Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/855—Optical field-shaping means, e.g. lenses
  • H10H20/856—Reflecting means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
  • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
  • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
  • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
  • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0277—Bendability or stretchability details
  • H05K1/028—Bending or folding regions of flexible printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
  • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
  • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
  • H05K9/0073—Shielding materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/851—Wavelength conversion means
  • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
  • H10H20/8512—Wavelength conversion materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/852—Encapsulations
  • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
  • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
  • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10621—Components characterised by their electrical contacts
  • H05K2201/10674—Flip chip
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
  • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/01—Manufacture or treatment
  • H10H20/036—Manufacture or treatment of packages
  • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/01—Manufacture or treatment
  • H10H20/036—Manufacture or treatment of packages
  • H10H20/0362—Manufacture or treatment of packages of encapsulations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/01—Manufacture or treatment
  • H10H20/036—Manufacture or treatment of packages
  • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/01—Manufacture or treatment
  • H10H20/036—Manufacture or treatment of packages
  • H10H20/0364—Manufacture or treatment of packages of interconnections

Definitions

• the invention relates to an illuminating film structure.
• Organic LEDs or OLEDs offer a possibility to make a relatively thin and illuminating film which may in principle be flexible.
• Organic materials require a very good protection against environmental oxygen and moisture in order to have long enough life expectancy from practical point of view. That is why OLEDs are closed between two glass plates which results in loss of thinness and flexibility.
• SMD Surface-Mounted Device
• LED Light Emitting Diode
• the total thickness of the structure is mainly determined by the sum of thickness of the LED device and thickness of the polymer substrate(s). The total thickness causes an absolute limit for the flexibility of the illumination surface.
• the present invention seeks to provide an improved flexible and illuminating film structure and a manufacturing method thereof. According to an aspect of the present invention, there is provided an illuminating film structure as specified in claim 1 .
• the invention provides an improvement in flexibility and thickness in the light emitting films which enables their installation on surfaces of largely varying shapes.
• Figure 1 illustrates an example of a flexible and illuminating film structure
• Figure 2 illustrates a flexible single polymer foil and a flexible and electrically conductive layer
• Figure 3 illustrates of the flexible single polymer foil and the flexible and electrically conductive layer which is patterned
• Figure 4 illustrates the flexible single polymer foil and the flexible and electrically conductive layer with connecting areas revealed
• Figure 5 illustrates of the flexible single polymer foil and the flexible and electrically conductive layer on a second flexible shielding foil
• Figure 6 illustrates adhesives on the connecting areas
• Figure 7 illustrates LEDs bonded to the connecting areas
• Figure 8 illustrates a gap between at least one light emitting diode chip and walls of the cavity filled with elastic electrically non-conductive material
• Figure 9 illustrates a luminescent foil over the flexible single polymer foil
• Figure 10 illustrates an example of a roll-to-roll process
• Figure 1 1 illustrates a flow chart of a manufacturing method.
• Figures illustrate various embodiments, they are simplified and only show some structures and/or functional entities.
• the connections shown in the Figures may refer to electrical and/or physical connections. It is apparent to a person skilled in the art that the described apparatus may also comprise other functions and structures than those described in Figures and text. It should be appreciated that details of some functions, structures, power supply and the signalling are irrelevant to the actual invention. Therefore, they need not be discussed in more detail here.
• Figure 1 shows an example of the flexible and illuminating film structure 10.
• Figures 2 to 9 show examples of different phases of a manufacturing process of the illuminating film structurel O.
• the total thickness of the illumination film structure 10 has to be kept thin.
• the flexible and illuminating film structure 10 is a layered structure the thickness of which may be less than about 1 mm.
• the thickness may be about 0.1 mm or even less, for example.
• the film may be made thicker such that the thickness is about 2 mm, for example.
• the flexible and illuminating film structure 10 may not only be thin but it may also have a small radius of curvature.
• the radius of curvature may be less than 10mm, for example.
• the radius of curvature may go down to about 1 mm, for example.
• the surface on which the flexible and illuminating film 10 is placed may be planar, curved or even double curved.
• the flexible and illuminating film structure 10 comprises a flexible single polymer foil 100 which can be considered as a substrate of the film 10.
• the foil 100 may comprise plastic such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), liquid crystal polymer (LCP) or the like, for example.
• the the flexible and illuminating film structure 10 also comprises a flexible and electrically conductive layer 102 which can be patterned for making conductors of an electric circuit which enable the operation of the illuminating film structure 10.
• Figure 3 illustrates an example of the flexible and illuminating film 10 which has the flexible and electrically conductive layer 102 patterned.
• the electrically conductive pattern has contact areas 104 for components.
• the electrically conductive and patterned layer 102 may comprise a metallized polymer layer structure on a first side 106 of the polymer foil 100.
• the metallized polymer layer structure may be laminated on the first side 106 of the polymer foil 100.
• the metallized polymer layer structure on the first side 106 of the polymer foil 100 can be processed by laminating conductive patterns on top of polymer foil using transfer printing method. Another possible method is to combine evaporation and electrolytic deposition.
• a very straightforward method is to utilize commercially available laminated metallic, typically copper or aluminium, coated polymer foils in which conductive traces are patterned by etching, mechanical machine tooling or laser ablation, for example.
• the metallized polymer layer may then have the pattern of the circuitry of the conductors and the contact areas 104.
• the electrically conductive layer 102 may be made by printing the pattern of the circuitry of the conductors and the contact areas 104 with at least one printable conductive ink.
• Figure 3 illustrates these two embodiments of the electrically conductive pattern 102.
• the conductors are not shown in details in Figures but they are included in the conductive and patterned layer 102.
• the flexible and illuminating film 10 comprises at least one cavity 108 in the polymer foil 100.
• the at least one cavity 108 extends though the polymer foil 100 from a second side 1 10 to the contact areas 104 of the conductive pattern 102 on the first side 106.
• the bottom surface of each cavity 108 overlaps at least partly with at least one contact area 104.
• the at least one cavity 108 is made in order to reveal the contact areas 104 for enabling mounting of components such as light emitting diode chips and other electrical components via the at least one cavity 108 from a second side 1 10.
• the at least one cavity 108 also enables any action of bonding the components, for example.
• the film structure comprises a second flexible shielding foil 1 18 on the conductive pattern 102 such that the conductive pattern 102 is between the polymer foil 100 and the second shielding foil 1 18.
• the second shielding foil 1 18 may have a mirror like metallic coating for reflecting optical radiation transmitted by the light emitting diode chips 1 12.
• the second shielding foil 1 18 may mechanically support the polymer foil 100 and protect the polymer foil 100 mechanically.
• the second shielding foil 1 18 may be laminated on the first side 106 of the film structure 10.
• the film structure 10 may comprise a conductive adhesive 1 16 between the at least one light emitting diode chip 1 12 and the contact areas 104.
• the conductive adhesive 1 16 may be dispensed through the cavity 108 from the second side 1 10.
• the conductive adhesive 1 16 is isotropic glue. In an embodiment, the conductive adhesive 1 16 is anisotropic glue.
• the flexible and illuminating film structure 10 comprises at least one non-organic light emitting diode flip-chip 1 12.
• OLED organic light emitting diode
• the operational structure which emits light when electric current is fed to the OLED, has an organic compound.
• the organic compound is generally determined to be material which has at least one chemical compound of carbon.
• the non-organic light emitting diode doesn't have a chemical compound of carbon in the operational structure which emits light.
• the light emitting diode chips 1 12 are placed in the cavities 108 from the second side 1 10. Each of the at least one light emitting diode chip 1 12 may be placed in a cavity of the at least one cavity 108. Each of the at least one light emitting diode chip 1 12 is electrically coupled with the contact areas 104. The contact areas 104 may also be called pads.
• the flip-chip light emitting diode chips 108 may have anode 700 and cathode 702 on the same side or surface. The anode 700 and the cathode 702 are the electric terminals of a light emitting diode chip 1 12.
• the brightness of the film 10 may be over 1000 cd/m 2 or even more than 5000 cd/m 2 .
• led chips For a square meter 14 x 14 led chips may then be used.
• the pitch or distance between led chips is then about 7.9 cm.
• In order to have 5000 cd/m 2 requires five times more led chips which results in 865 leds.
• the inorganic light emitting diode chips 1 12 are durable and they can be bonded to printed conductors on the thin and flexible substrate foil 100 with modern roll- to-roll bonders, for example.
• the light emitting diode chip 1 12 is a light emitting diode die that has not been packaged or encapsulated. That is, the light emitting diode chip 1 12 includes the semiconductor structure but not a case, capsule or housing although the packed light emitting diode chips typically comprise a plastic case, capsule or housing, for example.
• the light emitting diode chips emit optical radiation.
• the optical radiation may be ultraviolet light, visible light or infrared light.
• the light emitting diode chips 1 12 may comprise monochromatic light emitting diode chips or RGB (Red Green Blue) light emitting diode chips. According to the chosen type of the light emitting diode chips 1 12 it is possible to electrically control the illumination color of film structure 10.
• the light emitting diode chips 1 12 may be dense or sparse depending on the application of the illuminating film 100. The sparse distribution of light emitting diode chips 1 12 makes the manufacturing faster and leads to low manufacturing costs.
• a gap 200 between at least one light emitting diode chip 1 12 and walls 1080 of the cavity 108 may be filled with elastic electrically non-conductive material 202.
• the at least one light emitting diode chip 1 12 may be surrounded by the elastic electrically non-conductive material 202.
• the elastic electrically non-conductive material 202 may be dispensed to each gap 200.
• the flexible and illuminating film structure 10 comprises a first flexible shielding foil 1 14 layered on the second side 1 10 of the polymer foil 100.
• the first shielding foil 1 14 may be of plastic, epoxy or silicon.
• the first shielding foil 1 14 may be laminated on the polymer foil 100 having the light emitting chips 1 12 therein. Epoxy and silicon may be dispensed on the polymer foil 100.
• the first shielding foil 1 14 may protect the light emitting chips 1 12 and other components mechanically.
• the first shielding foil 1 14 may also guide the light in a desired manner inside the flexible and illuminating film 10 and it may also guide light in a desired direction outwards from the flexible and illuminating film 10.
• the first shielding foil 1 14 may comprise a luminescent foil 120 placed over the the at least one light emitting diode chip 1 12.
• the luminescent foil 120 may be laminated on a layer of the first shielding foil 1 14 which may comprise at least one layer. If the first shielding foil 1 14 comprises several layers 122, 124, the luminescent foil 120 may reside between two layers of the first shielding foil 1 14.
• the luminescent foil 1 14 may be a phosphorus foil.
• the luminescent foil 1 14 may be patterned according to the conductive layer 102.
• the flexible illuminating film structure 10 may have a wide illuminating surface.
• the area of the flexible illuminating film structure 10 may be one or more square meters.
• the area of the flexible illuminating film structure 10 may be one or more square decimeters.
• the area of the flexible illuminating film structure 10 may be one or more square centimeters.
• the flexible illuminating film structure 10 may be manufactured using a roll-to-roll (R2R) method which is illustrated in Figure 10. Such a processing enables manufacturing wide, thin and flexible illuminating film which has a long life expectancy. Also the efficiency and brightness can be made better than those of the present OLEDs.
• the life expectancy of the flexible illuminating film 10 may be more than 10 000 hours or even 100 000 hours.
• the flexible illumination film 10 may shortly be described as follows:
• - substrate film 100 is based on polymers
• - substrate film may have wide surface
• - conductors may be printed on substrate film 10 using printing technology or etching of a foil with metal may be used
• FIG. 1 1 illustrates an example of a flow chart of the manufacturing method.
• a flexible electrically conductive pattern layer 102 with contact areas 104 for components on a first side 106 of a polymer foil 100 is provided.
• at least one cavity 108 which extends though the polymer foil 100 from the second side 1 10 to the contact areas 104 of the conductive pattern layer 102 on the first side 106 is formed, for revealing the contact areas 104 and for performing mounting of components via the at least one cavity 108 from a second side 1 10.
• each of at least one nonorganic light emitting diode flip-chip 1 12 is placed in an cavity of the at least one cavity 108.
• the at least one non-organic light emitting diode flip-chip 1 12 is coupled electrically with the revealed contact areas 104.
• a first flexible shielding foil 1 14 is provided on the second side 1 10 of the polymer foil 100.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Chemical & Material Sciences (AREA)
• Dispersion Chemistry (AREA)
• Power Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Led Device Packages (AREA)
• Electroluminescent Light Sources (AREA)

Priority Applications (6)

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Publications (1)

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Cited By (4)

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Citations (3)

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• 2014
  • 2014-12-17 JP JP2016560046A patent/JP2017501592A/ja active Pending
  • 2014-12-17 CN CN201480075212.4A patent/CN105980768A/zh active Pending
  • 2014-12-17 EP EP14872927.0A patent/EP3084290A4/en not_active Withdrawn
  • 2014-12-17 CA CA2934465A patent/CA2934465A1/en not_active Abandoned
  • 2014-12-17 US US15/105,462 patent/US20160315236A1/en not_active Abandoned
  • 2014-12-17 KR KR1020167019308A patent/KR20160100359A/ko not_active Ceased
  • 2014-12-17 WO PCT/FI2014/051016 patent/WO2015092140A1/en not_active Ceased

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