CN106158812A - A kind of TO 251 type four rejects shape lead frame group - Google Patents
A kind of TO 251 type four rejects shape lead frame group Download PDFInfo
- Publication number
- CN106158812A CN106158812A CN201610788176.7A CN201610788176A CN106158812A CN 106158812 A CN106158812 A CN 106158812A CN 201610788176 A CN201610788176 A CN 201610788176A CN 106158812 A CN106158812 A CN 106158812A
- Authority
- CN
- China
- Prior art keywords
- muscle
- lead frame
- heat sink
- type
- rejects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
Abstract
nullThe invention belongs to IC manufacturing field，Particularly relate to a kind of TO 251 type four reject shape lead frame group，Including several lead frames and muscle，Described lead frame includes heat sink and the terminal pin being connected with described heat sink，The thickness of described heat sink is 0.8mm，The thickness of described terminal pin is 0.5mm，Described muscle includes the top muscle being arranged on described heat sink top and is arranged on the end muscle bottom described terminal pin，Two described lead frames are connected together to two row's structures by described top muscle，Two described two row's structures are connected together to four row's structures by muscle of the described end，The present invention is by increasing to 0.8mm by the thickness of heat sink，Improve the thermal capacity of heat sink，Improve its heat dispersion，And preferably slow down the release of stress，Improve the intensity of heat sink，It is not easily broken，And single lead frame is connected by muscle symmetry，Form the structure of one group of four row，Add the quantity of Dan Zuzhong lead frame，Improve production and processing efficiency.
Description
Technical field
The invention belongs to IC manufacturing field, particularly relate to a kind of TO-251 type four and reject shape lead frame group.
Background technology
Lead frame is the carrier of a kind of IC chip, is made by bonding wire and makes chip internal circuits exit (key
Chalaza) realize the electrical connection with outer lead by lead, form the key structure part of electric loop.In the semiconductors, draw
Wire frame acts primarily as firm chip, conducted signal, the effect of transmission heat, needs in intensity, bending, electric conductivity, heat conductivity, resistance to
The aspects such as hot, thermally matched, corrosion-resistant, stepping, coplanarity, Stress Release reach higher standard.
The model of lead frame has multiple, and wherein, the application of TO-251 type lead frame is widely.Traditional TO-251
Type lead frame includes heat sink and terminal pin, and chip is arranged on heat sink, and heat sink and terminal pin are the copper of 0.5mm
Band, in use, the programming rate of heat sink is higher, and thermal capacity is the most relatively limited, can not function well as heat radiation
Effect, if product heats up too high, easily burns out wiring board.It addition, traditional TO-251 type lead frame group, for single row configuration,
In process of production, may only put into two row lead frame groups in a diaphragm capsule, production efficiency is relatively low.
Because above-mentioned defect, the design people, the most in addition research and innovation, to founding a kind of TO-251 type four rejection
Shape lead frame group so that it is have more the value in industry.
Summary of the invention
For solving above-mentioned technical problem, it is an object of the invention to provide a kind of TO-251 type four and reject shape lead frame group,
The thermal capacity of its heat sink is higher, perfect heat-dissipating, not easy burn-out wiring board, it is possible to slow down the release of stress, and intensity is high, is difficult to
Fracture, and single lead frame is connected by muscle symmetry, form the structure of one group of four row, add Dan Zuzhong lead frame
Quantity, improve production and processing efficiency.
A kind of TO-251 type four that the present invention proposes rejects shape lead frame group, including several lead frames and muscle, institute
Stating lead frame and include heat sink and the terminal pin being connected with described heat sink, the thickness of described heat sink is 0.8mm, described in draw
The thickness of stitch is 0.5mm, and described muscle includes the top muscle being arranged on described heat sink top and is arranged on bottom described terminal pin
End muscle, two described lead frames are connected together to two row's structures by described top muscle, and two described two row's structures pass through institute
State end muscle and be connected together to four row's structures.
Further, the quantity of described terminal pin is 3, including middle foot and the side being separately positioned on described middle foot both sides
Foot, described batter is provided with pressure welding area.
Further, the size of two described weldering nips is different.
Further, described muscle includes the middle muscle connecting described middle foot and described batter.
Further, the material of described lead frame and muscle is copper.
Further, muscle of the described end is provided with hole, location.
Further, described heat sink is provided with louvre.
By such scheme, the present invention at least has the advantage that the present invention is by increasing to the thickness of heat sink
0.8mm, improves the thermal capacity of heat sink, improves its heat dispersion, and preferably slow down the release of stress, improves scattered
The intensity of hot plate, is not easily broken, and is connected by muscle symmetry by single lead frame, forms the structure of one group of four row, increases
The quantity of Dan Zuzhong lead frame, improves production and processing efficiency.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of description, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Accompanying drawing explanation
Fig. 1 is the partial structurtes schematic diagram of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment, the detailed description of the invention of the present invention is described in further detail.Hereinafter implement
Example is used for illustrating the present invention, but is not limited to the scope of the present invention.
Seeing Fig. 1, a kind of TO-251 type four described in a preferred embodiment of the present invention rejects shape lead frame 1 group, including
Several lead frames 1 and muscle 2.Lead frame 1 includes heat sink 11 and the terminal pin 12 being connected with heat sink 11, heat sink 11
Thickness be 0.8mm, the thickness of terminal pin 12 is 0.5mm, and the quantity of terminal pin 12 is 3, including middle foot 121 be respectively provided with
At the batter 122 of middle foot 121 both sides, batter 122 is provided with pressure welding area 13, and the size of two weldering nips 13 is different, and muscle 2 wraps
Include and be arranged on the top muscle 21 at heat sink 11 top, be arranged on foot 121 and batter in the end muscle 22 bottom terminal pin 12 and connection
The middle muscle 23 of 122.
In lead frame 1 group, two lead frames 1 are connected together to two row's structures, two two row's structures by top muscle 21
Being connected together to four row's structures by end muscle 22, several four rows structures are connected by end muscle 22, and side-by-side series forms lead frame
1 group of frame.It addition, the material of lead frame 1 and muscle 2 is copper, end muscle 22 is provided with hole 3, location, and heat sink 11 is provided with louvre
4。
In sum, the present invention, by the thickness of heat sink 11 is increased to 0.8mm, improves the thermal capacitance of heat sink 11
Amount, improves its heat dispersion, and preferably slow down the release of stress, improve the intensity of heat sink 11, be not easily broken, and
And single lead frame 1 is connected by muscle 2 is symmetrical, form the structure of one group of four row, add the number of Dan Zuzhong lead frame 1
Amount, improves production and processing efficiency.
The above is only the preferred embodiment of the present invention, is not limited to the present invention, it is noted that for this skill
For the those of ordinary skill in art field, on the premise of without departing from the technology of the present invention principle, it is also possible to make some improvement and
Modification, these improve and modification also should be regarded as protection scope of the present invention.
Claims (7)
1. a TO-251 type four rejects shape lead frame group, it is characterised in that: include several lead frames and muscle, described in draw
Wire frame includes heat sink and the terminal pin being connected with described heat sink, and the thickness of described heat sink is 0.8mm, described terminal pin
Thickness be 0.5mm, described muscle includes being arranged on the top muscle at described heat sink top and is arranged on the end bottom described terminal pin
Muscle, two described lead frames are connected together to two row's structures by described top muscle, and two described two row's structures are by the described end
Muscle is connected together to four row's structures.
TO-251 type four the most according to claim 1 rejects shape lead frame group, it is characterised in that: the number of described terminal pin
Amount is 3, and including middle foot and the batter being separately positioned on described middle foot both sides, described batter is provided with pressure welding area.
TO-251 type four the most according to claim 2 rejects shape lead frame group, it is characterised in that: two described weldering nips
Size different.
TO-251 type four the most according to claim 2 rejects shape lead frame group, it is characterised in that: described muscle includes connecting
Described middle foot and the middle muscle of described batter.
TO-251 type four the most according to claim 1 rejects shape lead frame group, it is characterised in that: described lead frame and
The material of muscle is copper.
TO-251 type four the most according to claim 1 rejects shape lead frame group, it is characterised in that: muscle of the described end is provided with
Hole, location.
TO-251 type four the most according to claim 1 rejects shape lead frame group, it is characterised in that: set on described heat sink
There is louvre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610788176.7A CN106158812A (en) | 2016-08-31 | 2016-08-31 | A kind of TO 251 type four rejects shape lead frame group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610788176.7A CN106158812A (en) | 2016-08-31 | 2016-08-31 | A kind of TO 251 type four rejects shape lead frame group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106158812A true CN106158812A (en) | 2016-11-23 |
Family
ID=57344285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610788176.7A Pending CN106158812A (en) | 2016-08-31 | 2016-08-31 | A kind of TO 251 type four rejects shape lead frame group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106158812A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593092A (en) * | 2012-03-22 | 2012-07-18 | 天水华天微电子股份有限公司 | Lead frame |
| CN203445111U (en) * | 2013-08-26 | 2014-02-19 | 无锡罗姆半导体科技有限公司 | Section copper strip TO-252 packaging lead wire framework |
| CN206210785U (en) * | 2016-08-31 | 2017-05-31 | 无锡罗姆半导体科技有限公司 | A kind of rejection shape lead frame group of 251 types of TO four |
-
2016
- 2016-08-31 CN CN201610788176.7A patent/CN106158812A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593092A (en) * | 2012-03-22 | 2012-07-18 | 天水华天微电子股份有限公司 | Lead frame |
| CN203445111U (en) * | 2013-08-26 | 2014-02-19 | 无锡罗姆半导体科技有限公司 | Section copper strip TO-252 packaging lead wire framework |
| CN206210785U (en) * | 2016-08-31 | 2017-05-31 | 无锡罗姆半导体科技有限公司 | A kind of rejection shape lead frame group of 251 types of TO four |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |
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| RJ01 | Rejection of invention patent application after publication |