CN106280177A - 金属化薄膜电容的封装材料 - Google Patents

金属化薄膜电容的封装材料 Download PDF

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CN106280177A
CN106280177A CN201610656227.0A CN201610656227A CN106280177A CN 106280177 A CN106280177 A CN 106280177A CN 201610656227 A CN201610656227 A CN 201610656227A CN 106280177 A CN106280177 A CN 106280177A
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李彦
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SUZHOU KECHUANG ELECTRONICS MATERIAL CO Ltd
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Abstract

本发明公开一种金属化薄膜电容的封装材料，包括第一层、第二层以及第一粘合剂：第一层包括以下重量份数的原料制成：石英砂5‑9份、氧化铝24‑30份、聚烯丙胺树脂24‑30份、氧化镁5‑10份、纳米级二氧化硅3‑9份、酸酐20‑26份、阻燃剂10‑15份、抗氧剂4‑8份；第二层包括以下重量份数的原料制成：环氧树脂8‑12份、聚酰胺树脂18‑22份、玻璃纤维30‑36份、纳米氧化锌5‑8份、氮化硅5‑9份、聚乙烯5‑9份、第二粘合剂10‑16份；第一粘合剂和第二粘合剂分别包括：聚氨酯、聚苯乙烯、聚丙烯酸酯、乙烯—醋酸乙烯共聚物以及乳化硅油。本发明具有耐高低温冲击、高阻燃、绝缘的优点。

Description

金属化薄膜电容的封装材料
技术领域
本发明涉及封装材料领域，更具体地说，本发明涉及一种金属化薄膜电容的封装材料。
背景技术
薄膜电容器是以金属箔当电极，将其和聚乙酯、聚丙烯、聚苯乙烯或聚碳酸酯等塑料薄膜，从两端重叠后，卷绕成圆筒状的构造之电容器。塑料薄膜上以真空蒸镀上一层很薄的金属做为电极而制成的薄膜电容称之为金属化薄膜电容。金属化薄膜电容可以省去电极箔的厚度，缩小电容器单位容量的体积，具有形状小、容量大的优点，在电气领域得到广泛的应用。
封装材料对金属化薄膜电容在高低温冲击、潮湿等各个应用环境中起保护作用，使金属化薄膜电容性能稳定、寿命延长。所以，金属化薄膜电容需要耐高低温冲击、高阻燃的绝缘性材料进行封装。
发明内容
针对上述技术中存在的不足之处，本发明提供一种金属化薄膜电容的封装材料，具有耐高低温冲击、高阻燃、绝缘的优点。
为了实现根据本发明的这些目的和其它优点，本发明通过以下技术方案实现：
本发明所述的金属化薄膜电容的封装材料，包括第一层、第二层以及第一粘合剂：所述第一层和所述第二层通过所述第一粘合剂热压粘合形成封装层包裹在薄膜电容金属层外侧；其中，
所述第一层包括以下重量份数的原料制成：石英砂5-9份、氧化铝24-30份、聚烯丙胺树脂24-30份、氧化镁5-10份、纳米级二氧化硅3-9份、酸酐20-26份、阻燃剂10-15份、抗氧剂4-8份；
所述第二层包括以下重量份数的原料制成：环氧树脂8-12份、聚酰胺树脂18-22份、玻璃纤维30-36份、纳米氧化锌5-8份、氮化硅5-9份、聚乙烯5-9份、第二粘合剂10-16份；
所述第一粘合剂和所述第二粘合剂分别包括：聚氨酯、聚苯乙烯、聚丙烯酸酯、乙烯—醋酸乙烯共聚物以及乳化硅油。
优选的是，所述第一层、所述第二层以及所述第一粘合剂的重量比为5:10-12:1。
优选的是，所述第一粘合剂和所述第二粘合剂分别包括以下重量份数的原料：聚氨酯7-10份、聚苯乙烯2-4份、聚丙烯酸酯7-10份、乙烯—醋酸乙烯共聚物3-6份以及乳化硅油4-7份。
优选的是，所述酸酐是邻苯二甲酸酐、顺丁烯二酸酐、均苯四甲酸酐、四氢苯酐、偏苯三甲酸酐中的至少一种。
优选的是，所述阻燃剂是氢氧化镁、氢氧化铝中的至少一种。
优选的是，所述阻燃剂包括重量比依次是1:2-3的氢氧化镁和氢氧化铝。
优选的是，所述抗氧剂包括特丁基对苯二酚、N,N'-二仲丁基对苯二胺、2，4-二甲基-6-叔丁基苯酚中的至少一种。
本发明至少包括以下有益效果：
1)本发明提供的金属化薄膜电容的封装材料，绝缘电阻为5.4-6.3×107Ω，拉伸强度132-139MPA，平行层向击穿电压为40-48KV，氧指数62％-68％，具有良好的绝缘、耐高低温冲击、高阻燃性能。
2)环氧树脂中加入第二粘合剂在加温固化后低温条件下不易开裂，电性能稳定、耐高低温；
3)第一粘合剂和第二粘合剂的聚氨酯中加入乳化硅油，降低固化时反应产生的气泡，固化均匀、耐力好。
本发明的其它优点、目标和特征将部分通过下面的说明体现，部分还将通过对本发明的研究和实践而为本领域的技术人员所理解。
具体实施方式
应当理解，本文所使用的诸如“具有”、“包含”以及“包括”术语并不配出一个或多个其它元件或其组合的存在或添加。
本发明提供一种金属化薄膜电容的封装材料，其包括第一层、第二层以及第一粘合剂：所述第一层和所述第二层通过所述第一粘合剂热压粘合形成封装层包裹在薄膜电容金属层外侧。
其中，第一层、第二层以及第一粘合剂的重量比为5:10-12:1；第一层包括以下重量份数的原料制成：石英砂5-9份、氧化铝24-30份、聚烯丙胺树脂24-30份、氧化镁5-10份、纳米级二氧化硅3-9份、酸酐20-26份、阻燃剂10-15份、抗氧剂4-8份；第二层包括以下重量份数的原料制成：环氧树脂8-12份、聚酰胺树脂18-22份、玻璃纤维30-36份、纳米氧化锌5-8份、氮化硅5-9份、聚乙烯5-9份、第二粘合剂10-16份；第一粘合剂和第二粘合剂分别包括以下重量份数的原料：聚氨酯7-10份、聚苯乙烯2-4份、聚丙烯酸酯7-10份、乙烯—醋酸乙烯共聚物3-6份以及乳化硅油4-7份。酸酐是邻苯二甲酸酐、顺丁烯二酸酐、均苯四甲酸酐、四氢苯酐、偏苯三甲酸酐中的至少一种。阻燃剂是氢氧化镁、氢氧化铝中的至少一种。阻燃剂包括氢氧化镁和氢氧化铝时，氢氧化镁和氢氧化铝的重量比依次是1:2-3。抗氧剂包括特丁基对苯二酚、N,N'-二仲丁基对苯二胺、2，4-二甲基-6-叔丁基苯酚中的至少一种。
实施例1
第一层、第二层以及第一粘合剂的重量比为5:10:1。其中，第一层包括以下重量份数的原料制成：石英砂5份、氧化铝24份、聚烯丙胺树脂24份、氧化镁5份、纳米级二氧化硅3份、酸酐20份、阻燃剂10份、抗氧剂4份；第二层包括以下重量份数的原料制成：环氧树脂8份、聚酰胺树脂18份、玻璃纤维30份、纳米氧化锌5份、氮化硅5份、聚乙烯5份、第二粘合剂10份；第一粘合剂和第二粘合剂分别包括以下重量份数的原料：聚氨酯7份、聚苯乙烯2份、聚丙烯酸酯7份、乙烯—醋酸乙烯共聚物3份以及乳化硅油4份。酸酐是邻苯二甲酸酐。阻燃剂包括氢氧化镁和氢氧化铝，氢氧化镁和氢氧化铝的重量比是1:2。抗氧剂是特丁基对苯二酚。
本实施例提供的金属化薄膜电容的封装材料在各组分材料的协同作用下，绝缘电阻为5.4-6.3×107Ω，拉伸强度132-138MPA，平行层向击穿电压为40-48KV，氧指数62％-67％，具有良好的绝缘、耐高低温冲击、高阻燃性能。
实施例2
第一层、第二层以及第一粘合剂的重量比为5:11:1；第一层包括以下重量份数的原料制成：石英砂8份、氧化铝26份、聚烯丙胺树脂26份、氧化镁7份、纳米级二氧化硅5份、酸酐22份、阻燃剂12份、抗氧剂6份；第二层包括以下重量份数的原料制成：环氧树脂11份、聚酰胺树脂20份、玻璃纤维33份、纳米氧化锌7份、氮化硅7份、聚乙烯7份、第二粘合剂14份；第一粘合剂和第二粘合剂分别包括以下重量份数的原料：聚氨酯8份、聚苯乙烯3份、聚丙烯酸酯8份、乙烯—醋酸乙烯共聚物4份以及乳化硅油5份。酸酐是均苯四甲酸酐。阻燃剂包括氢氧化镁和氢氧化铝，氢氧化镁和氢氧化铝的重量比是1:3。抗氧剂是2，4-二甲基-6-叔丁基苯酚。
本实施例提供的金属化薄膜电容的封装材料在各组分材料的协同作用下，绝缘电阻为5.6-6.2×107Ω，拉伸强度134-139MPA，平行层向击穿电压为42-48KV，氧指数63％-68％。
实施例3
第一层、第二层以及第一粘合剂的重量比为5:12:1；第一层包括以下重量份数的原料制成：石英砂9份、氧化铝30份、聚烯丙胺树脂30份、氧化镁10份、纳米级二氧化硅9份、酸酐26份、阻燃剂15份、抗氧剂8份；第二层包括以下重量份数的原料制成：环氧树脂12份、聚酰胺树脂22份、玻璃纤维36份、纳米氧化锌8份、氮化硅9份、聚乙烯9份、第二粘合剂16份；第一粘合剂和第二粘合剂分别包括以下重量份数的原料：聚氨酯10份、聚苯乙烯4份、聚丙烯酸酯10份、乙烯—醋酸乙烯共聚物6份以及乳化硅油7份。酸酐是顺丁烯二酸酐。阻燃剂是氢氧化铝。抗氧剂是N,N'-二仲丁基对苯二胺。
本实施例提供的金属化薄膜电容的封装材料在各组分材料的协同作用下，绝缘电阻为5.5-6.2×107Ω，拉伸强度132-136MPA，平行层向击穿电压为40-46KV，氧指数64％-68％。
对比例1
在实施例1的基础上，与实施例1不同的是，第二层不包括玻璃纤维和第二粘合剂，其余组分和参数均相同。
对比例2
在对比例1的基础上，与对比例1不同的是，第一粘合剂不包括成分乳化硅油，其余组分和参数均相同。
实施例1、实施例2、实施例3、对比例1以及对比例2中，金属化薄膜电容的封装材料的各种参数数值如表1所示。
表1 金属化薄膜电容的封装材料的各种参数数值
根据表1，各实施例分别和对比例相比可以看出，环氧树脂中加入第二粘合剂在加温固化后低温条件下不易开裂，电性能稳定、耐高低温。聚氨酯中加入乳化硅油，降低固化时反应产生的气泡，固化均匀、耐力好。本发明提供的金属化薄膜电容的封装材料，绝缘电阻为5.4-6.3×107Ω，拉伸强度132-139MPA，平行层向击穿电压为40-48KV，氧指数62％-68％，具有良好的绝缘、耐高低温冲击、高阻燃性能。
尽管本发明的实施方案已公开如上，但其并不仅仅限于说明书和实施方式中所列运用。它完全可以被适用于各种适合本发明的领域。对于熟悉本领域的人员而言可容易地实现另外的修改。因此在不背离权利要求及等同范围所限定的一般概念下，本发明并不限于特定的细节和这里示出与描述的例子。

Claims (7)

1.一种金属化薄膜电容的封装材料，其特征在于，包括第一层、第二层以及第一粘合剂：所述第一层和所述第二层通过所述第一粘合剂热压粘合形成封装层包裹在薄膜电容金属层外侧；其中，
所述第一层包括以下重量份数的原料制成：石英砂5-9份、氧化铝24-30份、聚烯丙胺树脂24-30份、氧化镁5-10份、纳米级二氧化硅3-9份、酸酐20-26份、阻燃剂10-15份、抗氧剂4-8份；
所述第二层包括以下重量份数的原料制成：环氧树脂8-12份、聚酰胺树脂18-22份、玻璃纤维30-36份、纳米氧化锌5-8份、氮化硅5-9份、聚乙烯5-9份、第二粘合剂10-16份；
所述第一粘合剂和所述第二粘合剂分别包括：聚氨酯、聚苯乙烯、聚丙烯酸酯、乙烯—醋酸乙烯共聚物以及乳化硅油。
2.如权利要求1所述的金属化薄膜电容的封装材料，其特征在于，所述第一层、所述第二层以及所述第一粘合剂的重量比为5:10-12:1。
3.如权利要求1所述的金属化薄膜电容的封装材料，其特征在于，所述第一粘合剂和所述第二粘合剂分别包括以下重量份数的原料：聚氨酯7-10份、聚苯乙烯2-4份、聚丙烯酸酯7-10份、乙烯—醋酸乙烯共聚物3-6份以及乳化硅油4-7份。
4.如权利要求1所述的金属化薄膜电容的封装材料，其特征在于，所述酸酐是邻苯二甲酸酐、顺丁烯二酸酐、均苯四甲酸酐、四氢苯酐、偏苯三甲酸酐中的至少一种。
5.如权利要求1所述的金属化薄膜电容的封装材料，其特征在于，所述阻燃剂是氢氧化镁、氢氧化铝中的至少一种。
6.如权利要求1所述的金属化薄膜电容的封装材料，其特征在于，所述阻燃剂包括重量比依次是1:2-3的氢氧化镁和氢氧化铝。
7.如权利要求1所述的金属化薄膜电容的封装材料，其特征在于，所述抗氧剂包括特丁基对苯二酚、N,N'-二仲丁基对苯二胺、2，4-二甲基-6-叔丁基苯酚中的至少一种。
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