CN105990379B - A kind of photosensitive mould group and production method - Google Patents
A kind of photosensitive mould group and production method Download PDFInfo
- Publication number
- CN105990379B CN105990379B CN201510087043.2A CN201510087043A CN105990379B CN 105990379 B CN105990379 B CN 105990379B CN 201510087043 A CN201510087043 A CN 201510087043A CN 105990379 B CN105990379 B CN 105990379B
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- metal electrode
- described image
- circuit board
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of photosensitive mould group and production methods, by the way that receiving component is arranged on a printed circuit, and imaging sensor is at least partially housed in the receiving component, so that the spacing of the printed circuit board and the package assembling is less than the thickness of described image sensor, since at least part material on printed circuit board can be made way for imaging sensor by the technical solution in the embodiment of the present application, it not only saves raw material and makes the spacing between package assembling and printed circuit board less than the thickness of imaging sensor, therefore the thickness for being at least imaging sensor than the spacing between the package assembling and printed circuit board of the prior art further decreases, realize the thickness that can further decrease photosensitive mould group, and more save the technical effect of raw material.
Description
Technical field
The present invention relates to photosensitive fields, more particularly to a kind of photosensitive mould group and production method.
Background technique
Currently, with the development of electronic technology, the shape of existing electronic product just becomes frivolous, various function applications increasingly
Also increasingly more powerful.
However, the sense electronics light imaging apparatus such as existing camera, video camera, in light and portable design condition
Under, if further to reduce the thickness of product, need to reduce the thickness of each mould group of interiors of products, and each mould of interiors of products
Group includes two parts, and a part is imaging modules, and another part is other each parts in addition to imaging modules.
As shown in Figure 1, imaging modules are usually with flowering structure: in printed circuit in existing sense electronics light imaging apparatus
Imaging sensor 102 is set on plate 101, and connects 101 liang of printed circuit board in the both ends of imaging sensor 102 setting conducting wire
A corresponding endpoint is being located at imaging sensor 102 relative to printed circuit to power for imaging sensor 102
It is additionally provided with infrared fileter 103 on the direction of 101 side of plate, filtered to incident light to further increase into image quality
Amount.
But in the actual production process, if reducing the thickness of the imaging modules of product, product certainly will be will affect
Image quality, therefore, in order to guarantee the image quality of high quality, in the structure member of existing electronics lighting apparatus, usually
The thickness of other each parts in addition to imaging modules can be reduced using various means.
But with the development of the prior art, in current sense electronics light imaging apparatus, the thickness of other each parts is equal
Most thin degree is had reached or is leveled off to, can not further reduce the integral thickness of product under conditions of guaranteeing image quality,
Therefore, it exists in the prior art in the case where guaranteeing certain image quality, electronics photosensitive imaging can not be further increased
The problem of thinness of product.
Summary of the invention
The application provides a kind of photosensitive mould group and production method, to solve to exist in the prior art guarantee it is certain
In the case where image quality, the problem of thinness of the photosensitive imaging product of electronics can not be further increased.
On the one hand the application provides a kind of photosensitive mould group, comprising:
Printed circuit board, including receiving component；
Imaging sensor, described image sensor are at least partially housed in the receiving component, so that the printing is electric
The spacing of road plate and the package assembling is less than the thickness of described image sensor；
Package assembling is connected with the printed circuit board, and for being packaged to described image sensor.
Preferably, the receiving component includes groove or a through-hole.
Preferably, the package assembling includes glass cover-plate, the first conducting wire, the second conducting wire, first conducting wire with it is described
Second conducting wire is set on the surface of the glass cover-plate, and between described image sensor and the glass cover-plate, institute
The first end of the first end and described image sensor of stating the first conducting wire connects, the second end and the printing of first conducting wire
The first end of circuit board connects, and the first end of second conducting wire and the second end of described image sensor connect, and described second
The second end of conducting wire is connect with the second end of the printed circuit board；
Preferably, the glass cover-plate includes packaged glass and infrared filter glass, and the packaged glass with it is described red
Outer filter glass is to overlap.
Preferably, the glass cover-plate includes one block of glass, and is provided with film plating layer in the both side surface of the glass,
The film plating layer is to cross the visible light filtered out other than infrared ray.
Preferably, first conducting wire is specially the first metal electrode, and second conducting wire is specially the second metal electrode,
And first metal electrode and second metal electrode are positioned close to the film plating layer of described image sensor side
On.
Preferably, the first hard contact and the second hard contact, the glass are additionally provided in described image sensor
The first end of first metal electrode on cover board is connect with first hard contact, and the first of second metal electrode
End is connect with second hard contact.
Preferably, it is additionally provided with sealing glue in the gap between described image sensor and the printed circuit board, used
To completely cut off air.
On the other hand, the embodiment of the present application also provides a kind of methods for manufacturing the photosensitive mould group, comprising:
Plated film is carried out in glass both side surface, the visible light filtered out other than infrared ray to enable the glass to cross obtains
To filter glass；
First metal electrode and the second metal electrode are set on the surface of the filter glass, obtain glass cover-plate；
Imaging sensor is fitted on the glass cover-plate, first metal electrode and second metal electrode are made
Between described image sensor and the glass cover-plate, the first end of first metal electrode and described image are sensed
The first end of device connects, and the second end of the first end of second metal electrode and described image sensor is connected, and by institute
It states glass cover-plate and is cut into mould group monolithic by predetermined dimension；Or,
The glass cover-plate is cut by predetermined dimension, and the glass cover-plate by described image sensor fitting after dicing
On, make first metal electrode and second metal electrode between described image sensor and the glass cover-plate,
The first end of the first end of first metal electrode and described image sensor is connected, by the of second metal electrode
The connection of the second end of one end and described image sensor, is made the mould group monolithic；
The mould group monolithic is bonded with the printed circuit board for being provided with receiving component, by the of first metal electrode
Two ends are connect with the first end of the printed circuit board, by the second end of second metal electrode and the printed circuit board
Second end connection, and it is at least partially housed in described image sensor in the receiving component.
Preferably, the method also includes:
Imaging sensor egative film is fitted in sensing wafer surface；
In first end welding the first metal ball of welding of each described image sensor egative film, sensed in each described image
The second end of device egative film welds the second metal ball, and first metal ball and second metal ball are located at and the sensing wafer
On the opposite surface of piece；
The sensing wafer is cut by predetermined dimension, obtains imaging sensor；
The first end for making the metal electrode is connect with described image sensor, comprising:
Described image sensor is fitted on the glass cover-plate；
The first end of first metal electrode is connect with first metal ball, forms the first hard contact；
The first end of second metal electrode is connect with second metal ball, forms the second hard contact.
It is preferably, described to be bonded the mould group monolithic with printed circuit board, comprising:
The mould group monolithic is subjected to tiling placement in the way of upward by described image sensor；
The printed circuit board is bonded in the way of moving down with the mould group monolithic, described image is passed
Sensor is at least partially housed in the receiving component；
The second end of first metal electrode is connect with the first end of the printed circuit board；
The second end of second metal electrode is connect with the second end of the printed circuit board；Or,
The mould group monolithic is bonded with printed circuit board using surface installation technique SMT, makes described image sensor extremely
Small part is contained in the receiving component；
The second end of first metal electrode is connect with the first end of the printed circuit board using tin cream；
The second end of second metal electrode is connect with the second end of the printed circuit board using tin cream.
Preferably, it is described the mould group monolithic is bonded with printed circuit board after, the method also includes:
Sealing glue is injected in gap between described image sensor and the printed circuit board, to completely cut off air.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
It can be seen that the technical solution in the embodiment of the present application accommodates component by setting on a printed circuit, and will
Imaging sensor is at least partially housed in the receiving component, so that the spacing of the printed circuit board and the package assembling
Less than the thickness of described image sensor, due to the technical solution in the embodiment of the present application can by printed circuit board at least
A part of material makes way for imaging sensor, not only saves raw material and makes between package assembling and printed circuit board
Spacing is less than the thickness of imaging sensor, therefore is at least than the spacing between the package assembling and printed circuit board of the prior art
The thickness of imaging sensor further decreases, and realizes the thickness that can further decrease photosensitive mould group, and more saves former
The technical effect of material.
The embodiment of the present application at least also at least has the following technical effects or advantages:
Further, in technical solution in the embodiment of the present application, the through-hole is specifically as follows a groove, that is,
It says, there are also the material layers of a layer printed circuit board on direction of the imaging sensor relative to glass cover-plate, when described image passes
When sensor is set in groove, it on the one hand can play protection imaging sensor and be caused in use by other devices scraping
The problem of damage, has the technical effect for reducing imaging sensor failure rate；On the other hand imaging sensor phase can also be avoided
Another surface of glass cover-plate is directly exposed in air, therefore also there is the probability for reducing impurity contamination imaging sensor
Technical effect.
Further, the glass cover-plate specifically can be by by common packaged glass and with infrared filtering effect
Glass overlapping combinations form, and the glass cover-plate being consequently formed while having encapsulation effect and infrared filtering effect, are guaranteeing this Shen
The photosensitive mould group in the embodiment of the present application please be also set to play on the basis of photosensitive mould group in embodiment has certain thinness
The effect of infrared filtering is carried out to incident light, and there is the technical effect for further promoting image quality.
Further, the glass cover-plate can specifically include one block of glass, and be arranged in glass both side surface
Film plating layer, the glass can play the role of infrared filtering to incident light by the film plating layer being arranged in both side surface, by
Can not only play the role of in film plating layer it is identical with infrared filter glass, but also for infrared filter glass volume and
Weight is more frivolous, it might even be possible to reach the degree ignored, therefore, the technical solution in the embodiment of the present application also has
Guarantee the technical effect that product thickness is further decreased on the basis of imaging modules have infrared filtering effect.
Further, first conducting wire and second conducting wire can be the conduction material being arranged in glass cover plate surfaces
Matter is specifically as follows the form of the first metal electrode and the second metal electrode, since the volume and thickness of metal electrode can neglect
Slightly disregard, therefore have and further decrease the technical effect of photosensitive mould group thickness, also, due in process can be by the
One metal electrode and the second metal electrode are set up directly on the film plating layer to realize imaging sensor and printed circuit board
Between conduct, reduce the difficulty in process, it is seen then that the technical solution in the embodiment of the present application also have reduction give birth to
The technical effect of complexity during production.
Further, connection type of the technical solution in the embodiment of the present application due to using contact avoids big
The contact connectio of area can not only guarantee that imaging sensor has the function of good image sensing, it can also real well
There is the problem of circuit cross-overs in existing conducting function, reduction, and therefore, also there is the technical solution in the embodiment of the present application guarantee to be imaged
Quality and the technical effect for reducing fault probability.
Further, the technical solution in the embodiment of the present application can be by between imaging sensor and printed circuit board
Gap in the material of the tools support and sealing function such as sealing glue is set, it is possible to prevente effectively from imaging sensor influenced by external force and
Deformation, damage etc., but also can effectively completely cut off air, the one side appearance for avoiding imaging sensor from receiving incident light is dirty equal existing
As influencing image quality, it is seen then that the technical solution in the embodiment of the present application can also reduce imaging sensor and deform, damage
The probability with fouling problems is ruined, there is the technical effect for being further ensured that product quality and image quality.
Detailed description of the invention
Fig. 1 is the structure chart of photosensitive mould group in the prior art；
Fig. 2 is a kind of structure chart of photosensitive mould group provided by the embodiments of the present application；
Fig. 3 is a kind of method flow diagram for manufacturing the photosensitive mould group provided by the embodiments of the present application.
Specific embodiment
The application provides a kind of photosensitive mould group and production method, to solve to exist in the prior art guarantee it is certain
Image quality in the case where, the problem of thinness of the photosensitive imaging product of electronics can not be further increased.
Technical solution in the embodiment of the present application is in order to solve the above technical problems, general thought is as follows:
Technical solution in the embodiment of the present application is by setting receiving component on a printed circuit, and by imaging sensor
It is at least partially housed in the receiving component, so that the spacing of the printed circuit board and the package assembling is less than the figure
As the thickness of sensor, since the technical solution in the embodiment of the present application can be by least part material on printed circuit board
Imaging sensor is made way for, raw material are not only saved and the spacing between package assembling and printed circuit board is made to be less than figure
It is at least imaging sensor as the thickness of sensor, therefore than the spacing between the package assembling and printed circuit board of the prior art
Thickness further decrease, realize the thickness that can further decrease photosensitive mould group, and more save the technology of raw material
Effect.
Technical scheme is described in detail below by attached drawing and specific embodiment, it should be understood that the application
Specific features in embodiment and embodiment are the detailed description to technical scheme, rather than to present techniques
The restriction of scheme, in the absence of conflict, the technical characteristic in the embodiment of the present application and embodiment can be combined with each other.
Embodiment one
Referring to FIG. 2, the embodiment of the present application one provides a kind of photosensitive mould group, comprising:
Printed circuit board 22, including receiving component 221；
Imaging sensor 23, described image sensor is at least partially housed in the receiving component, so that the printing
The spacing of circuit board and the package assembling is less than the thickness of described image sensor；
Package assembling is connected with the printed circuit board, and for being packaged to described image sensor.
Due to being provided with receiving component on a printed circuit, and described image sensor is at least partially housed in the receipts
Hold in component, so that when the photosensitive mould group and glass cover-plate that are horizontally arranged in the embodiment of the present application are located above printed circuit board
When, imaging sensor is in the position for being slightly below printed circuit board relative to glass cover-plate, it is seen then that the skill in the embodiment of the present application
Art scheme can make at least part material on printed circuit board in the prior art make way for imaging sensor, not only save
It has saved raw material and has made the spacing between package assembling and printed circuit board less than the thickness of imaging sensor, therefore than existing
The thickness for having the spacing between the package assembling of technology and printed circuit board to be at least imaging sensor further decreases, and realizes
The thickness of photosensitive mould group can be further decreased, and more saves the technical effect of raw material.
In the actual operation process, the receiving component can be a through-hole, or a groove, when the through-hole has
When body is a groove, in other words, the printed circuit board does not penetrate the form as hole, in imaging sensor relative to glass
There are also the material layers of a layer printed circuit board on the direction of glass cover board, when described image sensor is set in groove, a side
Face can play the problem of protection imaging sensor causes damage by other devices scraping in use, and having reduces image
The technical effect of sensor fault rate；On the other hand imaging sensor can also be avoided straight relative to another surface of glass cover-plate
It connects and is exposed in air, therefore also there is the technical effect for the probability for reducing impurity contamination imaging sensor.
Specifically, the package assembling includes glass cover-plate, the first conducting wire 211, the second conducting wire 212, first conducting wire
Be set on the surface of the glass cover-plate with second conducting wire, and be located at described image sensor and the glass cover-plate it
Between, the first end of first conducting wire and the first end of described image sensor connect, the second end of first conducting wire and institute
The first end connection of printed circuit board is stated, the first end of second conducting wire and the second end of described image sensor connect, institute
The second end for stating the second conducting wire is connect with the second end of the printed circuit board.
The material of first conducting wire and second conducting wire can be conductive material, the first end be respectively conducting wire or
One end of imaging sensor or printed circuit board, the second end are respectively the another of conducting wire or imaging sensor or printed circuit board
One end, since the first end of first conducting wire and the first end of described image sensor connect, the second of first conducting wire
End is connect with the first end of printed circuit board, therefore, can be by printed circuit board and first conducting wire to described image
The first end of sensor is powered.
Similarly, since the second end of the first end of second conducting wire and described image sensor connects, described second is led
The second end of line and the second end of printed circuit board connect, and hence it is also possible to pass through printed circuit board and second metal
Electrode is powered to the second end of described image sensor.
In the actual operation process, first conducting wire and second conducting wire can be traditional electric wire, can be gold
Belong to item, is also possible to other modes for realizing conduction, as long as it is corresponding with printed circuit board to can be achieved on imaging sensor
The electric connection of position, allows to the material being powered by printed circuit board to imaging sensor, can be used as institute
State the first conducting wire and the second conducting wire.
Specifically, the glass cover-plate includes packaged glass and infrared filter glass, and the packaged glass with it is described red
Outer filter glass is to overlap.
That is, the glass cover-plate specifically can be by by common packaged glass and with infrared filtering effect
Glass overlapping combinations form, and the glass cover-plate being consequently formed while having encapsulation effect and infrared filtering effect, are guaranteeing this Shen
The photosensitive mould group in the embodiment of the present application please be also set to play on the basis of photosensitive mould group in embodiment has certain thinness
The effect of infrared filtering is carried out to incident light, and there is the technical effect for further promoting image quality.
Specifically, the glass cover-plate includes one block of glass 213, and is provided with plated film in the both side surface of the glass
Layer 214, the film plating layer 214 is to cross the visible light filtered out other than infrared ray.
That is, the glass cover-plate can specifically include one block of glass, and be arranged in glass both side surface
Film plating layer, the glass can play the role of infrared filtering to incident light by the film plating layer being arranged in both side surface, by
Can not only play the role of in film plating layer it is identical with infrared filter glass, but also for infrared filter glass volume and
Weight is more frivolous, it might even be possible to reach the degree ignored, therefore, the technical solution in the embodiment of the present application also has
Guarantee the technical effect that product thickness is further decreased on the basis of imaging modules have infrared filtering effect.
Specifically, first conducting wire is specially the first metal electrode, and second conducting wire is specially the second metal electrode,
And first metal electrode and second metal electrode are positioned close to the film plating layer of described image sensor side
On.
In other words, first conducting wire and second conducting wire can be the conduction material being arranged in glass cover plate surfaces
Matter is specifically as follows the form of the first metal electrode and the second metal electrode, since the volume and thickness of metal electrode can neglect
Slightly disregard, therefore have and further decrease the technical effect of photosensitive mould group thickness, also, due in process can be by the
One metal electrode and the second metal electrode are set up directly on the film plating layer to realize imaging sensor and printed circuit board
Between conduct, reduce the difficulty in process, it is seen then that the technical solution in the embodiment of the present application also have reduction give birth to
The technical effect of complexity during production.
Specifically, the first hard contact 231 and the second hard contact 232, institute are additionally provided in described image sensor
The first end for stating first metal electrode on glass cover-plate is connect with first hard contact, second metal electrode
First end connect with second hard contact.
In other words, contact can be set with conductive material on the both ends of imaging sensor, then by by each touching
Point is connect with the metal electrode at corresponding end respectively, so that the connection between imaging sensor and metal electrode is realized, due to
Using the connection type of contact, the contact connectio of large area is avoided, it is good can not only to guarantee that imaging sensor has
Image sensing function, it can also realize conducting function well, there is the problem of circuit cross-overs, therefore, the application in reduction
Technical solution in embodiment also has the technical effect for guaranteeing image quality and reducing fault probability.
Specifically, it is additionally provided with sealing glue in the gap between described image sensor and the printed circuit board, used
To completely cut off air.
By the way that the support of the tools such as sealing glue and sealing function are arranged in the gap between imaging sensor and printed circuit board
Material, it is possible to prevente effectively from imaging sensor is influenced by external force and deformed, damaged, but also can effectively completely cut off air,
There is phenomena such as dirty in the one side for avoiding imaging sensor from receiving incident light, influences image quality, it is seen then that in the embodiment of the present application
Technical solution can also reduce imaging sensor and deform, damage and the probability of fouling problems, have and be further ensured that production
The technical effect of quality and image quality.
Embodiment two
Referring to FIG. 3, the embodiment of the present application two provides a kind of method for manufacturing photosensitive mould group as described in claim 1,
Include:
Step 301: glass both side surface carry out plated film, to enable the glass cross filter out other than infrared ray can
It is light-exposed, obtain filter glass；
Step 302: the first metal electrode and the second metal electrode being set on the surface of the filter glass, obtain glass
Cover board；
Step 303: imaging sensor being fitted on the glass cover-plate, first metal electrode and described second is made
Metal electrode between described image sensor and the glass cover-plate, by the first end of first metal electrode with it is described
The first end of imaging sensor connects, and the second end of the first end of second metal electrode and described image sensor is connected
It connects, and the glass cover-plate is cut into mould group monolithic by predetermined dimension；Or,
The glass cover-plate is cut by predetermined dimension, and the glass cover-plate by described image sensor fitting after dicing
On, make first metal electrode and second metal electrode between described image sensor and the glass cover-plate,
The first end of the first end of first metal electrode and described image sensor is connected, by the of second metal electrode
The connection of the second end of one end and described image sensor, is made the mould group monolithic；
Step 304: the mould group monolithic being bonded with the printed circuit board for being provided with receiving component, by first metal
The second end of electrode is connect with the first end of the printed circuit board, by the second end of second metal electrode and the printing
The second end of circuit board connects, and is at least partially housed in described image sensor in the receiving component.
Specifically, the method also includes:
Imaging sensor egative film is fitted in sensing wafer surface；
In first end welding the first metal ball of welding of each described image sensor egative film, sensed in each described image
The second end of device egative film welds the second metal ball, and first metal ball and second metal ball are located at and the sensing wafer
On the opposite surface of piece；
The sensing wafer is cut by predetermined dimension, obtains imaging sensor；
The first end for making the metal electrode is connect with described image sensor, comprising:
Described image sensor is fitted on the glass cover-plate；
The first end of first metal electrode is connect with first metal ball, forms the first hard contact；
The first end of second metal electrode is connect with second metal ball, forms the second hard contact.
It is specifically, described to be bonded the mould group monolithic with printed circuit board, comprising:
The mould group monolithic is subjected to tiling placement in the way of upward by described image sensor；
The printed circuit board is bonded in the way of moving down with the mould group monolithic, described image is passed
Sensor is at least partially housed in the receiving component；
The second end of first metal electrode is connect with the first end of the printed circuit board；
The second end of second metal electrode is connect with the second end of the printed circuit board；Or,
The mould group monolithic is bonded with printed circuit board using surface installation technique SMT, makes described image sensor extremely
Small part is contained in the receiving component；
The second end of first metal electrode is connect with the first end of the printed circuit board using tin cream；
The second end of second metal electrode is connect with the second end of the printed circuit board using tin cream.
Specifically, it is described the mould group monolithic is bonded with printed circuit board after, the method also includes:
Sealing glue is injected in gap between described image sensor and the printed circuit board, to completely cut off air.
It can be seen that the technical solution in the embodiment of the present application accommodates component by setting on a printed circuit, and will
Imaging sensor is at least partially housed in the receiving component, so that the spacing of the printed circuit board and the package assembling
Less than the thickness of described image sensor, due to the technical solution in the embodiment of the present application can by printed circuit board at least
A part of material makes way for imaging sensor, not only saves raw material and makes between package assembling and printed circuit board
Spacing is less than the thickness of imaging sensor, therefore is at least than the spacing between the package assembling and printed circuit board of the prior art
The thickness of imaging sensor further decreases, and realizes the thickness that can further decrease photosensitive mould group, and more saves former
The technical effect of material.
The embodiment of the present application at least also at least has the following technical effects or advantages:
Further, in technical solution in the embodiment of the present application, the through-hole is specifically as follows a groove, that is,
It says, there are also the material layers of a layer printed circuit board on direction of the imaging sensor relative to glass cover-plate, when described image passes
When sensor is set in groove, it on the one hand can play protection imaging sensor and be caused in use by other devices scraping
The problem of damage, has the technical effect for reducing imaging sensor failure rate；On the other hand imaging sensor phase can also be avoided
Another surface of glass cover-plate is directly exposed in air, therefore also there is the probability for reducing impurity contamination imaging sensor
Technical effect.
Further, the glass cover-plate specifically can be by by common packaged glass and with infrared filtering effect
Glass overlapping combinations form, and the glass cover-plate being consequently formed while having encapsulation effect and infrared filtering effect, are guaranteeing this Shen
The photosensitive mould group in the embodiment of the present application please be also set to play on the basis of photosensitive mould group in embodiment has certain thinness
The effect of infrared filtering is carried out to incident light, and there is the technical effect for further promoting image quality.
Further, the glass cover-plate can specifically include one block of glass, and be arranged in glass both side surface
Film plating layer, the glass can play the role of infrared filtering to incident light by the film plating layer being arranged in both side surface, by
Can not only play the role of in film plating layer it is identical with infrared filter glass, but also for infrared filter glass volume and
Weight is more frivolous, it might even be possible to reach the degree ignored, therefore, the technical solution in the embodiment of the present application also has
Guarantee the technical effect that product thickness is further decreased on the basis of imaging modules have infrared filtering effect.
Further, first conducting wire and second conducting wire can be the conduction material being arranged in glass cover plate surfaces
Matter is specifically as follows the form of the first metal electrode and the second metal electrode, since the volume and thickness of metal electrode can neglect
Slightly disregard, therefore have and further decrease the technical effect of photosensitive mould group thickness, also, due in process can be by the
One metal electrode and the second metal electrode are set up directly on the film plating layer to realize imaging sensor and printed circuit board
Between conduct, reduce the difficulty in process, it is seen then that the technical solution in the embodiment of the present application also have reduction give birth to
The technical effect of complexity during production.
Further, connection type of the technical solution in the embodiment of the present application due to using contact avoids big
The contact connectio of area can not only guarantee that imaging sensor has the function of good image sensing, it can also real well
There is the problem of circuit cross-overs in existing conducting function, reduction, and therefore, also there is the technical solution in the embodiment of the present application guarantee to be imaged
Quality and the technical effect for reducing fault probability.
Further, the technical solution in the embodiment of the present application can be by between imaging sensor and printed circuit board
Gap in the material of the tools support and sealing function such as sealing glue is set, it is possible to prevente effectively from imaging sensor influenced by external force and
Deformation, damage etc., but also can effectively completely cut off air, the one side appearance for avoiding imaging sensor from receiving incident light is dirty equal existing
As influencing image quality, it is seen then that the technical solution in the embodiment of the present application can also reduce imaging sensor and deform, damage
The probability with fouling problems is ruined, there is the technical effect for being further ensured that product quality and image quality.
Although the preferred embodiment of the application has been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (12)
1. a kind of photosensitive mould group, comprising:
Printed circuit board, including receiving component；
Imaging sensor, described image sensor are at least partially housed in the receiving component；
Package assembling is connected with the printed circuit board, and for being packaged to described image sensor；
Wherein, the spacing of the printed circuit board and the package assembling is less than the thickness of described image sensor；
Glass cover-plate of the described image sensor by the fitting package assembling, position corresponding with the printed circuit board
It is electrically connected.
2. photosensitive mould group as described in claim 1, which is characterized in that the receiving component includes groove or a through-hole.
3. photosensitive mould group as described in claim 1, which is characterized in that the package assembling includes the first conducting wire, the second conducting wire,
First conducting wire and second conducting wire are set on the surface of the glass cover-plate, and are located at described image sensor and institute
It states between glass cover-plate, the first end of first conducting wire and the first end of described image sensor connect, first conducting wire
Second end connect with the first end of the printed circuit board, the of the first end of second conducting wire and described image sensor
The connection of two ends, the second end of second conducting wire are connect with the second end of the printed circuit board.
4. photosensitive mould group as claimed in claim 3, which is characterized in that the glass cover-plate includes packaged glass and infrared filtering
Glass, and the packaged glass is to overlap with the infrared filter glass.
5. photosensitive mould group as claimed in claim 3, which is characterized in that the glass cover-plate includes one block of glass, and described
Film plating layer is provided in the both side surface of glass, the film plating layer is to cross the visible light filtered out other than infrared ray.
6. photosensitive mould group as claimed in claim 5, which is characterized in that first conducting wire is specially the first metal electrode, institute
Stating the second conducting wire is specially the second metal electrode, and first metal electrode and second metal electrode are positioned close to institute
It states on the film plating layer of imaging sensor side.
7. photosensitive mould group as claimed in claim 6, which is characterized in that be additionally provided with the first metal in described image sensor
Contact and the second hard contact, the first end of first metal electrode on the glass cover-plate and first hard contact
Connection, the first end of second metal electrode are connect with second hard contact.
8. photosensitive mould group as described in claim 1, which is characterized in that described image sensor and the printed circuit board it
Between gap in be additionally provided with sealing glue, to completely cut off air.
9. a kind of method of manufacture such as photosensitive mould group of any of claims 1-8, comprising:
Plated film is carried out in glass both side surface, the visible light filtered out other than infrared ray to enable the glass to cross is filtered
Light glass；
First metal electrode and the second metal electrode are set on the surface of the filter glass, obtain glass cover-plate；
Imaging sensor is fitted on the glass cover-plate, is located at first metal electrode with second metal electrode
Between described image sensor and the glass cover-plate, by the first end of first metal electrode and described image sensor
First end connection, the second end of the first end of second metal electrode and described image sensor is connected, and by the glass
Glass cover board is cut into mould group monolithic by predetermined dimension；Or,
The glass cover-plate is cut by predetermined dimension, and by described image sensor fitting glass cover-plate after dicing,
Make first metal electrode and second metal electrode between described image sensor and the glass cover-plate, by institute
The first end of the first end and described image sensor of stating the first metal electrode connects, by the first end of second metal electrode
It is connect with the second end of described image sensor, the mould group monolithic is made；
The mould group monolithic is bonded with the printed circuit board for being provided with receiving component, by the second end of first metal electrode
It is connect with the first end of the printed circuit board, by the second end of second metal electrode and the second of the printed circuit board
End connection, and it is at least partially housed in described image sensor in the receiving component.
10. method as claimed in claim 9, which is characterized in that the method also includes:
Imaging sensor egative film is fitted in sensing wafer surface；
The first metal ball is welded in the first end of each described image sensor egative film, in each described image sensor egative film
Second end welds the second metal ball, and first metal ball is located at opposite with the sensing wafer with second metal ball
On surface；
The sensing wafer is cut by predetermined dimension, obtains imaging sensor；
The first end for making the metal electrode is connect with described image sensor, comprising:
Described image sensor is fitted on the glass cover-plate；
The first end of first metal electrode is connect with first metal ball, forms the first hard contact；
The first end of second metal electrode is connect with second metal ball, forms the second hard contact.
11. method as claimed in claim 10, which is characterized in that it is described to be bonded the mould group monolithic with printed circuit board,
Include:
The mould group monolithic is subjected to tiling placement in the way of upward by described image sensor；
The printed circuit board is bonded in the way of moving down with the mould group monolithic, described image sensor is made
It is at least partially housed in the receiving component；
The second end of first metal electrode is connect with the first end of the printed circuit board；
The second end of second metal electrode is connect with the second end of the printed circuit board；Or,
The mould group monolithic is bonded with printed circuit board using surface installation technique SMT, makes described image sensor at least portion
Divide and is contained in the receiving component；
The second end of first metal electrode is connect with the first end of the printed circuit board using tin cream；
The second end of second metal electrode is connect with the second end of the printed circuit board using tin cream.
12. method as claimed in claim 10, which is characterized in that be bonded the mould group monolithic with printed circuit board described
Later, the method also includes:
Sealing glue is injected in gap between described image sensor and the printed circuit board, to completely cut off air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510087043.2A CN105990379B (en) | 2015-02-25 | 2015-02-25 | A kind of photosensitive mould group and production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510087043.2A CN105990379B (en) | 2015-02-25 | 2015-02-25 | A kind of photosensitive mould group and production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105990379A CN105990379A (en) | 2016-10-05 |
| CN105990379B true CN105990379B (en) | 2019-07-26 |
Family
ID=57038576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510087043.2A Active CN105990379B (en) | 2015-02-25 | 2015-02-25 | A kind of photosensitive mould group and production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105990379B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416241A (en) * | 2019-08-29 | 2019-11-05 | 苏州多感科技有限公司 | Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1450651A (en) * | 2003-05-15 | 2003-10-22 | 王鸿仁 | Image sensor package structure and image taking module using said sensor |
| CN2658948Y (en) * | 2003-09-05 | 2004-11-24 | 今湛光学科技股份有限公司 | Picture sensor flip-chip packaging structure and its picture sensor module |
| CN101281895A (en) * | 2007-04-02 | 2008-10-08 | 全懋精密科技股份有限公司 | Electric connecting structure of circuit board embedding with semiconductor chip |
| CN101764140A (en) * | 2008-12-25 | 2010-06-30 | 菱光科技股份有限公司 | Flip-chip type image sensing module and manufacture method hereof |
| CN102148230A (en) * | 2010-02-04 | 2011-08-10 | 菱光科技股份有限公司 | Image sensing module and packaging method thereof |
| CN102903726A (en) * | 2012-09-29 | 2013-01-30 | 格科微电子（上海）有限公司 | Wafer level packaging method for image sensor |
| CN103402049A (en) * | 2013-07-28 | 2013-11-20 | 宁波远大成立科技股份有限公司 | Image sensing element and manufacturing method |
| CN103996684A (en) * | 2014-05-20 | 2014-08-20 | 格科微电子（上海）有限公司 | Image sensor structure and packaging method thereof |
-
2015
- 2015-02-25 CN CN201510087043.2A patent/CN105990379B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1450651A (en) * | 2003-05-15 | 2003-10-22 | 王鸿仁 | Image sensor package structure and image taking module using said sensor |
| CN2658948Y (en) * | 2003-09-05 | 2004-11-24 | 今湛光学科技股份有限公司 | Picture sensor flip-chip packaging structure and its picture sensor module |
| CN101281895A (en) * | 2007-04-02 | 2008-10-08 | 全懋精密科技股份有限公司 | Electric connecting structure of circuit board embedding with semiconductor chip |
| CN101764140A (en) * | 2008-12-25 | 2010-06-30 | 菱光科技股份有限公司 | Flip-chip type image sensing module and manufacture method hereof |
| CN102148230A (en) * | 2010-02-04 | 2011-08-10 | 菱光科技股份有限公司 | Image sensing module and packaging method thereof |
| CN102903726A (en) * | 2012-09-29 | 2013-01-30 | 格科微电子（上海）有限公司 | Wafer level packaging method for image sensor |
| CN103402049A (en) * | 2013-07-28 | 2013-11-20 | 宁波远大成立科技股份有限公司 | Image sensing element and manufacturing method |
| CN103996684A (en) * | 2014-05-20 | 2014-08-20 | 格科微电子（上海）有限公司 | Image sensor structure and packaging method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105990379A (en) | 2016-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9704651B2 (en) | Electronic component | |
| CN104412381B (en) | Electronic component board for mounting electronic, electronic installation and photographing module | |
| CN105224926B (en) | Fingerprint recognition module installation method and fingerprint recognition module mounting structure | |
| JP2013546199A5 (en) | ||
| US20140262442A1 (en) | Module and method of manufacturing the same | |
| WO2017113472A1 (en) | Electronic terminal | |
| US9634046B2 (en) | Semiconductor packages including electrical insulation features | |
| CN105723508A (en) | Semiconductor module | |
| US8658966B2 (en) | Image sensor and method for packaging same | |
| CN205283692U (en) | Image sensor device that has electromagnetic compatibility shielding (EMC) | |
| CN106716575B (en) | Laminated electronic component | |
| CN105990379B (en) | A kind of photosensitive mould group and production method | |
| CN103730451A (en) | Multi-chip packaging body and packaging method | |
| CN102231382A (en) | Ceramic package for image sensor and package method | |
| US20040256735A1 (en) | Laminated chip electronic device and method of manufacturing the same | |
| US9766140B2 (en) | Surface mount force sensing module | |
| CN106663509B (en) | Thermistor element and electronic component | |
| CN203573987U (en) | SMD diode | |
| TWI550457B (en) | Touch panel and touch control module | |
| US9620445B1 (en) | Chip package structure and method of manufacturing the same | |
| EP3185036A1 (en) | Ultrasonic sensor | |
| WO2017113752A1 (en) | Imaging module and electronic device | |
| JP2006059855A (en) | Chip-type electrolytic capacitor and its manufacturing method | |
| TWI583282B (en) | High performance package and process for making | |
| CN211047397U (en) | Quartz resonator and circuit board integrated structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |