CN105992487A - 散热器模块及其虹吸式散热器 - Google Patents

散热器模块及其虹吸式散热器 Download PDF

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CN105992487A
CN105992487A CN201510043528.1A CN201510043528A CN105992487A CN 105992487 A CN105992487 A CN 105992487A CN 201510043528 A CN201510043528 A CN 201510043528A CN 105992487 A CN105992487 A CN 105992487A
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pipe
joint
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郑家俊
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Cooler Master Co Ltd
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Priority to DE202015107062.4U priority patent/DE202015107062U1/de
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明提供一种散热器模块及其虹吸式散热器,此虹吸式散热器包括一横向管件、一倾斜管件、一第一直向管、复数第二直向管、复数鳍片及一工作流体,倾斜管件设置在横向管的上方,倾斜管件具有一低位区段及高度高于低位区段的一高位区段;第一直向管两端分别搭接并连通于横向管及低位区段;各第二直向管两端分别搭接并连通于横向管及高位区段,横向管件、倾斜管件、第一直向管及数个第二直向管共同组成一回流管路;各鳍片连接于第二直向管;工作流体填充于回流管路。如此,以达到气、液流道分离的目的,进而增加虹吸式散热器的散热效率。

Description

散热器模块及其虹吸式散热器
技术领域
本发明涉及一种散热器,尤指一种散热器模块及其虹吸式散热器。
背景技术
随着科技进步,例如中央处理单元(CPU,Central Processing Unit)、绘图处理单元(GPU,Graphics Processing Unit)、北桥晶片(North Bridge Chip)或随机存取记忆体(RAM,Random Access Memory)等电子元件的运算速度也更加快速,使得电子元件的散热问题也更加严重。
为提升散热效率,目前市面发展出一种虹吸式散热器,如图1所示,虹吸式散热器主要包含一上横管C1、一下横管C2、复数直向管C3、复数鳍片C4及一工作流体C6,各直向管C3的两端分别搭接并连通于上横管C1及下横管C2,上横管C1、下横管C2及数个直向管C3并共同组成一回流管路C5,鳍片C4连接于直向管C3,工作流体C6填充于回流管路C5。如此,将虹吸式散热器配置在热源处,工作流体C6会利用受热汽化、气体向上、冷凝液化、液体向下等原理达成散热效果。
然而,上述虹吸式散热器具有以下缺点,因工作流体C6的气相向上及液相向下的过程都通过直向管C3达成,所以直向管C3内容易发生气相工作流体C6要向上与液相工作流体C6要向下的冲突情况,更甚者,气、液相工作流体C6相冲容易造成直向管C3堵塞,进而降低虹吸式散热器的散热效率。
有鉴于此,本发明人遂针对上述现有技术,特潜心研究并配合学理的运用,尽力解决上述的问题点,即成为本发明人开发的目标。
发明内容
本发明的一目的,在于提供一种散热器模块及其虹吸式散热器,其利用液相工作流体会向低处流,气相工作流体会向高处流原理,使液相工作流体自然往第一直向管流动,气相工作流体自然往第二直向管流动,以达到气、液流道分离的目的,避免气、液相工作流体相冲而造成管路堵塞,进而增加虹吸式散热器的散热效率。
为了达成上述的目的,本发明提供一种虹吸式散热器,其包括:
一横向管件;
一倾斜管件,设置在该横向管的上方,该倾斜管件具有一低位区段及高度高于该低位区段的一高位区段;
一第一直向管,两端分别搭接并连通于该横向管及该低位区段;
复数第二直向管,两端分别搭接并连通于该横向管及该高位区段,该横向管件、该倾斜管件、该第一直向管及该复数第二直向管共同组成一回流管路;
复数鳍片,连接于该复数第二直向管;以及
一工作流体,填充于该回流管路。
所述的虹吸式散热器,该第一直向管的口径大于各该第二直向管的口径。
所述的虹吸式散热器,其特征在于,该横向管件包含相互连通的一第一接头及一横向管,该倾斜管件包含相互连通的一第二接头及一倾斜管,该倾斜管朝远离该第二接头方向逐渐向上倾斜,而令该低位区段形成于该第二接头,该高位区段形成于该倾斜管,该第一直向管两端分别搭接并连通于该第一接头及该第二接头,各该第二直向管两端分别搭接并连通于该横向管及该倾斜管。
所述的虹吸式散热器,横向管、高位区段、倾斜管的数量分别为二,两个该横向管连接于该第一接头的两端,两个该倾斜管连接于该第二接头的两端。
所述的虹吸式散热器,该第一接头及该横向管呈直线配置。
所述的虹吸式散热器,该横向管朝远离该第一接头方向逐渐向上倾斜。
所述的虹吸式散热器,该横向管朝远离该第一接头方向逐渐向下倾斜。
为了达成上述的目的,本发明提供一种散热器模块,用于一发热件,其特征在于,该散热器模块包括:
一壳体,设有一透空口并内部具有相互连通并上、下并列的一第一通道及一第二通道,所述发热件容置于该第一通道;
一风扇,固置于该第二通道,该风扇具有一出风口;以及
上述虹吸式散热器,该横向管件对应该出风口配置,该第一直向管与该复数第二直向管穿设于该透空口,该倾斜管件裸露出该透空口。
所述的散热器模块,该横向管件、部分该第一直向管及部分该复数第二直向管共同定义出一受热面,该受热面与该出风口呈倾斜配置。
所述的散热器模块,该壳体内部具有一分隔板,该第一通道及该第二通道被分隔在该分隔板的上、下侧,且该壳体与该分隔板之间具有连通该第一通道及该第二通道的一第一通风口及一第二通风口。
本发明还具有以下功效:
第一、第一直向管的口径大于各第二直向管的口径,使液相工作流体容易往第一直向管流动,气相工作流体自然往第二直向管流动,以达到更加强气、液流道分离的效果。
第二、横向管件、部分第一直向管及部分数个第二直向管共同定义出受热面,受热面与出风口呈倾斜配置,进而增加受热面的受热面积,以提高散热器模块的散热效率。
附图说明
图1是现有虹吸式散热器的组合示意图;
图2是本发明虹吸式散热器第一实施例的组合示意图;
图3是本发明虹吸式散热器第二实施例的组合示意图;
图4是本发明虹吸式散热器第三实施例的组合示意图;
图5是本发明散热器模块的组合示意图。
附图标记说明:〈现有〉;C1-上横管;C2-下横管;C3-直向管;C4-鳍片;C5-回流管路;C6-工作流体;〈本发明〉100-散热器模块;10-虹吸式散热器;1-横向管件;11-第一接头;12-横向管;2-倾斜管件;21-低位区段;22-高位区段;23-第二接头;24-倾斜管;3-第一直向管;4-第二直向管;5-鳍片;6-工作流体;20-壳体;201-透空口;202-第一通道;203-第二通道;204-分隔板;205-第一通风口;206-第二通风口;30-风扇;301-出风口;200-发热件;s1-受热面;s2-散热面;p-回流管路;a、b-口径。
具体实施方式
有关本发明的详细说明及技术内容,将配合图式说明如下,然而所附图式仅作为说明用途,并非用于局限本发明。
请参考图2至图5所示,本发明提供一种散热器模块及其虹吸(siphon)式散热器,此虹吸(siphon)式散热器10主要包括一横向管件1、一倾斜管件2、一第一直向管3、复数第二直向管4、复数鳍片5及一工作流体6;散热器模块100主要包括一壳体20一风扇30及虹吸(siphon)式散热器10。
如图5所示,散热器模块100用于一发热件200,此发热件200为包含中央处理单元(CPU,Central Processing Unit)、绘图处理单元(GPU,GraphicsProcessing Unit)、北桥晶片(North Bridge Chip)或随机存取记忆体(RAM,Random Access Memory)等电子元件的运算器或信息处理器或任何热量产生元件。
如图2至图4所示,横向管件1包含相互连通的一第一接头11及一或二横向管12。其中,本实施例一至三的横向管12数量为二,二横向管12连接于第一接头11的两端。
如图2至图4所示,倾斜管件2设置在横向管1的上方,倾斜管件2具有一低位区段21及高度高于低位区段21的一或二高位区段22。
详细说明如下,倾斜管件2包含相互连通的一第二接头23及一或二倾斜管24,倾斜管24朝远离第二接头23方向逐渐向上倾斜,而令低位区段21形成于第二接头23,高位区段22形成于倾斜管24。其中,本实施例一至三的倾斜管24数量为二,二倾斜管24连接于第二接头23的两端。
如图2至图4所示,第一直向管3两端分别搭接并连通于横向管1及低位区段21,进一步说明如下,第一直向管3两端分别搭接并连通于第一接头11及第二接头23。
如图2至图4所示,各第二直向管4两端分别搭接并连通于横向管1及高位区段22,横向管件1、倾斜管件2、第一直向管3及数个第二直向管4共同组成一回流管路p。
详细说明如下,各第二直向管4彼此间隔并列排列,且各第二直向管4两端分别搭接并连通于横向管12及倾斜管24。另外,第一直向管3的口径a大于各第二直向管4的口径b。
再者,如图2所示,本发明虹吸(siphon)式散热器10第一实施例,第一实施例中第一接头11及横向管12呈一直线配置;如图3所示,本发明虹吸(siphon)式散热器10第二实施例,第二实施例中横向管12朝远离第一接头11方向逐渐向上倾斜;如图4所示,本发明虹吸(siphon)式散热器10第三实施例,第三实施例中横向管12朝远离第一接头11方向逐渐向下倾斜。因此,第一接头11与横向管12的配置关系,请参考上述三种实施例,其可视实际情况以自行择一实施。
如图2至图4所示,复数鳍片5连接于各第二直向管4;如图2所示,工作流体6填充于回流管路p,此工作流体6为纯水或甲醇、丙酮、R134A等冷媒其中任一。
如图5所示,壳体20设有透空口201并内部具有相互连通并上、下并列的第一通道202及第二通道203,发热件200容置于第一通道202。
进一步说明如下,壳体20内部具有一分隔板204,第一通道202及第二通道203被分隔在分隔板204的上、下侧,且壳体20与分隔板204之间具有连通第一通道202及第二通道203的一第一通风口205及一第二通风口206。
如图5所示,风扇30固置于第二通道203,风扇30具有一出风口301;横向管件1对应出风口301配置,第一直向管3与各第二直向管4穿设于透空口201,倾斜管件2裸露出透空口201。
另外,横向管件1、部分第一直向管3及部分数个第二直向管4共同定义出一受热面s1,受热面s1与出风口301呈倾斜配置。
再者,裸露出透空口201的倾斜管件2、部分第一直向管3及部分数个第二直向管4共同定义出一散热面s2,此散热面s2裸露于外部环境并提供散热功效。
如图2所示,本发明虹吸(siphon)式散热器10的组合,其利用倾斜管件2设置在横向管1的上方,倾斜管件2具有低位区段21及高度高于低位区段21的高位区段22;第一直向管3两端分别搭接并连通于横向管1及低位区段21;各第二直向管4两端分别搭接并连通于横向管1及高位区段22,横向管件1、倾斜管件2、第一直向管3及数个第二直向管4共同组成回流管路p;鳍片5连接于第二直向管4;工作流体6填充于回流管路p。
如此,如图2所示,工作流体6冷凝后呈液相的工作流体6,因液体会往低处流而流至低位区段21,使液相工作流体6自然往第一直向管3流动,工作流体6受热后呈气相的工作流体6,因液相工作流体6往第一直向管3流动,所以气相工作流体6自然往第二直向管4流动,以达到气、液流道分离的目的,避免气、液相工作流体6相冲而造成管路堵塞,进而增加虹吸(siphon)式散热器10的散热效率。
另外,第一直向管3的口径a大于各第二直向管4的口径b,使液相工作流体6容易往大口径a的第一直向管3流动,而不易往小口径b的第二直向管4流动,因第二直向管4内没有液相工作流体6所以管内阻力低,进而使气相工作流体6自然往第二直向管4流动,以达到更加强气、液流道分离的效果。
再者,如图3所示,横向管12朝远离第一接头11方向逐渐向上倾斜,所以横向管12能导引气相工作流体6自然往第二直向管4流动,以提升气、液流道分离的效果。
如图2、图5所示,本发明散热器模块100的组合,其利用壳体20设有透空口201并内部具有相互连通并上、下并列的第一通道202及第二通道203,发热件200容置于第一通道202;风扇30固置于第二通道203,风扇30具有出风口301;横向管件1对应出风口301配置,第一直向管3与各第二直向管4穿设于透空口201,倾斜管件2裸露出透空口201。
如此,发热件200的热量被风扇30导引至出风口301吹出,并将热量传递至横向管件1,横向管件1内的工作流体6受热呈气相并经由各第二直向管4流至倾斜管件2,因倾斜管件2裸露出透空口201,即倾斜管件2裸露于外部环境,所以倾斜管件2的工作流体6能冷凝呈液相并经由第一直向管3流回横向管件1,从而形成回流管路p。
另外,如图5所示,横向管件1、部分第一直向管3及部分数个第二直向管4共同定义出受热面s1,受热面s1与出风口301呈倾斜配置,进而增加受热面s1的受热面积,以提高散热器模块100的散热效率。
综上所述,本发明的散热器模块及其虹吸(siphon)式散热器,也未曾见于同类产品及公开使用,并具有产业利用性、新颖性与进步性,完全符合新型专利申请要件,爰依专利法提出申请,敬请详查并赐准本案专利,以保障发明人的权利。

Claims (10)

1.一种虹吸式散热器,其特征在于,包括:
一横向管件;
一倾斜管件,设置在该横向管的上方,该倾斜管件具有一低位区段及高度高于该低位区段的一高位区段;
一第一直向管,两端分别搭接并连通于该横向管及该低位区段;
复数第二直向管,两端分别搭接并连通于该横向管及该高位区段,该横向管件、该倾斜管件、该第一直向管及该复数第二直向管共同组成一回流管路;
复数鳍片,连接于该复数第二直向管;以及
一工作流体,填充于该回流管路。
2.如权利要求1所述的虹吸式散热器,其特征在于,该第一直向管的口径大于各该第二直向管的口径。
3.如权利要求2所述的虹吸式散热器,其特征在于,该横向管件包含相互连通的一第一接头及一横向管,该倾斜管件包含相互连通的一第二接头及一倾斜管,该倾斜管朝远离该第二接头方向逐渐向上倾斜,而令该低位区段形成于该第二接头,该高位区段形成于该倾斜管,该第一直向管两端分别搭接并连通于该第一接头及该第二接头,各该第二直向管两端分别搭接并连通于该横向管及该倾斜管。
4.如权利要求3所述的虹吸式散热器,其特征在于,横向管、高位区段、倾斜管的数量分别为二,两个该横向管连接于该第一接头的两端,两个该倾斜管连接于该第二接头的两端。
5.如权利要求3或4所述的虹吸式散热器,其特征在于,该第一接头及该横向管呈直线配置。
6.如权利要求3或4所述的虹吸式散热器,其特征在于,该横向管朝远离该第一接头方向逐渐向上倾斜。
7.如权利要求3或4所述的虹吸式散热器,其特征在于,该横向管朝远离该第一接头方向逐渐向下倾斜。
8.一种散热器模块,用于一发热件,其特征在于,该散热器模块包括:
一壳体,设有一透空口并内部具有相互连通并上、下并列的一第一通道及一第二通道,所述发热件容置于该第一通道;
一风扇,固置于该第二通道,该风扇具有一出风口;以及
如权利要求1至7中任一项所述的虹吸式散热器,该横向管件对应该出风口配置,该第一直向管与该复数第二直向管穿设于该透空口,该倾斜管件裸露出该透空口。
9.如权利要求8所述的散热器模块,其特征在于,该横向管件、部分该第一直向管及部分该复数第二直向管共同定义出一受热面,该受热面与该出风口呈倾斜配置。
10.如权利要求8所述的散热器模块,其特征在于,该壳体内部具有一分隔板,该第一通道及该第二通道被分隔在该分隔板的上、下侧,且该壳体与该分隔板之间具有连通该第一通道及该第二通道的一第一通风口及一第二通风口。
CN201510043528.1A 2015-01-28 2015-01-28 散热器模块及其虹吸式散热器 Pending CN105992487A (zh)

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