CN105977244A - 一种可调色温的csp封装器件及其封装方法 - Google Patents

一种可调色温的csp封装器件及其封装方法 Download PDF

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CN105977244A
CN105977244A CN201610570580.7A CN201610570580A CN105977244A CN 105977244 A CN105977244 A CN 105977244A CN 201610570580 A CN201610570580 A CN 201610570580A CN 105977244 A CN105977244 A CN 105977244A
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csp
level package
package device
fluorescent glue
packaging
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程胜鹏
许瑞龙
刘火奇
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ZHONGSHAN LITI LIGHTING TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

本发明公开了一种可调色温的CSP封装器件及其封装方法，本发明所述可调色温的CSP封装器件包括荧光胶封层、CSP芯片级封装器件和LED倒装芯片；所述CSP芯片级封装器件和LED倒装芯片相互紧挨，并由荧光胶封层包覆；所述CSP芯片级封装器件包括芯片和包覆芯片的荧光胶，其中荧光胶封层和荧光胶中荧光粉的浓度不同。本发明所述可调色温的CSP封装器件中两种色温器件之间的距离很近，避免产生因两种色温器件之间的距离产生的光斑，提高了照明效果。

Description

一种可调色温的CSP封装器件及其封装方法
技术领域
本发明涉及CSP封装器件及其封装方法。
背景技术
LED灯因其节能、环保、光效高和寿命长灯优点，正在逐步取代传统光源。随着人们对生活品质要求的提高，为营造不同的气氛，人们希望能够实现可以根据情景调节色温调节。
一般可调色温LED灯的光源由两个独立且不同色温的器件组成，仅能发出两种色温的光；上述可调色温LED灯的光源在点亮时会因两种色温器件之间的距离差而产生光斑，降低照明效果。
发明内容
为解决上述的技术问题，本发明提供一种可调色温的CSP封装器件及其封装方法，本发明采用的技术手段为：
一种可调色温的CSP封装器件，包括荧光胶封层、CSP芯片级封装器件和LED倒装芯片；所述CSP芯片级封装器件和LED倒装芯片相互紧挨，并由荧光胶封层包覆；所述CSP芯片级封装器件包括芯片和包覆芯片的荧光胶，其中荧光胶封层和荧光胶中荧光粉的浓度不同。
进一步的，所述荧光胶封层内至少分别有一个CSP芯片级封装器件和LED倒装芯片。
进一步的，所述荧光胶封层和荧光胶的材料均为透明胶水和荧光粉的混合物。
进一步的，所述LED倒装芯片和CSP芯片级封装器件的电性连接 为并联。
本发明所述可调色温的CSP封装器件的封装方法包括以下步骤：
S1、将LED倒装芯片与CSP芯片级封装器件均匀排列置于载板上；
S2、在S1所得产品涂覆一层荧光胶封层并烘干；
S3、以至少分别一个LED倒装芯片和CSP芯片级封装器件为单位切割所述S2的产品并去掉载板。
本发明所述可调色温的CSP封装器件中两种色温器件相互紧挨，两种色温器件之间的距离小，在点亮时不会因距离差而产生光斑，具有良好的照明效果；同时本发明所述可调色温的CSP封装器件采用CSP封装，适用于小面积的发光模组，实现了小体积可调色温的功能。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明所述可调色温的CSP封装器件的结构示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例和附图，对本发明实施例中的技术方案进行清楚、完整地描述。需要说明的是，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于 本发明保护的范围。
下面结合附图说明本发明的具体实施方式。
如图1所示为本发明所述可调色温的CSP封装器件的结构示意图，包括荧光胶封层1、LED倒装芯片2和CSP芯片级封装器件3。
所述LED倒装芯片2和CSP芯片级封装器件3紧挨，并由荧光胶封层1包覆。LED倒装芯片2和CSP芯片级封装器件3之间的距离小，LED倒装芯片2和CSP芯片级封装器件3点亮时，避免因LED倒装芯片2和CSP芯片级封装器件3的距离差而产生光斑，提高了照明效果。作为优选，所述荧光胶封层1内至少分别有一个LED倒装芯片2和CSP芯片级封装器件3。
作为优选，所述荧光胶封层1和荧光胶4的材料均为透明胶水和荧光粉的混合物。所述CSP芯片级封装器件3包括芯片和包覆芯片的荧光胶4,其中所述荧光胶4和荧光胶封层1的荧光粉的浓度不同。LED倒装芯片2和CSP芯片级封装器件3发出的光经过不同浓度的荧光胶4和荧光胶封层1可获得不同色温的光。
当CSP芯片级封装器件3外涂覆的荧光胶4中的荧光粉的浓度高于荧光胶封层1中荧光粉的浓度时，CSP芯片级封装器件3发出的光比LED倒装芯片2发出的光所经过的荧光粉颗粒的数目多，因此CSP芯片级封装器件3中的芯片发出的光的色温低于LED倒装芯片2发出的光的色温。
当CSP芯片级封装器件3外涂覆的荧光胶4中的荧光粉的浓度低于荧光胶封层1中荧光粉的浓度时，CSP芯片级封装器件3发出的光所经过的荧光粉颗粒的数目少于LED倒装芯片2发出的光所经过的荧光粉颗粒的数目，因此CSP芯片级封装器件3点亮时发出的光的色温高于LED倒装芯片2发出的光的色温。
当CSP芯片级封装器件3外涂覆的荧光胶4中荧光粉的浓度为零 时，即CSP芯片级封装器件3外涂覆着透明胶水时，CSP芯片级封装器件3所经过的荧光胶封层1的厚度小于LED倒装芯片2所经过的荧光胶封层1的厚度，因此CSP芯片级封装器件3发出的光比LED倒装芯片2发出的光所经过的荧光粉颗粒的数目少，因此CSP芯片级封装器件3点亮时发出的光的色温高于LED倒装芯片2点亮时发出的光的色温。
当荧光胶封层1中的荧光粉的浓度为零时，即荧光胶封层1为透明胶水时，CSP芯片级封装器件3点亮时发出的光经过的荧光粉颗粒比LED倒装芯片2多，此时CSP芯片级封装器件3点亮时发出的光的色温低于LED倒装芯片2点亮时发出的光的色温。
作为优选，所述LED倒装芯片2和CSP芯片级封装器件3的电性连接为并联，可通过调节LED倒装芯片2和CSP芯片级封装器件3中驱动电流的大小，达到调节色温的目的。
本发明所述可调色温的CSP封装器件的封装方法包括以下步骤：
S1、将LED倒装芯片与CSP芯片级封装器件置于载板上；
S2、在S1所得产品涂覆一层荧光胶封层并烘干；
S3、以至少分别一个LED倒装芯片和CSP芯片级封装器件为单位切割所述S2的产品并去掉载板。
本发明所述可调色温的CSP封装器件中LED倒装芯片和CSP芯片级封装器件相互紧挨，两种色温器件之间的距离小，避免不同色温器件在点亮之间因距离差而产生光斑，提高了照明效果。同时，本发明所述一种可调色温的CSP封装器件采用CSP封装，适用于小面积的发光模组。

Claims (5)

1.一种可调色温的CSP封装器件，其特征在于，包括荧光胶封层、CSP芯片级封装器件和LED倒装芯片；所述CSP芯片级封装器件和LED倒装芯片相互紧挨，并由荧光胶封层包覆；所述CSP芯片级封装器件包括芯片和包覆芯片的荧光胶，其中荧光胶封层和荧光胶中荧光粉的浓度不同。
2.根据权利要求1所述可调色温的CSP封装器件，其特征在于，所述荧光胶封层内至少分别有一个CSP芯片级封装器件和LED倒装芯片。
3.根据权利要求2所述可调色温的CSP封装器件，其特征在于，所述荧光胶封层和荧光胶的材料均为透明胶水和荧光粉的混合物。
4.根据权利要求3所述可调色温的CSP封装器件，其特征在于，所述LED倒装芯片和CSP芯片级封装器件的电性连接为并联。
5.一种可调色温的CSP封装器件的封装方法，其特征在于，包括以下步骤：
S1、将LED倒装芯片与CSP芯片级封装器件均匀排列在载板上；
S2、在S1所得产品涂覆一层荧光胶封层并烘干；
S3、以至少分别一个LED倒装芯片和CSP芯片级封装器件为单位切割所述S2的产品并去掉载板。
CN201610570580.7A 2016-07-18 2016-07-18 一种可调色温的csp封装器件及其封装方法 Pending CN105977244A (zh)

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CN106356432A (zh) * 2016-11-23 2017-01-25 中山市富利迪光电科技有限公司 一种可调色温的光源以及封装方法
CN106409820A (zh) * 2016-10-24 2017-02-15 中山市立体光电科技有限公司 一种可调色温的led灯珠及其封装方法
CN106678730A (zh) * 2017-03-03 2017-05-17 四川鋈新能源科技有限公司 色温可调的led灯丝及led灯泡
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CN106409820A (zh) * 2016-10-24 2017-02-15 中山市立体光电科技有限公司 一种可调色温的led灯珠及其封装方法
CN106356432A (zh) * 2016-11-23 2017-01-25 中山市富利迪光电科技有限公司 一种可调色温的光源以及封装方法
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CN109980070A (zh) * 2017-12-22 2019-07-05 海迪科（南通）光电科技有限公司 一种晶圆级芯片级csp封装结构及其制备方法
CN109980070B (zh) * 2017-12-22 2024-03-19 海迪科（南通）光电科技有限公司 一种晶圆级芯片级csp封装结构及其制备方法

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