯金属,且能够有效地除去铜金属表面的氧化膜的清洗液。
发明内容
为此,本发明的技术课题在于提供一种清洗液组合物,其能够保护纯金属,并且能够有效地除去金属表面的氧化膜。
为了解决上述问题,本发明提供一种清洗液组合物,其包含下述化学式1所表示的化合物:
[化学式1]
上述化学式1中,
X及Y各自独立表示具有非共用电子对的原子或官能团,
R1及R2各自独立表示氢原子、羟基、羧基,或者被取代或未被取代的、碳原子数为1至20的烷基,
m及n各自独立为1至5的整数。
根据一实施例,上述化合物中,X及Y各自独立选自氧族元素原子、氮族元素原子或含有它们的官能团。
根据一实施例,X为氧原子或-NH,Y为氮原子。
根据一实施例,X为-NH,Y为氮元素,R1及R2各自独立表示氢原子、羟基或羧基化合物。
根据一实施例,清洗液组合物还包含氢氧化季铵。
上述氢氧化季铵可包含四甲基氢氧化铵、四乙基氢氧化铵、三甲基(羟乙基)氢氧化铵以及三乙基(羟乙基)氢氧化铵中的一种以上。
根据一实施例,还包含有机胺。
上述有机胺为单乙醇胺、二乙醇胺、三乙醇胺、咪唑乙醇、单异丙醇胺、氨基异丙醇、氨基丙醇、甲基氨基乙醇、氨基丁醇、氨基乙氧基乙醇、氨基乙基氨基乙醇、苄基哌嗪、四氢呋喃基胺、二乙烯三胺、三乙四胺以及四乙烯五胺中的一种以上。
根据一实施例,清洗液组合物包含1至30重量份的上述化学式1的化合物、0.1至30重量份的氢氧化季铵以及1至50重量份的有机胺。
上述清洗液组合物用于化学机械研磨(CMP)后的清洗。
根据本发明提供的清洗液组合物,由于对金属粒子的络合力得以增强,因此在能够改善对金属氧化物及金属研磨粒子等残留物的清洗力的同时,还能够抑制对金属表面的附加氧化及提升金属的防腐蚀力。
附图说明
图1为示出本发明的清洗液组成物所含有的化学式1的化合物的作用原理的概念图。
具体实施方式
以下用于对本发明进行详细说明。本说明书及权利要求书中所使用的术语或词语不应解释为通常的含义或字典中的含义,应解释为,发明人为了以最合适的方法说明其发明,基于调整而定义术语的概念这一原则而符合本发明的技术思想的含义与概念。
以下,对本发明的实施方式进行更详细的说明。
半导体及微电子元件等的制造工程包括化学机械平坦化工程(CMP),在这种研磨工程之后,金属的表面上会自然生成氧化膜。另外,还会产生这样的问题,即,工程中使用的泥浆粒子与污染残留物等会与金属氧化膜一起残留于金属表面。因此,为了解决上述问题,本发明提供一种清洗液组成物,其在除去氧化金属膜与残留物的同时,还能够使未氧化的纯金属膜的损伤最小化。
即,本发明提供一种清洗液组成物,其包含化学式1的化合物,该化合物同时具有对金属或金属氧化膜粒子的络合力与还原力。具体地,上述化合物随着自身被氧化,其能够与构成络合物的金属或金属氧化物粒子进行还原,是一种在分子结构内具有各个功能的官能团的化合物。
本发明提供的清洗液组合物包含下述化学式1所表示的化合物:
[化学式1]
上述化学式中,
X及Y各自独立表示具有非共用电子对的原子或官能团,
R1及R2各自独立选自氢原子、羟基、羧基,或者被取代或未被取代的、碳原子数为1至20的烷基,
m及n各自独立为1至5的整数。
上述化学式1的化合物的X及Y各自独立选自具有非共用电子对的原子或官能团。
如图1所示,化学式1的化合物由于具有上述非共用电子对的X及Y,因此能够与金属或金属氧化物粒子形成络合物。
作为具有上述这种非共用电子对的原子或官能团,可包括氧族元素原子、氮族元素原子或含有它们的官能团。上述氧族元素原子可为氧、硫、硒、碲,钋及鉝等,氮族元素原子可为氮、磷、砷、锑及铋等。
根据一实施例,上述化学式1的X及Y可各自独立选自氧原子、氮原子或含有它们的官能团。优选的是,X为氧原子或-NH,Y为氮原子。
另外,上述化学式1的R1及R2可各自独立选自氢元素、羟基、碳原子数为1至10的羧基及者被取代或未被取代的、碳原子数为1至20的烷基。此处的“被取代”是指,包含于化合物中的至少一个氢原子被卤素原子、碳原子数为1至10的烷基、卤化烷基、碳原子数为3至30的环烷基、碳原子数为6至30的芳基、羟基、碳原子数为1至10的烷氧基(alkoxy group)、羧酸基(carboxylic acid group)、醛基(aldehyde group)、环氧基(epoxy group)、氰基(cyano group)、硝基(nitro group)、氨基(amino group)、磺酸基(sulfonic acid group)及它们的衍生物所构成的群中选择的取代基所代替。另外,虽然未特别说明,烷基可包括直链状、支链状及环状烃基。
上述碳原子数为1至20的烷基举例而言可为甲基(methyl)、乙基(ethyl)、正丙基(n-propyl)、异丙基(isopropyl)、正丁基(n-butyl)、异丁基(isobutyl)、戊基(pentyl)、己基(hexyl)、庚基(heptyl)、辛基(octyl)、2-乙基己基(2-ethylhexyl group)、壬基(nonyl)、癸基(decyl)、十一烷基(undecyl)、十二烷基(dodecyl)等。碳原子数越多,作为目的的化学物的粘度及沸点越高,碳原子数越少,挥发性会增加,因此,可为碳原子数为1至10或碳原子数为1至6的烷基。
根据一实施例,上述化学式1的R1及R2各自独立表示氢原子、羟基或羧基。
根据一实施例,上述化学式1的m及n表示苯环上被取代的取代基的数目,可为1至5或1至3的整数。
以清洗液组合物总共为100重量份,可使用1至30重量份的上述化学式1的化合物,例如可使用1至20重量份或1至10重量份。在含量不合适的情况下,无法发挥络合金属及对附加氧化的效果,或对泥浆的分散性造成影响。
根据一实施例,上述化学式1的化合物可通过使下述化学式2及化学式3的化合物反应而制造。
[化学式2]
[化学式3]
上述化学式2及3的取代基与化学式1中的定义相同。
根据一实施例,上述化学式2所能表示的化合物举例而言,可包括吡啶-2,6-二羧酸(Pyridine-2,6-dicarboxylic acid)及吡啶-2,6-二甲酰胺(Pyridine-2,6-dicarboxamide)等。
上述化学式3所能表示的化合物举例而言,可为4-亚氨基甲基苯甲酸(4-(iminomethyl)benzoic acid)、4-亚氨基甲基羟基苯(4-(iminomethyl)Hydroxybenzene)等。
在化学式1的化合物中,对于与上述化学式2对应的部分,其与金属氧化物形成络合物,因此其起到除去被氧化的金属及金属研磨粒子等污染残留物的作用。另外,对于与上述化学式3对应的部分,其保护金属表面使得金属表面远离氧及碱性环境,因而能够起到抑制附加的氧化反应的功能。因此,由化学式2及3组合而形成的上述化学式1的化合物具有高还原力的特性。即,化学式1的化合物具有如下倾向:随着化学式1的化合物自身被氧化,其与能够形成络合物的金属氧化物进行还原。
因此,化学式1的化合物在本发明的清洗液组合物内,根据上述那种化合物特性,作为具有对金属进行络合的功能的络合材料而起作用。另外,在除去残留物的同时,还起到抑制纯金属表面的附加氧化的作用。
本发明所提供的清洗液组合物除了上述化学式1的化合物外,还可包含被当作络合剂、螯合剂(chelating agent)和/或金属掩蔽剂(sequestering agent)的化合物。这些成分可与待除去的金属原子及金属离子发生化学性结合,或者,可对这些金属离子进行物理性固定。
根据一实施例,本发明所提供的清洗液组合物还包含氢氧化季铵。
上述氢氧化季铵中,烃基(Hydrocarbon group)键合到季氮原子上,可包含具有羟基的、阴离子性及阳离子性的盐。键合到上述季氮原子的烃基例如为,烷基、烯基(Alkenyl)、芳基及芳烷基被羟基部分地取代或未取代的烃基。这种氢氧化季铵具体而言可包含四甲基氢氧化铵(tetramethyl ammonium hydroxide,TMAH)、四乙基氢氧化铵(tetraethyl ammonium hydroxide,TEAH)、四丁基氢氧化铵(tetrabutyl ammoniumhydroxide,TBAH)、四丙基氢氧化铵(tetrapropylammonium hydroxide)、三甲基乙基氢氧化铵(trimethylethylammonium hydroxide)、(羟乙基)三甲基氢氧化铵((hydroxyethyl)trimethylammonium hydroxide)、(羟乙基)三乙基氢氧化铵((hydroxyethyl)triethylammonium hydroxide)、(羟乙基)三丙基氢氧化铵((hydroxyethyl)tripropylammonium hydroxide)、(羟丙基)三甲基氢氧化铵(hydroxypropyl)trimethylammonium hydroxide、乙基三甲基氢氧化铵(ethyl trimethyl ammoniumhydroxide)、二乙基二甲基氢氧化铵(diethyl dimethyl ammonium hydroxide)苄基三甲基氢氧化铵(benzyltrimethylammonium hydroxide)等构成的群中的一种以上。
举例而言,可包含四甲基氢氧化铵、四乙基氢氧化铵、三甲基(羟乙基)氢氧化铵以及三乙基(羟乙基)氢氧化铵中的一种以上。
在含量不合适的情况下,上述氢氧化季铵难以除去金属氧化物。因此,以清洗液组合物总共为100重量份,上述氢氧化季铵的含量可为0.1至30重量份,例如1至20重量份或1至15重量份。
根据一实施例,上述清洗液组合物还包含有机胺。上述有机胺对金属氧化物作用,从而起到均匀地清洗被氧化的金属表面的作用。上述这种有机胺为由有机伯胺、有机仲胺及有机叔胺构成的群中的一种以上。
上述有机胺具体可包含一甲胺(methylamine)、乙胺(ethylamine)、异丙胺(isopropylamine)、单丙醇胺(monopropanolamine)、单异丙胺(monoisopropyl amine)、乙酰胆碱(acetylcholine)、单乙醇胺(monoethanolamine)、二乙醇胺(diethanolamine)、2-氨基乙醇(2-aminoethanol)、2-(甲氨基)乙醇(2-(methylamino)ethanol)、二甘醇胺(diglycol amine)、甲基二乙醇胺(methyl diethanol amine)、二乙胺(diethylamine)、二异丙胺(diisopropylamine)、二丁胺(dibutylamine)、三甲胺(trimethylamine)、三乙胺(triethylamine)、三异丙基胺(triisopropyl amine)、三丁胺(tributylamine)、五甲基二乙烯基三胺(pentamethyldiethylenetriamine)、三乙醇胺(triethanolamine)、三乙烯二胺(triethylenediamine)、六次甲基四胺(hexamethylenetetramine)、3,3-亚氨基二(3,3-imino bis)、咪唑乙醇(imidazolidin ethanol)、二甲基丙胺(dimethyl propylamine)、乙基氨基乙醇(ethylamino ethanol)、甲基氨基乙醇(methyl amino ethanol)、羟乙基吗啉(hydroxyethyl morpholine)、氨丙基吗啉(aminopropyl morpholine)、氨基乙氧基乙醇(amino ethoxyethanol)、氨基丙醇(amino propanol)、氨基丁醇(amino butanol)、亚氨基二乙酸(iminodiacetic acid)、甘氨酸(glycine)、氮三乙酸(nitrilotriacetic acid)、羟乙基亚氨基二乙酸(hydroxyethyl iminodiacetic acid)、四甲基胍(tetramethylguanidine)、乙二胺四乙酸(ethylene diamine tetraacetic acid,EDTA)、氨基乙基氨基乙醇(amino ethyl amino ethanol)、苄基哌嗪(benzyl piperazine)、四氢呋喃基胺(Tetra hydroperoxide furyl amine)、二乙烯三胺(diethylene triamine)、三乙四胺(triethylenetetramine)以及四乙烯五胺(tetraethylene penta amine)构成的群中的一种以上。
例如,可包含单乙醇胺(monoethanolamine)、二乙醇胺(diethanolamine)、三乙醇胺(triethanolamine)、1-咪唑乙醇(1-imidazolidin ethanol)、单异丙醇胺(monoisopropanol amine)、1-氨基异丙醇(1-amino isopropanol)、2-氨基-1-丙醇(2-amino-1-propanol)、N-甲基氨基乙醇(N-methyl amino ethanol)、3-氨基-1-丙醇(3-amino-1-propanol)、4-氨基-1-丁醇(4-amino-1-butanol)、2-(2-氨基乙氧基)-1-乙醇、苄基哌嗪(benzyl piperazine)、四氢呋喃基胺(Tetra hydroperoxide furyl amine)、二乙烯三胺(diethylenetriamine)、三乙四胺(triethylenetetramine)以及四乙烯五胺(tetraethylene penta amine)中的一种以上。
上述有机胺的含量不适合的情况下,将无法完全除去金属氧化膜,或者产生金属腐蚀或泥浆的分散性的问题。以清洗液组合物总共为100重量份,可使用1至50重量份的上述有机胺,例如5至30重量份。
由于本发明所涉及的清洗液组合物基本为水性的组合物,因此包含有水。上述水通常可使用半导体工程所用的去离子水。例如,所使用的水具有18MΩ/cm以上纯度,在使组成物总重量为100重量份时,可添加水以使与其他成分的含量合计为100。
根据一实施例,上述清洗液组合物还可附加包含腐蚀抑制剂、表面活性剂及有机溶剂等。
上述金属腐蚀抑制剂可包括具有氨基的化合物,可从胺类和唑类等中单独选择一种或选择两种以上。另外,上述金属腐蚀抑制剂可为芳香环内包含至少一个氮原子的化合物,该化合物中,上述氮原子上直接键合能够以氢离子的形式从泥浆内分离出来的氢原子。
举例而言,上述金属腐蚀抑制剂可包含3-甲基吡啶(3-methylpyridine)、半胱胺(Cysteamine),还包含唑类化合物、2-丁炔-1,4-二醇(2-butyne-1,4-diol)、3-丁炔-1-醇(3-butyn-1-ol)或硫醇(Thiol)类化合物。
根据一实施例,上述金属腐蚀抑制剂作为唑类化合物可包含三唑类(triazole)化合物、苯并三唑类(benzotriazole)化合物、咪唑类(imidazole)化合物、四唑类(tetrazole)化合物、噻唑类(thiazole)化合物、恶唑类(oxazole)化合物及吡唑类(pyrazole)化合物等,且这些化合物可独立或混合使用。例如,上述金属腐蚀抑制剂可独立地包含三唑类化合物、苯并三唑类化合物、咪唑类化合物所构成的群中的任意一种或混合地包含该群中任意多种。
更具体地,作为本发明所提供的金属腐蚀抑制剂所能包含的唑类化合物的例子,可为三唑、1H-1,2,3-三唑、1,2,3-三唑-4,5-二羧酸、1,2,4-三唑、1-H-1,2,4-三唑-3-硫醇、3-氨基-三唑等,且可独立或混合使用这些化合物。
上述唑类化合物的其他例子可为苯并三唑类化合物,可为苯并三唑、1-氨基-苯并三唑、1-羟基-苯并三唑、5-甲基-1H-苯并三唑、苯并三唑-5-羧酸等,且可独立或混合使用这些化合物。
上述唑类化合物的又一例子可为咪唑类化合物,可为咪唑、1-甲基-咪唑、苯并咪唑、1-甲基-苯并咪唑、2-甲基-苯并咪唑、5-甲基-苯并咪唑等,且可独立或混合使用这些化合物。
上述唑类化合物的又一例子可为四唑类化合物,可为1H-四唑、1H-四唑-5-乙酸、5-氨基-四唑等,且可独立或混合使用这些化合物。
上述唑类化合物的又一例子可为噻唑类化合物,可为苯并噻唑、2-甲基-苯并噻唑、2-氨基-苯并噻唑、6-氨基-苯并噻唑、2-巯基-苯并噻唑等,且可独立或混合使用这些化合物。
上述唑类化合物的又一例子可为恶唑类化合物,可为异恶唑、苯并恶唑、2-甲基-苯并恶唑、2-巯基-苯并恶唑等,且可独立或混合使用这些化合物。
上述唑类化合物的又一例子可为吡唑类化合物,可为吡唑,4-吡唑-羧酸等,且可独立或混合使用这些化合物。
另外,根据一实施例,上述金属腐蚀抑制剂可为吡啶(pyridine)和哌啶(piperidine)中的一种以上,例如可包含3-甲基吡啶、半胱胺。
根据一实施例,上述金属腐蚀抑制剂可包含吡唑、三唑、苯并三唑、甲苯基三唑(tolyltriazole)、氨基三唑、甲基四唑、咪唑、吡啶、哒嗪(pyridazine)及吲唑(indazole)中的一种以上。
根据一实施例,上述金属腐蚀抑制剂包含苯基(benzene)或与苯基类似的疏水性基团的情况下,可增加金属的氧化防止效果。
上述金属腐蚀抑制剂的含量不合适的情况下,不具有防止金属腐蚀的效果或者可能妨害清洗效果,以清洗液组合物总共为100重量份,上述金属腐蚀抑制剂的含量为10重量份以下,例如包含0.001至5重量份。
根据一实施例,上述清洗液组合物中作为添加剂还包括表面活性剂。上述表面活性剂起到如下作用,提高作为作用对象的金属表面的图案或通孔(via hole)之间湿润性(wetting property),使清洗液组成物能够均等地进行作用,改善添加剂的泡沫特性。这种表面活性剂可从由非离子性表面活性剂、阴离子性表面活性剂、阳离子性表面活性剂及两性表面活性剂组成的群中选择一种以上来使用。
上述非离子性表面活性剂在水溶液状态下不会产生离子,基于该理由,其可与其他类型的表面活性剂混合添加而使用。非离子性表面活性剂举例而言可包含乙氧基化的直链醇(ethoxylated linear alcohol)、乙氧基化的烷基酚(ethoxylated alkylphenol)、脂肪酸酯(fatty acid ester)、胺与酰胺衍生物(amine and amide derivative)、烷基聚糖苷(alkyl poly glycoside)、环氧乙烷-环氧丙烷共聚物(ethylene oxide-propyleneoxide copolymer)、聚醇和乙氧基化的多元醇(poly alcohol and ethoxylatedpolyalcohol)、硫醇和硫醇衍生物(thiol and mercaptan derivative)等。
上述阴离子性表面活性剂可包含硫酸盐、磺酸盐、有机磷酸系列、肌氨酸(sarcoside)、烷基氨基酸、月桂肌氨酸(lauryl sarcoside)等,例如,包含烷基酯硫酸盐(alkyl ester sulfate)、烷基乙氧基醚硫酸盐(alkyl ethoxy ether sulfate)、十二烷基苯磺酸盐(dodecylbenzene sulfonate)、烷基苯磺酸盐(alkyl benzene sulfonate)、α-烯烃磺酸盐(alpha-olefin sulfonate)、二十四磺酸盐(lignoceric sulfonate)、锍羧基化合物(sulfonium-carboxyl compound)等。
上述阳离子性表面活性剂能够吸附于带负电的基质,因此,能够起到防止静电及柔软剂的作用。还能起到作为固态粒子的分散剂、浮动集尘剂、疏水剂、腐蚀抑制剂的作用。阳离子性表面活性剂举例而言可包括脂肪酸胺、烷基季铵(quaternary alkyl ammonium)、直链二胺(linear diamine)、氯化十二烷基吡啶(n-dodecyl pyridinium chloride)、咪唑与吗啉化合物(imidazole and morpholine)等。
上述两性表面活性剂在同一分子中具有阴离子性与阳离子性的解离,具有一定的等电点,例如可包含两性羧酸盐(amphoteric carboxylate)、烷基甜菜碱(alkylbetaine)、酰胺烷基甜菜碱(amido alkyl betaine)、酰胺烷基磺基甜菜碱(amido alkylsultaine)、两性磷酸盐(amphoteric phosphate)、磷酸酯甜菜碱(phosphobetaine)、焦磷酸酯甜菜碱(pyrophosphobetaine)、羧基烷基胺(carboxy alkyl polyamine)等。
上述表面活性剂举例而言可使用乙炔二醇(Acetylene diol)、烷基胺(alkylamine)、烷基羧酸(alkyl carboxylic acid)与普兰尼克(pluoronic)系列聚合物中的一种以上。上述普兰尼克系列聚合物举例而言可包括环氧乙烷与环氧丙烷的嵌段共聚物等。
上述清洗液组合物所能包含的表面活性剂为本领域中通常使用的,并不限定于上述记载的表面活性剂。
在上述表面活性剂的含量不合适的情况下,其提高湿润性及改善添加剂的泡沫特性的效果不优,或者因溶解度的问题导致可能出现表面活性剂析出的问题。因此,以上述清洗液组合物总共为100重量份,可添加表面活性剂10重量份以下,例如0.0005至5重量份。举例而言,非离子性表面活性剂、两性表面活性剂或它们的混合物添加0.001至2重量份。
在添加如上所述的添加剂的情况下,其含量可根据各添加剂的使用目的等调节而选择,然而,从不损害本发明的效果的来看,优选的是,以本发明的清洗液组合物是100重量份为基准,全部添加剂的含量共占10重量份以下的范围。
根据一实施例,上述清洗液组合物还包含有机胺,具体地,可包含多元醇(Polyol)和砜(sulfone)中的一种以上。上述多元醇可为乙二醇(Ethylene glycol)、丙二醇(propylene glycol)、新戊二醇(neopentyl glycol)、甘油(glycerol)、二甘醇(diethylene glycol)、二丙二醇(dipropylene glycol)、1,4-丁二醇(1,4-butanediol)、2,3-丁二醇(2,3-butylene glycol)、1,3-戊二醇(1,3-pentanediol)、1,4-戊二醇(1,4-pentanediol)、1,5-戊二醇(1,5-pentanediol)、和3-甲基-1,5-戊二醇(3-methyl-1,5-pentanediol)中的一种以上。上述砜可为四亚甲基砜(Tetramethylene sulfone)、二甲基砜(dimethyl sulfone)、二乙基砜(diethyl sulfone)、二(2-羟乙基)砜(bis(2-hydroxyethyl)sulfone)、甲基环丁砜(methyl sulfolane)及乙基环丁砜(ethylsulfolane)中的一种以上。举例而言,上述有机胺可包含四亚甲基砜、甘油(glycerin)、丙二醇、乙二醇中的一种以上。
根据一实施例,上述清洗液组合物可用于含有下述金属中的一种以上或它们的合金的基板的清洗工程中,这些金属为铝、铜、钛、钼、铅、锌、锡、银。特别适用于含有铜的基板的化学机械研磨工程后的清洗工程中,但并不仅限于此。
根据一实施例,本发明的清洗液组合物在使用前被适量的水稀释,以作为所需要的浓缩物而提供,在上述情况下,各个的成分能够以上述适当范围内的量存在于上述清洗液组合物中。例如,上述浓缩物被稀释为两倍的情况下,对包含于化学式1的化合物、氢氧化季铵及有机胺的各成分,可以上述含量的两倍以上的量分别包含于浓缩物中。如上所述,上述清洗液组合物可稀释为2至100倍,例如5至50倍后再使用。
稀释后再使用的情况下,也满足下述比例,即,上述化学式1的化合物为1至30重量份,氢氧化季铵为0.1至30重量份,有机胺为1至50重量份,更优选的是,化学式1的化合物为1至20重量份,氢氧化季铵为1至20重量份,有机胺为5至30重量份。
根据更优选的一实施例,可使用化学式1的化合物:氢氧化季铵:有机胺的重量比例为1:0.2~2:0.5~5,或者1:0.5~1.5:0.8~3,但并不仅限于此。
本发明可进行多种变换,能够实施各种实施例,以下,对本发明进行详细说明,以使本发明所属的技术领域的普通技术人员能够容易实施本发明。下述实施例仅用于例示本发明,本发明的内容并不限于下述实施例,本发明的内容需理解为包含于本发明的思想及技术范围内的全部变形、等同物及替代物。
合成例1:合成PDCA-OH
具有下述结构式的化合物通过如下方式合成。
[化学式4]
首先,使2,6-吡啶二羧酸在氯化亚砜(Thionyl chloride)触媒下,在过量的甲醇中常温反应24小时,然后加入水合肼(Hydrazine hydrate)进行3小时的回流(reflux)反应。最后加入2摩尔的4-羟基苯甲醛(4-Hydroxybenzaldehyde)进行回流(reflux)反应后,通过过滤器(filter)获取反应物,再通过热的乙醇进行重结晶并提纯。NMR的结果如下。
1H NMR(DMSO-d6,300MHz):δ(ppm)12.44(s,2H,-NH),8.81(s,2H,CH=N),8.37(m,2H,CHpy),8.33(m,1H,CHPy),8.04(d.4H,ArH),7.92(d,4H,ArH).5.35(2H,Ar-OH),
13C-NMR(DMSO-d6,300MHz):δ(ppm)160.8(C1,Ar-OH),138.18(C2,ArH),127.41(C4,ArH),132.12(C5,ArH),140.11(C6,-CH=N),159.70(C7,-C(O)NH),148.89-148.15(C8,C9,Py).
合成例2:合成PDCA-COOH
具有下述结构式的化合物通过如下方式合成。
[化学式5]
使共1摩尔的2,6-吡啶二羧酸、2,6-二酰肼(2,6-pyridinedicarboxylic acid、2,6-dihydrazide)与2摩尔的4-甲酰基-苯甲酸(4-formyl-benzoic acid)在甲醇中按照合成化学式4的反应方法进行合成。NMR的结果如下。
1H NMR(DMSO-d6,300MHz):δ(ppm)13.20(b,2H,-COOH),12.44(s,2H,-NH),8.81(s,2H,CH=N),8.37(m,2H,CHpy),8.33(m,1H,CHPy),8.04(d.4H,ArH),7.92(d,4H,ArH).
13C-NMR(DMSO-d6,300MHz):δ(ppm)166.95(C1,-COOH),138.18(C2,ArH),127.41(C4,ArH),132.12(C5,ArH),140.11(C6,-CH=N),159.70(C7,-C(O)NH),148.89-148.15(C8,C9,Py).
实施例1至5与比较例1至5
下述表1及2的成分是以清洗液组成物总共为100重量份为准进行表示的,含有剩余量的水。下述表中的略语的意义如下。
TMAH:四甲基氢氧化铵(tetramethyl ammonium hydroxide)
TEHA:四乙基氢氧化铵(Tetraethylammonium hydroxide)
MEA:单乙醇胺(monoethanolamine)
DETA:二乙烯三胺(diethylenetriamine)
TETA:三乙四胺(triethylenetetramine)
PDCA-OH:化学式4的化合物
PDCA-CO2H:化学式5的化合物
--EDTA-4NH4--:乙二胺四乙酸铵盐(Ethylenediaminetetraacetic acidammonium salt)
--CA-3NH4--:柠檬酸铵盐(Citric acid Ammonium salt)
AsA:抗坏血酸铵盐(Ascorbic acid Ammonium salt)
DIW:去离子水
【表一】
【表二】
实验例1:对纯铜与氧化铜的清洗
将实施例及比较例所涉及的各清洗液组合物稀释到50倍后使用。纯铜及氧化铜试片在各清洗液组合物浸渍1分钟后,利用电感耦合等离子体发射光谱仪(ICP-OES)测定铜及氧化铜的出溶量。
上述纯铜试片采用通过稀的氢氟酸蚀刻氧化铜得到的纯铜膜质,氧化铜试片采用使铜在炉(oven)中以200℃的条件氧化30分钟得到的产物,将各个试片切割成20mm×30mm大小而进行实验。
实验例2:氧化还原电位测定
为了实施例及比较例所涉及的清洗液组合物的稳定性,通过ORP测定(metrohm,瑞士万通,ORP electrode,ORP电极)确定各清洗液组合物在初始时及在48小时后的氧化还原电位。上述初始时及48小时后的清洗液组合物采用新制造的清洗液组合物与放置在大气中48小时的清洗液组合物。
上述实验例1所涉及的氧化铜及纯铜的时刻量与实施例2所涉及的氧化还原电位的测定结果如下述表3所示。
如根据上述表3的结果可确认的,关于实施例组合物,氧化铜相对于纯铜的选择比(氧化铜/纯铜)较高,在2以上;与此相对,关于比较例组合物,该选择比全都在2以下,较低。
特别地,还可确认如下情况,即,在氧化还原电位中,实施例所涉及的清洗液组合物即使在48小时以后,还原力还能维持在-100以下的数值,还原力较高,与初始时的氧化还原电位相比没有较大的差距,比较例1至5所涉及的清洗液组合物处于从初始开始具有还原力的状态,然而还原力维持于相对较低的水平,或者,48小时后还原力降到一半以下。
因此,本发明所提供的清洗液组合物相对氧化还原粒子形成络合物,因此起到的清洗液的作用,另外,还由于维持清洗液内的还原电位而能够抑制纯铜的附加氧化。
另外,由于不包含类似于抗坏血酸(Ascorbic acid)等对氧与温度敏感的化合物,因此,对其保管较为容易,在清洗工程中能够维持稳定的清洗液状态。
如上述对本发明内容的特定部分的详细记述,对于本领域普通技术人员而言,这些具体的记述仅仅是优选的实施方式,因此本发明的范围不限于上述记载的特定的实施例。
Claims (10)
1.一种清洗液组合物,其特征在于,包含下述化学式1所表示的化合物:
[化学式1]
在上述化学式中,X及Y各自独立表示具有非共用电子对的原子或官能团,
R1及R2各自独立选自氢原子,羟基,羧基,及被取代或未被取代的、碳原子数为1至20的烷基,
m及n各自独立为1至5的整数。
2.根据权利要求1所述的清洗液组合物,其特征在于,
X及Y各自独立选自氧族元素原子、氮族元素原子或含有它们的官能团。
3.根据权利要求1所述的清洗液组合物,其特征在于,
X为氧原子或-NH,Y为氮原子。
4.根据权利要求1所述的清洗液组合物,其特征在于,
X为-NH,Y为氮元素,R1及R2各自独立表示氢原子、羟基或羧基。
5.根据权利要求1所述的清洗液组合物,其特征在于,
还包含氢氧化季铵。
6.根据权利要求5所述的清洗液组合物,其特征在于,
上述氢氧化季铵包含四甲基氢氧化铵、四乙基氢氧化铵、三甲基(羟乙基)氢氧化铵以及三乙基(羟乙基)氢氧化铵中的一种以上。
7.根据权利要求1所述的清洗液组合物,其特征在于,
还包含有机胺。
8.根据权利要求7所述的清洗液组合物,其特征在于,
上述有机胺为单乙醇胺、二乙醇胺、三乙醇胺、咪唑乙醇、单异丙醇胺、氨基异丙醇、氨基丙醇、甲基氨基乙醇、氨基丁醇、氨基乙氧基乙醇、氨基乙基氨基乙醇、苄基哌嗪、四氢呋喃基胺、二乙烯三胺、三乙四胺以及四乙烯五胺中的一种以上。
9.根据权利要求1所述的清洗液组合物,其特征在于,
清洗液组合物包含1至30重量份的上述化学式1的化合物、0.1至30重量份的氢氧化季铵以及1至50重量份的有机胺。
10.根据权利要求1所述的清洗液组合物,其特征在于,
上述清洗液组合物用于化学机械研磨(CMP)后的清洗。
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