US20140116653A1

US20140116653A1 - Loop thermosyphon cooling device

Info

Publication number: US20140116653A1
Application number: US14/049,689
Authority: US
Inventors: Torben Bjerrisgaard Lange; I-Ching Wang
Original assignee: COOLING HOUSE CO Ltd
Current assignee: COOLING HOUSE CO Ltd
Priority date: 2012-10-25
Filing date: 2013-10-09
Publication date: 2014-05-01
Also published as: TWM450187U

Abstract

A loop thermosyphon cooling device includes an evaporator, a condenser and a communication assembly. The evaporator includes a heat conducting element and evaporation pipes, and the heat conducting element has through holes, and each evaporation pipe is passed and positioned into each respective through hole. The condenser includes a condensation pipe. The communication assembly includes a first barrel and a second barrel, and both ends of each evaporation pipe are communicated with the first and second barrels, and both ends of the condensation pipe are communicated with the first and second barrels, so that the evaporation pipe, condensation pipe, first barrel and second barrel jointly define a loop. A communication assembly is coupled between the evaporation pipe and the condensation pipe, and the quantity of evaporation pipes and condensation pipes can be increased or decreased as needed, and the thermosyphon cooling device is compact and high heat dissipation efficiency.

Description

FIELD OF THE INVENTION

The present invention relates to a cooling device, and more particularly to the loop thermosyphon cooling device.

BACKGROUND OF THE INVENTION

Cooling devices are used extensively in different places such as playgrounds, malls and factories where high bay lamps are installed and used as a main light source, and the light source of the high bay lamp is gradually replaced by low power consuming LEDs. However, LEDs will generate a large amount of heat, so that it is necessary to add a cooling device at the high bay lamp to assist the effect of dissipating the heat generated by the LEDs. In addition, places such as machine rooms having equipment like mainframe computers, servers or instruments installed therein may accumulate lots of heat after a long time of the operation, so that the cooling device is required to prevent the equipment from being damaged and achieve the heat dissipation effect.
A conventional “loop cooling device” as disclosed in Taiwan Pat. No. M256674 comprises a heat conducting element, a loop heat pipe and a working fluid, and the working fluid circulates in the loop heat pipe, and the loop heat pipe has an evaporation section and a condensation section, and the evaporation section is fixed to the heat conducting element, and the condensation section has fins or a fan installed thereon, so that the working fluid from the evaporation section carries away and dissipates the heat to the condensation section to achieve the heat dissipation effect.
However, the aforementioned loop cooling device has the following drawbacks: more loop heat pipes are generally required in the evaporation area and the condensation area for dissipating heat; and the loop heat pipe can be used only for guiding the flow in areas other than the evaporation area and the condensation area, so that less loop heat pipes are required in areas other than the evaporation area and the condensation area to reduce the total volume of the cooling device, but the loop heat pipe is a single pipe, and the quantity of loop heat pipes in each area is the same, and the loop cooling device cannot have both advantages of small volume and high heat dissipation efficiency.
In view of the aforementioned drawbacks, the inventor of the present invention based on years of experience in the related industry to conduct extensive researches and experiments to develop and design a loop thermosyphon cooling device in accordance with the invention to overcome the aforementioned drawbacks of the prior art.

SUMMARY OF THE INVENTION

Therefore, it is a primary objective of the present invention to provide a loop thermosyphon cooling device having a communication assembly coupled between the evaporation pipe and the condensation pipe, so that the quantity of evaporation pipes and condensation pipes can be increased or decreased as needed to achieve both advantages of small volume and high heat dissipation efficiency of the thermosyphon cooling device.
To achieve the aforementioned objective, the present invention provides a loop thermosyphon cooling device, comprising: an evaporator, including a heat conducting element and a plurality of evaporation pipes, and the heat conducting element having a plurality of through holes, and each evaporation pipe being passed and positioned into each corresponding through hole; a condenser, including a condensation pipe; and a communication assembly, including a first barrel and a second barrel, and both ends of each evaporation pipe being communicated with the first barrel and the second barrel respectively, and both ends of the condensation pipe being communicated with the first barrel and the second barrel respectively, so that each of the evaporation pipes, the condensation pipe, the first barrel and the second barrel jointly form a loop.
The present invention has the following advantages and effects:
1. The evaporation pipe and the condensation pipe are connected by the communication assembly, so that it is not necessary to integrally form the evaporation pipe and the condensation pipe, and the quantity of evaporation pipes and condensation pipes can be increased or decreased according to actual needs to achieve the effects of compact size and high heat dissipation efficiency of the thermosyphon cooling device.
2. The heat conducting element can have different numbers of through holes, and each evaporation pipe is passed and positioned in each respective through hole, so that the evaporation pipes can be arranged in parallel with one another to allow more evaporation pipes to be installed on the heat conducting element, so as to improve the heat dissipating effect of the thermosyphon cooling device of the present invention.
3. The thermosyphon cooling device of the present invention further includes a working fluid circulated in a loop, and the loop is vacuumed, so that the working fluid can be dragged by pressure to flow and circulate in the loop, and the evaporator, condenser communication assembly and working fluid of the thermosyphon cooling device jointly dissipate heat to achieve an excellent heat dissipation efficiency.
4. The first barrel is a liquid storage barrel capable of increasing the storage capacity of a liquid-state working fluid, so that the loop of the thermosyphon cooling device has a good buffering capability for a sudden increase of heat and can concentrate the convergent working fluid and divide the flow uniformly into each evaporation pipe, so as to stabilize the thermal conduction efficiency of each evaporation pipe.
5. The second barrel is a gas storage barrel, and the gas storage barrel can increase the storage capacity of the gas-state working fluid and has a convergence effect, and the gas storage barrel is communicated with each of the evaporation pipes and condensation pipes, so that the quantity of condensation pipes is not necessary equal to the quantity of evaporation pipes, so that the quantity of condensation pipes can be decreased to achieve a compact size of the thermosyphon cooling device of the present invention.
6. Both ends of each evaporation pipe are communicated with the first barrel and the second barrel respectively, and the heat conducting element has a heated surface, and the height difference between the second barrel and the heated surface is greater than the height difference between the first barrel and the heated surface, so that the position of the second barrel (which is the gas storage barrel) is higher than the position of the first barrel (which is the liquid storage barrel). The gas-state working fluid with a smaller specific gravity flows towards a high position, and the liquid-state working fluid with a greater specific gravity flows to a low position to stabilize the flow of the working fluid, so as to accelerate the circulating and cooling speed of the thermosyphon cooling device and improve the heat dissipating effect of the thermosyphon cooling device.
7. The quantity of condensation pipes can be increased as needed, and the communication assembly can have an increased quantity of barrels to fit the condensation pipes and adjust the volume and the heat dissipation efficiency of the thermosyphon cooling device.
8. The condenser further includes a fin, and the condensation pipe at the position of fixing the fin is tilted gradually in a direction from an end portion where the gas-state working fluid is entered towards the heat conducting element, so that the gas-state working fluid can be cooled into a liquid state by the fin, and the liquid-state working fluid flows downward accordingly. In the meantime, the liquid-state working fluid has a greater specific gravity to accelerate the flow of the liquid-state working fluid, so that the working fluid can be refilled into the evaporation pipe quickly to stabilize the flow and improve the heat dissipation efficiency of the working fluid.
9. The condensation pipe has a necking portion formed at a position adjacent to the first barrel, so that the internal diameter of the necking section can be smaller than the internal diameter of the evaporation pipe to prevent the working fluid in the evaporation pipe from flowing back into the condensation pipe and achieve a stable flow of the working fluid 5.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a loop thermosyphon cooling device of a first preferred embodiment of the present invention;

FIG. 2 is a schematic view of an evaporation pipe to be passed through a through hole of the present invention;

FIG. 3 is a schematic view of an evaporation pipe already passed through a through hole of the present invention;

FIG. 4 is a sectional view of a heat conducting element of the first preferred embodiment of the present invention;

FIG. 5 is a sectional view of a heat conducting element of a second preferred embodiment of the present invention;

FIG. 6 is a sectional view of a heat conducting element of a third preferred embodiment of the present invention;

FIG. 7 is a schematic view of a using status of a thermosyphon cooling device of the first preferred embodiment of the present invention;

FIG. 8 is a perspective view of a thermosyphon cooling device of the second preferred embodiment of the present invention;

FIG. 9 is a schematic view of a using status of a thermosyphon cooling device of the second preferred embodiment of the present invention;

FIG. 10 is a perspective view of a thermosyphon cooling device of the third preferred embodiment of the present invention; and

FIG. 11 is a perspective view of a thermosyphon cooling device of a fourth preferred embodiment of the present invention fourth.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The technical contents of the present invention will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is noteworthy that the drawings are provided for the purpose of illustrating the present invention, but not intended for limiting the scope of the invention.
With reference to FIGS. 1 to 7 for a loop thermosyphon cooling device of the present invention, the thermosyphon cooling device 10 comprises an evaporator 1, a condenser 2 and a communication assembly 3.
The evaporator 1 includes a heat conducting element 11 and plurality of evaporation pipes 12, and both ends of each evaporation pipe 12 have a liquid inlet end 122 and a gas outlet end 123 respectively. With reference to FIGS. 1 to 4 for a heat conducting element 11 of the first preferred embodiment of the present invention, the heat conducting element 11 has a plurality of through holes 111, and each evaporation pipe 12 is passed and positioned in each through hole 111.
With reference to FIG. 5 for a heat conducting element 11 of the second preferred embodiment of the present invention, the heat conducting element 11 has a heated surface 112 and a placing surface 113 disposed opposite to each other, and each through hole 111 has a through opening 114 formed on the placing surface 113, and each evaporation pipe 12 is partially exposed from the placing surface 113 through each through opening 114. With reference to FIG. 6 for the a heat conducting element 11 of the third preferred embodiment of the present invention, the heat conducting element 11 has a heated surface 112, and each through hole 111 has a through opening 114 formed on the heated surface 112, and each evaporation pipe 12 has a plane 121 exposed from each through opening 114, and each plane 121 is pressed and aligned evenly with the heated surface 112.
The condenser 2 includes a condensation pipe 21 and a plurality of fins 22. Further, the condensation pipe 21 includes a plurality of first condensation pipes 211 and at least one second condensation pipe 212, and both ends of each first condensation pipe 211 have a gas inlet end 2111 and a liquid outlet end 2112 respectively, and both ends of the second condensation pipe 212 have a liquid filling end 2121 and a liquid discharging end 2122 respectively, and each fin 22 is fixed to the first condensation pipes 211, and each first condensation pipe 211 is tilted gradually from the gas inlet end 2111 to the liquid outlet end 2112 in a direction approaching the heat conducting element 11.
The communication assembly 3 includes a first barrel 31 and a second barrel 32, and both ends of each evaporation pipe 12 are communicated with the first barrel 31 and the second barrel 32 respectively, and both ends of the condensation pipe 21 are communicated with the first barrel 31 and the second barrel 32 respectively, and each evaporation pipe 12, condensation pipe 21, first barrel 31 and second barrel 32 jointly form a loop 4. Specifically, the liquid inlet end 122 of each evaporation pipe 12 is communicated with the first barrel 31, and each gas outlet end 123 is communicated with the second barrel 32, and the heat conducting element 11 has a heated surface 112, and the second barrel 32 and the heated surface 112 have a height difference s1 greater than the height difference s2 between the first barrel 31 and the heated surface 112.
In addition, the communication assembly 3 includes a third barrel 33, and the gas inlet end 2111 of each first condensation pipe 211 is communicated with the second barrel 32, and each liquid outlet end 2112 is communicated with the third barrel 33, and the liquid filling end 2121 of the second condensation pipe 212 is communicated with the third barrel 33, and the liquid discharging end 2122 is communicated with the first barrel 31. In addition, the second condensation pipe 212 has a necking portion 2123 formed at a position near the first barrel 31.
The loop thermosyphon cooling device of the present invention further comprises a working fluid 5 circulating in the loop 4, and the interior of the loop 4 is vacuumed, so that the working fluid 5 is dragged by pressure to flow in the loop 4. In addition, the first barrel 31 is a liquid storage barrel 6, the second barrel 32 is a gas storage barrel 7, and the third barrel 33 is a liquid storage barrel 6. Wherein, the working fluid 5 is water or a coolant.
In addition, the first barrel 31 or the second barrel 32 has a filling head 8 communicated with the loop 4, and the filling head 8 is vacuumed, and then the working fluid 3 is filled into the loop 4, such that the working fluid 3 is contained in the loop 4.
In the assembly of the loop thermosyphon cooling device of the present invention, the evaporator 1 includes a heat conducting element 11 and each evaporation pipe 12, and the heat conducting element 11 has each through hole 111 passed and positioned into each through hole 111, and the condenser 2 includes a condensation pipe 21. The communication assembly 3 includes a first barrel 31 and a second barrel 32, and both ends of each evaporation pipe 12 are communicated with the first barrel 31 the and second barrel 32, and both ends of the condensation pipe 21 are communicated with the first barrel 31 and the second barrel 32, such that each evaporation pipe 12, condensation pipe 21, first barrel 31 and second barrel 32 jointly form a loop 4. A communication assembly 3 coupled between the evaporation pipe 12 and the condensation pipe 21, so that it is not necessary to have the evaporation pipe 12 and the condensation pipe 21 integrally formed with each other, and the quantity of evaporation pipes 12 and condensation pipes 21 can be increased or decreased as needed, so as to achieve the effect of a small volume and a high heat dissipation efficiency of the thermosyphon cooling device 10.
In addition, the heat conducting element 11 has a plurality of through holes 111, and each evaporation pipe 12 is passed and positioned into each through hole 111, so that the evaporation pipes 12 are arranged almost parallel to one another, and more evaporation pipes 12 can be installed on the heat conducting element 11 to improve the heat dissipating effect of the thermosyphon cooling device 10 of the present invention.
With reference to FIG. 7 for a thermosyphon cooling device in accordance with the first preferred embodiment of the present invention, the heat generating element 100 is fixed onto the heated surface 112, and the working fluid 5 is in a liquid state and flows from the first barrel 31 into each evaporation pipe 12, and each evaporation pipe 12 receives the heat of the heat generating element 100, so that the working fluid 5 is heated to become a gas-state. Further, the gas-state working fluid 5 enters into the second barrel 32 from each evaporation pipe 12, and then enters into each first condensation pipe 211 from the second barrel 32. Since the fins 22 are fixed to the first condensation pipes 211, so that the heat of the gas-state working fluid 5 is dissipated through the fins 22 to form a liquid-state working fluid 5. Finally, the liquid-state working fluid 5 flows from each first condensation pipe 211 into the third barrel 33, and then enters into the first barrel 31 from the third barrel 33 through the second condensation pipe 212, so as to define a loop 4. The thermosyphon cooling device 10 of the present invention further comprises a working fluid 5 circulated in the loop 4, and the interior of the loop 4 is vacuumed, and the working fluid 5 is dragged by pressure to flow in the loop 4, so that the thermosyphon cooling device 10 can dissipate heat through the evaporator 1, the condenser 2, the communication assembly 3 and the working fluid 5 to achieve an excellent the heat dissipation efficiency of the thermosyphon cooling device 10 of the present invention.
In addition, the first barrel 31 is a liquid storage barrel 6 and capable of increasing the storage capacity of the liquid state working fluid 5 to provide a good buffer of the loop 4 of the thermosyphon cooling device 10 for a sudden increase of heat, while concentrating the working fluid 5 and flowing the working fluid 5 uniformly in each evaporation pipe 12 to stabilize the thermal conduction efficiency of each evaporation pipe 12.
In addition, the second barrel 32 is a gas storage barrel 7 and capable of increasing the storage capacity of the gas-state working fluid 5 and has a convergence effect, and the gas storage barrel 7 is communicated with each of the evaporation pipes 12 and condensation pipes 21, so that the number of condensation pipes 21 is not necessary to be equal to the number of evaporation pipes 12, so that the number of condensation pipes 21 can be reduced to achieve the feature of a compact size of the thermosyphon cooling device 10.
The liquid inlet end 122 of each evaporation pipe 12 is communicated with the first barrel 31, and the gas outlet end 123 of each evaporation pipe 12 is communicated with the second barrel 32, and the heat conducting element 11 has a heated surface 112, and the height difference s1 between the second barrel 32 and the heated surface 112 is greater than the height difference s2 between the first barrel 31 and the heated surface 112, so that the position of the second barrel 32 (which is the gas storage barrel 7) is higher than the position of the first barrel 31 (which is the liquid storage barrel 6), and the gas-state working fluid 5 with a smaller specific gravity flows to a high position, and the liquid-state working fluid 5 with a greater specific gravity enters from a low position to stabilize the flow of the working fluid 5, so as to increase the circulating and cooling speed of the thermosyphon cooling device 10 and improve the heat dissipating effect of the thermosyphon cooling device.
In addition, the condensation pipe 21 includes a first condensation pipe 211 and a second condensation pipe 212, and the communication assembly 3 further includes a third barrel 33, and both ends of the first condensation pipe 211 are communicated with the second barrel 32 and the third barrel 33 respectively, and both ends of the second condensation pipe 212 are communicated with the third barrel 33 and the first barrel 31 respectively. Therefore, the quantity of condensation pipes 21 can be increased as needed, and the communication assembly 3 operated with the condensation pipe 21 can have an increased quantity of barrels to adjust the volume and the heat dissipation efficiency of the thermosyphon cooling device 10.
The condenser 2 further includes a plurality of fins 22, and each fin 22 is fixed to the first condensation pipe 211, and each first condensation pipe 211 is tilted from the gas inlet end 2111 to the liquid outlet end 2112 and gradually towards the heat conducting element 11. In other words, the condensation pipe 21 at the position of fixing the fin 22 is tilted gradually from an end portion where the gas-state working fluid 5 is entered in a direction towards the heat conducting element 11, so that the gas-state working fluid 5 can be cooled into a liquid state by the fin 22, and the liquid-state working fluid 5 flows downward accordingly. In the meantime, the liquid-state working fluid 5 with a greater specific gravity accelerates the flow of the liquid- state working fluid 5 and is refilled into the evaporation pipe 12 quickly to stabilize the flow and improve the heat dissipation efficiency of the working fluid.
Finally, the second condensation pipe 212 has a necking portion 2123 formed at a position adjacent to the first barrel 31. In other words, the condensation pipe 21 has necking portion 2123 adjacent to the first barrel 31, so that the internal diameter of the necking section 2123 is smaller than the internal diameter of the evaporation pipe 12 to prevent the working fluid 5 in the evaporation pipe 12 from flowing back into the condensation pipe 21, so as to achieve a stable flow of the working fluid 5.
With reference to FIGS. 8 and 9 for a thermosyphon cooling device in accordance with the second preferred embodiment of the present invention, the communication assembly 3 further includes a fourth barrel 34, and the condensation pipe 21 further includes at least one diversion assisting pipe 213, and a gas filling end 2131 and a gas outlet end 2132 disposed at both ends of the diversion assisting pipe 213 respectively. The gas filling end 2131 of the diversion assisting pipe 213 is communicated with the second barrel 32, the gas outlet end 2132 is communicated with the fourth barrel 34, the gas inlet end 2111 of each first condensation pipe 211 is communicated with the fourth barrel 34, each liquid outlet end 2112 is communicated with the third barrel 33, the liquid filling end 2121 of the second condensation pipe 212 is communicated with the third barrel 33, the liquid discharging end 2122 is communicated with the first barrel 31, and the fourth barrel 34 is a gas storage barrel 7. Therefore, the same effects and functions as described above can be achieved.
With reference to FIG. 10 for a thermosyphon cooling device in accordance with the third preferred embodiment of the present invention, the second barrel 32 can be an upright barrel or a horizontal barrel as shown in FIGS. 1 and 2. Similarly, the first barrel 31, the third barrel 33 or the fourth barrel 34 as shown in FIG. 1 or FIG. 8 can be an upright barrel or a horizontal barrel. In addition, the shape of the first barrel 31, second barrel 32, third barrel 33 or fourth barrel 34 includes but not limited to a circular shape, an oval shape or any geometric shape.
With reference to FIG. 11 for a thermosyphon cooling device in accordance with the fourth preferred embodiment of the present invention, the condensation pipe 21 includes a condensation pipe 214, and a liquid guiding end 2141 and a gas guiding end 2142 disposed at both ends of the condensation pipe 214 respectively, wherein the liquid guiding end 2141 is communicated with the first barrel 31, and the gas guiding end 2142 is communicated with the second barrel 32. Therefore, the working fluid 5 can be circulated in the loop 4, and the loop 4 is vacuumed, and the working fluid 5 is dragged by pressure to flow in the loop 4, so that the thermosyphon cooling device 10 can dissipate heat jointly by the evaporator 1, the condenser 2, the communication assembly 3 and the working fluid 5, so as to achieve the excellent heat dissipation efficiency of the thermosyphon cooling device 10 of the present invention.
In addition, the condensation pipe 214 has at least one U-shaped section 2143, and each fin 22 is fixed to the U-shaped section 2143, and the condensation pipe 214 has an extension 215 formed in a direction from the gas guiding end 2142 to a position away from the heat conducting element 11, and the extension 215 has an end 2151, and the condensation pipe 214 has a U-shaped section 2143 formed at the end 2151, and the U-shaped section 2143 is tilted gradually in a direction from the end 2151 towards the heat conducting element 11. In other words, the condensation pipe 21 has a position for fixing the fin 22, and is tilted gradually from an end portion where the gas-state working fluid 5 is entered towards the heat conducting element 11, so that the gas-state working fluid 5 can be cooled by the fin 22 into a liquid state, and the liquid-state working fluid 5 flows downward accordingly. Meanwhile, the liquid-state working fluid 5 has a greater specific ratio to accelerate the flow of the liquid-state working fluid 5, so that the evaporation pipe 12 can be filled with the liquid-state working fluid 5 quickly to achieve a stable flow and a high heat dissipation efficiency of the working fluid 5.
In addition, the condensation pipe 214 has a necking portion 2144 disposed at a position adjacent to the first barrel 31. In other words, the condensation pipe 21 has a necking portion 2123 adjacent to the first barrel 31, so that the necking section 2123 can have an internal diameter smaller than the internal diameter of the evaporation pipe 12 to prevent the working fluid 5 in the evaporation pipe 12 from flowing back into the condensation pipe 21, so as to achieve a stable flow of the working fluid 5.
In summation of the description above, the present invention achieves the expected objectives and overcomes the drawbacks of the prior art, and the invention complies with patent application requirements, and is thud duly filed for patent application.
While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Claims

What is claimed is:

1. A loop thermosyphon cooling device, comprising:

an evaporator, including a heat conducting element and a plurality of evaporation pipes, and the heat conducting element having a plurality of through holes, and each evaporation pipe being passed and positioned into each corresponding through hole;

a condenser, including a condensation pipe; and

a communication assembly, including a first barrel and a second barrel, and both ends of each evaporation pipe being communicated with the first barrel and the second barrel respectively, and both ends of the condensation pipe being communicated with the first barrel and the second barrel respectively, so that each of the evaporation pipes, the condensation pipe, the first barrel and the second barrel jointly form a loop.

2. The loop thermosyphon cooling device of claim 1, wherein the heat conducting element has a heated surface and a placing surface opposite to each other, and each through hole has a through opening of the placing surface, and each evaporation pipe is partially exposed from the placing surface through each through opening.

3. The loop thermosyphon cooling device of claim 1, wherein the heat conducting element has a heated surface, and each through hole has a through opening formed on the heated surface, and each evaporation pipe has a plane exposed from each through opening, and each plane and the heated surface are aligned evenly with each other.

4. The loop thermosyphon cooling device of claim 1, further comprising a working fluid circulating in the loop, and both ends of each evaporation pipe having a liquid inlet end and a gas outlet end respectively, and each liquid inlet end being communicated with the first barrel, and each gas outlet end being communicated with the second barrel, and the heat conducting element having a heated surface, and the second barrel and the heated surface having a height difference greater than the height difference between the first barrel and the heated surface, and the first barrel is a liquid storage barrel, and the second barrel is a gas storage barrel.

5. The loop thermosyphon cooling device of claim 4 wherein the working fluid is water or a coolant.

6. The loop thermosyphon cooling device of claim 4, wherein the condenser further comprises a plurality of fins, and the communication assembly further comprises a third barrel, and the condensation pipe comprises a plurality of first condensation pipes and at least one second condensation pipe, and both ends of each first condensation pipe has a gas inlet end and a liquid outlet end, and both ends of the second condensation pipe have a liquid filling end and a liquid discharging end respectively, and each fin is fixed to the first condensation pipes, and each gas inlet end is communicated with the second barrel, and each liquid outlet end is communicated with the third barrel, and the liquid filling end is communicated with the third barrel, and the liquid discharging end is communicated with the first barrel, and the third barrel is a liquid storage barrel.

7. The loop thermosyphon cooling device of claim 6, wherein each first condensation pipe is tilted gradually from the gas inlet end to the liquid outlet end in a direction of approaching the heat conducting element.

8. The loop thermosyphon cooling device of claim 6, wherein the second condensation pipe has a necking portion formed at a position near the first barrel.

9. The loop thermosyphon cooling device of claim 4, wherein the condenser further includes a plurality of fins, and the communication assembly further includes a third barrel and a fourth barrel, and the condensation pipe includes a plurality of first condensation pipes, at least one second condensation pipe and at least one diversion assisting pipe, and both ends of each first condensation pipe have a gas inlet end and a liquid outlet end respectively, and both ends of the second condensation pipe have a liquid filling end and a liquid discharging end respectively, and both ends of the diversion assisting pipe have a gas filling end and a gas outlet end respectively, and each fin is fixed to the first condensation pipes, and the gas filling end is communicated with the second barrel, and the gas outlet end is communicated with the fourth barrel, and each gas inlet end is communicated with the fourth barrel, and each liquid outlet end is communicated with the third barrel, and the liquid filling end is communicated with the third barrel, and the liquid discharging end is communicated with the first barrel, and the third barrel is a liquid storage barrel, and the fourth barrel is a gas storage barrel.

10. The loop thermosyphon cooling device of claim 9, wherein each first condensation pipe is tilted gradually from the gas inlet end to the liquid outlet end in a direction approaching the heat conducting element.

11. The loop thermosyphon cooling device of claim 9, wherein the second condensation pipe has a necking portion formed at a position near the first barrel.

12. The loop thermosyphon cooling device of claim 4, wherein the condenser further includes a plurality of fins, and the condensation pipe includes a condensation pipe, and both ends of the condensation pipe have a liquid guiding end and a gas guiding end respectively, and the liquid guiding end is communicated with the first barrel, and the gas guiding end is communicated with the second barrel, and the condensation pipe has at least one U-shaped section bent from the condensation pipe, and the fins are fixed to the U-shaped section.

13. The loop thermosyphon cooling device of claim 12, wherein the condensation pipe has an extension from at the gas guiding end and away from the heat conducting element, and the extension has an end, and the condensation pipe has the U-shaped section extended from the end, and the U-shaped section is tilted gradually from the end in a direction approaching the heat conducting element.

14. The loop thermosyphon cooling device of claim 12, wherein the condensation pipe has a necking portion formed at a position near the first barrel.