CN106133847B - 具有纳米结构的图案的透光性导电体及其制造方法 - Google Patents

具有纳米结构的图案的透光性导电体及其制造方法 Download PDF

Info

Publication number
CN106133847B
CN106133847B CN201480077699.XA CN201480077699A CN106133847B CN 106133847 B CN106133847 B CN 106133847B CN 201480077699 A CN201480077699 A CN 201480077699A CN 106133847 B CN106133847 B CN 106133847B
Authority
CN
China
Prior art keywords
layer
conductive
transparent conductive
nanostructure
body according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480077699.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN106133847A (zh
Inventor
郑京浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Tree Corp
Original Assignee
British Tree Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Tree Corp filed Critical British Tree Corp
Publication of CN106133847A publication Critical patent/CN106133847A/zh
Application granted granted Critical
Publication of CN106133847B publication Critical patent/CN106133847B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/81Electrodes
    • H10K30/82Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0242Shape of an individual particle
    • H05K2201/026Nanotubes or nanowires
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Nanotechnology (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN201480077699.XA 2014-04-09 2014-10-31 具有纳米结构的图案的透光性导电体及其制造方法 Active CN106133847B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020140042135A KR101586902B1 (ko) 2014-04-09 2014-04-09 나노구조의 패턴을 구비한 광투과성 도전체 및 그 제조방법
KR10-2014-0042135 2014-04-09
PCT/KR2014/010333 WO2015156467A1 (ko) 2014-04-09 2014-10-31 나노구조의 패턴을 구비한 광투과성 도전체 및 그 제조방법

Publications (2)

Publication Number Publication Date
CN106133847A CN106133847A (zh) 2016-11-16
CN106133847B true CN106133847B (zh) 2018-04-20

Family

ID=54288024

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480077699.XA Active CN106133847B (zh) 2014-04-09 2014-10-31 具有纳米结构的图案的透光性导电体及其制造方法

Country Status (5)

Country Link
US (1) US10165680B2 (enExample)
JP (1) JP6486383B2 (enExample)
KR (1) KR101586902B1 (enExample)
CN (1) CN106133847B (enExample)
WO (1) WO2015156467A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101606338B1 (ko) * 2014-04-22 2016-03-24 인트리 주식회사 나노구조의 패턴을 구비한 광투과성 도전체를 제조하기 위한 포토마스크 및 그 제조방법
KR102285456B1 (ko) 2015-02-10 2021-08-03 동우 화인켐 주식회사 도전패턴
US9801284B2 (en) * 2015-11-18 2017-10-24 Dow Global Technologies Llc Method of manufacturing a patterned conductor
TWI718414B (zh) * 2018-09-21 2021-02-11 元太科技工業股份有限公司 導電結構、線路結構及顯示器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101689568A (zh) * 2007-04-20 2010-03-31 凯博瑞奥斯技术公司 复合透明导体及其形成方法
JP2012174600A (ja) * 2011-02-23 2012-09-10 Fujifilm Corp 導電シートの製造方法、導電シート及びタッチパネル
CN103282866A (zh) * 2010-11-05 2013-09-04 富士胶片株式会社 触控面板
CN103649884A (zh) * 2011-07-11 2014-03-19 富士胶片株式会社 导电性层压体、触摸屏以及显示装置
KR20140040919A (ko) * 2012-09-27 2014-04-04 한국과학기술원 은 나노와이어 네트워크―그래핀 적층형 투명전극 소재, 그 제조 방법 및 이를 포함하는 투명전극

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006030981A1 (ja) * 2004-09-17 2006-03-23 National Institute Of Advanced Industrial Scienceand Technology 透明導電性カーボンナノチューブフィルムとその製造方法
JP5546763B2 (ja) 2005-08-12 2014-07-09 カンブリオス テクノロジーズ コーポレイション ナノワイヤに基づく透明導電体
WO2007114645A1 (en) * 2006-04-04 2007-10-11 Topnanosis, Inc. Conductive composite material and method for manufacturing the same
JP5221088B2 (ja) 2007-09-12 2013-06-26 株式会社クラレ 透明導電膜およびその製造方法
JP5360528B2 (ja) * 2008-05-07 2013-12-04 国立大学法人北陸先端科学技術大学院大学 ギャップで分断された薄膜の製造方法、およびこれを用いたデバイスの製造方法
JP2011065944A (ja) 2009-09-18 2011-03-31 Fujifilm Corp 導電膜形成用感光材料、導電性材料、表示素子及び太陽電池
US8604332B2 (en) 2010-03-04 2013-12-10 Guardian Industries Corp. Electronic devices including transparent conductive coatings including carbon nanotubes and nanowire composites, and methods of making the same
EP2598942A4 (en) * 2010-07-30 2014-07-23 Univ Leland Stanford Junior CONDUCTIVE FILMS
JP5542752B2 (ja) * 2011-07-06 2014-07-09 信越ポリマー株式会社 絶縁部形成方法及び導電パターン形成基板の製造方法
JP5646424B2 (ja) 2011-09-27 2014-12-24 株式会社東芝 透明電極積層体
KR101328483B1 (ko) 2012-05-10 2013-11-13 전자부품연구원 금속 메쉬 구조를 갖는 투명 전극 박막 및 그 제조방법
JPWO2014050440A1 (ja) * 2012-09-27 2016-08-22 東レフィルム加工株式会社 透明導電積層体
WO2014088798A1 (en) * 2012-12-07 2014-06-12 3M Innovative Properties Company Electrically conductive articles

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101689568A (zh) * 2007-04-20 2010-03-31 凯博瑞奥斯技术公司 复合透明导体及其形成方法
CN103282866A (zh) * 2010-11-05 2013-09-04 富士胶片株式会社 触控面板
JP2012174600A (ja) * 2011-02-23 2012-09-10 Fujifilm Corp 導電シートの製造方法、導電シート及びタッチパネル
CN103649884A (zh) * 2011-07-11 2014-03-19 富士胶片株式会社 导电性层压体、触摸屏以及显示装置
KR20140040919A (ko) * 2012-09-27 2014-04-04 한국과학기술원 은 나노와이어 네트워크―그래핀 적층형 투명전극 소재, 그 제조 방법 및 이를 포함하는 투명전극

Also Published As

Publication number Publication date
KR101586902B1 (ko) 2016-01-19
CN106133847A (zh) 2016-11-16
JP6486383B2 (ja) 2019-03-20
US10165680B2 (en) 2018-12-25
US20170150598A1 (en) 2017-05-25
KR20150117000A (ko) 2015-10-19
JP2017519326A (ja) 2017-07-13
WO2015156467A1 (ko) 2015-10-15

Similar Documents

Publication Publication Date Title
JP6730411B2 (ja) タッチウィンドウ及びこれを含むタッチデバイス
US8741424B2 (en) Transparent conductive element, input device, electronic device, and master for fabrication of transparent conductive element
KR102056928B1 (ko) 터치스크린 패널 및 그의 제조방법
CN104331184B (zh) 触摸窗口及包含该触摸窗口的显示器
CN106133847B (zh) 具有纳米结构的图案的透光性导电体及其制造方法
US11169630B2 (en) Touch panel with nanowires
CN102682665A (zh) 透明电极元件、信息输入设备和电子装置
CN108874228A (zh) 触控器件、触控显示基板及显示装置
CN102915142A (zh) 透明电极器件、信息输入装置和电子设备
JP2014523599A (ja) 導電性基板およびこれを含む電子素子
CN205015856U (zh) 包括网格结构图案的触摸面板
JP6342511B2 (ja) ナノ構造のパターンを備えた光透過性導電体を製造するためのフォトマスク及びその製造方法
CN109407883B (zh) 一种触摸屏及其制作方法、显示装置
CN105549804B (zh) 触控装置及其制造方法
KR20180045712A (ko) 터치 스크린 패널용 센서의 제조 방법 및 터치 스크린 패널용 센서
KR20170058895A (ko) 나노섬유 패턴을 구비한 광투과성 도전체 및 그 제조방법
JP2014130383A (ja) 透明導電性素子、入力装置、電子機器、透明導電性素子の製造方法
KR102306428B1 (ko) 전도성 패턴
KR101739726B1 (ko) 나노섬유 패턴을 구비한 광투과성 도전체의 제조방법
CN109429516A (zh) 触摸基板、触控显示设备和制造触摸基板的方法
KR20130033538A (ko) 투명전극 필름의 제조 방법
TWI760092B (zh) 觸控感應器及其製造方法
CN212391785U (zh) 透明导电薄膜及触控面板
KR20160069823A (ko) 전도성 구조체 및 이의 제조방법
KR20130121338A (ko) 터치 패널의 투명전극 필름 및 그 제조 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant