CN106116688B - 一种具有多层结构的陶瓷的制作方法 - Google Patents
一种具有多层结构的陶瓷的制作方法 Download PDFInfo
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- CN106116688B CN106116688B CN201610500997.6A CN201610500997A CN106116688B CN 106116688 B CN106116688 B CN 106116688B CN 201610500997 A CN201610500997 A CN 201610500997A CN 106116688 B CN106116688 B CN 106116688B
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Abstract
本发明提供一种具有多层结构的陶瓷的制作方法,包括以下步骤:普通陶瓷砖坯料制作面坯、泡沫陶瓷底坯坯料制备泡沫陶瓷底坯的制作,将所述面坯和泡沫陶瓷底坯压制成为相互间隔的多层,瓷砖最上面一层为面坯,面坯干燥后,得到半成品;在半成品上色,经一次共烧形成泡沫陶瓷底坯层与非多孔面坯层共存的多层结构的陶瓷砖。本发明具有多层结构的陶瓷砖,轻且便于粘贴,面坯紧实光色度高的优点。
Description
技术领域
本发明涉及陶瓷生产领域,特别是一种具有多层结构的陶瓷的制作方法。
背景技术
目前外墙保温所用的材料主要是聚苯板、聚氨酯板、酚醛等保温板,这些有机保温材料的防火等级属于B级,不耐高温、易燃烧,而且在燃烧时释放大梁的热量,同时长生大梁的有毒有害气体,不仅会加速大伙的蔓延、而且容易造成被困人员及救援人员的伤亡;外墙保温材料也会使用石棉板、玻璃面板等无机保温材料,这些无机保温材料存在粉尘和细小纤维,既污染空气又滋生细菌,早已成为危害人们健康的隐患;泡沫玻璃的保温性能然后还不错,但是在使用温度、抗压强度、抗折强度上还有待提高。
泡沫瓷砖具有隔热、保暖、隔音、吸音、透水、防潮、调湿等功能,应用领域十分广阔,主要产品有:渗水道路广场砖、轻质外墙砖、轻质内墙砖、温暖地砖、隔热砖、吸音砖、隔音砖、呼吸调湿砖等。目前,这些产品都是由整体的泡沫陶瓷材料制成(整体式),而由于泡沫陶瓷材料存在吸湿性、抗冻性差、机械强度低、不耐磨、不耐污等缺点,限制了整体式多孔陶瓷产品应用领域的进一步推广。
泡沫陶瓷的制备方法主要有有机前驱体浸渍法、添加造孔剂法、直接起泡法和溶胶-凝胶法。与其它方法相比,直接起泡法更易于控制产品的形状、成分和密度。直接起泡法以泡沫作为中间体,通过改变发泡剂的种类和用量可制备出不同孔径和孔隙率的泡沫陶瓷。在所有关于泡沫的应用研究中,泡沫的热力学不稳定性都是一个关键的因素。采用直接起泡法制备多孔陶瓷,首先必须提高泡沫稳定性,获得具有一定稳定性的陶瓷泡沫。在泡沫陶瓷制作过程中,由于烧失量大,发气量大,造成表面外观差。
将多孔陶瓷与非多孔陶瓷相复合(复合式),则可以使产品克服各自材料的缺点,发挥各类陶瓷材料各自的优点,扬长避短。目前一般是将烧好的两类陶瓷通过粘合剂复合为一体,这样做,存在能耗大,工艺复杂,设备多,生产成本高的问题。
发明内容
本发明所要解决的技术问题是提供一种多层陶瓷制备方法,能够解决各类陶瓷的缺点。
本发明技术方案:
一种具有多层结构的陶瓷的制作方法,所述方法包括以下步骤:
1)制备普通陶瓷砖坯料备用;
2)制备泡沫陶瓷坯料,所述坯料的包括按重量份计的以下组分:
氮化硅粉100~120份,烧结助剂3~10份,分散剂0.5~1.5份,羧甲基纤维素和魔芋葡聚糖的水溶液10~15份,坯体烧成收缩剂20~150 份;发泡剂0.03~20份;
3)将普通陶瓷砖坯料成型后,普通陶瓷砖坯料正面朝下放入模具中,再灌入泡沫陶瓷坯料到模具中,压制成型制成多层结构的瓷砖坯;
4)多层结构的瓷砖坯干燥后,得到半成品;
5)经共烧形成多层结构的陶瓷砖。
优选地,所述普通陶瓷砖坯料中包括按重量份计的以下组分:
粘土10~15份,烧滑石1~5份,萤石4~8份,石英5~10份,抛光渣74~85份,硼钙石2~5份,解胶剂0.2~1.2份,羧甲基淀粉钠0~0.5份,三聚磷酸钠0.2~0.4份。
优选地,所述步骤1)制备的所述普通陶瓷砖坯料经加水球磨、过筛、喷雾干燥,成形备用。
优选地,所述步骤2)羧甲基纤维素和魔芋葡聚糖的水溶液浓度为1%~2%,羧甲基纤维素和魔芋葡聚糖质量比为10~20:1;所述烧结助剂采用Y2O3-La2O3体系,两者的质量比为Y2O3:La2O3=1~2.5:1;所述坯体烧成收缩剂选自碳粉、面粉、玉米粉、红薯粉、淀粉、酵母粉、石蜡、沥青粉、木屑、植物纤维、明胶、凝胶、魔芋葡聚糖中的一种或几种的混合物;所述发泡剂为戊酸或没食子酸正丙酯或氮化硼、碳酸钙中的一种或几种的混合物,所述发泡剂的粒径小于50微米。
优选地,所述步骤3)泡沫陶瓷坯料到模具中的方法为:按泡沫陶瓷坯原料配比称取混合,按混合物总质量的1~2倍加入去离子水得到混料;调节混料的pH值,调节后的混料pH 值为9~11,将混料球磨后得到浆料;将球磨后的浆料加入适量引发剂和催化剂搅拌发泡,注入到模具中、固化成型后进行干燥和排胶;将排胶后的坯体在氮气气氛下进行常压烧结,得到多层结构的瓷砖坯;烧结过程分阶段进行:850℃以下升温速率为20℃/min,气氛为氦气,800℃以上升温速率为 15℃/min 升至烧结温度,烧结温度为1500℃~1750℃,气氛为氮气,保温1.5~2.5 h。
优选地,所述方法还包括普通陶瓷砖坯料正面进行渗花、丝网印刷、凹版印刷、辊筒印刷、喷墨打印或施釉装饰的步骤。
优选地,普通陶瓷砖坯料正面经干燥后施底釉,经印花装饰成为釉上彩坯。
优选地,所述底釉包括以下重量份的组分:熔块 81 ~ 90 份,高岭土 8 ~ 12份,石英2~7 份,粘土3~7份, 石英28~32份,氧化钛8~12份, 二氧化钛3~5份、氧化铁3~7份, 氧化铅3~6份,三氧化二锑5~6份,氟硅酸钠3~6份份, 硅酸锆为3~6份。
优选地,在坯温 65~70℃喷施所述底釉,制备成釉坯待用;施底釉后釉坯再经过数字喷墨、胶辊、平板印刷中的一种或者多种印花装饰制成釉上彩坯,上面喷适量施甲基纤维素固定待用。
优选地,所述步骤5)共烧温度为1000~1050℃,烧成时间60~150分钟。普通陶瓷砖坯料、泡沫陶瓷坯料进行共烧制成,两者之间的结合力更强,
优选地,所述步骤5)共烧时,普通陶瓷砖坯料正面朝下,保证在得到的多层结构的陶瓷结构表面光滑,在烧结过程中不会破坏。
本发明与现有技术相比的有益效果 :
1、本发明具有多层结构的陶瓷砖,轻且便于粘贴,外表面紧实光色度高的优点;
2、本发明泡沫瓷砖坯料,采用羧甲基纤维素和魔芋葡聚糖混合水溶液作为粘结剂,在羧甲基纤维素的基础上加入魔芋葡聚糖,使泡沫体系表面张力降低、浆料粘弹性增加、泡沫浆料的流动性和稳定性得到改善、泡沫干燥过程中收缩小、成品率高,泡沫孔径较小,进而使烧结体力学性能优异、泡沫气孔分布均匀;
3、发明通过直接机械搅拌起泡技术,制备泡沫陶瓷坯料,泡沫稳定性好,力学性能优异,出其他现有技术制备的氮化硅泡沫陶瓷10~30%),氮化硅泡沫陶瓷气孔率>60%,抗弯强度高;
4、本发明制备工艺在泡沫体干燥过程收缩较小,表面结构均匀,制备的多层结构的陶瓷砖结构均匀、孔径较小、平均孔径为20μm左右,均匀分布的孔结构能够有效改善陶瓷的力学性能;
5、本发明由于泡沫陶瓷与普通陶瓷砖坯料嵌套式放置,两者之间的结合力更强,制作的多层结构陶瓷砖表面光滑,同时减少了生产的加工工序,降低了能耗及生产成本;
6、本发明采用低温共烧,可以规避抛光砖废渣可能引起的发泡现象,同时配方中大幅降低粘土的用量,引入多增强技术,不但确保多层结构陶瓷砖的强度,而且大幅减少烧成过程中排气,有效解决烧成缩釉、针孔、黑心、耐酸碱、吸污等问题,并大幅扩宽了色料的色域范围,提升产品的热稳定性,减少龟裂和冷加工开裂;
7、本发明底釉具有良好的耐酸碱性,且釉面光滑度好、釉浆性能好、烧成范围宽,釉料耐磨不易脱落,且还具有良好的抗热震性能;
8、本发明采用多层复合结构,增加一层装饰作用的表面材料,能直接使用在建筑物内墙、外墙、屏风上,不仅使装饰、保温、防火融为一体,而且大幅降低装修成本,减小建筑物重量,节约能源,使用范围大,具有远大的前景。
具体实施方式
下面结合实施例来进一步说明本发明,但本发明要求保护的范围并不局限于实施例表述的范围。
实施例1
一种具有多层结构的陶瓷的制作方法,所述方法包括以下步骤:
1)制备普通陶瓷砖坯料备用;
2)制备泡沫陶瓷坯料,所述坯料的包括按重量份计的以下组分:
氮化硅粉100份,烧结助剂3份,分散剂0.5份,羧甲基纤维素和魔芋葡聚糖的水溶液10份,坯体烧成收缩剂20份;发泡剂0.03份;
3)将普通陶瓷砖坯料成型后,普通陶瓷砖坯料正面朝下放入模具中,再灌入泡沫陶瓷坯料到模具中,制成多层结构的瓷砖坯;采用正面朝下的方案,能够避免在压制过程中,损坏普通陶瓷砖坯,优选的,普通陶瓷砖坯的厚度低于整体厚度的1/3。
4)多层结构的瓷砖坯干燥后,得到半成品;
5)经共烧形成多层结构的陶瓷砖。
所述普通陶瓷砖坯料中包括按重量份计的以下组分:
粘土10份,烧滑石5份,萤石4份,石英5份,抛光渣74份,硼钙石2份,解胶剂0~1.2份,羧甲基淀粉钠0.2份,三聚磷酸钠0.2份。
所述步骤1)制备的所述普通陶瓷砖坯料经加水球磨、过筛、喷雾干燥,成形备用。
所述步骤2)羧甲基纤维素和魔芋葡聚糖的水溶液浓度为1%,羧甲基纤维素和魔芋葡聚糖质量比为10:1;所述烧结助剂采用Y2O3-La2O3体系,两者的质量比为Y2O3:La2O3=1:1;所述坯体烧成收缩剂选自碳粉红薯粉、淀粉、凝胶、魔芋葡聚糖中的一种或几种的混合物;所述发泡剂为没食子酸正丙酯,所述发泡剂的粒径小于50微米。
所述步骤3)泡沫陶瓷坯料到模具中的方法为:按泡沫陶瓷底坯原料配比称取混合,按混合物总质量的1倍加入去离子水得到混料;调节混料的pH值,调节后的混料 pH 值为9,将混料球磨后得到浆料;将球磨后的浆料加入适量引发剂和催化剂搅拌发泡,注模、固化成型后进行干燥和排胶;将排胶后的坯体在氮气气氛下进行常压烧结,得到多层结构的瓷砖坯;烧结过程分阶段进行:850℃以下升温速率为20℃/min,气氛为氦气,800℃以上升温速率为 15℃/min 升至烧结温度,烧结温度为1500℃℃,气氛为氮气,保温1.5 h,烧结温度越高其力学性能越好、烧结体更致密、但可能对气孔率有影响,本实施例温度范围适宜。
引发剂可采用过硫酸铵或过硫酸钾,但不限于此,催化剂可采用 N,N,N’,N’,-四甲基乙二胺 C6H16N2。
所述方法还包括将普通陶瓷砖坯料正面进行渗花、丝网印刷、凹版印刷、辊筒印刷、喷墨打印或施釉装饰的步骤。
半成品的普通陶瓷砖坯料正面经干燥后施底釉,经印花装饰成为釉上彩坯。
所述底釉包括以下重量份的组分:熔块 81份,高岭土 8份,石英2份,粘土3份, 石英28份,氧化钛8份,二氧化钛3份、氧化铁3份, 氧化铅3份,三氧化二锑5份,氟硅酸钠3份,硅酸锆为3份。
在坯温 65℃喷施所述底釉,制备成釉坯待用;施底釉后釉坯再经过数字喷墨、胶辊、平板印刷中的一种或者多种印花装饰制成釉上彩坯,上面喷适量施甲基纤维素固定待用。
优选的方案中,所述步骤5)共烧温度为1000℃,烧成时间60分钟,普通陶瓷砖坯料正面朝下。由此方案,避免泡沫陶瓷坯料在烧制过程中的变形影响整体外观效果。进一步优选的方案中,在共烧烧制后,再在通陶瓷砖坯料正面上色施釉。
实施例2
一种具有多层结构的陶瓷的制作方法,所述方法包括以下步骤:
1)制备普通陶瓷砖坯料备用;
2)制备泡沫陶瓷坯料,所述坯料的包括按重量份计的以下组分:
氮化硅粉120份,烧结助剂10份,分散剂1.5份,羧甲基纤维素和魔芋葡聚糖的水溶液15份,坯体烧成收缩剂150份;发泡剂20份;
3)将普通陶瓷砖坯料成型后,普通陶瓷砖坯料正面朝下放入模具中,再灌入泡沫陶瓷坯料到模具中,制成多层结构的瓷砖坯;
4)多层结构的瓷砖坯干燥后,得到半成品;
5)经共烧形成多层结构的陶瓷砖。
所述普通陶瓷砖坯料中包括按重量份计的以下组分:
粘土15份,烧滑石5份,萤石8份,石英10份,抛光渣85份,硼钙石5份,解胶剂1.2份,羧甲基淀粉钠0.5份,三聚磷酸钠0.4份。
所述步骤1)制备的所述普通陶瓷砖坯料经加水球磨、过筛、喷雾干燥,成形备用。
所述步骤2)羧甲基纤维素和魔芋葡聚糖的水溶液浓度为1%~2%,羧甲基纤维素和魔芋葡聚糖质量比为20:1;所述烧结助剂采用Y2O3-La2O3体系,两者的质量比为Y2O3:La2O3=2.5:1;所述坯体烧成收缩剂选自魔芋葡聚糖;所述发泡剂为戊酸、没食子酸正丙酯的混合物,所述发泡剂的粒径小于50微米。
所述步骤3)泡沫陶瓷坯料到模具中的方法为:按泡沫陶瓷坯原料配比称取混合,按混合物总质量的2倍加入去离子水得到混料;调节混料的pH值,调节后的混料 pH 值为11,将混料球磨后得到浆料;将球磨后的浆料加入适量引发剂和催化剂搅拌发泡,注模、固化成型后进行干燥和排胶;将排胶后的坯体在氮气气氛下进行常压烧结,得到多层结构的瓷砖坯;烧结过程分阶段进行:850℃以下升温速率为20℃/min,气氛为氦气,800℃以上升温速率为 15℃/min 升至烧结温度,烧结温度为1750℃,气氛为氮气,保温2.5 h,烧结温度越高其力学性能越好、烧结体更致密、但可能对气孔率有影响,本实施例温度范围适宜。
引发剂可采用过硫酸铵或过硫酸钾,但不限于此,催化剂可采用 N,N,N’,N’,-四甲基乙二胺 C6H16N2。
所述方法还包括将半成品中的普通陶瓷砖坯料正面进行渗花、丝网印刷、凹版印刷、辊筒印刷、喷墨打印或施釉装饰的步骤。
半成品的普通陶瓷砖坯料正面经步骤4)干燥后施底釉,经印花装饰成为釉上彩坯。
所述底釉包括以下重量份的组分:熔块90 份,高岭土12 份,石英7 份,粘土7份,石英32份,氧化钛12份, 二氧化钛5份、氧化铁7份, 氧化铅6份,三氧化二锑6份,氟硅酸钠份, 硅酸锆为6份。
在坯温 65~70℃喷施所述底釉,制备成釉坯待用;施底釉后釉坯再经过数字喷墨、胶辊、平板印刷中的一种或者多种印花装饰制成釉上彩坯,上面喷适量施甲基纤维素固定待用。
所述步骤5)共烧温度为1050℃,烧成时间150分钟。共烧时,普通陶瓷砖坯料正面朝下。
实施例3
一种具有多层结构的陶瓷的制作方法,所述方法包括以下步骤:
1)制备普通陶瓷砖坯料备用;
2)制备泡沫陶瓷坯料,所述坯料的包括按重量份计的以下组分:
氮化硅粉110份,烧结助剂5份,分散剂0.8份,羧甲基纤维素和魔芋葡聚糖的水溶液11份,坯体烧成收缩剂50份;发泡剂5份;
3)将普通陶瓷砖坯料成型后,普通陶瓷砖坯料正面朝下放入模具中,再灌入泡沫陶瓷坯料到模具中,制成多层结构的瓷砖坯;
4)多层结构的瓷砖坯干燥后,得到半成品;
5)经共烧形成多层结构的陶瓷砖。
所述普通陶瓷砖坯料中包括按重量份计的以下组分:
粘土12份,烧滑石3份,萤石5份,石英6份,抛光渣76份,硼钙石3份,解胶剂0.8份,羧甲基淀粉钠0.3份,三聚磷酸钠0.3份。
所述步骤1)制备的所述普通陶瓷砖坯料经加水球磨、过筛、喷雾干燥,成形备用。
所述步骤2)羧甲基纤维素和魔芋葡聚糖的水溶液浓度为1.5%,羧甲基纤维素和魔芋葡聚糖质量比为15:1;所述烧结助剂采用Y2O3-La2O3体系,两者的质量比为Y2O3:La2O3=1.5:1;所述坯体烧成收缩剂选自玉米粉、红薯粉、沥青粉、木屑、植物纤维、魔芋葡聚糖中的一种或几种的混合物;所述发泡剂为戊酸、没食子酸正丙酯、氮化硼、的混合物,所述发泡剂的粒径小于50微米。
所述步骤3)泡沫陶瓷坯料到模具中的方法为:按泡沫陶瓷坯原料配比称取混合,按混合物总质量的1~2倍加入去离子水得到混料;调节混料的pH值,调节后的混料 pH 值为9~11,将混料球磨后得到浆料;将球磨后的浆料加入适量引发剂和催化剂搅拌发泡,注模、固化成型后进行干燥和排胶;将排胶后的坯体在氮气气氛下进行常压烧结,得到多层结构的瓷砖坯;烧结过程分阶段进行:850℃以下升温速率为20℃/min,气氛为氦气,800℃以上升温速率为 15℃/min 升至烧结温度,烧结温度为1650℃,气氛为氮气,保温2 h,烧结温度越高其力学性能越好、烧结体更致密、但可能对气孔率有影响,本实施例温度范围适宜。
引发剂可采用过硫酸铵或过硫酸钾,但不限于此,催化剂可采用 N,N,N’,N’,-四甲基乙二胺 C6H16N2。
所述步骤5)共烧温度为1010℃,烧成时间70分钟。
所述方法还包括将共烧后的普通陶瓷砖坯料正面进行渗花、丝网印刷、凹版印刷、辊筒印刷、喷墨打印或施釉装饰的步骤。
共烧后的普通陶瓷砖坯料正面施底釉,经印花装饰成为釉上彩坯。用于高档陶瓷。
所述底釉包括以下重量份的组分:熔块85份,高岭土9 份,石英5 份,粘土6份, 石英30份,氧化钛10份, 二氧化钛4份、氧化铁5份, 氧化铅5份,三氧化二锑5.5份,氟硅酸钠4份, 硅酸锆为4份。
在坯温 68℃喷施所述底釉,制备成釉坯待用;施底釉后釉坯再经过数字喷墨、胶辊、平板印刷中的一种或者多种印花装饰制成釉上彩坯,上面喷适量施甲基纤维素固定,再进行一次共烧,共烧温度为1000℃,烧成时间20分钟。
实施例4
一种具有多层结构的陶瓷的制作方法,所述方法包括以下步骤:
1)制备普通陶瓷砖坯料备用;
2)制备泡沫陶瓷坯料,所述坯料的包括按重量份计的以下组分:
氮化硅粉105份,烧结助剂8份,分散剂0.9份,羧甲基纤维素和魔芋葡聚糖的水溶液12份,坯体烧成收缩剂110份;发泡剂12份;
3)将普通陶瓷砖坯料成型后,普通陶瓷砖坯料正面朝下放入模具中,再灌入泡沫陶瓷坯料到模具中,制成多层结构的瓷砖坯;
4)多层结构的瓷砖坯干燥后,得到半成品;
5)经共烧形成多层结构的陶瓷砖。
所述普通陶瓷砖坯料中包括按重量份计的以下组分:
粘土12份,烧滑石4份,萤石5份,石英12份,抛光渣80份,硼钙石3份,解胶剂0.5份,羧甲基淀粉钠0.4份,三聚磷酸钠0.3份。
所述步骤1)制备的所述普通陶瓷砖坯料经加水球磨、过筛、喷雾干燥,成形备用。
所述步骤2)羧甲基纤维素和魔芋葡聚糖的水溶液浓度为1.6%,羧甲基纤维素和魔芋葡聚糖质量比为15:1;所述烧结助剂采用Y2O3-La2O3体系,两者的质量比为Y2O3:La2O3=1.5:1;所述坯体烧成收缩剂选自淀粉、酵母粉、石蜡、沥青粉、木屑、植物魔芋葡聚糖中的一种或几种的混合物;所述发泡剂为没食子酸正丙酯、碳酸钙的混合物,所述发泡剂的粒径小于50微米。
所述步骤3)泡沫陶瓷坯料到模具中的方法为:按泡沫陶瓷坯原料配比称取混合,按混合物总质量的1.5倍加入去离子水得到混料;调节混料的pH值,调节后的混料 pH 值为10,将混料球磨后得到浆料;将球磨后的浆料加入适量引发剂和催化剂搅拌发泡,注模、固化成型后进行干燥和排胶;将排胶后的坯体在氮气气氛下进行常压烧结,得到多层结构的瓷砖坯;烧结过程分阶段进行:850℃以下升温速率为20℃/min,气氛为氦气,800℃以上升温速率为 15℃/min 升至烧结温度,烧结温度为1650℃,气氛为氮气,保温2 h,烧结温度越高其力学性能越好、烧结体更致密、但可能对气孔率有影响,本实施例温度范围适宜。
引发剂可采用过硫酸铵或过硫酸钾,但不限于此,催化剂可采用 N,N,N’,N’,-四甲基乙二胺 C6H16N2。
所述方法还包括将半成品中的普通陶瓷砖坯料正面进行渗花、丝网印刷、凹版印刷、辊筒印刷、喷墨打印或施釉装饰的步骤。
半成品的普通陶瓷砖坯料正面经步骤4)干燥后施底釉,经印花装饰成为釉上彩坯。
所述底釉包括以下重量份的组分:熔块88份,高岭土10份,石英3份,粘土4份, 石英29份,氧化钛10份, 二氧化钛4份、氧化铁6份, 氧化铅5份,三氧化二锑5.6份,氟硅酸钠5份, 硅酸锆5份。
在坯温 65~70℃喷施所述底釉,制备成釉坯待用;施底釉后釉坯再经过数字喷墨、胶辊、平板印刷中的一种或者多种印花装饰制成釉上彩坯,上面喷适量施甲基纤维素固定待用。
所述步骤5)共烧温度为1010℃,烧成时间120分钟。
实施例5
一种具有多层结构的陶瓷的制作方法,所述方法包括以下步骤:
1)制备普通陶瓷砖坯料备用;
2)制备泡沫陶瓷坯料,所述坯料的包括按重量份计的以下组分:
氮化硅粉115份,烧结助剂8份,分散剂1.3份,羧甲基纤维素和魔芋葡聚糖的水溶液10~15份,坯体烧成收缩剂60 份;发泡剂12份;
3)将普通陶瓷砖坯料成型后,普通陶瓷砖坯料正面朝下放入模具中,再灌入泡沫陶瓷坯料到模具中,制成多层结构的瓷砖坯;
4)多层结构的瓷砖坯干燥后,得到半成品;
5)经共烧形成多层结构的陶瓷砖。
所述普通陶瓷砖坯料中包括按重量份计的以下组分:
粘土13份,烧滑石4份,萤石5份,石英8份,抛光渣82份,硼钙石3份,解胶剂0.9份,羧甲基淀粉钠0.3份,三聚磷酸钠0.2份。
所述步骤1)制备的所述普通陶瓷砖坯料经加水球磨、过筛、喷雾干燥,成形备用。
所述步骤2)羧甲基纤维素和魔芋葡聚糖的水溶液浓度为1%~2%,羧甲基纤维素和魔芋葡聚糖质量比为18:1;所述烧结助剂采用Y2O3-La2O3体系,两者的质量比为Y2O3:La2O3=1.9:1;所述坯体烧成收缩剂选自酵母粉、石蜡、沥青粉、木屑、植物纤维、魔芋葡聚糖中的一种或几种的混合物;所述发泡剂为戊酸、没食子酸正丙酯的混合物,所述发泡剂的粒径小于50微米。
所述步骤3)泡沫陶瓷坯料到模具中的方法为:按泡沫陶瓷坯原料配比称取混合,按混合物总质量的1~2倍加入去离子水得到混料;调节混料的pH值,调节后的混料 pH 值为10,将混料球磨后得到浆料;将球磨后的浆料加入适量引发剂和催化剂搅拌发泡,注模、固化成型后进行干燥和排胶;将排胶后的坯体在氮气气氛下进行常压烧结,得到多层结构的瓷砖坯;烧结过程分阶段进行:850℃以下升温速率为20℃/min,气氛为氦气,800℃以上升温速率为 15℃/min 升至烧结温度,烧结温度为1650℃,气氛为氮气,保温2.5 h,烧结温度越高其力学性能越好、烧结体更致密、但可能对气孔率有影响,本实施例温度范围适宜。
引发剂可采用过硫酸铵或过硫酸钾,但不限于此,催化剂可采用 N,N,N’,N’,-四甲基乙二胺 C6H16N2。
所述方法还包括将半成品中的普通陶瓷砖坯料正面进行渗花、丝网印刷、凹版印刷、辊筒印刷、喷墨打印或施釉装饰的步骤。
半成品的普通陶瓷砖坯料正面经步骤4)干燥后施底釉,经印花装饰成为釉上彩坯。
所述底釉包括以下重量份的组分:熔块85份,高岭土10份,石英6份,粘土5份, 石英30份,氧化钛10份, 二氧化钛3份、氧化铁4份, 氧化铅5份,三氧化二锑5份,氟硅酸钠4份, 硅酸锆为4份。
在坯温68℃喷施所述底釉,制备成釉坯待用;施底釉后釉坯再经过数字喷墨、胶辊、平板印刷中的一种或者多种印花装饰制成釉上彩坯,上面喷适量施甲基纤维素固定待用。
所述步骤5)共烧温度为1030℃,烧成时间120分钟。
实施例6
一种具有多层结构的陶瓷的制作方法,所述方法包括以下步骤:
1)制备普通陶瓷砖坯料备用;
2)制备泡沫陶瓷坯料,所述坯料的包括按重量份计的以下组分:
氮化硅粉105份,烧结助剂9份,分散剂1.3份,羧甲基纤维素和魔芋葡聚糖的水溶液12份,坯体烧成收缩剂110份;发泡剂18份;
3)将普通陶瓷砖坯料成型后,普通陶瓷砖坯料正面朝下放入模具中,再灌入泡沫陶瓷坯料到模具中,制成多层结构的瓷砖坯;
4)多层结构的瓷砖坯干燥后,得到半成品;
5)经共烧形成多层结构的陶瓷砖。
所述普通陶瓷砖坯料中包括按重量份计的以下组分:
粘土13份,烧滑石4份,萤石7份,石英8份,抛光渣83份,硼钙石4份,解胶剂1.1份,羧甲基淀粉钠0.2,三聚磷酸钠0.3份。
所述步骤1)制备的所述普通陶瓷砖坯料经加水球磨、过筛、喷雾干燥,成形备用。
所述步骤2)羧甲基纤维素和魔芋葡聚糖的水溶液浓度为1.2%,羧甲基纤维素和魔芋葡聚糖质量比为18:1;所述烧结助剂采用Y2O3-La2O3体系,两者的质量比为Y2O3:La2O3=2.2:1;所述坯体烧成收缩剂选自酵母粉、明胶、凝胶、魔芋葡聚糖中的混合物;所述发泡剂为戊酸、氮化硼、碳酸钙中的混合物,所述发泡剂的粒径小于50微米。
所述步骤3)泡沫陶瓷坯料到模具中的方法为:按泡沫陶瓷坯原料配比称取混合,按混合物总质量的1倍加入去离子水得到混料;调节混料的pH值,调节后的混料 pH 值为10,将混料球磨后得到浆料;将球磨后的浆料加入适量引发剂和催化剂搅拌发泡,注模、固化成型后进行干燥和排胶;将排胶后的坯体在氮气气氛下进行常压烧结,得到多层结构的瓷砖坯;烧结过程分阶段进行:850℃以下升温速率为20℃/min,气氛为氦气,800℃以上升温速率为 15℃/min 升至烧结温度,烧结温度为1650℃,气氛为氮气,保温1.8h,烧结温度越高其力学性能越好、烧结体更致密、但可能对气孔率有影响,本实施例温度范围适宜。
引发剂可采用过硫酸铵或过硫酸钾,但不限于此,催化剂可采用 N,N,N’,N’,-四甲基乙二胺 C6H16N2。
所述方法还包括将半成品中的普通陶瓷砖坯料正面进行渗花、丝网印刷、凹版印刷、辊筒印刷、喷墨打印或施釉装饰的步骤。
半成品的普通陶瓷砖坯料正面经步骤4)干燥后施底釉,经印花装饰成为釉上彩坯。
所述底釉包括以下重量份的组分:熔块88份,高岭土10份,石英6份,粘土6份, 石英30份,氧化钛11份, 二氧化钛3份、氧化铁7份, 氧化铅5份,三氧化二锑5.5份,氟硅酸钠6份, 硅酸锆为5份。
在坯温69℃喷施所述底釉,制备成釉坯待用;施底釉后釉坯再经过数字喷墨、胶辊、平板印刷中的一种或者多种印花装饰制成釉上彩坯,上面喷适量施甲基纤维素固定待用。
所述步骤5)共烧温度为1040℃,烧成时间100分钟。
上述的实施例仅为本发明的优选技术方案,而不应视为对于本发明的限制,本发明的保护范围应以权利要求记载的技术方案,包括权利要求记载的技术方案中技术特征的等同替换方案为保护范围。即在此范围内的等同替换改进,也在本发明的保护范围之内。
Claims (6)
1.一种具有多层结构的陶瓷的制作方法,其特征在于:所述方法包括以下步骤:
1)制备普通陶瓷砖坯料备用;
2)制备泡沫陶瓷坯料,所述坯料的包括按重量份计的以下组分:
氮化硅粉100~120份,烧结助剂3~10份,分散剂0.5~1.5份,羧甲基纤维素和魔芋葡聚糖的水溶液10~15份,坯体烧成收缩剂20~150 份;发泡剂0.03~20份;
3)将普通陶瓷砖坯料成型后,普通陶瓷砖坯料正面朝下放入模具中,再灌入泡沫陶瓷坯料到模具中,压制成型制成多层结构的瓷砖坯;
4)多层结构的瓷砖坯干燥后,得到半成品;
5)经共烧形成多层结构的陶瓷砖;
所述步骤2)羧甲基纤维素和魔芋葡聚糖的水溶液浓度为1%~2%,羧甲基纤维素和魔芋葡聚糖质量比为10~20:1;所述烧结助剂采用Y2O3-La2O3体系,两者的质量比为Y2O3:La2O3=1~2.5:1;所述坯体烧成收缩剂选自碳粉、面粉、玉米粉、红薯粉、淀粉、酵母粉、石蜡、沥青粉、木屑、植物纤维、明胶、凝胶、魔芋葡聚糖中的一种或几种的混合物;所述发泡剂为戊酸或没食子酸正丙酯或氮化硼、碳酸钙中的一种或几种的混合物,所述发泡剂的粒径小于50微米;
所述步骤3)泡沫陶瓷坯料到模具中的方法为:按泡沫陶瓷坯原料配比称取混合,按混合物总质量的1~2倍加入去离子水得到混料;调节混料的pH值,调节后的混料 pH 值为9~11,将混料球磨后得到浆料;将球磨后的浆料加入适量引发剂和催化剂搅拌发泡,注入到模具中、固化成型后进行干燥和排胶;将排胶后的坯体在氮气气氛下进行常压烧结,得到多层结构的瓷砖坯;烧结过程分阶段进行:850℃以下升温速率为20℃/min,气氛为氦气,800℃以上升温速率为 15℃/min 升至烧结温度,烧结温度为1500℃~1750℃,气氛为氮气,保温1.5~2.5 h;
所述步骤5)共烧温度为1000~1050℃,烧成时间60~150分钟。
2.根据权利要求1所述的方法,其特征在于,所述普通陶瓷砖坯料中包括按重量份计的以下组分:
粘土10~15份,烧滑石1~5份,萤石4~8份,石英5~10份,抛光渣74~85份,硼钙石2~5份,解胶剂0.2~1.2份,羧甲基淀粉钠0~0.5份,三聚磷酸钠0.2~0.4份。
3.根据权利要求1所述的方法,其特征在于:所述步骤1)制备的所述普通陶瓷砖坯料经加水球磨、过筛、喷雾干燥,成形备用。
4.根据权利要求1所述的方法,其特征在于:所述方法还包括将普通陶瓷砖坯料正面进行渗花、丝网印刷、凹版印刷、辊筒印刷、喷墨打印或施釉装饰的步骤。
5.根据权利要求4所述的方法,其特征在于:普通陶瓷砖坯料正面经干燥后施底釉,经印花装饰成为釉上彩坯。
6.根据权利要求5所述的方法,其特征在于:所述步骤5)共烧时,普通陶瓷砖坯料正面朝下。
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