US20160216041A1 - Heat sink module and siphon heat sink thereof - Google Patents
Heat sink module and siphon heat sink thereof Download PDFInfo
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- US20160216041A1 US20160216041A1 US14/957,794 US201514957794A US2016216041A1 US 20160216041 A1 US20160216041 A1 US 20160216041A1 US 201514957794 A US201514957794 A US 201514957794A US 2016216041 A1 US2016216041 A1 US 2016216041A1
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- pipe
- heat sink
- vertical
- joint
- tilt
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the technical field relates to a heat sink, more particularly to a heat sink module and its siphon heat sink.
- a siphon heat sink as shown in FIG. 1 is developed and available in the market, and the siphon heat sink comprises an upper transverse pipe C 1 , a lower transverse pipe C 2 , a plurality of vertical pipes C 3 , a plurality of fins C 4 and a working fluid C 6 , wherein both ends of each vertical pipe C 3 are coupled and communicated to the upper transverse pipe C 1 and the lower transverse pipe C 2 respectively, and the upper transverse pipe C 1 , the lower transverse pipe C 2 and the plurality of vertical pipes C 3 jointly form a return pipeline C 5 , and the fin C 4 is coupled to the vertical pipe C 3 , and the working fluid C 6 is filled in the return pipeline C 5 .
- the siphon heat sink is installed at a heat source, and the working fluid C 6 achieves a cooling effect by the principle of a heated and vaporized gas flowing upward and a condensed and liquefied liquid flowing downward.
- the aforementioned siphon heat sink still has the following drawbacks. Since the process for the gas-phase working fluid C 6 to flow upward and the liquid-phase working fluid C 6 to flow downward is achieved by the vertical pipe C 3 , therefore the content contained in the vertical pipe C 3 may conflict with the gas-phase working fluid C 6 flowing upward and the liquid-phase working fluid C 6 flowing downward. Even worse, the gas-phase and liquid-phase working fluids C 6 may conflict with each other clog the vertical pipe C 3 , and lower the heat dissipating efficiency of the siphon heat sink.
- this disclosure provides a siphon heat sink, comprising: a transverse pipe member; a tilt pipe member, installed at the top of the transverse pipe member, and having a low section and a high section higher than the low section; a first vertical pipe, with both ends coupled and communicated to the transverse pipe member and the low section respectively; a plurality of second vertical pipes, with both ends coupled and communicated to the transverse pipe member and the high section respectively, such that the transverse pipe member, the tilt pipe member, the first vertical pipe and the second vertical pipes jointly forming a return pipeline; and a plurality of fins, coupled to the second vertical pipes.
- this disclosure further provides a heat sink module applied to a heat generating component
- the heat sink module comprises: a casing, having a through opening, a first channel and a second channel communicated with each other and arranged in upper and lower rows respectively, and the heat generating component being contained in the first channel; a fan, installed at the second channel, and having an air outlet; and a siphon heat sink, comprising a transverse pipe member, a tilt pipe member, a first vertical pipe, a plurality of second vertical pipes, a plurality of fins and a working fluid, and the tilt pipe being installed at the top of the transverse pipe member, and the tilt pipe member having a low section and a high section higher than the low section, and both ends of the first vertical pipe being coupled and communicated to the transverse pipe member and the low section respectively, and both ends of each second vertical pipe being coupled and communicated to the transverse pipe member and the high section respectively, and the transverse pipe member, the tilt pipe member, the first vertical pipe and the first vertical pipe and the
- the first vertical pipe has a diameter greater than the diameter of each second vertical pipe, so that the liquid-phase working fluid flows to the first vertical pipe easily and the gas-phase working fluid flows to the second vertical pipe naturally, so as to improve the effect of separating the gas and liquid channels.
- the transverse pipe member, a part of the first vertical pipes, and a part of the second vertical pipes jointly define the heating surface, and the heating surface is tilted with respect to the air outlet, so as to increase the surface area of the heating surface and improve the heat dissipating efficiency of the heat sink module.
- FIG. 1 is a perspective view of a conventional siphon heat sink
- FIG. 2 is a perspective view of a siphon heat sink in accordance with a first preferred embodiment of this disclosure
- FIG. 3 is a perspective view of a siphon heat sink in accordance with a second preferred embodiment of this disclosure.
- FIG. 4 is a perspective view of a siphon heat sink in accordance with a fourth preferred embodiment of this disclosure.
- FIG. 5 is a perspective view of a heat sink module of this disclosure.
- the siphon heat sink 10 comprises a transverse pipe member 1 , a tilt pipe member 2 , a first vertical pipe 3 , a plurality of second vertical pipes 4 , a plurality of fins 5 ; and the heat sink module 100 comprises a casing 20 , a fan 30 , and the siphon heat sink 10 .
- the heat sink module 100 is applied to a heat generating component 200
- the heat generating component 200 is a computing device or an information processing device of an electronic component such as a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a north bridge chip, a random access memory (RAM), or any device that generates heat.
- CPU Central Processing Unit
- GPU Graphics Processing Unit
- RAM random access memory
- the transverse pipe member 1 includes a first joint 11 and one or two transverse pipes 12 communicated with each other.
- the quantity of transverse pipes 12 is equal to two, and the two transverse pipes 12 are coupled to both ends of the first joint 11 respectively.
- the tilt pipe member 2 is installed at the top of the transverse pipe member 1 , and the tilt pipe member 2 has a low section 21 and one or two high sections 22 higher than the low section 21 .
- the tilt pipe member 2 includes a second joint 23 and one or two tilt pipes 24 communicated with one another, and the tilt pipe 24 tilts gradually upward in a direction away from the second joint 23 , so that the low section 21 is formed at the second joint 23 , and the high section 22 is formed at the tilt pipe 24 .
- the quantity of tilt pipes 24 is equal to two, and the two tilt pipes 24 are coupled to both ends of the second joint 23 respectively.
- both ends of the first vertical pipe 3 are coupled and communicated to the transverse pipe member 1 and the low section 21 respectively.
- both ends of the first vertical pipe 3 are coupled and communicated to the first joint 11 and the second joint 23 respectively.
- each second vertical pipe 4 both ends of each second vertical pipe 4 are coupled and communicated to the transverse pipe member 1 and the high section 22 respectively, and the transverse pipe member 1 , the tilt pipe member 2 , the first vertical pipe 3 and the plurality of second vertical pipes 4 jointly form a return pipeline p.
- the second vertical pipes 4 are arranged apart and parallel to one another, and both ends of each second vertical pipe 4 are coupled and communicated to the transverse pipe 12 and the tilt pipe 24 respectively.
- the first vertical pipe 3 has a diameter a greater than the diameter b of each second vertical pipe 4 .
- the first joint 11 and the transverse pipe 12 of the first preferred embodiment are configured linearly with respect to each other.
- the transverse pipe 12 of the second preferred embodiment tilts gradually upward in a direction away from the first joint 11 .
- the transverse pipe 12 of the third preferred embodiment gradually tilts downward in a direction away from the first joint 11 . Therefore, the configuration relation between the first joint 11 and the transverse pipe 12 may refer to the aforementioned three preferred embodiments and implemented with any one of them depending on the actual situation.
- the plurality of fins 5 is coupled to each second vertical pipe 4 .
- a working fluid 6 is filled in a return pipeline p, and the working fluid 6 is a cooling medium selected form the group consisting of pure water, methanol, acetone, and R134A.
- the casing 20 has a through opening 201 and includes a first channel 202 and a second channel 203 disposed therein, communicated with one another, and respectively and parallelly arranged at upper and lower rows, and the heat generating component 200 is contained in the first channel 202 .
- the casing 20 has a partition plate 204 installed therein, and the first channel 202 and the second channel 203 are separated and disposed on upper and lower sides of the partition plate 204 respectively, and a first vent 205 and a second vent 206 communicated with the first channel 202 and the second channel 203 respectively are formed between the casing 20 and the partition plate 204 .
- the fan 30 is installed at the second channel 203 , and the fan 30 has an air outlet 301 .
- the transverse pipe member 1 is configured to be corresponsive to the air outlet 301 , and the first vertical pipe 3 and each second vertical pipe 4 are passed and installed in the through opening 201 , and the tilt pipe member 2 is exposed from the through opening 201 .
- transverse pipe member 1 a part of the first vertical pipes 3 , and a part of the second vertical pipes 4 jointly define a heating surface s 1 , and the heating surface s 1 is tilted with respect to the air outlet 301 .
- the tilt pipe member 2 exposed from the through opening 201 , a part of the first vertical pipes 3 and a part of the second vertical pipes 4 jointly define a cooling surface s 2 , and the cooling surface s 2 is exposed to the outside to provide a cooling effect.
- the tilt pipe member 2 is installed at the top of the transverse pipe member 1 , and the tilt pipe member 2 has a low section 21 and a high section 22 higher than the low section 21 . Both ends of the first vertical pipe 3 are coupled and communicated to the transverse pipe member 1 and the low section 21 respectively. Both ends of each second vertical pipe 4 are coupled and communicated to the transverse pipe member 1 and the high section 22 respectively.
- the transverse pipe member 1 , the tilt pipe member 2 , the first vertical pipe 3 and the plurality of second vertical pipes 4 jointly form a return pipeline p.
- the fin 5 is coupled to the second vertical pipe 4 .
- the working fluid 6 is filled in the return pipeline p.
- the liquid-phase working fluid 6 flows towards a low position to the low section 21 , so that the liquid-phase working fluid 6 naturally flows towards the first vertical pipe 3 , and after the working fluid 6 is heated to form a gas-phase working fluid 6 , and the liquid-phase working fluid 6 flows towards the first vertical pipe 3 , so that the gas-phase working fluid 6 naturally flows towards the second vertical pipe 4 to achieve the effects of separating gas and liquid channels, preventing the gas-phase and liquid-phase working fluids 6 from conflicting with each other or clogging the pipeline, so as to improve the heat dissipating efficiency of the siphon heat sink 10 .
- the first vertical pipe 3 has a diameter a greater than the diameter b of each second vertical pipe 4 , so that the liquid-phase working fluid 6 flows towards the first vertical pipe 3 with a larger diameter a more easily, and flows to the second vertical pipe 4 with a smaller diameter b less easily. Since the second vertical pipe 4 does not have the liquid-phase working fluid 6 , the resistance in the pipe is low, and the gas-phase working fluid 6 naturally flows towards the second vertical pipe 4 to achieve the effect of improving the effect of separating the gas and liquid channels.
- the transverse pipe 12 tilts gradually upward in a direction away from the first joint 11 , so that the transverse pipe 12 can guide the gas-phase working fluid 6 to flow towards the second vertical pipe 4 naturally to improve the effect of separating the gas and liquid channels.
- the casing 20 has a through opening 201 and contains a first channel 202 and a second channel 203 communicated with each other and arranged respectively and parallelly at upper and lower rows, and the heat generating component 200 is contained in the first channel 202 .
- the fan 30 is installed at the second channel 203 , and the fan 30 has an air outlet 301 .
- the transverse pipe member 1 is configured to be corresponsive to the air outlet 301 .
- the first vertical pipe 3 and each second vertical pipe 4 are passed and installed in the through opening 201 .
- the tilt pipe member 2 is exposed from the through opening 201 .
- the heat of the heat generating component 200 is guided to the air outlet 301 and blown out by the fan 30 , and the heat is transferred to the transverse pipe member 1 , and the working fluid 6 inside the transverse pipe member 1 is heated into a gas-phase working fluid 6 , and the gas-phase working fluid 6 flows from each second vertical pipe 4 to the tilt pipe member 2 . Since the tilt pipe member 2 is exposed from the through opening 201 , and the tilt pipe member 2 is exposed to the outside, therefore the working fluid 6 of the tilt pipe member 2 can be condensed into a liquid phase, and the liquid-phase working fluid 6 returns to the transverse pipe member 1 from the first vertical pipe 3 to form a return pipeline p.
- the transverse pipe member 1 , a part of the first vertical pipes 3 , and a part of the second vertical pipes 4 jointly define a heating surface s 1 , and the heating surface s 1 is tilted with respect to the air outlet 301 to increase the surface area of the heating surface s 1 , so as to improve the heat dissipating efficiency of the heat sink module 100 .
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- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
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Abstract
A heat sink module and its siphon heat sink includes a transverse pipe member, a tilt pipe member, a first vertical pipe, second vertical pipes, fins, and a working fluid. The tilt pipe member having a low section and a high section is installed at the top of the transverse pipe member. Both ends of the first vertical pipe are coupled and communicated to the transverse pipe member and the low section respectively. Both ends of each second vertical pipe are coupled and communicated to the transverse pipe member and the high section respectively. The transverse pipe member, tilt pipe member, first vertical pipe and second vertical pipes jointly form a return pipeline. Each fin is coupled to the second vertical pipe. The working fluid is filled in the return pipeline. Therefore, the effects of separating gas and liquid channels and improving the heat dissipating efficiency can be achieved.
Description
- The technical field relates to a heat sink, more particularly to a heat sink module and its siphon heat sink.
- As science and technology advance, the computation speed of electronic components such as a central processing unit (CPU), a graphics processing unit (GPU), a north bridge chip or a random access memory (RAM) becomes increasingly faster, and the heat dissipation problem of the electronic component becomes more serious.
- To enhance the heat dissipating efficiency, a siphon heat sink as shown in
FIG. 1 is developed and available in the market, and the siphon heat sink comprises an upper transverse pipe C1, a lower transverse pipe C2, a plurality of vertical pipes C3, a plurality of fins C4 and a working fluid C6, wherein both ends of each vertical pipe C3 are coupled and communicated to the upper transverse pipe C1 and the lower transverse pipe C2 respectively, and the upper transverse pipe C1, the lower transverse pipe C2 and the plurality of vertical pipes C3 jointly form a return pipeline C5, and the fin C4 is coupled to the vertical pipe C3, and the working fluid C6 is filled in the return pipeline C5. The siphon heat sink is installed at a heat source, and the working fluid C6 achieves a cooling effect by the principle of a heated and vaporized gas flowing upward and a condensed and liquefied liquid flowing downward. - However, the aforementioned siphon heat sink still has the following drawbacks. Since the process for the gas-phase working fluid C6 to flow upward and the liquid-phase working fluid C6 to flow downward is achieved by the vertical pipe C3, therefore the content contained in the vertical pipe C3 may conflict with the gas-phase working fluid C6 flowing upward and the liquid-phase working fluid C6 flowing downward. Even worse, the gas-phase and liquid-phase working fluids C6 may conflict with each other clog the vertical pipe C3, and lower the heat dissipating efficiency of the siphon heat sink.
- In view of the aforementioned drawbacks of the prior art, the discloser of this disclosure based on years of experience in the industry to conduct extensive researches and experiments and finally provided a feasible solution to overcome the drawbacks of the prior art effectively.
- It is a primary objective of this disclosure to provide a heat sink module and a siphon heat sink thereof, and the principle of a liquid-phase working fluid flowing to a low position and a gas-phase working fluid flowing to a high position is used, so that the liquid-phase working fluid naturally flows towards a first vertical pipe and a gas-phase working fluid naturally flows towards a second vertical pipe, so as to achieve the effects of separating gas and liquid channels, preventing the gas-phase and liquid-phase working fluids from conflicting with each other or clogging the pipeline, and improving the heat dissipating efficiency of a siphon heat sink.
- To achieve the aforementioned and other objectives, this disclosure provides a siphon heat sink, comprising: a transverse pipe member; a tilt pipe member, installed at the top of the transverse pipe member, and having a low section and a high section higher than the low section; a first vertical pipe, with both ends coupled and communicated to the transverse pipe member and the low section respectively; a plurality of second vertical pipes, with both ends coupled and communicated to the transverse pipe member and the high section respectively, such that the transverse pipe member, the tilt pipe member, the first vertical pipe and the second vertical pipes jointly forming a return pipeline; and a plurality of fins, coupled to the second vertical pipes.
- To achieve the aforementioned and other objectives, this disclosure further provides a heat sink module applied to a heat generating component, and the heat sink module comprises: a casing, having a through opening, a first channel and a second channel communicated with each other and arranged in upper and lower rows respectively, and the heat generating component being contained in the first channel; a fan, installed at the second channel, and having an air outlet; and a siphon heat sink, comprising a transverse pipe member, a tilt pipe member, a first vertical pipe, a plurality of second vertical pipes, a plurality of fins and a working fluid, and the tilt pipe being installed at the top of the transverse pipe member, and the tilt pipe member having a low section and a high section higher than the low section, and both ends of the first vertical pipe being coupled and communicated to the transverse pipe member and the low section respectively, and both ends of each second vertical pipe being coupled and communicated to the transverse pipe member and the high section respectively, and the transverse pipe member, the tilt pipe member, the first vertical pipe and the second vertical pipes jointly forming a return pipeline, and each fin being coupled to the second vertical pipes, and the working fluid being filled in the return pipeline, and the transverse pipe member being configured to be corresponsive to the air outlet, and the first vertical pipe and the second vertical pipes passed and installed into the through opening, and the tilt pipe member being exposed from the through opening.
- This disclosure has the following effects:
- 1. The first vertical pipe has a diameter greater than the diameter of each second vertical pipe, so that the liquid-phase working fluid flows to the first vertical pipe easily and the gas-phase working fluid flows to the second vertical pipe naturally, so as to improve the effect of separating the gas and liquid channels.
- 2. The transverse pipe member, a part of the first vertical pipes, and a part of the second vertical pipes jointly define the heating surface, and the heating surface is tilted with respect to the air outlet, so as to increase the surface area of the heating surface and improve the heat dissipating efficiency of the heat sink module.
-
FIG. 1 is a perspective view of a conventional siphon heat sink; -
FIG. 2 is a perspective view of a siphon heat sink in accordance with a first preferred embodiment of this disclosure; -
FIG. 3 is a perspective view of a siphon heat sink in accordance with a second preferred embodiment of this disclosure; -
FIG. 4 is a perspective view of a siphon heat sink in accordance with a fourth preferred embodiment of this disclosure; and -
FIG. 5 is a perspective view of a heat sink module of this disclosure. - The technical contents of this disclosure will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and figures disclosed herein are to be considered illustrative rather than restrictive.
- With reference to
FIGS. 2 to 5 for a heat sink module and a siphon heat sink thereof in accordance with this disclosure, thesiphon heat sink 10 comprises atransverse pipe member 1, atilt pipe member 2, a firstvertical pipe 3, a plurality of secondvertical pipes 4, a plurality offins 5; and theheat sink module 100 comprises acasing 20, afan 30, and thesiphon heat sink 10. - In
FIG. 5 , theheat sink module 100 is applied to aheat generating component 200, and theheat generating component 200 is a computing device or an information processing device of an electronic component such as a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a north bridge chip, a random access memory (RAM), or any device that generates heat. - In
FIGS. 2 to 4 , thetransverse pipe member 1 includes afirst joint 11 and one or twotransverse pipes 12 communicated with each other. In the first to third preferred embodiments, the quantity oftransverse pipes 12 is equal to two, and the twotransverse pipes 12 are coupled to both ends of thefirst joint 11 respectively. - In
FIGS. 2 to 4 , thetilt pipe member 2 is installed at the top of thetransverse pipe member 1, and thetilt pipe member 2 has alow section 21 and one or twohigh sections 22 higher than thelow section 21. - Specifically, the
tilt pipe member 2 includes asecond joint 23 and one or twotilt pipes 24 communicated with one another, and thetilt pipe 24 tilts gradually upward in a direction away from thesecond joint 23, so that thelow section 21 is formed at thesecond joint 23, and thehigh section 22 is formed at thetilt pipe 24. In the first to third preferred embodiments, the quantity oftilt pipes 24 is equal to two, and the twotilt pipes 24 are coupled to both ends of thesecond joint 23 respectively. - In
FIGS. 2 to 4 , both ends of the firstvertical pipe 3 are coupled and communicated to thetransverse pipe member 1 and thelow section 21 respectively. Specifically, both ends of the firstvertical pipe 3 are coupled and communicated to thefirst joint 11 and thesecond joint 23 respectively. - In
FIGS. 2 to 4 , both ends of each secondvertical pipe 4 are coupled and communicated to thetransverse pipe member 1 and thehigh section 22 respectively, and thetransverse pipe member 1, thetilt pipe member 2, the firstvertical pipe 3 and the plurality of secondvertical pipes 4 jointly form a return pipeline p. - Specifically, the second
vertical pipes 4 are arranged apart and parallel to one another, and both ends of each secondvertical pipe 4 are coupled and communicated to thetransverse pipe 12 and thetilt pipe 24 respectively. In addition, the firstvertical pipe 3 has a diameter a greater than the diameter b of each secondvertical pipe 4. - With reference to
FIG. 2 for asiphon heat sink 10 in accordance with the first preferred embodiment of this disclosure, thefirst joint 11 and thetransverse pipe 12 of the first preferred embodiment are configured linearly with respect to each other. With reference toFIG. 3 for asiphon heat sink 10 in accordance with the second preferred embodiment of this disclosure, thetransverse pipe 12 of the second preferred embodiment tilts gradually upward in a direction away from thefirst joint 11. With reference toFIG. 4 for asiphon heat sink 10 in accordance with the third preferred embodiment of this disclosure, thetransverse pipe 12 of the third preferred embodiment gradually tilts downward in a direction away from thefirst joint 11. Therefore, the configuration relation between thefirst joint 11 and thetransverse pipe 12 may refer to the aforementioned three preferred embodiments and implemented with any one of them depending on the actual situation. - In
FIGS. 2 to 4 , the plurality offins 5 is coupled to each secondvertical pipe 4. InFIG. 2 , a workingfluid 6 is filled in a return pipeline p, and the workingfluid 6 is a cooling medium selected form the group consisting of pure water, methanol, acetone, and R134A. - In
FIG. 5 , thecasing 20 has a through opening 201 and includes afirst channel 202 and asecond channel 203 disposed therein, communicated with one another, and respectively and parallelly arranged at upper and lower rows, and theheat generating component 200 is contained in thefirst channel 202. - Further, the
casing 20 has apartition plate 204 installed therein, and thefirst channel 202 and thesecond channel 203 are separated and disposed on upper and lower sides of thepartition plate 204 respectively, and afirst vent 205 and asecond vent 206 communicated with thefirst channel 202 and thesecond channel 203 respectively are formed between thecasing 20 and thepartition plate 204. - In
FIG. 5 , thefan 30 is installed at thesecond channel 203, and thefan 30 has anair outlet 301. Thetransverse pipe member 1 is configured to be corresponsive to theair outlet 301, and the firstvertical pipe 3 and each secondvertical pipe 4 are passed and installed in the throughopening 201, and thetilt pipe member 2 is exposed from the throughopening 201. - In addition, the
transverse pipe member 1, a part of the firstvertical pipes 3, and a part of the secondvertical pipes 4 jointly define a heating surface s1, and the heating surface s1 is tilted with respect to theair outlet 301. - In addition, the
tilt pipe member 2 exposed from the throughopening 201, a part of the firstvertical pipes 3 and a part of the secondvertical pipes 4 jointly define a cooling surface s2, and the cooling surface s2 is exposed to the outside to provide a cooling effect. - With reference to
FIG. 2 for the assembly of asiphon heat sink 10 of this disclosure, thetilt pipe member 2 is installed at the top of thetransverse pipe member 1, and thetilt pipe member 2 has alow section 21 and ahigh section 22 higher than thelow section 21. Both ends of the firstvertical pipe 3 are coupled and communicated to thetransverse pipe member 1 and thelow section 21 respectively. Both ends of each secondvertical pipe 4 are coupled and communicated to thetransverse pipe member 1 and thehigh section 22 respectively. Thetransverse pipe member 1, thetilt pipe member 2, the firstvertical pipe 3 and the plurality of secondvertical pipes 4 jointly form a return pipeline p. Thefin 5 is coupled to the secondvertical pipe 4. The workingfluid 6 is filled in the return pipeline p. - In
FIG. 2 , after the workingfluid 6 is condensed, the liquid-phase working fluid 6 flows towards a low position to thelow section 21, so that the liquid-phase working fluid 6 naturally flows towards the firstvertical pipe 3, and after the workingfluid 6 is heated to form a gas-phase working fluid 6, and the liquid-phase working fluid 6 flows towards the firstvertical pipe 3, so that the gas-phase working fluid 6 naturally flows towards the secondvertical pipe 4 to achieve the effects of separating gas and liquid channels, preventing the gas-phase and liquid-phase working fluids 6 from conflicting with each other or clogging the pipeline, so as to improve the heat dissipating efficiency of thesiphon heat sink 10. - In addition, the first
vertical pipe 3 has a diameter a greater than the diameter b of each secondvertical pipe 4, so that the liquid-phase working fluid 6 flows towards the firstvertical pipe 3 with a larger diameter a more easily, and flows to the secondvertical pipe 4 with a smaller diameter b less easily. Since the secondvertical pipe 4 does not have the liquid-phase working fluid 6, the resistance in the pipe is low, and the gas-phase working fluid 6 naturally flows towards the secondvertical pipe 4 to achieve the effect of improving the effect of separating the gas and liquid channels. - In
FIG. 3 , thetransverse pipe 12 tilts gradually upward in a direction away from thefirst joint 11, so that thetransverse pipe 12 can guide the gas-phase working fluid 6 to flow towards the secondvertical pipe 4 naturally to improve the effect of separating the gas and liquid channels. - With reference to
FIGS. 2 and 5 for an assembly of aheat sink module 100 of this disclosure, thecasing 20 has a throughopening 201 and contains afirst channel 202 and asecond channel 203 communicated with each other and arranged respectively and parallelly at upper and lower rows, and theheat generating component 200 is contained in thefirst channel 202. Thefan 30 is installed at thesecond channel 203, and thefan 30 has anair outlet 301. Thetransverse pipe member 1 is configured to be corresponsive to theair outlet 301. The firstvertical pipe 3 and each secondvertical pipe 4 are passed and installed in the throughopening 201. Thetilt pipe member 2 is exposed from the throughopening 201. - Therefore, the heat of the
heat generating component 200 is guided to theair outlet 301 and blown out by thefan 30, and the heat is transferred to thetransverse pipe member 1, and the workingfluid 6 inside thetransverse pipe member 1 is heated into a gas-phase working fluid 6, and the gas-phase working fluid 6 flows from each secondvertical pipe 4 to thetilt pipe member 2. Since thetilt pipe member 2 is exposed from the throughopening 201, and thetilt pipe member 2 is exposed to the outside, therefore the workingfluid 6 of thetilt pipe member 2 can be condensed into a liquid phase, and the liquid-phase working fluid 6 returns to thetransverse pipe member 1 from the firstvertical pipe 3 to form a return pipeline p. - In
FIG. 5 , thetransverse pipe member 1, a part of the firstvertical pipes 3, and a part of the secondvertical pipes 4 jointly define a heating surface s1, and the heating surface s1 is tilted with respect to theair outlet 301 to increase the surface area of the heating surface s1, so as to improve the heat dissipating efficiency of theheat sink module 100. - In summation of the description above, the heat sink module and its siphon heat sink in accordance with this disclosure are novel and inventive and comply with patent application requirements, and thus this disclosure is filed for patent application.
- While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
Claims (16)
1. A siphon heat sink, comprising:
a transverse pipe member;
a tilt pipe member, installed at the top of the transverse pipe member, and having a low section and a high section higher than the low section;
a first vertical pipe, with both ends coupled and communicated to the transverse pipe member and the low section respectively;
a plurality of second vertical pipes, each with both ends coupled and communicated to the transverse pipe member and the high section respectively, such that the transverse pipe member, the tilt pipe, the first vertical pipe and the second vertical pipes jointly forming a return pipeline; and
a plurality of fins, coupled to the second vertical pipes.
2. The heat sink module according to claim 1 , wherein the first vertical pipe has a diameter greater than the diameter of each second vertical pipe.
3. The heat sink module according to claim 2 , wherein the transverse pipe member includes a first joint and a transverse pipe communicated with each other, and the tilt pipe member includes a second joint and a tilt pipe communicated with each other, and the tilt pipe gradually tilts upward in a direction away from the second joint, so that the low section is formed at the second joint, and the high section is formed at the tilt pipe, and both ends of the first vertical pipe are coupled and communicated to the first joint and the second joint respectively, and both ends of each second vertical pipe are coupled and communicated to the transverse pipe and the tilt pipe respectively.
4. The heat sink module according to claim 3 , wherein the transverse pipe, the high section, and the tilt pipe come with a quantity of two each, and the two transverse pipes are coupled to both ends of the first joint respectively, and the two tilt pipes are coupled to both ends of the second joint respectively.
5. The heat sink module according to claim 3 , wherein the first joint and the transverse pipe are configured linearly with respect to each other.
6. The heat sink module according to claim 3 , wherein the transverse pipe tilts gradually upward in a direction away from the first joint.
7. The heat sink module according to claim 3 , wherein the transverse pipe tilts gradually downward in a direction away from the first joint.
8. A heat sink module, applied to a heat generating component, comprising:
a casing, having a through opening, and a first channel and a second channel communicated with each other, and respectively and parallelly arranged at upper and lower rows, and the heat generating component being contained in the first channel;
a fan, installed at the second channel, and having an air outlet; and
a siphon heat sink, comprising:
a transverse pipe member;
a tilt pipe member, installed at the top of the transverse pipe member, and having a low section and a high section higher than the low section;
a first vertical pipe, with both ends coupled and communicated to the transverse pipe member and the low section respectively;
a plurality of second vertical pipes, each with both ends coupled and communicated to the transverse pipe member and the high section respectively, such that the transverse pipe member, the tilt pipe member, the first vertical pipe and the second vertical pipes jointly forming a return pipeline; and
a plurality of fins, coupled to the second vertical pipes,
wherein the transverse pipe member being configured to be corresponsive to the air outlet, and the first vertical pipe and the second vertical pipes passed and installed into the through opening, and the tilt pipe member being exposed from the through opening.
9. The heat sink module according to claim 8 , wherein the first vertical pipe has a diameter greater than the diameter of each second vertical pipe.
10. The heat sink module according to claim 9 , wherein the transverse pipe member includes a first joint and a transverse pipe communicated with each other, and the tilt pipe member includes a second joint and a tilt pipe communicated with each other, and the tilt pipe tilts gradually upward in a direction away from the second joint, so that the low section is formed at the second joint, and the high section is formed at the tilt pipe, and both ends of the first vertical pipe are coupled and communicated to the first joint and the second joint respectively, and both ends of each second vertical pipes are coupled and communicated to the transverse pipe and the tilt pipe respectively.
11. The heat sink module according to claim 10 , wherein the transverse pipe, the high section, and the tilt pipe come with a quantity of two each, and the two transverse pipes are coupled to both ends of the first joint respectively, and the two tilt pipes are coupled to both ends of the second joint respectively.
12. The heat sink module according to claim 10 , wherein the first joint and the transverse pipe are configured linearly with respect to each other.
13. The heat sink module according to claim 10 , wherein the transverse pipe tilts gradually upward in a direction away from the first joint.
14. The heat sink module according to claim 10 , wherein the transverse pipe tilts gradually downward in a direction away from the first joint.
15. The heat sink module according to claim 8 , wherein the transverse pipe member, a part of the first vertical pipe, and a part of the second vertical pipes jointly define a heating surface, and the heating surface is tilted with respect to the air outlet.
16. The heat sink module according to claim 8 , wherein the casing contains a partition plate installed therein, and the first channel and the second channel are separated and disposed at the upper and lower sides of the partition plate respectively, and a first vent and a second vent communicated with the first channel and the second channel respectively are formed between the casing and the partition plate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201510043528.1A CN105992487A (en) | 2015-01-28 | 2015-01-28 | Radiator module and siphon-type radiator thereof |
CN201510043528.1 | 2015-01-28 |
Publications (1)
Publication Number | Publication Date |
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US20160216041A1 true US20160216041A1 (en) | 2016-07-28 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US14/957,794 Abandoned US20160216041A1 (en) | 2015-01-28 | 2015-12-03 | Heat sink module and siphon heat sink thereof |
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US (1) | US20160216041A1 (en) |
CN (1) | CN105992487A (en) |
DE (1) | DE202015107062U1 (en) |
Cited By (2)
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US20170055370A1 (en) * | 2015-08-20 | 2017-02-23 | Cooler Master Co., Ltd. | Liquid-cooling heat dissipation device |
EP4195894A4 (en) * | 2020-08-24 | 2024-01-24 | Huawei Technologies Co., Ltd. | Heat dissipation device and manufacturing method therefor |
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US20130081784A1 (en) * | 2010-03-30 | 2013-04-04 | Ast Modular, S.L. | System for air-conditioning the interior of a data processing center |
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2015
- 2015-01-28 CN CN201510043528.1A patent/CN105992487A/en active Pending
- 2015-12-03 US US14/957,794 patent/US20160216041A1/en not_active Abandoned
- 2015-12-23 DE DE202015107062.4U patent/DE202015107062U1/en active Active
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US4337820A (en) * | 1979-03-19 | 1982-07-06 | General Electric Company | Leak detector for vaporization cooled transformers |
US6119767A (en) * | 1996-01-29 | 2000-09-19 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
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US20130081784A1 (en) * | 2010-03-30 | 2013-04-04 | Ast Modular, S.L. | System for air-conditioning the interior of a data processing center |
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US20170055370A1 (en) * | 2015-08-20 | 2017-02-23 | Cooler Master Co., Ltd. | Liquid-cooling heat dissipation device |
US10111362B2 (en) * | 2015-08-20 | 2018-10-23 | Cooler Master Co., Ltd. | Liquid-cooling heat dissipation device |
EP4195894A4 (en) * | 2020-08-24 | 2024-01-24 | Huawei Technologies Co., Ltd. | Heat dissipation device and manufacturing method therefor |
Also Published As
Publication number | Publication date |
---|---|
DE202015107062U1 (en) | 2016-02-01 |
CN105992487A (en) | 2016-10-05 |
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Owner name: COOLER MASTER CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHENG, CHIA-CHUN;REEL/FRAME:037198/0932 Effective date: 20151119 |
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STCB | Information on status: application discontinuation |
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