CN208971869U - It is a kind of to cross reflow soldering tool - Google Patents
It is a kind of to cross reflow soldering tool Download PDFInfo
- Publication number
- CN208971869U CN208971869U CN201821411776.2U CN201821411776U CN208971869U CN 208971869 U CN208971869 U CN 208971869U CN 201821411776 U CN201821411776 U CN 201821411776U CN 208971869 U CN208971869 U CN 208971869U
- Authority
- CN
- China
- Prior art keywords
- foundation trench
- reflow soldering
- hole
- jig body
- slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Reflow soldering tool, including jig body are crossed the utility model discloses a kind of, which is characterized in that are equipped with the foundation trench to place printed circuit board in the jig body, which is integrally square setting, and four corners of the foundation trench are arranged in radiussed outwardly；The utility model proposes it is this cross reflow soldering tool, used the processes such as positioning, printing, Reflow Soldering suitable for printed circuit board, have the advantages that accurate positioning, pick and place that convenient and heating conduction is strong when welding.
Description
Technical field
The utility model relates to the welding auxiliary tool field of printed circuit board, have for be it is a kind of cross Reflow Soldering control
Tool.
Background technique
SMT is surface installation technique (surface mounting technology) (abbreviation of Surface Mount Technology), referred to as
Surface mount or surface mounting technique；It is a kind of most popular technology and technique in current electronic assembly industry.It is a kind of incites somebody to action
Printed circuit board is mounted on without pin or short leg surface-assembled component (abbreviation SMC/SMD, Chinese claim sheet component)
On surface or the surface of other substrates, the circuit load technology of welding assembly is subject to by the methods of Reflow Soldering or immersed solder.
SMT jig is mainly used for the processes such as printing, attachment, Reflow Soldering when printed circuit board (PCBA) carries out surface-assembled
Carry out positioning printed circuit board.SMT jig common at present has the drawback that, since SMT jig is integrally relatively thin, so PCBA
Taking and placing it is inconvenient；Simultaneously during Reflow Soldering, the heating conduction of jig is lower, causes the waste of electric energy；Therefore it needs
It develops a kind of convenience, high-precision, high stability and crosses reflow soldering tool.
Utility model content
In order to solve the problems of the above-mentioned prior art, reflow soldering tool is crossed the utility model proposes a kind of, is applicable in
It is used in the processes such as positioning, printing, Reflow Soldering in printed circuit board, there is accurate positioning, pick and place conveniently and in welding
The strong advantage of heating conduction.
The technical solution of the utility model is achieved in that
It is a kind of to cross reflow soldering tool, including jig body, which is characterized in that be equipped in the jig body to place print
The foundation trench of printed circuit board, the foundation trench are integrally square setting, and four corners of the foundation trench are described in radiussed setting outwardly
Left thermal hole, intermediate thermal conductivity hole, the right thermal hole of equal distribution are successively arranged on the center line in basialveolar length direction, with the left side
Thermal hole, intermediate thermal conductivity hole, right thermal hole be the center of circle periphery at be successively arranged the first, second, third, fourth thermally conductive circle,
The first, second, third, fourth thermally conductive circle is made of the multiple thermal holes arranged in a ring, and master is equipped in the foundation trench
Positioning column, the master positioning column are equipped with 4 and are respectively arranged at the four corners of foundation trench, and the quadrangle of the foundation trench is in radiussed outwardly
It is arranged, two secondary positioning columns is respectively provided at the both sides of the edge in the basialveolar length direction, are linked to be between the secondary positioning column
Rectangular lines the 4th thermally conductive circle corresponding with intermediate thermal conductivity hole it is tangent, the foundation trench is opened with the corresponding edge of secondary positioning column
Half slot equipped with one outwardly, the secondary positioning column are located on the circumference extended line of half slot and integrally perpendicular with half slot
Setting；
The jig body, which is equipped with, picks and places slot, which sets there are two and be located at the two of basialveolar length direction
Side, the pick-and-place slot part are located in foundation trench.
In the present invention, the depth for picking and placing slot and being greater than foundation trench relative to the depth of jig body.
In the present invention, the jig body is made of aluminium alloy.
Compared with prior art, implement this reflow soldering jig excessively in the utility model, have the advantages that
Printed circuit board can be fast and accurately placed in jig foundation trench by master positioning column or secondary positioning column, while jig
The pick-and-place slot being equipped with can allow operator easily to pick and place printed circuit board；Unique thermal hole and thermally conductive circle are related to improving
Thermal conductivity of the printed circuit board in welding.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe.
This reflow soldering tool, including jig body 1 excessively as shown in Figure 1, jig body 1 is interior to be equipped with to place printing
The foundation trench 11 of circuit board, the whole setting that is square of the foundation trench 11, four corners of foundation trench 11 are in radiussed setting outwardly, foundation trench
Left thermal hole 12, intermediate thermal conductivity hole 13, the right thermal hole 14 of equal distribution are successively arranged on the center line of 11 length directions, with a left side
Thermal hole 12, intermediate thermal conductivity hole 13, right thermal hole 14 are led to be successively arranged first, second, third, fourth at the periphery in the center of circle
Gas ket, the first, second, third, fourth thermally conductive circle are made of the multiple thermal holes arranged in a ring.
Master positioning column 15 is equipped in foundation trench 11, which is equipped with 4 and is respectively arranged at the four corners of foundation trench 11,
The quadrangle of foundation trench 11 is arranged in radiussed outwardly, and two secondary positioning columns are respectively provided at the both sides of the edge of 11 length direction of foundation trench
16, tangent, the foundation trench 11 of rectangular lines the 4th thermally conductive circle corresponding with intermediate thermal conductivity hole 13 being linked to be between the secondary positioning column 16
Edge corresponding with secondary positioning column 16 offers a half slot 17 outwardly, and secondary positioning column 16 is located at half slot 17
On circumference extended line and with the whole perpendicular setting of half slot 17.
Jig body 1, which is equipped with, picks and places slot 18, which sets there are two and be located at 11 length direction of foundation trench
Two sides pick and place being located in foundation trench for 18 part of slot.
In the present solution, pick and place slot 18 relative to jig body 1 depth be greater than foundation trench 11 depth.
In the present solution, jig body 1 is made of aluminium alloy.
In the specific use process, printed circuit board can be positioned by the master positioning column that foundation trench quadrangle goes out, by
It is arranged in foundation trench quadrangle in outside radiussed, certain puts leeway so can have when positioning.Foundation trench two simultaneously
Its depth of the pick-and-place slot of side is greater than foundation trench, and the thumb or index finger that can be convenient hand-held printed circuit board are put into pick-and-place slot, convenient
The pick-and-place of printed circuit board.It is big that the setting of secondary positioning column can make this jig in this programme can be used for another size
Small printed circuit board.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, made any modification, equivalent replacement and improvement etc. should be included in the utility model
Protection scope within.
Claims (3)
1. a kind of cross reflow soldering tool, including jig body, which is characterized in that be equipped in the jig body to place printing
The foundation trench of circuit board, the foundation trench are integrally square setting, and four corners of the foundation trench are in radiussed setting outwardly, the base
It is successively arranged left thermal hole, intermediate thermal conductivity hole, the right thermal hole of equal distribution on the center line in slot length direction, is led with the left side
Hot hole, intermediate thermal conductivity hole, right thermal hole be the center of circle periphery at be successively arranged the first, second, third, fourth thermally conductive circle, institute
It states the first, second, third, fourth thermally conductive circle to be made of the multiple thermal holes arranged in a ring, it is main fixed to be equipped in the foundation trench
Position column, the master positioning column are equipped with 4 and are respectively arranged at the four corners of foundation trench, and the quadrangle of the foundation trench is set in radiussed outwardly
It sets, two secondary positioning columns is respectively provided at the both sides of the edge in the basialveolar length direction, are linked to be between the secondary positioning column
Rectangular lines the 4th thermally conductive circle corresponding with intermediate thermal conductivity hole is tangent, and foundation trench edge corresponding with secondary positioning column opens up
Have a half slot outwardly, the secondary positioning column be located on the circumference extended line of half slot and with half slot is integrally perpendicular sets
It sets；
The jig body, which is equipped with, picks and places slot, which sets there are two and be located at the two sides in basialveolar length direction, institute
State being located in foundation trench for pick-and-place slot part.
2. a kind of reflow soldering tool excessively according to claim 1, which is characterized in that the pick-and-place slot is relative to jig body
Depth be greater than foundation trench depth.
3. a kind of reflow soldering tool excessively according to claim 1, which is characterized in that the jig body is aluminium alloy system
At.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821411776.2U CN208971869U (en) | 2018-08-30 | 2018-08-30 | It is a kind of to cross reflow soldering tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821411776.2U CN208971869U (en) | 2018-08-30 | 2018-08-30 | It is a kind of to cross reflow soldering tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208971869U true CN208971869U (en) | 2019-06-11 |
Family
ID=66753029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821411776.2U Active CN208971869U (en) | 2018-08-30 | 2018-08-30 | It is a kind of to cross reflow soldering tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208971869U (en) |
-
2018
- 2018-08-30 CN CN201821411776.2U patent/CN208971869U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208971869U (en) | It is a kind of to cross reflow soldering tool | |
| EP2003942A3 (en) | Method of assembly to achieve thermal bondline with minimal lead bending | |
| AU2018101057A4 (en) | PCB capable of protecting mark points against deformation | |
| CN107949160A (en) | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method | |
| CN206698504U (en) | Pcb board fixture | |
| CN210080900U (en) | Tin stove tool is crossed to printed wiring board | |
| CN211240289U (en) | PCB convenient to paster | |
| CN208971867U (en) | A kind of SMT special fixture | |
| CN203632978U (en) | Diode/resistor tin-soldering tool | |
| CN203352967U (en) | Carrier dedicated for SMT process | |
| CN205847735U (en) | Anti-deformation crosses furnace carrier | |
| CN210432100U (en) | Magnetic jig | |
| CN105491815A (en) | Reflow soldering template, template component, tin paste printing device and reflow soldering method | |
| CN106658993B (en) | One kind is structure improved to cross furnace carrier | |
| CN206894999U (en) | A kind of LED exempts from welding electrode electric wire formula wiring board | |
| CN103415142B (en) | A kind of FPC localization method and pcb board structure | |
| CN106163122A (en) | A kind of simple and convenient makes the method for circuit board | |
| CN217428452U (en) | SMT paster crosses stove carrier | |
| CN214627513U (en) | Double-sided board positioning jig | |
| CN214046132U (en) | Multilayer printed PCB circuit board capable of rapidly radiating | |
| CN205082071U (en) | FPC crosses stove anchor clamps | |
| CN220993068U (en) | Reflow soldering jig | |
| CN219421208U (en) | Fixing tool for welding special-shaped small-area PCB | |
| CN212761635U (en) | Wave-soldering tool of welding pencil | |
| CN221841081U (en) | Simple carrier plate suitable for test fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |