WO2008052762A3 - Halbleiteranordnung und verfahren zur herstellung einer halbleiteranordnung - Google Patents
Halbleiteranordnung und verfahren zur herstellung einer halbleiteranordnung Download PDFInfo
- Publication number
- WO2008052762A3 WO2008052762A3 PCT/EP2007/009454 EP2007009454W WO2008052762A3 WO 2008052762 A3 WO2008052762 A3 WO 2008052762A3 EP 2007009454 W EP2007009454 W EP 2007009454W WO 2008052762 A3 WO2008052762 A3 WO 2008052762A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor arrangement
- fabricating
- component layer
- substrate
- layer
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
- B81C2203/0735—Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Element Separation (AREA)
Abstract
Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung: mit einem Substrat (1), mit einer Bauelementeschicht (3) aus einem einkristallinem Halbleitermaterial, mit einer Isolatorschicht (2), die zwischen dem Substrat (1 ) und der Bauelementeschicht (3) ausgebildet ist und die Bauelementeschicht (3) vom Substrat (1) isoliert (SOI), mit einer Anzahl von Bauelementen (140), die in der Bauelementeschicht (3) ausgebildet sind, mit einer Grabenstruktur (13), die an die Isolatorschicht (2) angrenzt und die mit einer Füllung verfüllt ist um zumindest ein Bauelement (140) der Anzahl von Bauelementen (140) innerhalb der Bauelementeschicht (3) in lateraler Richtung zu isolieren, wobei die Füllung ein Dielektrikum aufweist, und mit einer freitragenden Mikrostruktur (150, 250, 350, 450, 550), die in einem durch die Grabenstruktur (13) festgelegten Strukturbereich (151, 251, 351, 451, 551 ) ausgebildet ist.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85575006P | 2006-11-01 | 2006-11-01 | |
US60/855,750 | 2006-11-01 | ||
DE102006051597A DE102006051597A1 (de) | 2006-11-02 | 2006-11-02 | Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008052762A2 WO2008052762A2 (de) | 2008-05-08 |
WO2008052762A3 true WO2008052762A3 (de) | 2008-07-17 |
Family
ID=39264755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/009454 WO2008052762A2 (de) | 2006-11-01 | 2007-10-31 | Halbleiteranordnung und verfahren zur herstellung einer halbleiteranordnung |
Country Status (3)
Country | Link |
---|---|
US (1) | US20080099860A1 (de) |
DE (1) | DE102006051597A1 (de) |
WO (1) | WO2008052762A2 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007329295A (ja) * | 2006-06-08 | 2007-12-20 | Hitachi Ltd | 半導体及びその製造方法 |
KR100829607B1 (ko) * | 2006-10-23 | 2008-05-14 | 삼성전자주식회사 | 전기적-기계적 비휘발성 메모리 장치 및 그 제조 방법 |
CN101548465B (zh) * | 2006-12-05 | 2012-09-05 | 明锐有限公司 | 用于mems振荡器的方法及设备 |
FR2932790B1 (fr) * | 2008-06-23 | 2010-08-20 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif electromecanique comprenant au moins un element actif. |
US7943410B2 (en) * | 2008-12-10 | 2011-05-17 | Stmicroelectronics, Inc. | Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming |
US8564103B2 (en) * | 2009-06-04 | 2013-10-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing an electronic device |
JP2012080165A (ja) * | 2010-09-30 | 2012-04-19 | Yamaha Corp | コンデンサマイクロホンアレイチップ |
US8779534B2 (en) * | 2010-11-04 | 2014-07-15 | Meggitt (Orange County), Inc. | Low-G MEMS acceleration switch |
DE102010062062B4 (de) | 2010-11-26 | 2022-07-28 | Robert Bosch Gmbh | Verfahren zum Herstellen von MEMS-Strukturen und MEMS-Struktur |
CN104541141B (zh) * | 2012-02-15 | 2017-08-18 | 罗伯特·博世有限公司 | 具有掺杂电极的压力传感器 |
US9181086B1 (en) | 2012-10-01 | 2015-11-10 | The Research Foundation For The State University Of New York | Hinged MEMS diaphragm and method of manufacture therof |
DE102013204475A1 (de) * | 2013-03-14 | 2014-09-18 | Robert Bosch Gmbh | Herstellungsverfahren für ein mikromechanisches Bauelement und entsprechendes mikromechanisches Bauelement |
DE102017216835B9 (de) * | 2017-09-22 | 2022-06-30 | Infineon Technologies Ag | MEMS-Bauelement und Herstellungsverfahren für ein MEMS-Bauelement |
CN108566174A (zh) * | 2018-04-17 | 2018-09-21 | 武汉大学 | 预设空腔防护墙型薄膜体声波谐振器及制备方法 |
US11596058B2 (en) * | 2019-03-08 | 2023-02-28 | Qorvo Us, Inc. | Fiducials for laminate structures |
US11575081B2 (en) * | 2019-11-26 | 2023-02-07 | Vanguard International Semiconductor Singapore Pte. Ltd. | MEMS structures and methods of forming MEMS structures |
CN113810009B (zh) * | 2021-09-22 | 2023-03-24 | 武汉敏声新技术有限公司 | 薄膜体声波谐振器及其制备方法、薄膜体声波滤波器 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19651269A1 (de) * | 1996-06-14 | 1997-12-18 | Mitsubishi Electric Corp | Halbleiterbeschleunigungssensor |
WO1998057529A1 (en) * | 1997-06-13 | 1998-12-17 | The Regents Of The University Of California | Microfabricated high aspect ratio device with electrical isolation and interconnections |
EP1695937A2 (de) * | 2005-02-25 | 2006-08-30 | Hitachi, Ltd. | Integriertes mikromechanisches System und dessen Herstellung |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6399516B1 (en) * | 1998-10-30 | 2002-06-04 | Massachusetts Institute Of Technology | Plasma etch techniques for fabricating silicon structures from a substrate |
DE102004043233B4 (de) * | 2003-09-10 | 2014-02-13 | Denso Corporation | Verfahren zum Herstellen eines beweglichen Abschnitts einer Halbleitervorrichtung |
JP4569322B2 (ja) * | 2005-03-02 | 2010-10-27 | 株式会社デンソー | 可動センサ素子 |
-
2006
- 2006-11-02 DE DE102006051597A patent/DE102006051597A1/de not_active Withdrawn
-
2007
- 2007-10-31 WO PCT/EP2007/009454 patent/WO2008052762A2/de active Application Filing
- 2007-11-01 US US11/934,073 patent/US20080099860A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19651269A1 (de) * | 1996-06-14 | 1997-12-18 | Mitsubishi Electric Corp | Halbleiterbeschleunigungssensor |
WO1998057529A1 (en) * | 1997-06-13 | 1998-12-17 | The Regents Of The University Of California | Microfabricated high aspect ratio device with electrical isolation and interconnections |
EP1695937A2 (de) * | 2005-02-25 | 2006-08-30 | Hitachi, Ltd. | Integriertes mikromechanisches System und dessen Herstellung |
Also Published As
Publication number | Publication date |
---|---|
WO2008052762A2 (de) | 2008-05-08 |
US20080099860A1 (en) | 2008-05-01 |
DE102006051597A1 (de) | 2008-05-08 |
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