CN106158798A - 一种芯片结构及其封装方法 - Google Patents
一种芯片结构及其封装方法 Download PDFInfo
- Publication number
- CN106158798A CN106158798A CN201610541009.2A CN201610541009A CN106158798A CN 106158798 A CN106158798 A CN 106158798A CN 201610541009 A CN201610541009 A CN 201610541009A CN 106158798 A CN106158798 A CN 106158798A
- Authority
- CN
- China
- Prior art keywords
- weld pad
- film
- oxide
- chip structure
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610541009.2A CN106158798A (zh) | 2016-07-11 | 2016-07-11 | 一种芯片结构及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610541009.2A CN106158798A (zh) | 2016-07-11 | 2016-07-11 | 一种芯片结构及其封装方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106158798A true CN106158798A (zh) | 2016-11-23 |
Family
ID=58062405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610541009.2A Pending CN106158798A (zh) | 2016-07-11 | 2016-07-11 | 一种芯片结构及其封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106158798A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111128770A (zh) * | 2019-12-16 | 2020-05-08 | 华虹半导体(无锡)有限公司 | 铝垫的形成方法以及包含铝垫的器件 |
CN112447607A (zh) * | 2019-09-02 | 2021-03-05 | 铠侠股份有限公司 | 半导体装置的制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60186030A (ja) * | 1984-03-05 | 1985-09-21 | Fujitsu Ltd | ボンデイング方法 |
JPS62276841A (ja) * | 1986-05-26 | 1987-12-01 | Hitachi Ltd | ワイヤボンデイング方法 |
JPH01161843A (ja) * | 1987-12-18 | 1989-06-26 | Hitachi Ltd | 半導体装置の製造方法 |
CN102456667A (zh) * | 2010-10-19 | 2012-05-16 | 台湾积体电路制造股份有限公司 | 接合焊盘结构以及具有该接合焊盘结构的晶片 |
-
2016
- 2016-07-11 CN CN201610541009.2A patent/CN106158798A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60186030A (ja) * | 1984-03-05 | 1985-09-21 | Fujitsu Ltd | ボンデイング方法 |
JPS62276841A (ja) * | 1986-05-26 | 1987-12-01 | Hitachi Ltd | ワイヤボンデイング方法 |
JPH01161843A (ja) * | 1987-12-18 | 1989-06-26 | Hitachi Ltd | 半導体装置の製造方法 |
CN102456667A (zh) * | 2010-10-19 | 2012-05-16 | 台湾积体电路制造股份有限公司 | 接合焊盘结构以及具有该接合焊盘结构的晶片 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112447607A (zh) * | 2019-09-02 | 2021-03-05 | 铠侠股份有限公司 | 半导体装置的制造方法 |
CN112447607B (zh) * | 2019-09-02 | 2024-04-09 | 铠侠股份有限公司 | 半导体装置的制造方法 |
CN111128770A (zh) * | 2019-12-16 | 2020-05-08 | 华虹半导体(无锡)有限公司 | 铝垫的形成方法以及包含铝垫的器件 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 401331 No. 25 Xiyong Avenue, Xiyong Town, Shapingba District, Chongqing Applicant after: Huarun Microelectronics (Chongqing) Co., Ltd. Address before: 401331 No. 25 Xiyong Avenue, Xiyong Town, Shapingba District, Chongqing Applicant before: China Aviation (Chongqing) Microelectronics Co., Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 401331 No. 25 Xiyong Avenue, Shapingba District, Chongqing Applicant after: Huarun Microelectronics (Chongqing) Co., Ltd. Address before: 401331 No. 25 Xiyong Avenue, Xiyong Town, Shapingba District, Chongqing Applicant before: Huarun Microelectronics (Chongqing) Co., Ltd. |
|
CB02 | Change of applicant information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |
|
RJ01 | Rejection of invention patent application after publication |