CN109545945B - 一种白光led用夹层荧光玻璃的制备方法 - Google Patents
一种白光led用夹层荧光玻璃的制备方法 Download PDFInfo
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- CN109545945B CN109545945B CN201811439183.1A CN201811439183A CN109545945B CN 109545945 B CN109545945 B CN 109545945B CN 201811439183 A CN201811439183 A CN 201811439183A CN 109545945 B CN109545945 B CN 109545945B
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- 239000011521 glass Substances 0.000 title claims abstract description 203
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 38
- 239000003292 glue Substances 0.000 claims abstract description 20
- 238000005086 pumping Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 108010043121 Green Fluorescent Proteins Proteins 0.000 claims description 35
- 150000004767 nitrides Chemical class 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 230000007480 spreading Effects 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 150000002222 fluorine compounds Chemical class 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 3
- 238000005303 weighing Methods 0.000 abstract 2
- 238000009827 uniform distribution Methods 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 230000004907 flux Effects 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000009877 rendering Methods 0.000 description 8
- 229910002027 silica gel Inorganic materials 0.000 description 8
- 239000000741 silica gel Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001194 electroluminescence spectrum Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000103 photoluminescence spectrum Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
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CN201811439183.1A CN109545945B (zh) | 2018-11-28 | 2018-11-28 | 一种白光led用夹层荧光玻璃的制备方法 |
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CN201811439183.1A CN109545945B (zh) | 2018-11-28 | 2018-11-28 | 一种白光led用夹层荧光玻璃的制备方法 |
Publications (2)
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CN109545945A CN109545945A (zh) | 2019-03-29 |
CN109545945B true CN109545945B (zh) | 2021-03-23 |
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CN201811439183.1A Active CN109545945B (zh) | 2018-11-28 | 2018-11-28 | 一种白光led用夹层荧光玻璃的制备方法 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114221207B (zh) * | 2021-11-24 | 2023-12-01 | 华中科技大学 | 一种荧光玻璃片及其制备方法和应用 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101894897A (zh) * | 2010-06-13 | 2010-11-24 | 东南大学 | 发光二极管的高性能玻璃封装方法 |
CN102420221A (zh) * | 2010-09-28 | 2012-04-18 | 盈胜科技股份有限公司 | 气密型多层式阵列型发光二极管 |
CN202024287U (zh) * | 2010-11-01 | 2011-11-02 | 盈胜科技股份有限公司 | 气密型多层式阵列型发光二极管的封装结构 |
CN102487117A (zh) * | 2010-12-06 | 2012-06-06 | 矽品精密工业股份有限公司 | 透光盖板及其制法及发光二极管的封装结构 |
CN102157668A (zh) * | 2011-04-01 | 2011-08-17 | 饶曼夫 | 发光二极管的荧光粉封装结构及其封装方法 |
CN102945914B (zh) * | 2012-08-17 | 2016-03-02 | 江苏脉锐光电科技有限公司 | 一种用于光学波长转换的荧光玻璃涂层及白光发光装置 |
CN202945732U (zh) * | 2012-11-26 | 2013-05-22 | 徐明远 | 一种有照明功能的墙砖 |
US9202996B2 (en) * | 2012-11-30 | 2015-12-01 | Corning Incorporated | LED lighting devices with quantum dot glass containment plates |
CN103398316A (zh) * | 2013-08-27 | 2013-11-20 | 江苏华英光宝科技股份有限公司 | 高透超薄石英晶体散热平板led光源 |
CN203395700U (zh) * | 2013-08-27 | 2014-01-15 | 江苏华英光宝科技股份有限公司 | 高透超薄石英晶体散热平板led光源 |
CN107123725B (zh) * | 2017-05-02 | 2019-08-23 | 武汉纺织大学 | 量子点薄膜、量子点白光led及其封装方法 |
KR102389815B1 (ko) * | 2017-06-05 | 2022-04-22 | 삼성전자주식회사 | 양자점 유리셀 및 이를 포함하는 발광소자 패키지 |
WO2019190026A1 (ko) * | 2018-03-26 | 2019-10-03 | 주식회사 루멘스 | 퀀텀닷 플레이트 조립체와 이를 포함하는 발광소자 패키지 및 led 모듈 |
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- 2018-11-28 CN CN201811439183.1A patent/CN109545945B/zh active Active
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CB03 | Change of inventor or designer information |
Inventor after: Wan Wenchang Inventor after: Li Zonghuan Inventor after: Zhang Hui Inventor after: Wang Jiang Inventor after: Huang Yuanbo Inventor after: Zhang Xiaoxiao Inventor after: Lin Tao Inventor after: Shi Mingming Inventor after: Zou Jun Inventor before: Wan Wenchang Inventor before: Li Zonghuan Inventor before: Zhang Hui Inventor before: Wang Jiangbo Inventor before: Huang Yuanbo Inventor before: Zhang Xiaoxiao Inventor before: Lin Tao Inventor before: Shi Mingming Inventor before: Zou Jun |
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Effective date of registration: 20210421 Address after: 315301 No. 299, Zongan Road, Zonghan street, Cixi City, Ningbo City, Zhejiang Province Patentee after: NINGBO LONGER LIGHTING Co.,Ltd. Address before: 200235 No. 120-121, Xuhui District, Shanghai, Caobao Road Patentee before: SHANGHAI INSTITUTE OF TECHNOLOGY |
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