CN106280306A - 可热封高阻隔包装膜 - Google Patents
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Abstract
本发明公开了一种可热封高阻隔包装膜,其结构具有ABC型三层复合结构,A层为PETT/PETG聚酯层,B层是两种热塑性树脂材料通过共挤工艺实现,C层包括PET切片和无机粒子。本发明提供一种具有优良的阻隔性能,可以直接热封的包装膜。本发明提供的三层式可热封高阻隔包装膜,其结构紧致,能够大幅度提高包装薄膜的阻隔性能,且还能热封,并且安全无毒,可用于食品保证行业。
Description
技术领域
本发明属于包装膜领域,特别是涉及一种可热封高阻隔的包装膜。
背景技术
PET由于具有成型加工方便、综合力学性能优良、价格低廉等优点,已经成为目前广泛使用的一种包装材料。虽然PET本身对于水、氧气以及二氧化碳气体以及具有较高的阻隔性能,但是对于一些对阻隔性有特殊要求的场合,如番茄制品、对微量氧气敏感的熟产品等等,仅用PET作为包装材料就不能满足要求了。
作为包装材料,可热封性是一种基本的性能,PET由于分子链本身是刚性的,加之生产过程中的热定型使得其结晶度高而导致熔点比较高,因此,PET薄膜自身不能热封结合,很大程度上限制了包装材料的使用。
发明内容
针对上述不足之处,本发明的目的在于提供一种具有优良的阻隔性能,可以直接热封的包装膜。本发明提供的三层式可热封高阻隔包装膜,其结构紧致,能够大幅度提高包装薄膜的阻隔性能,且还能热封,并且安全无毒,可用于食品保证行业。
本发明采用的的技术方案如下:
一种可热封高阻隔包装膜,其结构具有ABC型三层复合结构,其特征在于:
所述A层为上表层,所述A层为PETT/PETG聚酯层,所述PET/PETG聚酯层是由PET切片和PETG切片共混熔融挤出,其中PET切片的质量含量为10%~20%,PETG切片的质量含量为80%~90%;
所述B层为芯层,所述B层是两种热塑性树脂材料通过共济工艺实现;
所述C层为下表层,所述C层包括以下重量百分比的组分:95%~98%的PET切片,2%~5%的无机粒子。
本发明的表面热封层的共聚酯PETG在聚合中引入了第三单体,指示分子链的规整度下降,导致共聚酯的结晶程度大大降低,表面热封层在一定的温度和压力下进行热封时不易结晶,分子链具有较高的运动性,两个热封层分子链相互运动、缠绕和交织在一起,最终表现为薄膜热封在一起。
优选的是,所述热塑性树脂材料为包含下式单元的聚酯材料、聚碳酸酯、聚丙烯、聚氯乙烯、高密度聚乙烯、低密度聚乙烯中的一种,
其中T为二价基体,选自C5-7脂环族基团、C6-12芳族基团及其组合,D为二价基团,选自C6-12脂环族基团、C2-12脂族基团及其组合。
优选的是,所述T选自亚环己基、对苯二亚甲基、间苯二亚甲基货期组合;D选自1,4-环己烷二亚甲基、亚甲基、1,2-亚丙基、1,3-亚丙基,1,4-亚丁基和其组合。
本发明的离型层采用聚酯材料、聚碳酸酯、聚丙烯、聚氯乙烯、高密度聚乙烯、低密度聚乙烯材料中的任意两种材料制成的薄膜,这些薄膜能够与有机硅有很好的吸附,避免对离形力产生影响,同时还能降低成本。两中材料的组合优选聚酯材料和聚碳酸酯。适合本发明的聚酯切片为特性粘度为0.6~0.7dl/g的聚对苯二甲酸与乙二醇的缩聚物。聚碳酸酯材料优选双酚A聚碳酸酯。在进行双向拉伸之前需要对聚酯切片和聚碳酸酯进行干燥处理和预结晶,提高聚合物的软化点,避免其在干燥和熔融挤出过程中树脂粒子相互粘连、结块,防止含有酯基的聚合物在熔融挤出过程中发生水解降解和产生气泡。一般情况下,预结晶和干燥温度在160~180℃左右,结晶时间在10~20分钟,干燥时间4~6小时。
优选的是,所述合薄膜厚度为15~125μm,上、下表层的厚度均为2~30μm。
优选的是,所述无机粒子的粒径范围为5~100nm。无机粒子尺寸小于可见光波长,纳米聚酯薄膜具有高的光泽和良好的透明度,同时粒径为纳米级的无机粒子能够提高膜的硬度。当无机粒子的粒径小于5纳米时,会提高聚酯膜与辊之间的摩擦,增加聚酯膜的划伤;当无机粒子的粒径大于100纳米时,会增加聚酯膜的雾度,降低透明度。
优选的是,所述所述无机粒子选自二氧化硅,碳酸钙,醋酸镁,蒙脱土中的一种或其组合,优选蒙脱土。
蒙脱土是我国副产的一类天然黏土矿物。它是一种层状硅酸盐,其结构:片层为纳米尺度,包含3个亚层,在2个硅氧四面体亚层中间夹含一个铝氧八面体亚层,亚层之间通过共用氧原子以共价键连接,结合及其牢固。蒙脱土能进一步与单体或聚合物熔体反应,在单体聚合或聚合物熔体混合的过程中,剥离为纳米尺度的结构片层,均匀分散到聚合物基体中,从而形成纳米塑料。纳米塑料中含蒙脱土量较少,通常质量分数为2%~5%,其刚性、强度、耐热性等性能大幅提高。
优选的是,所述PET切片的特性粘度为0.6~0.8dl/g。由于这种聚酯熔点低,结晶度小,有助于提高热封性,避免由于熔点高结晶性强难于热封。
本发明至少包括以下有益效果:
(1)上层采用PET/PETG共混共挤,导致共聚酯的结晶程度大大降低,表面热封层在一定的温度和压力下进行热封时不易结晶,分子链具有较高的运动性,两个热封层分子链相互运动、缠绕和交织在一起,最终表现为薄膜热封在一起;
(2)下层采用无机纳米粒子,一是可以提高所得复合薄膜的表面滑爽度,有利于后期的收卷和应用;还可以调剂复合薄膜的结晶性,降低成本;同时,通过选择具有阻燃性的无机纳米粒子,可以有效的提高薄膜的阻燃自熄性;
(3)中层采用两种热塑性树脂材料通过共挤工艺实现,可以降低成本。
具体实施方式
可热封高阻隔包装膜加工工艺:
将所述PET切片和无机粒子、PETG和PET共混切片,两种混合热树脂材料分别经过鼓风干燥机干燥后,分别采用三个对应的双螺杆挤出机,经过三层共挤模头挤出,然后依次通过过滤、铸片、纵向拉伸、在线涂布、横向拉伸、牵引收卷、分切制得可热封高阻隔包装膜。
表1实施例1~7各组分组成
如表2所示,将以上实施例进行测试,测试内容如下,测试结果详见表2。
1、拉伸试验(拉伸强度)
试验条件:样品尺寸为210mm×15mm,样条数量10个,拉伸试验机夹具间距为100mm,用拉伸试验机分别测量拉伸强度,取平均值作为该试样的试样结果。
2、热稳定性试验(热收缩率)
试验条件:样品尺寸为10mm×10mm;温度为200℃;时间为30min。
3、气体阻隔性试验
根据GB/T1038-2000《塑料薄膜和薄片气体透过性试验方法压差法》中所要求的压差法测定。
表2测试结果
本发明的可热封高阻隔包装膜的表面热封层熔点较低,对折后热封温度为130℃左右,与软包装行业中经常使用的热封材料如CPP热封温度(120~140℃)相当,并且其热封强度优于其他热封材料如CPP、PE等的热封强度。
尽管本发明的实施方案已公开如上,但其并不仅仅限于说明书和实施方式中所列运用,它完全可以被适用于各种适合本发明的领域,对于熟悉本领域的人员而言,可容易地实现另外的修改,因此在不背离权利要求及等同范围所限定的一般概念下,本发明并不限于特定的细节。
Claims (7)
1.一种可热封高阻隔包装膜,其结构具有ABC型三层复合结构,其特征在于:
所述A层为上表层,所述A层为PET/PETG聚酯层,所述PET/PETG聚酯层是由PET切片和PETG切片共混熔融挤出,其中PET切片的质量含量为10%~20%,PETG切片的质量含量为80%~90%;
所述B层为芯层,所述B层是两种热塑性树脂材料通过共挤工艺实现;
所述C层为下表层,所述C层包括如下百分比的组分:95%~98%的PET切片,2%~5%的无机粒子。
2.如权利要求1所述的可热封高阻隔包装膜,其特征在于,所述热塑性树脂材料为包含下式单元的聚酯材料、聚碳酸酯、聚丙烯、聚氯乙烯、高密度聚乙烯、低密度聚乙烯中的一种,
其中T为二价基体,选自C5-7脂环族基团、C6-12芳族基团及其组合,D为二价基团,选自C6-12脂环族基团、C2-12脂族基团及其组合。
3.如权利要求2所述的可热封高阻隔包装膜,其特征在于,所述T选自亚环己基、对苯二亚甲基、间苯二亚甲基或其组合;D选自1,4-环己烷二亚甲基、亚甲基、1,2-亚丙基、1,3-亚丙基,1,4-亚丁基或其组合。
4.如权利要求1所述的可热封高阻隔包装膜,其特征在于,所述包装厚度为15~125μm,上、下表层的厚度均为2~30μm。
5.如权利要求1所述的可热封高阻隔包装膜,其特征在于,所述无机粒子的粒径范围为5~100nm。
6.如权利要求1所述的可热封高阻隔包装膜,其特征在于,所述所述无机粒子选自二氧化硅,碳酸钙,醋酸镁,蒙脱土中的一种或其组合。
7.如权利要求1所述的可热封高阻隔包装膜,其特征在于,所述PET切片特性粘度为0.6~0.8dl/g。
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CN108357783A (zh) * | 2018-03-16 | 2018-08-03 | 中塑新材料科技(杭州)有限公司 | 一种抗油污热封高阻隔膜 |
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