CN105980768A - 照明膜结构 - Google Patents

照明膜结构 Download PDF

Info

Publication number
CN105980768A
CN105980768A CN201480075212.4A CN201480075212A CN105980768A CN 105980768 A CN105980768 A CN 105980768A CN 201480075212 A CN201480075212 A CN 201480075212A CN 105980768 A CN105980768 A CN 105980768A
Authority
CN
China
Prior art keywords
contact area
foil
flexible
polymer
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480075212.4A
Other languages
English (en)
Chinese (zh)
Inventor
P·马库南
K·凯拉南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fleck Brett Ltd
Original Assignee
Fleck Brett Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fleck Brett Ltd filed Critical Fleck Brett Ltd
Publication of CN105980768A publication Critical patent/CN105980768A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
CN201480075212.4A 2013-12-18 2014-12-17 照明膜结构 Pending CN105980768A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20136284 2013-12-18
FI20136284 2013-12-18
PCT/FI2014/051016 WO2015092140A1 (en) 2013-12-18 2014-12-17 Illuminating film structure

Publications (1)

Publication Number Publication Date
CN105980768A true CN105980768A (zh) 2016-09-28

Family

ID=53402172

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480075212.4A Pending CN105980768A (zh) 2013-12-18 2014-12-17 照明膜结构

Country Status (7)

Country Link
US (1) US20160315236A1 (enExample)
EP (1) EP3084290A4 (enExample)
JP (1) JP2017501592A (enExample)
KR (1) KR20160100359A (enExample)
CN (1) CN105980768A (enExample)
CA (1) CA2934465A1 (enExample)
WO (1) WO2015092140A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109140269A (zh) * 2017-06-19 2019-01-04 施赖纳集团两合公司 具有借助于led技术产生可见光的薄膜结构和制造方法
US10760771B2 (en) 2017-06-19 2020-09-01 Schreiner Group Gmbh & Co. Kg Foil structure with generation of visible light by means of LED technology

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016109054A1 (de) * 2016-05-17 2017-11-23 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung
WO2017220847A1 (en) 2016-06-21 2017-12-28 Ledfoil Finland Oy Led screen or illumination means with a flexible film structure
EP3264241A1 (en) * 2016-06-29 2018-01-03 Saint-Gobain Glass France Lighting laminated glazing with a capacitive touch sensitive device and a light emitting diode and the manufacturing
FI130299B (en) 2017-12-28 2023-06-09 Ledfoil Finland Oy DISPLAY STRUCTURE SUITABLE FOR ICE AND OUTDOOR USE
CN108354394B (zh) * 2018-03-29 2024-06-04 江苏集萃有机光电技术研究所有限公司 一种oled照明屏风
KR102486207B1 (ko) * 2021-02-10 2023-01-10 주식회사 파이헬스케어 광원용 기판 및 그 제조방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200935621A (en) * 2008-02-05 2009-08-16 Asmobile Inc Light emitting diode package structure and light emitting diode packaging method
US20090296395A1 (en) * 2008-05-29 2009-12-03 Norm Tarko Light Strip
CN102340931A (zh) * 2010-07-20 2012-02-01 王定锋 采用并置的导线制作单面电路板的方法
CN202189512U (zh) * 2011-06-18 2012-04-11 浙江志江光电科技有限公司 一种smd led柔性显示屏
CN202302941U (zh) * 2011-07-22 2012-07-04 王宁 一种半柔性led灯条及显示屏
TW201234682A (en) * 2010-12-22 2012-08-16 Microconnections Sas Circuit for a light emitting component and method of manufacturing the same
CN102881780A (zh) * 2011-07-15 2013-01-16 展晶科技(深圳)有限公司 发光模组及其制造方法
CN103190204A (zh) * 2010-11-03 2013-07-03 3M创新有限公司 具有无引线接合管芯的柔性led器件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0216787D0 (en) * 2002-07-19 2002-08-28 Pilkington Plc Laminated glazing panel
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7926176B2 (en) * 2005-10-19 2011-04-19 General Electric Company Methods for magnetically directed self assembly
TWI306652B (en) * 2005-10-28 2009-02-21 Chipmos Technologies Inc Light emitting diode package structure
KR101104026B1 (ko) * 2010-05-27 2012-01-06 강민수 Ｌｅｄ 전원용 압전회로부를 포함하는 전자식 카드
WO2013116623A1 (en) * 2012-02-02 2013-08-08 The Procter & Gamble Company Bidirectional light sheet
US9111464B2 (en) * 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200935621A (en) * 2008-02-05 2009-08-16 Asmobile Inc Light emitting diode package structure and light emitting diode packaging method
US20090296395A1 (en) * 2008-05-29 2009-12-03 Norm Tarko Light Strip
CN102340931A (zh) * 2010-07-20 2012-02-01 王定锋 采用并置的导线制作单面电路板的方法
CN103190204A (zh) * 2010-11-03 2013-07-03 3M创新有限公司 具有无引线接合管芯的柔性led器件
TW201234682A (en) * 2010-12-22 2012-08-16 Microconnections Sas Circuit for a light emitting component and method of manufacturing the same
CN202189512U (zh) * 2011-06-18 2012-04-11 浙江志江光电科技有限公司 一种smd led柔性显示屏
CN102881780A (zh) * 2011-07-15 2013-01-16 展晶科技(深圳)有限公司 发光模组及其制造方法
CN202302941U (zh) * 2011-07-22 2012-07-04 王宁 一种半柔性led灯条及显示屏

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109140269A (zh) * 2017-06-19 2019-01-04 施赖纳集团两合公司 具有借助于led技术产生可见光的薄膜结构和制造方法
US10760771B2 (en) 2017-06-19 2020-09-01 Schreiner Group Gmbh & Co. Kg Foil structure with generation of visible light by means of LED technology
US10847692B2 (en) 2017-06-19 2020-11-24 Schreiner Group Gmbh & Co. Kg Foil structure with generation of visible light by means of LED technology
CN109140269B (zh) * 2017-06-19 2021-08-31 施赖纳集团两合公司 具有借助于led技术产生可见光的薄膜结构和制造方法

Also Published As

Publication number Publication date
EP3084290A4 (en) 2018-05-02
EP3084290A1 (en) 2016-10-26
CA2934465A1 (en) 2015-06-25
WO2015092140A1 (en) 2015-06-25
KR20160100359A (ko) 2016-08-23
JP2017501592A (ja) 2017-01-12
US20160315236A1 (en) 2016-10-27

Similar Documents

Publication Publication Date Title
CN105980768A (zh) 照明膜结构
US8860045B2 (en) LED light sheet
JP5533183B2 (ja) Ｌｅｄ光源装置及びその製造方法
JP6110695B2 (ja) 発光装置
CN101630668B (zh) 化合物半导体元件及光电元件的封装结构及其制造方法
KR101084246B1 (ko) 유기 발광 조명 장치
EP2309312B1 (en) Light module
JP2012074724A (ja) 薄膜基板、薄膜基板を備えた化合物半導体デバイスのパッケージ封入構造及びその作製方法
CN103608921A (zh) 具有嵌入式led的led阵列及其方法
US9281299B2 (en) Simple LED package suitable for capacitive driving
CN103081575B (zh) 在电路板上的光源装置和具有多个光源装置的光源设备
CN104081523A (zh) 发光层合体及其制备方法
EP2634474A1 (en) Light emitting module
CN101728370B (zh) 化合物半导体元件的封装模块结构及其制造方法
CN100420049C (zh) 发光二极管模块的基板结构
TW201119099A (en) Light-emitting diode and method for manufacturing thereof
CN112271173A (zh) 双层基板及光源装置
CN1317788C (zh) 电子线路嵌进型电池
TWI254466B (en) Substrate structure of LED module
CN101789472A (zh) 薄型发光二极管组件制作方法
TWI284432B (en) Light emitting diode package module
US20140183565A1 (en) Light-Emitting Module Board and Manufacturing Method of the Light-Emitting Module Board
KR101302280B1 (ko) 엘이디 조명 장치 및 그의 제조 방법
CN117410425A (zh) 发光二极管封装器件及其制备方法、背光模组
TWM505061U (zh) 發光式封裝結構

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160928

WD01 Invention patent application deemed withdrawn after publication