CN106164805B - 用于封装高密度固态驱动器的系统和方法 - Google Patents
用于封装高密度固态驱动器的系统和方法 Download PDFInfo
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- CN106164805B CN106164805B CN201480073665.3A CN201480073665A CN106164805B CN 106164805 B CN106164805 B CN 106164805B CN 201480073665 A CN201480073665 A CN 201480073665A CN 106164805 B CN106164805 B CN 106164805B
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Classifications
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/86—Secure or tamper-resistant housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0204—Mounting supporting structures on the outside of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/2153—Using hardware token as a secondary aspect
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Computer Security & Cryptography (AREA)
- Software Systems (AREA)
- Storage Device Security (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/086,032 | 2013-11-21 | ||
US14/086,032 US9304557B2 (en) | 2013-11-21 | 2013-11-21 | Systems and methods for packaging high density SSDS |
PCT/US2014/066815 WO2015077563A1 (en) | 2013-11-21 | 2014-11-21 | Systems and methods for packaging high density ssds |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106164805A CN106164805A (zh) | 2016-11-23 |
CN106164805B true CN106164805B (zh) | 2019-11-26 |
Family
ID=53173078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480073665.3A Active CN106164805B (zh) | 2013-11-21 | 2014-11-21 | 用于封装高密度固态驱动器的系统和方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US9304557B2 (zh) |
EP (2) | EP3072027B1 (zh) |
JP (1) | JP2017505470A (zh) |
KR (1) | KR101833029B1 (zh) |
CN (1) | CN106164805B (zh) |
AU (2) | AU2014352866A1 (zh) |
CA (1) | CA2931301C (zh) |
WO (1) | WO2015077563A1 (zh) |
Families Citing this family (18)
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US9585290B2 (en) | 2013-07-15 | 2017-02-28 | Skyera, Llc | High capacity storage unit |
US9304557B2 (en) | 2013-11-21 | 2016-04-05 | Skyera, Llc | Systems and methods for packaging high density SSDS |
US9600038B2 (en) | 2013-11-21 | 2017-03-21 | Skyera, Llc | Systems and methods for securing high density SSDs |
DE102014114790B3 (de) * | 2014-10-13 | 2016-02-04 | Fujitsu Technology Solutions Intellectual Property Gmbh | Anordnung zur Festlegung wenigstens einer Erweiterungskarte und Serversystem |
US10320571B2 (en) * | 2016-09-23 | 2019-06-11 | Microsoft Technology Licensing, Llc | Techniques for authenticating devices using a trusted platform module device |
US11102294B2 (en) | 2017-06-09 | 2021-08-24 | Samsung Electronics Co., Ltd. | System and method for supporting energy and time efficient content distribution and delivery |
TWI627890B (zh) * | 2017-06-22 | 2018-06-21 | 技嘉科技股份有限公司 | 伺服器裝置 |
CN107336633A (zh) * | 2017-07-24 | 2017-11-10 | 友邦电气(平湖)股份有限公司 | 一种用于新能源电动汽车充电桩的充电模块 |
US10764064B2 (en) * | 2017-12-01 | 2020-09-01 | International Business Machines Corporation | Non-networked device performing certificate authority functions in support of remote AAA |
US10666439B2 (en) | 2017-12-01 | 2020-05-26 | International Business Machines Corporation | Hybrid security key with physical and logical attributes |
KR102075129B1 (ko) * | 2018-01-12 | 2020-02-10 | 둘툰(주) | 미니 피씨와 usb 메모리 기능이 구현된 모듈형 착탈식 공유장치 |
CN110139522B (zh) * | 2018-02-09 | 2021-05-25 | 纬联电子科技(中山)有限公司 | 防坠机构以及其电子装置 |
KR102385570B1 (ko) * | 2018-03-09 | 2022-04-12 | 삼성전자주식회사 | 솔리드 스테이트 드라이브 케이스 및 이를 이용한 솔리드 스테이트 드라이브 장치 |
KR102615769B1 (ko) * | 2018-05-18 | 2023-12-20 | 삼성전자주식회사 | 메모리 장치 |
CN108599332A (zh) * | 2018-06-27 | 2018-09-28 | 友邦电气(平湖)股份有限公司 | 便携式充电机的通风模块 |
USD964344S1 (en) * | 2018-11-21 | 2022-09-20 | Bitmain Technologies Inc. | Supercomputing device |
KR102621360B1 (ko) * | 2019-07-03 | 2024-01-08 | 한국전력공사 | 통신회선의 분선장치 |
CN112241272B (zh) * | 2019-07-17 | 2023-08-01 | 宇通客车股份有限公司 | 一种车载仪表及其升级方法、系统 |
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-
2013
- 2013-11-21 US US14/086,032 patent/US9304557B2/en active Active
-
2014
- 2014-11-21 AU AU2014352866A patent/AU2014352866A1/en not_active Abandoned
- 2014-11-21 KR KR1020167016126A patent/KR101833029B1/ko active IP Right Grant
- 2014-11-21 JP JP2016533184A patent/JP2017505470A/ja active Pending
- 2014-11-21 CN CN201480073665.3A patent/CN106164805B/zh active Active
- 2014-11-21 EP EP14864428.9A patent/EP3072027B1/en active Active
- 2014-11-21 WO PCT/US2014/066815 patent/WO2015077563A1/en active Application Filing
- 2014-11-21 EP EP18196787.8A patent/EP3454168B1/en active Active
- 2014-11-21 CA CA2931301A patent/CA2931301C/en active Active
-
2016
- 2016-03-31 US US15/087,386 patent/US9891675B2/en active Active
-
2017
- 2017-12-01 AU AU2017268659A patent/AU2017268659B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102292732A (zh) * | 2009-01-20 | 2011-12-21 | 微软公司 | 具有物理可分离的密钥存储设备的硬件加密存储设备 |
Also Published As
Publication number | Publication date |
---|---|
AU2017268659A1 (en) | 2017-12-21 |
JP2017505470A (ja) | 2017-02-16 |
EP3072027A4 (en) | 2017-07-19 |
US9891675B2 (en) | 2018-02-13 |
EP3454168A1 (en) | 2019-03-13 |
WO2015077563A1 (en) | 2015-05-28 |
AU2014352866A1 (en) | 2016-07-07 |
KR101833029B1 (ko) | 2018-02-27 |
US20150138716A1 (en) | 2015-05-21 |
CA2931301A1 (en) | 2015-05-28 |
EP3072027B1 (en) | 2019-02-27 |
CN106164805A (zh) | 2016-11-23 |
EP3454168B1 (en) | 2020-01-08 |
AU2017268659B2 (en) | 2019-07-11 |
KR20160110358A (ko) | 2016-09-21 |
US9304557B2 (en) | 2016-04-05 |
US20160209889A1 (en) | 2016-07-21 |
EP3072027A1 (en) | 2016-09-28 |
CA2931301C (en) | 2019-09-24 |
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Effective date of registration: 20180724 Address after: California, USA Applicant after: Western Digital Technologies, Inc. Address before: California, USA Applicant before: Skylar LLC |
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Effective date of registration: 20240919 Address after: Delaware, USA Patentee after: SANDISK TECHNOLOGIES Inc. Country or region after: U.S.A. Address before: California, USA Patentee before: Western Digital Technologies, Inc. Country or region before: U.S.A. |