CN105934069B - A kind of multiple-printed-panel for circuit board - Google Patents
A kind of multiple-printed-panel for circuit board Download PDFInfo
- Publication number
- CN105934069B CN105934069B CN201610380418.9A CN201610380418A CN105934069B CN 105934069 B CN105934069 B CN 105934069B CN 201610380418 A CN201610380418 A CN 201610380418A CN 105934069 B CN105934069 B CN 105934069B
- Authority
- CN
- China
- Prior art keywords
- technique edges
- via hole
- copper sheet
- circuit board
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of multiple-printed-panel for circuit board, including veneer and the technique edges of veneer edge are arranged in, technique edges include copper sheet layer and separation layer, and copper sheet layer is at least two layers, are provided with separation layer between adjacent two layers copper sheet layer；Via hole is provided on technique edges, via hole is electroplated in technique edges, via hole to be formed with reinforcing prop, and reinforcing prop is fixedly connected with all copper sheet layers.Reinforcing prop is formed by plated via hole wall, and the bonding strength between copper sheet layer is larger, and securely all copper sheet layers can link together, to improve the structural strength of technique edges, is improved the anti-of technique edges and is torn curved ability open, effectively prevent technique edges stress deformation；It when preparing veneer progress electroplating technology, can be electroplated to form reinforcing prop simultaneously, technique edges structural strength can be enhanced without increasing additional process step, simplify technique, reduce production cost.
Description
Technical field
The present invention relates to circuit board design techniques field more particularly to a kind of multiple-printed-panel for circuit board.
Background technique
With the fast development of the electronic products such as mobile phone, tablet computer.The fuselage of product is increasingly intended to thin, light and handy
Change.The space layout of interiors of products also can be more and more compacter.Circuit board size in electronic product is smaller, generally uses split type
Printed circuit board, i.e. multiple-printed-panel for circuit board is put together by several lesser circuit boards.Multiple-printed-panel for circuit board is generally by technique
Side and dowel fit together.In the prior art, multiple-printed-panel for circuit board (PCB jigsaw) is carrying out SMT (Surface Mount
Technology, surface mounting technology) cross furnace when, due to high-temperature heating, the longitudinal direction of jigsaw can since stroke is longer
The phenomenon that temperature distortion can be will appear, multiple-printed-panel for circuit board deformation can make the welding of the device on multiple-printed-panel for circuit board rosin joint or desoldering occur
The phenomenon that, leading welding heavy industry to increase SMT processing cost influences SMT processing efficiency.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of multiple-printed-panel for circuit board, can be improved the structure of technique edges
Intensity.
In order to solve the above-mentioned technical problem, it the embodiment provides a kind of multiple-printed-panel for circuit board, including veneer and sets
The technique edges in the veneer edge are set, the technique edges include copper sheet layer and separation layer, and the copper sheet layer is at least two layers,
The separation layer is provided between copper sheet layer described in adjacent two layers；Via hole is provided on the technique edges, the via hole runs through institute
State technique edges, electroplated in the via hole to be formed with reinforcing prop, the reinforcing prop is fixedly connected with all copper sheet layers.
Wherein, the reinforcing prop is solid cylindrical.
It wherein, is the copper sheet layer at two outermost layers on the technique edges.
Wherein, the aperture of the via hole is 0.4-0.5mm.
Wherein, the via hole is circular hole.
Wherein, the via hole is multiple.
Wherein, the technique edges are box shape, and four edges are provided with via hole.
Wherein, each edge of the technique edges is provided with multiple via holes.
Wherein, multiple via holes of each edge are arranged at L-shaped along the corner.
Wherein, multiple via holes are provided on the frame of the technique edges.
Multiple-printed-panel for circuit board provided by the invention, reinforcing prop are formed by plated via hole wall, with the connection between copper sheet layer
Intensity is larger, and securely all copper sheet layers can link together, to improve the structural strength of technique edges, improve technique edges
It is anti-to tear curved ability open, it effectively prevent technique edges stress deformation；Prepare veneer carry out electroplating technology when, can be electroplated simultaneously to be formed plus
Qiang Zhu can enhance technique edges structural strength without increasing additional process step, simplify technique, reduction is produced into
This.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram for the multiple-printed-panel for circuit board that the preferred embodiment of the present invention provides；
Fig. 2 is sectional view of the multiple-printed-panel for circuit board at via hole in Fig. 1.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.
Referring to Fig. 1-2, exist for a kind of multiple-printed-panel for circuit board that preferred embodiment in the present invention provides, including veneer 2 and setting
The technique edges 1 of 2 edge of veneer.Veneer 2 can be one, or multiple.When veneer 2 is multiple, technique edges 1 are located at more
The whole outer edge of a veneer 2.In the present embodiment, veneer 2 is four.Technique edges 1 are box shape, the whole position of four veneers 2
In the framework of technique edges 1.
Technique edges 1 include copper sheet layer 11 and separation layer 12, and copper sheet layer 11 is at least two layers, between adjacent two layers copper sheet layer 11
It is provided with separation layer 12.The electric isolution between copper sheet layer 11 may be implemented by separation layer 12.In the present embodiment, copper sheet layer 11 is
Four layers, separation layer 12 is three layers, and four layers of copper sheet layer 11 are separated.
Via hole 10 is provided on technique edges 1, via hole 10 is electroplated in technique edges 1, via hole 10 to be formed with reinforcing prop 13,
Reinforcing prop 13 is fixedly connected with all copper sheet layers 11.Reinforcing prop 13 is formed by 10 hole wall of plated via, between copper sheet layer 11
Bonding strength it is larger, securely all copper sheet layers 11 can be linked together, to improve the structural strength of technique edges 1, mentioned
The anti-of high technology side 1 tears curved ability open, effectively prevent technique edges stress deformation.When preparing the progress electroplating technology of veneer 2, Ke Yitong
When be electroplated to form reinforcing prop 13,1 structural strength of technique edges can be enhanced without increasing additional process step, simplify work
Skill reduces production cost.
Preferably, reinforcing prop 13 is solid cylindrical.Plated material can fill completely entire via hole 10, to enhance via hole 10
The structural strength at place.Herein, in other embodiments, it can control electroplating time, be only electroplated one on the hole wall of via hole 10
Layer, so that reinforcing prop 13 is hollow column.
It is copper sheet layer 11 at two outermost layers on technique edges 1 in the present embodiment.After plating forms reinforcing prop 13, reinforcing prop
13 can securely connect with outermost two layers of copper sheet layer 11, as shown in Fig. 2, two layers of copper sheet layer 11 in top layer and bottom is equal
It is connected with reinforcing prop 13, so that the multilayered structure in technique edges 1 be pressed together, improves the anti-of technique edges and tear curved ability open, mention
The intensity of high multiple-printed-panel for circuit board.
The aperture of via hole 10 is 0.4-0.5mm, excessive to avoid 10 aperture of via hole, avoids aperture to the structure of technique edges 1
Intensity affects greatly.Meanwhile the aperture of via hole 10 be 0.4-0.5mm, in the plating process, can within a short period of time by
Via hole 10 is filled into solid reinforcing prop 13, in order to the machine-shaping of solid reinforcing prop 13.
Via hole 10 is circular hole, in order to carry out aperture on technique edges 1, while avoiding aperture strong to the structure of technique edges 1
Degree affects greatly, and is conducive to the plating to 10 hole wall of via hole.Herein, in other embodiments, via hole 10 can be with
For other shapes such as delthyrium, square hole or elliptical apertures.
Via hole 10 be it is multiple, using multiple via holes 10 for being electroplate with reinforcing prop 13, can effectively improve the structure of technique edges 1
Intensity.Via hole 10 can be set in place of structure is more weak, to improve corresponding site according to the shape and structure of technique edges 1
Structural strength.
In the present embodiment, technique edges 1 are box shape, and technique edges 1 can be made integrally to have stronger structural strength.When
So, in other embodiments, technique edges 1 can also be the other shapes such as U-shaped frame shape, "-" type.Four corners of technique edges 1
Place is provided with via hole 10.The structural strength of 1 edge of technique edges can be improved using 10 structure of via hole.Further, technique edges 1
Each edge be provided with multiple via holes 10, to further increase the structural strength of the corner of technique edges 1.Each edge it is more
A via hole 10 is at L-shaped along corner arrangement, and multiple via holes 10 are at L-shaped along corner arrangement, can be effectively improved according to the shape of corner
The structural strength of via hole 10.
Shape matches between the edge corresponding with both veneers 2 of technique edges 1, so that the inside edge of technique edges 1 can
Along the setting of the edge shape of corresponding veneer 2, can keep relatively uniform gap therebetween, technique edges 1 can be abundant
Using unilateral edge shape, to increase the partial width of technique edges 1, to improve the structural strength of technique edges 1.
In the above-described embodiment, via hole 10 only is set in the edge of technique edges 1, herein, in other embodiments,
Multiple via holes 10 can also be set on the frame of technique edges 1, to improve the structural strength of the frame of technique edges 1.
Above embodiment does not constitute the restriction to the technical solution protection scope.It is any in above embodiment
Spirit and principle within made modifications, equivalent substitutions and improvements etc., should be included in the technical solution protection scope it
It is interior.
Claims (9)
1. a kind of multiple-printed-panel for circuit board, which is characterized in that including veneer and be arranged in the technique edges of the veneer edge, the work
Skill side includes copper sheet layer and separation layer, and the copper sheet layer is at least two layers, is provided between copper sheet layer described in adjacent two layers described
Separation layer；The weaker place of structure is respectively arranged with via hole on the technique edges, and the via hole runs through the technique edges, the mistake
The electroplated reinforcing prop for being formed with solid cylindrical of the hole wall in hole, the reinforcing prop are fixedly connected with all copper sheet layers, wherein
The electroplating technology of the reinforcing prop carries out in same processing step with the electroplating technology for preparing the veneer.
2. multiple-printed-panel for circuit board according to claim 1, which is characterized in that be described at two outermost layers on the technique edges
Copper sheet layer.
3. multiple-printed-panel for circuit board according to claim 1, which is characterized in that the aperture of the via hole is 0.4-0.5mm.
4. multiple-printed-panel for circuit board according to claim 1, which is characterized in that the via hole is circular hole.
5. multiple-printed-panel for circuit board according to claim 1, which is characterized in that the via hole is multiple.
6. multiple-printed-panel for circuit board according to claim 1, which is characterized in that the technique edges are box shape, four corners
Place is provided with the via hole.
7. multiple-printed-panel for circuit board according to claim 6, which is characterized in that each edge of the technique edges is provided with more
A via hole.
8. multiple-printed-panel for circuit board according to claim 7, which is characterized in that multiple via holes of each edge are along institute
It is at L-shaped to state corner arrangement.
9. multiple-printed-panel for circuit board according to claim 6, which is characterized in that be provided with multiple institutes on the frame of the technique edges
State via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380418.9A CN105934069B (en) | 2016-05-31 | 2016-05-31 | A kind of multiple-printed-panel for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380418.9A CN105934069B (en) | 2016-05-31 | 2016-05-31 | A kind of multiple-printed-panel for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105934069A CN105934069A (en) | 2016-09-07 |
| CN105934069B true CN105934069B (en) | 2019-04-05 |
Family
ID=56832134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610380418.9A Expired - Fee Related CN105934069B (en) | 2016-05-31 | 2016-05-31 | A kind of multiple-printed-panel for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105934069B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114423142B (en) * | 2021-12-13 | 2023-12-12 | 湖南省方正达电子科技有限公司 | Three-dimensional assembled ceramic circuit board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201967249U (en) * | 2010-12-31 | 2011-09-07 | 深圳市同创鑫电子有限公司 | Large-current PCB (printed circuit board) |
| CN202317770U (en) * | 2011-11-23 | 2012-07-11 | 天津普林电路股份有限公司 | Milled plate clamp special for single assembly plate or multiple assembly plates of high-density interconnection circuit board |
| CN104918423A (en) * | 2015-06-19 | 2015-09-16 | 深圳崇达多层线路板有限公司 | Manufacturing method for circuit board capable of detecting inner-layer pore ring |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101873770B (en) * | 2009-04-21 | 2012-07-18 | 广东兴达鸿业电子有限公司 | Electroplating copper plughole process of circuit board |
-
2016
- 2016-05-31 CN CN201610380418.9A patent/CN105934069B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201967249U (en) * | 2010-12-31 | 2011-09-07 | 深圳市同创鑫电子有限公司 | Large-current PCB (printed circuit board) |
| CN202317770U (en) * | 2011-11-23 | 2012-07-11 | 天津普林电路股份有限公司 | Milled plate clamp special for single assembly plate or multiple assembly plates of high-density interconnection circuit board |
| CN104918423A (en) * | 2015-06-19 | 2015-09-16 | 深圳崇达多层线路板有限公司 | Manufacturing method for circuit board capable of detecting inner-layer pore ring |
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| Publication number | Publication date |
|---|---|
| CN105934069A (en) | 2016-09-07 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190405 |
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| CF01 | Termination of patent right due to non-payment of annual fee |