CN106238273A - 一种引线框架刮胶机及其工作过程 - Google Patents
一种引线框架刮胶机及其工作过程 Download PDFInfo
- Publication number
- CN106238273A CN106238273A CN201610868487.4A CN201610868487A CN106238273A CN 106238273 A CN106238273 A CN 106238273A CN 201610868487 A CN201610868487 A CN 201610868487A CN 106238273 A CN106238273 A CN 106238273A
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- China
- Prior art keywords
- lead frame
- frame
- stacking
- frictioning
- lead
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/16—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length only at particular parts of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201610868487.4A CN106238273B (zh) | 2016-09-30 | 2016-09-30 | 一种引线框架刮胶机及其工作过程 |
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CN201610868487.4A CN106238273B (zh) | 2016-09-30 | 2016-09-30 | 一种引线框架刮胶机及其工作过程 |
Publications (2)
Publication Number | Publication Date |
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CN106238273A true CN106238273A (zh) | 2016-12-21 |
CN106238273B CN106238273B (zh) | 2018-08-21 |
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CN201610868487.4A Active CN106238273B (zh) | 2016-09-30 | 2016-09-30 | 一种引线框架刮胶机及其工作过程 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108155109A (zh) * | 2017-12-29 | 2018-06-12 | 山东才聚电子科技有限公司 | 一种芯片的管脚焊接方法 |
CN109712919A (zh) * | 2019-02-15 | 2019-05-03 | 山东才聚电子科技有限公司 | 一种为晶圆填充玻璃粉的装置 |
CN112122073A (zh) * | 2020-09-22 | 2020-12-25 | 李锋 | 一种引线框架刮胶机 |
CN112917619A (zh) * | 2021-01-21 | 2021-06-08 | 翁晓炜 | 一种胶合板的压合装置 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4505225A (en) * | 1983-08-31 | 1985-03-19 | National Semiconductor Corporation | Self-aligning apparatus for semiconductor lead frame processing means |
JPH0938547A (ja) * | 1995-07-27 | 1997-02-10 | Dainippon Screen Mfg Co Ltd | ロールコーター |
CN201946580U (zh) * | 2010-12-14 | 2011-08-24 | 中山品高电子材料有限公司 | 一种引线框架片装电镀线上料机 |
CN102392280A (zh) * | 2011-11-04 | 2012-03-28 | 毕翊 | 半导体引线框架电镀全自动生产线 |
CN102923516A (zh) * | 2012-08-09 | 2013-02-13 | 浙江捷华电子有限公司 | 集成芯片引线框架定长传送装置 |
CN204236000U (zh) * | 2014-11-25 | 2015-04-01 | 阜南县特立电子有限公司 | 一种新型自动刮锡设备 |
CN104576479A (zh) * | 2014-12-31 | 2015-04-29 | 上海新阳半导体材料股份有限公司 | 引线框架装料装置 |
CN204506106U (zh) * | 2015-02-10 | 2015-07-29 | 淄博才聚电子科技有限公司 | 一种网印机的刮胶移料装置 |
CN205035483U (zh) * | 2015-10-14 | 2016-02-17 | 保定市普天奥电子科技设备有限公司 | 引线框架连续电镀料带续接机 |
CN206122067U (zh) * | 2016-09-30 | 2017-04-26 | 淄博才聚电子科技有限公司 | 一种引线框架刮胶机 |
-
2016
- 2016-09-30 CN CN201610868487.4A patent/CN106238273B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4505225A (en) * | 1983-08-31 | 1985-03-19 | National Semiconductor Corporation | Self-aligning apparatus for semiconductor lead frame processing means |
JPH0938547A (ja) * | 1995-07-27 | 1997-02-10 | Dainippon Screen Mfg Co Ltd | ロールコーター |
CN201946580U (zh) * | 2010-12-14 | 2011-08-24 | 中山品高电子材料有限公司 | 一种引线框架片装电镀线上料机 |
CN102392280A (zh) * | 2011-11-04 | 2012-03-28 | 毕翊 | 半导体引线框架电镀全自动生产线 |
CN102923516A (zh) * | 2012-08-09 | 2013-02-13 | 浙江捷华电子有限公司 | 集成芯片引线框架定长传送装置 |
CN204236000U (zh) * | 2014-11-25 | 2015-04-01 | 阜南县特立电子有限公司 | 一种新型自动刮锡设备 |
CN104576479A (zh) * | 2014-12-31 | 2015-04-29 | 上海新阳半导体材料股份有限公司 | 引线框架装料装置 |
CN204506106U (zh) * | 2015-02-10 | 2015-07-29 | 淄博才聚电子科技有限公司 | 一种网印机的刮胶移料装置 |
CN205035483U (zh) * | 2015-10-14 | 2016-02-17 | 保定市普天奥电子科技设备有限公司 | 引线框架连续电镀料带续接机 |
CN206122067U (zh) * | 2016-09-30 | 2017-04-26 | 淄博才聚电子科技有限公司 | 一种引线框架刮胶机 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108155109A (zh) * | 2017-12-29 | 2018-06-12 | 山东才聚电子科技有限公司 | 一种芯片的管脚焊接方法 |
CN108155109B (zh) * | 2017-12-29 | 2020-04-14 | 山东才聚电子科技有限公司 | 一种芯片的管脚焊接方法 |
CN109712919A (zh) * | 2019-02-15 | 2019-05-03 | 山东才聚电子科技有限公司 | 一种为晶圆填充玻璃粉的装置 |
CN112122073A (zh) * | 2020-09-22 | 2020-12-25 | 李锋 | 一种引线框架刮胶机 |
CN112917619A (zh) * | 2021-01-21 | 2021-06-08 | 翁晓炜 | 一种胶合板的压合装置 |
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Publication number | Publication date |
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CN106238273B (zh) | 2018-08-21 |
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Address after: No. 29-3, Shandong high tech Zone, min Tai Road, Zibo, Shandong Applicant after: SHANDONG CAIJU ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 255086 Shandong Zibo high tech Zone North Xin Xi Road, Gan Jia Industrial Park Applicant before: ZIBO CAIJU ELECTRONIC TECHNOLOGY Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Solder-paste spreading machine for lead frames and working process of solder-paste spreading machine Effective date of registration: 20200403 Granted publication date: 20180821 Pledgee: Bank of China Limited by Share Ltd. Zibo branch Pledgor: SHANDONG CAIJU ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2020980001298 |
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Date of cancellation: 20230112 Granted publication date: 20180821 Pledgee: Bank of China Limited by Share Ltd. Zibo branch Pledgor: SHANDONG CAIJU ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2020980001298 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |