CN106132660A - 电子部件的制造方法 - Google Patents

电子部件的制造方法 Download PDF

Info

Publication number
CN106132660A
CN106132660A CN201580014133.7A CN201580014133A CN106132660A CN 106132660 A CN106132660 A CN 106132660A CN 201580014133 A CN201580014133 A CN 201580014133A CN 106132660 A CN106132660 A CN 106132660A
Authority
CN
China
Prior art keywords
mentioned
resin layer
metallic conductor
manufacture method
electronic unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580014133.7A
Other languages
English (en)
Chinese (zh)
Inventor
谷口义尚
藤田贵之
铃木邦明
佐藤秀隆
坂本尭也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of CN106132660A publication Critical patent/CN106132660A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacture Of Switches (AREA)
CN201580014133.7A 2014-04-04 2015-04-02 电子部件的制造方法 Pending CN106132660A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-078239 2014-04-04
JP2014078239 2014-04-04
PCT/JP2015/060444 WO2015152364A1 (ja) 2014-04-04 2015-04-02 電子部品の製造方法

Publications (1)

Publication Number Publication Date
CN106132660A true CN106132660A (zh) 2016-11-16

Family

ID=54240672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580014133.7A Pending CN106132660A (zh) 2014-04-04 2015-04-02 电子部件的制造方法

Country Status (4)

Country Link
JP (1) JP6214757B2 (ko)
KR (1) KR101950899B1 (ko)
CN (1) CN106132660A (ko)
WO (1) WO2015152364A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9868632B2 (en) * 2016-03-24 2018-01-16 Infineon Technologies Ag Molded cavity package with embedded conductive layer and enhanced sealing
CN110248792A (zh) * 2017-02-03 2019-09-17 宝理塑料株式会社 树脂成型品的接合方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001315159A (ja) * 2000-05-10 2001-11-13 Mitsubishi Plastics Ind Ltd 金属板を有する射出成形品の製造方法
CN102753342A (zh) * 2010-02-04 2012-10-24 三菱树脂株式会社 树脂/金属复合叠层材料、树脂/金属复合注塑成型体、及其制造方法
CN103237646A (zh) * 2010-12-02 2013-08-07 东丽株式会社 金属复合体的制造方法以及电子设备壳体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63184357A (ja) * 1987-01-26 1988-07-29 Japan Aviation Electronics Ind Ltd インサート成形部品の端子保持方法
JPH05114664A (ja) * 1991-05-31 1993-05-07 Toshiba Chem Corp 電子機器筐体の製造方法
JPH0629021U (ja) 1992-09-21 1994-04-15 アルプス電気株式会社 電気部品の端子取付構造
JP3767005B2 (ja) * 1996-03-18 2006-04-19 富士通株式会社 筐体
JP3534949B2 (ja) 1996-08-12 2004-06-07 アルプス電気株式会社 電子部品の密閉構造
JP2000150551A (ja) * 1998-11-11 2000-05-30 Orc Mfg Co Ltd リードフレームの表面処理機構およびその方法
US6214152B1 (en) * 1999-03-22 2001-04-10 Rjr Polymers, Inc. Lead frame moisture barrier for molded plastic electronic packages
JP3947533B2 (ja) * 2004-07-16 2007-07-25 吉川工業株式会社 半導体収納用樹脂製中空パッケージ
JP5234011B2 (ja) * 2010-01-07 2013-07-10 豊田合成株式会社 金属と樹脂との複合体の製造方法
TW201313454A (zh) * 2011-09-27 2013-04-01 Ichia Tech Inc 將塑膠機構固著於金屬殼體之方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001315159A (ja) * 2000-05-10 2001-11-13 Mitsubishi Plastics Ind Ltd 金属板を有する射出成形品の製造方法
CN102753342A (zh) * 2010-02-04 2012-10-24 三菱树脂株式会社 树脂/金属复合叠层材料、树脂/金属复合注塑成型体、及其制造方法
CN103237646A (zh) * 2010-12-02 2013-08-07 东丽株式会社 金属复合体的制造方法以及电子设备壳体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
钱苗根: "《现代表面工程》", 30 September 2012 *

Also Published As

Publication number Publication date
JPWO2015152364A1 (ja) 2017-04-13
KR20160129068A (ko) 2016-11-08
WO2015152364A1 (ja) 2015-10-08
JP6214757B2 (ja) 2017-10-18
KR101950899B1 (ko) 2019-05-10

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Tokyo, Japan, Japan

Applicant after: Alpine Alpine Company

Address before: Tokyo, Japan, Japan

Applicant before: Alps Electric Co., Ltd.

CB02 Change of applicant information
RJ01 Rejection of invention patent application after publication

Application publication date: 20161116

RJ01 Rejection of invention patent application after publication