CN106163122A - A kind of simple and convenient makes the method for circuit board - Google Patents

A kind of simple and convenient makes the method for circuit board Download PDF

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Publication number
CN106163122A
CN106163122A CN201610585915.2A CN201610585915A CN106163122A CN 106163122 A CN106163122 A CN 106163122A CN 201610585915 A CN201610585915 A CN 201610585915A CN 106163122 A CN106163122 A CN 106163122A
Authority
CN
China
Prior art keywords
circuit board
printed
paper
convenient
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610585915.2A
Other languages
Chinese (zh)
Inventor
丁云飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FOREWIN FPC (SUZHOU) Co Ltd
Original Assignee
FOREWIN FPC (SUZHOU) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FOREWIN FPC (SUZHOU) Co Ltd filed Critical FOREWIN FPC (SUZHOU) Co Ltd
Priority to CN201610585915.2A priority Critical patent/CN106163122A/en
Publication of CN106163122A publication Critical patent/CN106163122A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0531Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention discloses a kind of method that simple and convenient makes circuit board, including step be: the shiny surface face of paper to be printed is printed mutually personnel, and puts in printing instrument, drawn circuit board is printed, obtains the circuit board of some printings;The circuit board of printing is carried out cutting, and is attached on copper clad plate carry out thermal transfer by the face being printed on the paper of circuit board, the circuit board after being transferred;Circuit board after described transfer is corroded, is inserted into electronic component, carry out process and obtain circuit board.By the way, the simple and convenient of the present invention makes the method for circuit board, and this manufacture method is simple to operate, it is possible to grasp manufacture method easily, it is not necessary to puts into substantial amounts of man power and material and learns, it is possible to large-scale popularization and application.

Description

A kind of simple and convenient makes the method for circuit board
Technical field
The present invention relates to electronics field, particularly relate to a kind of method that simple and convenient makes circuit board.
Background technology
Circuit board, it is possible to be referred to as printed circuit board (PCB), is called for short printed board, is one of the vitals of electronics industry.Circuit board Application quite varied, it provides the various electronic devices and components such as integrated circuit to fix the mechanical support of assembling, realize integrated circuit Etc. the electrical connection between various electronic devices and components or the electrical characteristic required by electric insulation, offer, such as characteristic impedance etc..Simultaneously There is provided welding resistance figure for automatic soldering, for components and parts plug-in mounting, check, offer is provided identifies character and figure.Existing circuit board Manufacturing process is extremely complex, it is not easy to operate, and needs substantial amounts of manpower to complete.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of method that simple and convenient makes circuit board, the most skilled palm Hold manufacture method.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide a kind of simple and convenient to make electricity The method of road plate, including step be: the shiny surface face of paper to be printed is printed mutually personnel, and puts in printing instrument, will paint The circuit board made prints, and obtains the circuit board of some printings;The circuit board of printing is carried out cutting, and circuit will be printed on The face of the paper of plate is attached on copper clad plate carry out thermal transfer, the circuit board after being transferred;Circuit board after described transfer is carried out Corrosion, is inserted into electronic component, carries out process and obtain circuit board.
In a preferred embodiment of the present invention, described paper to be printed is transfer paper.
In a preferred embodiment of the present invention, every paper to be printed includes two to four circuit boards, at every Good circuit board makes to select printing effect on paper to be printed.
In a preferred embodiment of the present invention, temperature during described thermal transfer is 180-240 DEG C.
The invention has the beneficial effects as follows: the simple and convenient of the present invention makes the method for circuit board, the operation letter of this manufacture method Single, it is possible to grasp manufacture method easily, it is not necessary to put into substantial amounts of man power and material and learn, it is possible to large-scale Popularization and application.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection Enclose.
Embodiment one:
A kind of method providing simple and convenient to make circuit board, including step be:
(1) the shiny surface face of transfer paper is printed mutually personnel, and put in printing instrument, drawn circuit board is printed Come, obtain the circuit board of some printings, every paper to be printed includes two circuit boards, every paper to be printed selects The circuit board that printing effect is good makes;
(2) circuit board of printing is carried out cutting, and be attached to the face being printed on the transfer paper of circuit board on copper clad plate carry out heat turn Print, temperature during thermal transfer is 180 DEG C, the circuit board after being transferred;
(3) circuit board after described transfer is corroded, be inserted into electronic component, carry out process and obtain circuit board.
Embodiment two:
A kind of method providing simple and convenient to make circuit board, including step be:
(1) the shiny surface face of transfer paper is printed mutually personnel, and put in printing instrument, drawn circuit board is printed Come, obtain the circuit board of some printings, every paper to be printed includes three circuit boards, every paper to be printed selects The circuit board that printing effect is good makes;
(2) circuit board of printing is carried out cutting, and be attached to the face being printed on the transfer paper of circuit board on copper clad plate carry out heat turn Print, temperature during thermal transfer is 200 DEG C, the circuit board after being transferred;
(3) circuit board after described transfer is corroded, be inserted into electronic component, carry out process and obtain circuit board.
Embodiment three:
A kind of method providing simple and convenient to make circuit board, including step be:
(1) the shiny surface face of transfer paper is printed mutually personnel, and put in printing instrument, drawn circuit board is printed Come, obtain the circuit board of some printings, every paper to be printed includes four circuit boards, every paper to be printed selects The circuit board that printing effect is good makes;
(2) circuit board of printing is carried out cutting, and be attached to the face being printed on the transfer paper of circuit board on copper clad plate carry out heat turn Print, temperature during thermal transfer is 240 DEG C, the circuit board after being transferred;
(3) circuit board after described transfer is corroded, be inserted into electronic component, carry out process and obtain circuit board.
The invention has the beneficial effects as follows:
One, the method for described simple and convenient making circuit board is simple to operate, it is possible to grasp manufacture method easily;
Two, described simple and convenient makes the method for circuit board and need not put into substantial amounts of man power and material and learn, it is possible to big The popularization and application of scale.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck Territory, is the most in like manner included in the scope of patent protection of the present invention.

Claims (4)

1. the method that a simple and convenient makes circuit board, it is characterised in that include that step is: by the shiny surface of paper to be printed Face prints personnel mutually, and puts in printing instrument, is printed by drawn circuit board, obtains the circuit board of some printings; The circuit board of printing is carried out cutting, and is attached on copper clad plate carry out thermal transfer by the face being printed on the paper of circuit board, transferred After circuit board;Circuit board after described transfer is corroded, is inserted into electronic component, carry out process and obtain circuit board.
Simple and convenient the most according to claim 1 makes the method for circuit board, it is characterised in that described paper to be printed is Transfer paper.
Simple and convenient the most according to claim 1 makes the method for circuit board, it is characterised in that on every paper to be printed Including two to four circuit boards, good circuit board makes to select printing effect on every paper to be printed.
Simple and convenient the most according to claim 1 makes the method for circuit board, it is characterised in that temperature during described thermal transfer Degree is for 180-240 DEG C.
CN201610585915.2A 2016-07-25 2016-07-25 A kind of simple and convenient makes the method for circuit board Pending CN106163122A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610585915.2A CN106163122A (en) 2016-07-25 2016-07-25 A kind of simple and convenient makes the method for circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610585915.2A CN106163122A (en) 2016-07-25 2016-07-25 A kind of simple and convenient makes the method for circuit board

Publications (1)

Publication Number Publication Date
CN106163122A true CN106163122A (en) 2016-11-23

Family

ID=58060259

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610585915.2A Pending CN106163122A (en) 2016-07-25 2016-07-25 A kind of simple and convenient makes the method for circuit board

Country Status (1)

Country Link
CN (1) CN106163122A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110225668A (en) * 2019-06-14 2019-09-10 大连亚太电子有限公司 A kind of route transfer method based on circuit board making

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270996A (en) * 2001-03-13 2002-09-20 Fuji Photo Film Co Ltd Manufacturing method for printed circuit board
CN104900642A (en) * 2015-03-26 2015-09-09 苏州市德莱尔建材科技有限公司 MPPO board for integrated circuit and manufacturing method thereof
CN105704935A (en) * 2016-03-04 2016-06-22 广德英菲特电子有限公司 PCB production and detection method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270996A (en) * 2001-03-13 2002-09-20 Fuji Photo Film Co Ltd Manufacturing method for printed circuit board
CN104900642A (en) * 2015-03-26 2015-09-09 苏州市德莱尔建材科技有限公司 MPPO board for integrated circuit and manufacturing method thereof
CN105704935A (en) * 2016-03-04 2016-06-22 广德英菲特电子有限公司 PCB production and detection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110225668A (en) * 2019-06-14 2019-09-10 大连亚太电子有限公司 A kind of route transfer method based on circuit board making

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20161123

RJ01 Rejection of invention patent application after publication