CN106189204B - 薄膜电容的防水绝缘封装材料 - Google Patents
薄膜电容的防水绝缘封装材料 Download PDFInfo
- Publication number
- CN106189204B CN106189204B CN201610656001.0A CN201610656001A CN106189204B CN 106189204 B CN106189204 B CN 106189204B CN 201610656001 A CN201610656001 A CN 201610656001A CN 106189204 B CN106189204 B CN 106189204B
- Authority
- CN
- China
- Prior art keywords
- parts
- film capacitor
- thin
- waterproof
- encapsulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title claims abstract description 34
- 239000003990 capacitor Substances 0.000 title claims abstract description 31
- 239000010409 thin film Substances 0.000 title claims abstract description 21
- 238000009413 insulation Methods 0.000 title claims abstract description 18
- 239000010410 layer Substances 0.000 claims abstract description 26
- 239000012790 adhesive layer Substances 0.000 claims abstract description 22
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 239000000839 emulsion Substances 0.000 claims abstract description 16
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 16
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004793 Polystyrene Substances 0.000 claims abstract description 14
- 229920002223 polystyrene Polymers 0.000 claims abstract description 14
- 229920002635 polyurethane Polymers 0.000 claims abstract description 14
- 239000004814 polyurethane Substances 0.000 claims abstract description 14
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 12
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 12
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 12
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 12
- 239000003063 flame retardant Substances 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000003365 glass fiber Substances 0.000 claims abstract description 8
- -1 polyethylene Polymers 0.000 claims abstract description 8
- 239000004952 Polyamide Substances 0.000 claims abstract description 7
- 239000004698 Polyethylene Substances 0.000 claims abstract description 7
- 239000006004 Quartz sand Substances 0.000 claims abstract description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 7
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 7
- 229920002647 polyamide Polymers 0.000 claims abstract description 7
- 229920000573 polyethylene Polymers 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 12
- 239000005995 Aluminium silicate Substances 0.000 claims description 9
- 235000012211 aluminium silicate Nutrition 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 9
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 229920002261 Corn starch Polymers 0.000 claims description 6
- 241000195493 Cryptophyta Species 0.000 claims description 6
- 229920002907 Guar gum Polymers 0.000 claims description 6
- 239000004927 clay Substances 0.000 claims description 6
- 239000008120 corn starch Substances 0.000 claims description 6
- 229940099112 cornstarch Drugs 0.000 claims description 6
- 229960002154 guar gum Drugs 0.000 claims description 6
- 235000010417 guar gum Nutrition 0.000 claims description 6
- 239000000665 guar gum Substances 0.000 claims description 6
- 239000002689 soil Substances 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 6
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 5
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000009719 polyimide resin Substances 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 150000004291 polyenes Chemical class 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- OPLCSTZDXXUYDU-UHFFFAOYSA-N 2,4-dimethyl-6-tert-butylphenol Chemical compound CC1=CC(C)=C(O)C(C(C)(C)C)=C1 OPLCSTZDXXUYDU-UHFFFAOYSA-N 0.000 claims description 3
- XRCRJFOGPCJKPF-UHFFFAOYSA-N 2-butylbenzene-1,4-diol Chemical compound CCCCC1=CC(O)=CC=C1O XRCRJFOGPCJKPF-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000005038 ethylene vinyl acetate Substances 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims 1
- 229920001038 ethylene copolymer Polymers 0.000 abstract description 6
- ACOGMWBDRJJKNB-UHFFFAOYSA-N acetic acid;ethene Chemical group C=C.CC(O)=O ACOGMWBDRJJKNB-UHFFFAOYSA-N 0.000 abstract description 2
- 229920000083 poly(allylamine) Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 1
- 239000005977 Ethylene Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 11
- 239000011104 metalized film Substances 0.000 description 8
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 4
- 239000000347 magnesium hydroxide Substances 0.000 description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- FSWDLYNGJBGFJH-UHFFFAOYSA-N n,n'-di-2-butyl-1,4-phenylenediamine Chemical compound CCC(C)NC1=CC=C(NC(C)CC)C=C1 FSWDLYNGJBGFJH-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 2
- 235000019281 tert-butylhydroquinone Nutrition 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- UPZFLZYXYGBAPL-UHFFFAOYSA-N 2-ethyl-2-methyl-1,3-dioxolane Chemical compound CCC1(C)OCCO1 UPZFLZYXYGBAPL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
本发明公开一种薄膜电容的防水绝缘封装材料,包括防水绝缘层和粘合层,防水绝缘层包括一下重量份数的原料制成:石英砂5‑9份、氧化铝24‑30份、聚烯丙胺树脂24‑30份、氧化镁5‑10份、纳米级二氧化硅3‑9份、酸酐20‑26份、阻燃剂10‑15份、抗氧剂4‑8份;环氧树脂8‑12份、聚酰胺树脂18‑22份、玻璃纤维30‑36份、纳米氧化锌5‑8份、氮化硅5‑9份、聚乙烯5‑9份、抗紫外线剂10‑15份、粘合剂10‑16份;粘合层包括:聚氨酯7‑10份、聚苯乙烯2‑4份、聚丙烯酸酯7‑10份、乙烯—醋酸乙烯共聚物3‑6份以及乳化硅油4‑7份。本发明具有耐高低温冲击、高阻燃、防水、绝缘的优点。
Description
技术领域
本发明涉及封装材料领域,更具体地说,本发明涉及一种薄膜电容的防水绝缘封装材料。
背景技术
薄膜电容器是以金属箔当电极,将其和聚乙酯、聚丙烯、聚苯乙烯或聚碳酸酯等塑料薄膜,从两端重叠后,卷绕成圆筒状的构造之电容器。塑料薄膜上以真空蒸镀上一层很薄的金属做为电极而制成的薄膜电容称之为金属化薄膜电容。金属化薄膜电容可以省去电极箔的厚度,缩小电容器单位容量的体积,具有形状小、容量大的优点,在电气领域得到广泛的应用。
封装材料对金属化薄膜电容在高低温冲击、潮湿等各个应用环境中起保护作用,使金属化薄膜电容性能稳定、寿命延长。所以,金属化薄膜电容需要耐高低温冲击、高阻燃的防水绝缘性材料进行封装。
发明内容
针对上述技术中存在的不足之处,本发明提供一种金属化薄膜电容的封装材料,具有耐高低温冲击、高阻燃、防水、绝缘的优点。
为了实现根据本发明的这些目的和其它优点,本发明通过以下技术方案实现:
本发明所述的薄膜电容的防水绝缘封装材料,包括防水绝缘层和粘合层,所述防水绝缘层通过所述粘合层热压粘合形成封装层包裹在薄膜电容外侧;其中,
所述防水绝缘层包括以下重量份数的原料制成:石英砂5-9份、氧化铝24-30份、聚烯丙胺树脂24-30份、氧化镁5-10份、纳米级二氧化硅3-9份、酸酐20-26份、阻燃剂10-15份、抗氧剂4-8份、苏州土3-6份、环氧树脂8-12份、聚酰胺树脂18-22份、瓜尔胶2-4份、玻璃纤维30-36份、纳米氧化锌5-8份、玉米淀粉2-4份、氮化硅5-9份、海藻泥2-5份、聚乙烯5-9份、抗紫外线剂10-15份、粘合剂10-16份;
所述粘合层包括:聚氨酯7-10份、聚苯乙烯2-4份、聚丙烯酸酯7-10份、乙烯—醋酸乙烯共聚物3-6份以及乳化硅油4-7份。
优选的是,所述抗紫外线剂包括陶瓷粉、煅烧高岭土、氧化锌中的至少一种。
优选的是,所述抗紫外线剂包括重量份数分别是陶瓷粉10-15份、煅烧高岭土3-7份、氧化锌3-8份的材料。
优选的是,所述粘合剂包括重量份数分别是聚氨酯10-15份、聚苯乙烯4-8份、聚丙烯酸酯10-13份以及乳化硅油4-7份的材料。
优选的是,所述防水绝缘层的重量与所述粘合层的重量之比为5:1。
优选的是,所述阻燃剂是氢氧化镁、氢氧化铝中的至少一种。
优选的是,所述抗氧剂包括特丁基对苯二酚、N,N'-二仲丁基对苯二胺、2,4-二甲基-6-叔丁基苯酚中的至少一种。本发明至少包括以下有益效果:
本发明提供的薄膜电容的防水绝缘封装材料中包括聚氨酯,具有良好的防水效果;环氧树脂中加入粘合剂在加温固化后低温条件下不易开裂,电性能稳定、耐高低温;粘合剂和粘合层的聚氨酯中加入乳化硅油,降低固化时反应产生的气泡,固化均匀、耐力好;加入抗紫外线剂,具有抗老化的作用。
本发明的其它优点、目标和特征将部分通过下面的说明体现,部分还将通过对本发明的研究和实践而为本领域的技术人员所理解。
具体实施方式
应当理解,本文所使用的诸如“具有”、“包含”以及“包括”术语并不配出一个或多个其它元件或其组合的存在或添加。
本发明提供一种薄膜电容的防水绝缘封装材料,包括防水绝缘层和粘合层,所述防水绝缘层通过所述粘合层热压粘合形成封装层包裹在薄膜电容外侧;其中,所述防水绝缘层包括以下重量份数的原料制成:石英砂5-9份、氧化铝24-30份、聚烯丙胺树脂24-30份、氧化镁5-10份、纳米级二氧化硅3-9份、酸酐20-26份、阻燃剂10-15份、抗氧剂4-8份、苏州土3-6份、环氧树脂8-12份、聚酰胺树脂18-22份、瓜尔胶2-4份、玻璃纤维30-36份、纳米氧化锌5-8份、玉米淀粉2-4份、氮化硅5-9份、海藻泥2-5份、聚乙烯5-9份、抗紫外线剂10-15份、粘合剂10-16份;所述粘合层包括:聚氨酯7-10份、聚苯乙烯2-4份、聚丙烯酸酯7-10份、乙烯—醋酸乙烯共聚物3-6份以及乳化硅油4-7份。酸酐是邻苯二甲酸酐、顺丁烯二酸酐、均苯四甲酸酐、四氢苯酐、偏苯三甲酸酐中的至少一种。所述抗紫外线剂包括陶瓷粉、煅烧高岭土、氧化锌中的至少一种。所述抗紫外线剂包括重量份数分别是陶瓷粉10-15份、煅烧高岭土3-7份、氧化锌3-8份的材料。所述粘合剂包括重量份数分别是聚氨酯10-15份、聚苯乙烯4-8份、聚丙烯酸酯10-13份以及乳化硅油4-7份的材料。所述防水绝缘层的重量与所述粘合层的重量之比为5:1。所述阻燃剂是氢氧化镁、氢氧化铝中的至少一种。所述抗氧剂包括特丁基对苯二酚、N,N'-二仲丁基对苯二胺、2,4-二甲基-6-叔丁基苯酚中的至少一种。
本发明提供的薄膜电容的防水封装材料在各组分材料的协同作用下,绝缘电阻为6.2-7.5×107Ω,拉伸强度135-146MPA,氧指数60-68%,具有高低温冲击、高阻燃、防水、绝缘的优点。
实施例1
所述防水绝缘层包括以下重量份数的原料制成:石英砂5份、氧化铝24份、聚烯丙胺树脂24份、氧化镁5份、纳米级二氧化硅3份、酸酐20份、阻燃剂10份、抗氧剂4份、苏州土3份、环氧树脂8份、聚酰胺树脂18份、瓜尔胶2份、玻璃纤维30份、纳米氧化锌5份、玉米淀粉2份、氮化硅5份、海藻泥2份、聚乙烯5份、抗紫外线剂10份、粘合剂10份;所述粘合层包括:聚氨酯7份、聚苯乙烯2份、聚丙烯酸酯7份、乙烯—醋酸乙烯共聚物3份以及乳化硅油4份。酸酐是邻苯二甲酸酐。所述抗紫外线剂包括重量份数分别是陶瓷粉10份、煅烧高岭土3份、氧化锌3份的材料。所述粘合剂包括重量份数分别是聚氨酯10份、聚苯乙烯4份、聚丙烯酸酯10份以及乳化硅油4份的材料。所述防水绝缘层的重量与所述粘合层的重量之比为5:1。所述阻燃剂是氢氧化镁。所述抗氧剂包括特丁基对苯二酚。
实施例2
所述防水绝缘层包括以下重量份数的原料制成:石英砂9份、氧化铝30份、聚烯丙胺树脂30份、氧化镁10份、纳米级二氧化硅9份、酸酐26份、阻燃剂15份、抗氧剂8份、苏州土6份、环氧树脂12份、聚酰胺树脂22份、瓜尔胶4份、玻璃纤维36份、纳米氧化锌8份、玉米淀粉4份、氮化硅9份、海藻泥5份、聚乙烯9份、抗紫外线剂15份、粘合剂10-16份;所述粘合层包括:聚氨酯10份、聚苯乙烯4份、聚丙烯酸酯10份、乙烯—醋酸乙烯共聚物6份以及乳化硅油7份。酸酐是偏苯三甲酸酐。所述抗紫外线剂包括重量份数分别是陶瓷粉15份、煅烧高岭土7份、氧化锌8份的材料。所述粘合剂包括重量份数分别是聚氨酯15份、聚苯乙烯8份、聚丙烯酸酯13份以及乳化硅油7份的材料。所述防水绝缘层的重量与所述粘合层的重量之比为5:1。所述阻燃剂是氢氧化铝。所述抗氧剂包括2,4-二甲基-6-叔丁基苯酚。
实施例3
所述防水绝缘层包括以下重量份数的原料制成:石英砂7份、氧化铝25份、聚烯丙胺树脂25份、氧化镁8份、纳米级二氧化硅6份、酸酐22份、阻燃剂12份、抗氧剂5份、苏州土4份、环氧树脂9份、聚酰胺树脂20份、瓜尔胶3份、玻璃纤维35份、纳米氧化锌7份、玉米淀粉3份、氮化硅6份、海藻泥4份、聚乙烯6份、抗紫外线剂14份、粘合剂13份;所述粘合层包括:聚氨酯8份、聚苯乙烯3份、聚丙烯酸酯8份、乙烯—醋酸乙烯共聚物4份以及乳化硅油5份。酸酐是均苯四甲酸酐。所述抗紫外线剂包括重量份数分别是陶瓷粉11份、煅烧高岭土4份、氧化锌5份的材料。所述粘合剂包括重量份数分别是聚氨酯13份、聚苯乙烯5份、聚丙烯酸酯11份以及乳化硅油5份的材料。所述防水绝缘层的重量与所述粘合层的重量之比为5:1。所述阻燃剂是氢氧化镁和氢氧化铝。所述抗氧剂包括N,N'-二仲丁基对苯二胺。
对比例1
在实施例1的基础上,与实施例1不同的是,第二层不包括玻璃纤维和粘合剂,其余组分和参数均相同。
对比例2
在对比例1的基础上,与对比例1不同的是,粘合层和粘合剂不包括成分乳化硅油,其余组分和参数均相同。
对比例3
在对比例1的基础上,与对比例1不同的是,防水绝缘层不包括抗紫外线剂,其余组分和参数均相同。
实施例1、实施例2、实施例3、对比例1、对比例2以及对比例3中,金属化薄膜电容的封装材料的各种参数数值如表1所示。
表1薄膜电容的防水封装材料的各种参数数值
根据表1,各实施例分别和对比例相比可以看出,环氧树脂中加入第二粘合剂在加温固化后低温条件下不易开裂,电性能稳定、耐高低温。聚氨酯中加入乳化硅油,降低固化时反应产生的气泡,固化均匀、耐力好。本发明提供的金属化薄膜电容的封装材料,绝缘电阻为6.2-7.5×107Ω,拉伸强度135-146MPA,氧指数60-68%,具有高低温冲击、高阻燃、防水、绝缘的优点。
尽管本发明的实施方案已公开如上,但其并不仅仅限于说明书和实施方式中所列运用。它完全可以被适用于各种适合本发明的领域。对于熟悉本领域的人员而言可容易地实现另外的修改。因此在不背离权利要求及等同范围所限定的一般概念下,本发明并不限于特定的细节和这里示出与描述的图例。
Claims (7)
1.一种薄膜电容的防水绝缘封装材料,其特征在于,包括防水绝缘层和粘合层,所述防水绝缘层通过所述粘合层热压粘合形成封装层包裹在薄膜电容外侧;其中,
所述防水绝缘层包括以下重量份数的原料制成:石英砂5-9份、氧化铝24-30份、聚烯丙胺树脂24-30份、氧化镁5-10份、纳米级二氧化硅3-9份、酸酐20-26份、阻燃剂10-15份、抗氧剂4-8份、苏州土3-6份、环氧树脂8-12份、聚酰胺树脂18-22份、瓜尔胶2-4份、玻璃纤维30-36份、纳米氧化锌5-8份、玉米淀粉2-4份、氮化硅5-9份、海藻泥2-5份、聚乙烯5-9份、抗紫外线剂10-15份、粘合剂10-16份;
所述粘合层包括:聚氨酯7-10份、聚苯乙烯2-4份、聚丙烯酸酯7-10份、乙烯—醋酸乙烯共聚物3-6份以及乳化硅油4-7份。
2.如权利要求1所述的薄膜电容的防水绝缘封装材料,其特征在于,所述抗紫外线剂包括陶瓷粉、煅烧高岭土、氧化锌中的至少一种。
3.如权利要求2所述的薄膜电容的防水绝缘封装材料,其特征在于,所述抗紫外线剂包括重量份数分别是陶瓷粉10-15份、煅烧高岭土3-7份、氧化锌3-8份的材料。
4.如权利要求3所述的薄膜电容的防水绝缘封装材料,其特征在于,所述粘合剂包括重量份数分别是聚氨酯10-15份、聚苯乙烯4-8份、聚丙烯酸酯10-13份以及乳化硅油4-7份的材料。
5.如权利要求1-4中任一项所述的薄膜电容的防水绝缘封装材料,其特征在于,所述防水绝缘层的重量与所述粘合层的重量之比为5:1。
6.如权利要求5所述的薄膜电容的防水绝缘封装材料,其特征在于,所述阻燃剂是氢氧化镁、氢氧化铝中的至少一种。
7.如权利要求6所述的薄膜电容的防水绝缘封装材料,其特征在于,所述抗氧剂包括特丁基对苯二酚、N,N'-二仲丁基对苯二胺、2,4-二甲基-6-叔丁基苯酚中的至少一种。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610656001.0A CN106189204B (zh) | 2016-08-11 | 2016-08-11 | 薄膜电容的防水绝缘封装材料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610656001.0A CN106189204B (zh) | 2016-08-11 | 2016-08-11 | 薄膜电容的防水绝缘封装材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106189204A CN106189204A (zh) | 2016-12-07 |
CN106189204B true CN106189204B (zh) | 2019-05-28 |
Family
ID=57515069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610656001.0A Active CN106189204B (zh) | 2016-08-11 | 2016-08-11 | 薄膜电容的防水绝缘封装材料 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106189204B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107629375B (zh) * | 2017-10-13 | 2020-11-20 | 绍兴文理学院 | 一种耐候型防水建筑材料的制备方法 |
CN112289587B (zh) * | 2020-12-30 | 2021-05-18 | 宁波市江北九方和荣电气有限公司 | 一种金属化薄膜电容器的加工方法及金属化薄膜电容器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104130547A (zh) * | 2014-07-18 | 2014-11-05 | 无锡东润电子材料科技有限公司 | 一种大容量薄膜电容的绝缘封装材料 |
CN104592704A (zh) * | 2015-02-06 | 2015-05-06 | 苏州欢颜电气有限公司 | 电气工程用防潮绝缘材料 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014231536A (ja) * | 2013-05-28 | 2014-12-11 | 株式会社Adeka | 樹脂組成物及び接着剤 |
-
2016
- 2016-08-11 CN CN201610656001.0A patent/CN106189204B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104130547A (zh) * | 2014-07-18 | 2014-11-05 | 无锡东润电子材料科技有限公司 | 一种大容量薄膜电容的绝缘封装材料 |
CN104592704A (zh) * | 2015-02-06 | 2015-05-06 | 苏州欢颜电气有限公司 | 电气工程用防潮绝缘材料 |
Also Published As
Publication number | Publication date |
---|---|
CN106189204A (zh) | 2016-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3086381B1 (en) | Thin-film encapsulation structure for oled, oled device and display device | |
CN106189204B (zh) | 薄膜电容的防水绝缘封装材料 | |
EP1634697B1 (en) | Transparent gas barrier multilayer film, electroluminescent light-emitting device using same, electroluminescent display, and electrophoretic display panel | |
KR101773230B1 (ko) | 진공단열재용 외피재 및 이를 포함하는 진공단열재 | |
KR101410083B1 (ko) | 태양 전지 이면 보호막용 적층 폴리에스테르 필름 | |
WO2007038103A3 (en) | Display cell structure and electrode protecting layer compositions | |
US9159952B2 (en) | Flexible packaging substrate and fabricating method thereof and packaging method for OLED using the same | |
MX2012013326A (es) | Cinta aislante de alta temperatura y alambre o cable forrado con la misma. | |
WO2012061091A3 (en) | Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package | |
WO2008052762A3 (de) | Halbleiteranordnung und verfahren zur herstellung einer halbleiteranordnung | |
TW504711B (en) | Resistor with non-linear voltage characteristic and the manufacturing method of the same | |
CN104393074B (zh) | 一种太阳电池组件用绝缘膜及其制备方法 | |
US20230307153A1 (en) | Formation and modifications of ceramic nanowires and their use in functional materials | |
CN103794668B (zh) | Ptfe双面涂层背板及其制备方法 | |
CN209328592U (zh) | 一种高柔韧性抗折损环保电缆 | |
CN106280177A (zh) | 金属化薄膜电容的封装材料 | |
JP2010201630A (ja) | 乾燥剤含有多層フィルム及び該フィルムを備えた電子デバイス | |
WO2016089101A1 (ko) | 진공단열재용 외피재 및 이를 포함하는 진공단열재 | |
CN202307379U (zh) | 用于电机、变压器的绝缘复合膜 | |
CN106167617B (zh) | 薄膜电容封装材料的制造方法 | |
CN107346687B (zh) | 复合空心绝缘子及其制备方法 | |
CN106380184A (zh) | 一种碳膜电阻基片的配方 | |
CN109560043A (zh) | 层叠柔性微电子系统级封装方法及封装结构 | |
CN107325396A (zh) | 舰船用防潮电缆绝缘复合材料及其制备方法 | |
CN203102906U (zh) | 一种抗紫外线型架空绝缘电缆 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |