CN106117261A - 一种八环己烷环氧烷笼型倍半硅氧烷及其制备方法 - Google Patents
一种八环己烷环氧烷笼型倍半硅氧烷及其制备方法 Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- -1 dimethylsilyl Chemical group 0.000 claims abstract description 30
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 239000001257 hydrogen Substances 0.000 claims abstract description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 12
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000003756 stirring Methods 0.000 claims description 31
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 5
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 claims description 5
- 235000014443 Pyrus communis Nutrition 0.000 claims description 4
- 239000003610 charcoal Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 4
- 229940058401 polytetrafluoroethylene Drugs 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims description 2
- 239000006228 supernatant Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract description 18
- 229920005989 resin Polymers 0.000 abstract description 18
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 230000003301 hydrolyzing effect Effects 0.000 abstract description 4
- 238000009833 condensation Methods 0.000 abstract description 3
- 230000005494 condensation Effects 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 abstract description 2
- 150000002148 esters Chemical class 0.000 abstract description 2
- 238000005984 hydrogenation reaction Methods 0.000 abstract description 2
- 238000006459 hydrosilylation reaction Methods 0.000 abstract description 2
- 230000002194 synthesizing effect Effects 0.000 abstract description 2
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 abstract description 2
- 239000005050 vinyl trichlorosilane Substances 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 24
- 239000000463 material Substances 0.000 description 18
- OKKJLVBELUTLKV-MZCSYVLQSA-N Deuterated methanol Chemical compound [2H]OC([2H])([2H])[2H] OKKJLVBELUTLKV-MZCSYVLQSA-N 0.000 description 14
- 239000000805 composite resin Substances 0.000 description 14
- 238000002444 silanisation Methods 0.000 description 14
- 239000000377 silicon dioxide Substances 0.000 description 13
- 239000011159 matrix material Substances 0.000 description 12
- 238000005481 NMR spectroscopy Methods 0.000 description 10
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 9
- AMFGWXWBFGVCKG-UHFFFAOYSA-N Panavia opaque Chemical compound C1=CC(OCC(O)COC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCC(O)COC(=O)C(C)=C)C=C1 AMFGWXWBFGVCKG-UHFFFAOYSA-N 0.000 description 9
- 229930006711 bornane-2,3-dione Natural products 0.000 description 9
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 5
- 238000005133 29Si NMR spectroscopy Methods 0.000 description 5
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 5
- 229910002808 Si–O–Si Inorganic materials 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 description 4
- KJSGODDTWRXQRH-UHFFFAOYSA-N 2-(dimethylamino)ethyl benzoate Chemical compound CN(C)CCOC(=O)C1=CC=CC=C1 KJSGODDTWRXQRH-UHFFFAOYSA-N 0.000 description 4
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 4
- 241000790917 Dioxys <bee> Species 0.000 description 4
- 229910003978 SiClx Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 235000009508 confectionery Nutrition 0.000 description 4
- QFWPJPIVLCBXFJ-UHFFFAOYSA-N glymidine Chemical compound N1=CC(OCCOC)=CN=C1NS(=O)(=O)C1=CC=CC=C1 QFWPJPIVLCBXFJ-UHFFFAOYSA-N 0.000 description 4
- 150000002496 iodine Chemical class 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- 238000009849 vacuum degassing Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 235000002597 Solanum melongena Nutrition 0.000 description 2
- 244000061458 Solanum melongena Species 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000002769 thiazolinyl group Chemical group 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- YRCUYAQBRRTNTF-UHFFFAOYSA-N CC1OCC(CC[Si+](C)(C)OC)CC1 Chemical compound CC1OCC(CC[Si+](C)(C)OC)CC1 YRCUYAQBRRTNTF-UHFFFAOYSA-N 0.000 description 1
- BCWMBWSIQNQIHR-UHFFFAOYSA-N CCC1CC2OC2CC1 Chemical compound CCC1CC2OC2CC1 BCWMBWSIQNQIHR-UHFFFAOYSA-N 0.000 description 1
- HAEDJBHOPDKZSV-NBXIYJJMSA-N C[SiH2]CC[C@@H]1C[C@@H]2OC2CC1 Chemical compound C[SiH2]CC[C@@H]1C[C@@H]2OC2CC1 HAEDJBHOPDKZSV-NBXIYJJMSA-N 0.000 description 1
- 241001597008 Nomeidae Species 0.000 description 1
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical group [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 238000007171 acid catalysis Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005815 base catalysis Methods 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000012656 cationic ring opening polymerization Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000001212 derivatisation Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 125000005401 siloxanyl group Chemical group 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
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Abstract
一种八环己烷环氧烷笼型倍半硅氧烷及其制备方法涉及一种笼型倍半硅氧烷的制备方法。以已工业化的原硅酸四乙酯基酯及四甲基氢氧化铵为初级原料,首先经缩合合成出八聚四甲铵基笼型倍半硅氧烷,后经硅氢化反应制得八聚氢基二甲基硅烷基笼型倍半硅氧烷,经硅氢加成反应制得八环己烷环氧烷笼型倍半硅氧烷,相比于以乙烯基三氯硅烷为原料经水解缩合,再经氧化制备的多为混合产物的笼型倍半硅氧烷,本发明产品结构单一,产率高,简单易行,且制得的八环己烷环氧烷笼型倍半硅氧烷可用于改性树脂,制备高性能的复合材料。
Description
技术领域
本发明涉及一种八环己烷环氧烷笼型倍半硅氧烷及其制备方法。
背景技术
有机-无机杂化材料由于具有优异的力学性能、热学性能、电学性能、光学性能而引起了人们的广泛关注。多面低聚倍半硅氧烷(POSS),是一种近年来受到广泛关注的聚合物改性材料,一般认为,POSS具有经典分子结构式(RSiQ1.5)n[n≥4],其R取代基可以为氢、烷基、烯基、芳基、亚芳基以及它们的衍生物基团;其结构主要有无规、梯型、笼型、部分笼型和桥型等;n一般为6、8、10、12等,其中以n=8最为常见,为一典型的多面体低聚倍半硅氧烷,具有高度对称的立方体笼型骨架。
多面低聚倍半硅氧烷(POSS)包含无机和有机两部分,内部是硅和氧构成的无机结构中心,外围多被有机基团所覆盖,是真正意义上具有有机-无机杂化结构的纳米材料。其无机硅-氧核心笼型结构,具有良好的机械性能;外围的有机基团具有极高的可设计性和反应性,可接一个或多个有机活性官能团。这些有机取代基团可分为两大类:一类是惰性基团,如环己基、环戊基、乙基、异丁基等;另一类是活性基团,如各类烯基、环氧基、氨基等。POSS引入聚合物基体中时,外围的非反应性有机基团可增强其与聚合物基体之间的相容性;外围的反应性基团可通过聚合、接枝、表面键合或其他方式与基体型成共价键连接,实现POSS均匀分散并与基体型成分子水平、性能优越的三维新型有机-无机复合材料,使材料性能得到较大改善,在航天、航空、电子、光学、医药、材料高科技等领域有着非常广阔的应用前景。
目前,POSS的合成主要有以下三种方法:其一是水解缩合法,是制备POSS最直接的一种方法,该法以RSiX3型单体为原料,在特定条件下缩聚反应自组装成相应的POSS单体,反应收率受R、溶剂和催化剂的共同影响,其中又分为酸催化和碱催化两种反应类型;其二是缺角闭环法,即RSiX3在一定条件下不完全水解时,会缩聚生成较稳定的缺角七聚POSS,再按等物质量比例加入含活性基团的硅氧烷单体于溶剂中以水为催化剂水解缩聚闭环得到相应POSS单体,此类七聚缺角POSS也可由笼形八聚POSS在碱催化剂作 用下开环降解得到,通过使用新型碱性催化剂,可以得到超纯POSS单体;其三是官能团衍生法,即利用几种常见POSS为原料,通过化学反应可以得到一系列带活性基团的POSS衍生物,目前应用较多的主要有氢基POSS和氢氧化四甲铵基POSS,前者主要利用氢基与不饱和化合物进行硅氢加成反应,后者主要利用硅烷化反应引入新的活性基团。本发明即详细阐述利用官能团衍生法制备一种八环己烷环氧烷笼型倍半硅氧烷的制备方法。
发明内容
本发明提供了一种八环己烷环氧烷笼型倍半硅氧烷及其制备方法,以已工业化的原硅酸四乙酯基酯及四甲基氢氧化铵为初级原料,首先经缩合合成出八聚四甲铵基笼型倍半硅氧烷,后经硅氢化反应制得八聚氢基二甲基硅烷基笼型倍半硅氧烷,经硅氢加成反应制得八环己烷环氧烷笼型倍半硅氧烷,相比于以乙烯基三氯硅烷为原料经水解缩合,再经氧化制备的多为混合产物的笼型倍半硅氧烷,本发明产品结构单一,产率高,简单易行。
一种八环己烷环氧烷笼型倍半硅氧烷,其结构式如下:
上述八环己烷环氧烷笼型倍半硅氧烷的制备方法,包括八聚四甲铵基笼型倍半硅氧烷的合成、八聚氢基二甲基硅烷基笼型倍半硅氧烷的制备、八环己烷环氧烷笼型倍半硅氧烷的制备三个步骤,具体如下:
(1)在圆底烧瓶中加入四甲基氢氧化铵(TMAH),甲醇水溶液,在冰浴中搅拌,然后加入四乙氧基硅烷(TEOS),在室温下搅拌24h,即得到分散于溶液中的八聚四甲铵基 笼型倍半硅氧烷;
(2)将此混合物在冰浴条件下,逐滴加入到另一个已加入正己烷和二甲基氯硅烷(DMCS)的三口烧瓶中,该混合物在室温下搅拌3h;用梨型漏斗分液,取上层液体旋蒸,抽滤,用甲醇清洗3次,得白色粉末固体,干燥,即得到八聚氢基二甲基硅烷基笼型倍半硅氧烷;
(3)在三口烧瓶中加入无水甲苯,取八聚氢基二甲基硅烷基笼型倍半硅氧烷,搅拌5min,加入1,2-环氧4-乙烯基环己烷,加入铂(0)-1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷络合物Pt(dvs)。在50℃下搅拌、反应24h;冷却,加入干活性炭,搅拌5min后;混合物通过0.45μm的聚四氟乙烯膜,过滤,减压旋蒸,得不透明粘性液体,即为八环己烷环氧烷笼型倍半硅氧烷。
本发明八环己烷环氧烷笼型倍半硅氧烷的制备方法的合成路线如下:
本发明所合成的的八环己烷环氧烷笼型倍半硅氧烷在阳离子引发剂的作用下可发生阳离子开环聚合反应,反应过程中聚合收缩较小,且可引入网络交联点,可应用于齿科树脂的改性,提高材料聚合收缩及机械性能。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下列举实例对本发明进行进一步的详细说明。本领域技术人员应当理解,所述的实例仅仅用于帮助理解本发明,并不用于限定本发明。
实施例1:
(1)八聚四甲铵基笼型倍半硅氧烷的合成
在500mL圆底烧瓶中加入41.0mL的四甲基氢氧化铵(TMAH),50.96mL甲醇,15mL水,在冰浴中搅拌,然后加入22mL四乙氧基硅烷(TEOS),室温下搅拌24h;用旋转蒸发器将反应液浓缩至8倍,置于冰箱中冷冻使其结晶,晶体经丙酮洗,真空干燥得八聚四甲铵基笼型倍半硅氧烷,产率97%。其核磁共振及红外吸收分析表征数据为:29Si-NMR(119MHz,CD3OD,300K,ppm)-99.1;13C-NMR(159MHz,CD3OD,300K,ppm)15.10;1H-NMR(600MHz,CD3OD,300K,ppm)3.19;FTIR(cm-1,KBr)3393,1643(νN-O),1489(νasC-N),1116(νSi-O-Si)
(2)八聚氢基二甲基硅烷基笼型倍半硅氧烷的制备
取2.85g八聚四甲铵基笼型倍半硅氧烷,加入另一个1L的三口烧瓶中(瓶内已加入500mL正己烷及60mL二甲基氯硅烷),该混合物在室温下搅拌3h;用梨型漏斗分液,取上层液体旋蒸,抽滤,用甲醇清洗3次,得白色粉末固体,干燥,即得到二甲基硅烷基笼型倍半硅氧烷,产率95%。其核磁共振及红外吸收分析表征数据为:29Si-NMR(119MHz,CD3OD,300K,ppm)-108.66,1.40;FTIR(cm-1,KBr)2968(νasC-H),2147(νSi-H),1101(νSi-O-Si)
(3)八环己烷环氧烷笼型倍半硅氧烷的制备
在100mL三口烧瓶中加入20mL无水甲苯,2.0g二甲基硅烷基笼型倍半硅氧烷,搅拌5min,加入2g1,2-环氧4-乙烯基环己烷,加入0.1g铂(0)-1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷络合物Pt(dvs)。在50℃下搅拌、反应24h;冷却,加入干活性炭,搅拌5min后;混合物通过0.45μm的聚四氟乙烯膜,过滤到100mL茄型瓶中,旋蒸,除溶剂得到不透明的粘性液体,即为八环己烷环氧烷笼型倍半硅氧烷。其核磁共振及红外吸收分析表征数据为:29Si-NMR(119MHz,CD3OD,300K,ppm)-108.5;FTIR(cm-1,KBr)2967(νasC-H),2145(νSi-H),1097(νSi-O-Si)
实施例2:
(1)八聚四甲铵基笼型倍半硅氧烷的合成
在500mL圆底烧瓶中加入41.0mL的四甲基氢氧化铵(TMAH),50.96mL甲醇,15mL水,在冰浴中搅拌,然后加入22mL四乙氧基硅烷(TEOS),室温下搅拌24h;此时八聚四甲铵基笼型倍半硅氧烷均匀分散于反应液中。
(2)八聚氢基二甲基硅烷基笼型倍半硅氧烷的制备
将第一步反应混合溶液在冰浴条件下滴加到另一个1L的三口烧瓶中(瓶内已加入500mL正己烷及60mL二甲基氯硅烷),该混合物在室温下搅拌3h;用梨型漏斗分液,取上层液体旋蒸,抽滤,用甲醇清洗3次,得白色粉末固体,干燥,即得到二甲基硅烷基笼型倍半硅氧烷,产率95%。其核磁共振及红外吸收分析表征数据为:29Si-NMR(119MHz,CD3OD,300K,ppm)-108.66,1.40;FTIR(cm-1,KBr)2968(νasC-H),2147(νSi-H),1101(νSi-O-Si)
(3)八环己烷环氧烷笼型倍半硅氧烷的制备
在100mL三口烧瓶中加入20mL无水甲苯,2.0g二甲基硅烷基笼型倍半硅氧烷,搅拌5min,加入2g1,2-环氧4-乙烯基环己烷,加入0.1g铂(0)-1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷络合物Pt(dvs)。在50℃下搅拌、反应24h;冷却,加入干活性炭,搅拌5min后;混合物通过0.45μm的聚四氟乙烯膜,过滤到100mL茄型瓶中,旋蒸,除溶剂得到不透明的粘性液体,即为八环己烷环氧烷笼型倍半硅氧烷。其核磁共振及红外吸收分析表征数据为:29Si-NMR(119MHz,CD3OD,300K,ppm)-108.5;FTIR(cm-1,KBr)2967(νasC-H),2145(νSi-H),1097(νSi-O-Si)
实施例3:
1、制备八环己烷环氧烷笼型倍半硅氧烷:
制备方法同实施例1;
2、制备硅烷化微米二氧化硅:
(1)将微米级二氧化硅置于100℃真空烘箱中干燥24h;
(2)称取干燥粉体10g置于500mL单口烧瓶中,依次加入100mL环己烷、1.1mLγ-甲基丙烯酰氧丙基三甲氧基硅烷(γ-MPS)、0.51mL正丙胺,
(3)混合液先超声10min后,再于室温下搅拌30min,然后于60℃油浴锅中搅拌反应0.5h;
(4)将反应液倒入旋转蒸发装置中在60℃的条件下减压旋蒸,待溶剂被蒸出后将温度调至95℃,进一步旋蒸45min;
(5)最后将所得的白色粉末置于80℃真空烘箱内干燥18h,即得到硅烷化的微米级二氧化硅。
3、按重量比7:3将双酚A-甲基丙烯酸缩水甘油酯(Bis-GMA)和二甲基丙烯酸三甘醇酯(TEGDMA)混合均匀形成树脂基体备用;
4、量取15.2g树脂基体于50mL烧杯中,加入0.8g八环己烷环氧烷笼型倍半硅氧烷,搅拌均匀,超声0.5h;
5、加入0.4g樟脑醌(CQ)、0.4g对二甲氨基苯甲酸乙酯(EDAB)、0.4g六氟碘酸 二苯基碘鎓盐(PI),避光搅拌均匀,避光超声2h;
6、加入24g硅烷化微米二氧化硅,避光加入树脂中,避光搅拌,使硅烷化微米二氧化硅与树脂充分润湿;
7、将复合树脂避光搅拌均匀后,避光超声2h;
8、真空除气泡、倒入模具、蓝光固化60s后即可得到复合树脂材料;
9、对材料进行聚合收缩率、力学性能、吸水溶解性能测试。
实施例4:
1、制备八环己烷环氧烷笼型倍半硅氧烷:
制备方法同实施例1;
2、制备硅烷化微米二氧化硅:
制备方法同实施例3;
3、按重量比7:3将双酚A-甲基丙烯酸缩水甘油酯(Bis-GMA)和二甲基丙烯酸三甘醇酯(TEGDMA)混合均匀形成树脂基体备用;
4、量取14.4g树脂基体于50mL烧杯中,加入1.6g八环己烷环氧烷笼型倍半硅氧烷,搅拌均匀,超声0.5h;
5、加入0.4g樟脑醌(CQ)、0.4g对二甲氨基苯甲酸乙酯(EDAB)、0.4g六氟碘酸二苯基碘鎓盐(PI),避光搅拌均匀,避光超声2h;
6、加入24g硅烷化微米二氧化硅,避光加入树脂中,避光搅拌,使硅烷化微米二氧化硅与树脂充分润湿;
7、将复合树脂避光搅拌均匀后,避光超声2h;
8、真空除气泡、倒入模具、蓝光固化100s后即可得到复合树脂材料;
9、对材料进行聚合收缩率、力学性能、吸水溶解性能测试。
实施例5:
1、制备八环己烷环氧烷笼型倍半硅氧烷:
制备方法同实施例1;
2、制备硅烷化微米二氧化硅:
制备方法同实施例3;
3、按重量比7:3将双酚A-甲基丙烯酸缩水甘油酯(Bis-GMA)和二甲基丙烯酸三甘醇酯(TEGDMA)混合均匀形成树脂基体备用;
4、量取13.6g树脂基体于50mL烧杯中,加入2.4g八环己烷环氧烷笼型倍半硅氧烷,搅拌均匀,超声0.5h;
5、加入0.4g樟脑醌(CQ)、0.4g对二甲氨基苯甲酸乙酯(EDAB)、0.4g六氟碘酸二苯基碘鎓盐(PI),避光搅拌均匀,避光超声2h;
6、加入24g硅烷化微米二氧化硅,避光加入树脂中,避光搅拌,使硅烷化微米二氧化硅与树脂充分润湿;
7、将复合树脂避光搅拌均匀后,避光超声2h;
8、真空除气泡、倒入模具、蓝光固化60s后即可得到复合树脂材料;
9、对材料进行聚合收缩率、力学性能、吸水溶解性能测试。
实施例6:
1、制备八环己烷环氧烷笼型倍半硅氧烷:
制备方法同实施例1;
2、制备硅烷化微米二氧化硅:
制备方法同实施例3;
3、按重量比7:3将双酚A-甲基丙烯酸缩水甘油酯(Bis-GMA)和二甲基丙烯酸三甘醇酯(TEGDMA)混合均匀形成树脂基体备用;
4、量取12.8g树脂基体于50mL烧杯中,加入3.2g八环己烷环氧烷笼型倍半硅氧烷,搅拌均匀,超声0.5h;
5、加入0.4g樟脑醌(CQ)、0.4g对二甲氨基苯甲酸乙酯(EDAB)、0.4g六氟碘酸二苯基碘鎓盐(PI),避光搅拌均匀,避光超声2h;
6、加入24g硅烷化微米二氧化硅,避光加入树脂中,避光搅拌,使硅烷化微米二氧化硅与树脂充分润湿;
7、将复合树脂避光搅拌均匀后,避光超声2h;
8、真空除气泡、倒入模具、蓝光固化60s后即可得到复合树脂材料;
9、对材料进行聚合收缩率、力学性能、吸水溶解性能测试。
齿科复合树脂材料组分及各组分含量(wt%)
组分 | 实施例1 | 实施例2 | 实施例3 | 实施例4 |
Bis-GMA | 24.5 | 23.1 | 21.7 | 20.3 |
TEGDMA | 10.5 | 9.9 | 9.3 | 8.7 |
POSS | 2 | 4 | 6 | 8 |
CQ | 1 | 1 | 1 | 1 |
EDAB | 1 | 1 | 1 | 1 |
PI | 1 | 1 | 1 | 1 |
SiO2 | 60 | 60 | 60 | 60 |
齿科复合树脂材料体积收缩率(%)
组分 | 实施例1 | 实施例2 | 实施例3 | 实施例4 |
体积收缩率(%) | 2.83 | 2.42 | 2.36 | 2.23 |
齿科复合树脂材料挠曲强度(MPa)
组分 | 实施例1 | 实施例2 | 实施例3 | 实施例4 |
挠曲强度(MPa) | 105.69 | 147.69 | 158.22 | 211.58 |
齿科复合树脂材料压缩强度(MPa)
组分 | 实施例1 | 实施例2 | 实施例3 | 实施例4 |
压缩强度(MPa) | 120.55 | 135.97 | 152.60 | 163.4 |
齿科复合树脂材料邵氏硬度HD(%)
组分 | 实施例1 | 实施例2 | 实施例3 | 实施例4 |
邵氏硬度HD | 88.2 | 90.1 | 91.3 | 90.0 |
齿科复合树脂材料吸水值(μg·mm-3)及溶解值(μg·mm-3)
组分 | 实施例1 | 实施例2 | 实施例3 | 实施例4 |
吸水值(μg·mm-3) | 1.15 | 1.04 | 0.12 | 0.11 |
溶解值(μg·mm-3) | 2.92 | 2.04 | 1.22 | 0.44 |
Claims (2)
1.一种八环己烷环氧烷笼型倍半硅氧烷,其结构式如下:
2.如权利要求1所述的八环己烷环氧烷笼型倍半硅氧烷,其特征在于,采用以下步骤进行制备:
(1)在圆底烧瓶中加入四甲基氢氧化铵,甲醇水溶液,在冰浴中搅拌,然后加入四乙氧基硅烷,在室温下搅拌24h,即得到分散于溶液中的八聚四甲铵基笼型倍半硅氧烷;
(2)将此混合物在冰浴条件下,逐滴加入到另一个已加入正己烷和二甲基氯硅烷的三口烧瓶中,该混合物在室温下搅拌3h;用梨型漏斗分液,取上层液体旋蒸,抽滤,用甲醇清洗3次,得白色粉末固体,干燥,即得到八聚氢基二甲基硅烷基笼型倍半硅氧烷;
(3)在三口烧瓶中加入无水甲苯,取八聚氢基二甲基硅烷基笼型倍半硅氧烷,搅拌5min,加入1,2-环氧4-乙烯基环己烷,加入催化剂铂(0)-1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷络合物Pt;在50℃下搅拌、反应24h;冷却,加入干活性炭,搅拌5min后;混合物通过0.45μm的聚四氟乙烯膜,过滤,减压旋蒸,得不透明粘性液体,即为八环己烷环氧烷笼型倍半硅氧烷。
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WO2023083325A1 (zh) * | 2021-11-12 | 2023-05-19 | 北京深云智合科技有限公司 | 阻燃剂及其应用和耐火型环氧树脂 |
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