CN106133184B - 用于有机材料的蒸发源 - Google Patents

用于有机材料的蒸发源 Download PDF

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Publication number
CN106133184B
CN106133184B CN201480077386.4A CN201480077386A CN106133184B CN 106133184 B CN106133184 B CN 106133184B CN 201480077386 A CN201480077386 A CN 201480077386A CN 106133184 B CN106133184 B CN 106133184B
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China
Prior art keywords
evaporation source
evaporation
distribution
source array
substrate
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CN201480077386.4A
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Chinese (zh)
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CN106133184A (zh
Inventor
J·M·迭戈兹-坎波
S·邦格特
A·鲁普
U·舒斯勒
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Applied Materials Inc
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Applied Materials Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201480077386.4A 2014-03-21 2014-03-21 用于有机材料的蒸发源 Active CN106133184B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/055744 WO2015139777A1 (en) 2014-03-21 2014-03-21 Evaporation source for organic material

Publications (2)

Publication Number Publication Date
CN106133184A CN106133184A (zh) 2016-11-16
CN106133184B true CN106133184B (zh) 2020-03-17

Family

ID=50382443

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480077386.4A Active CN106133184B (zh) 2014-03-21 2014-03-21 用于有机材料的蒸发源

Country Status (7)

Country Link
US (1) US20170081755A1 (https=)
EP (1) EP3119920A1 (https=)
JP (1) JP6704348B2 (https=)
KR (1) KR101997808B1 (https=)
CN (1) CN106133184B (https=)
TW (1) TWI640646B (https=)
WO (1) WO2015139777A1 (https=)

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KR101990619B1 (ko) * 2014-11-07 2019-06-18 어플라이드 머티어리얼스, 인코포레이티드 증발된 재료를 증착하기 위한 장치, 분배 파이프, 진공 증착 챔버, 및 증발된 재료를 증착하기 위한 방법
WO2017121491A1 (en) * 2016-01-15 2017-07-20 Applied Materials, Inc. Evaporation source, apparatus and method for depositing organic material
JP6941564B2 (ja) * 2016-05-10 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 蒸発した材料を堆積させるための蒸発源、及び蒸発した材料を堆積させるための方法
CN106595759B (zh) * 2016-12-07 2019-02-01 上海宇航系统工程研究所 一种低温推进剂贮存技术地面试验系统
KR20200049915A (ko) * 2016-12-12 2020-05-08 어플라이드 머티어리얼스, 인코포레이티드 기판 상에서의 재료의 증착을 위한 장치, 기판 상에 하나 또는 그 초과의 층들을 증착하기 위한 시스템, 및 진공 증착 시스템을 모니터링하기 위한 방법
CN109563608A (zh) * 2017-02-24 2019-04-02 应用材料公司 用于基板载体和掩模载体的定位配置、用于基板载体和掩模载体的传送系统及其方法
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
CN108966659B (zh) * 2017-03-17 2021-01-15 应用材料公司 沉积系统、沉积设备、和操作沉积系统的方法
US20200040445A1 (en) * 2017-04-28 2020-02-06 Applied Materials, Inc. Vacuum system and method for depositing a plurality of materials on a substrate
JP2019534938A (ja) * 2017-09-26 2019-12-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 材料堆積装置、真空堆積システム、及び真空堆積を行う方法
WO2019096392A1 (en) * 2017-11-16 2019-05-23 Applied Materials, Inc. Method of cooling a deposition source, chamber for cooling a deposition source and deposition system
WO2019201434A1 (en) * 2018-04-18 2019-10-24 Applied Materials, Inc. Evaporation source for deposition of evaporated material on a substrate, deposition apparatus, method for measuring a vapor pressure of evaporated material, and method for determining an evaporation rate of an evaporated material
CN112424393A (zh) * 2018-06-15 2021-02-26 应用材料公司 用于冷却沉积区域的冷却系统，用于进行材料沉积的布置，以及在基板上进行沉积的方法
CN112534564A (zh) * 2018-08-07 2021-03-19 应用材料公司 材料沉积设备、真空沉积系统及用以处理大面积基板的方法
US10566168B1 (en) * 2018-08-10 2020-02-18 John Bennett Low voltage electron transparent pellicle
CN108842134B (zh) * 2018-08-29 2024-01-16 郑州华晶新能源科技有限公司 一种油屏蔽挥发装置
KR20200040537A (ko) * 2018-10-10 2020-04-20 엘지디스플레이 주식회사 측향식 진공증착용 소스, 소스 어셈블리 및 이를 이용한 측향식 진공증착 장치
JP7309882B2 (ja) * 2018-12-21 2023-07-18 アプライド マテリアルズ インコーポレイテッド 真空チャンバ内で基板をコーティングするための気相堆積装置及び方法

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CN1904130A (zh) * 2005-07-28 2007-01-31 应用薄膜有限公司 气相沉积装置
EP2204467A1 (en) * 2008-12-23 2010-07-07 Applied Materials, Inc. Method and apparatus for depositing mixed layers

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KR100477546B1 (ko) * 2002-07-24 2005-03-18 주식회사 소로나 유기물질 증착방법 및 이를 적용한 장치
JP2005002450A (ja) * 2003-06-13 2005-01-06 Pioneer Electronic Corp 蒸着方法、蒸着ヘッド、及び有機エレクトロルミネッセンス表示パネルの製造装置
EP2369035B9 (en) * 2003-08-04 2014-05-21 LG Display Co., Ltd. Evaporation source
JP4557170B2 (ja) * 2004-11-26 2010-10-06 三星モバイルディスプレイ株式會社 蒸発源
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JP5183310B2 (ja) * 2008-06-12 2013-04-17 日立造船株式会社 蒸着装置
KR20090130559A (ko) * 2008-06-16 2009-12-24 삼성모바일디스플레이주식회사 이송 장치 및 이를 구비하는 유기물 증착 장치
DE102010041380A1 (de) * 2009-09-25 2011-04-28 Von Ardenne Anlagentechnik Gmbh Verdampfereinrichtung für eine Beschichtungsanlage
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KR101288307B1 (ko) * 2011-05-31 2013-07-22 주성엔지니어링(주) 증발 증착 장치 및 증발 증착 방법
JP2013211137A (ja) * 2012-03-30 2013-10-10 Samsung Display Co Ltd 真空蒸着方法及びその装置
CN105917019A (zh) * 2014-02-04 2016-08-31 应用材料公司 用于有机材料的蒸发源、具有用于有机材料的蒸发源的设备、具有带有用于有机材料的蒸发源的蒸发沉积设备的系统以及用于操作用于有机材料的蒸发源的方法

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CN1904130A (zh) * 2005-07-28 2007-01-31 应用薄膜有限公司 气相沉积装置
EP2204467A1 (en) * 2008-12-23 2010-07-07 Applied Materials, Inc. Method and apparatus for depositing mixed layers

Also Published As

Publication number Publication date
KR20160135355A (ko) 2016-11-25
KR101997808B1 (ko) 2019-07-08
CN106133184A (zh) 2016-11-16
TWI640646B (zh) 2018-11-11
EP3119920A1 (en) 2017-01-25
TW201604302A (zh) 2016-02-01
JP2017509794A (ja) 2017-04-06
WO2015139777A1 (en) 2015-09-24
JP6704348B2 (ja) 2020-06-03
US20170081755A1 (en) 2017-03-23

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