CN105860898A - 一种无铅导电胶及其制备工艺 - Google Patents
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Abstract
本发明公开了一种无铅导电胶,其包括以下质量份数的原料:基础胶体30~50份、导电填料50~80份、无机填料5~10份、偶联剂2~8份、表面活性剂3~10份、增韧剂5~12份、阻燃剂1~3份、抗氧剂1~2份、溶剂6~12份及增塑剂3~8份,本发明同时公开了一种无铅导电胶的制备工艺。本发明所得导电胶不含铅及其他有毒金属,具有优良的电性能、机械强度和抗冲击能力;与传统的Pb/Sn金属合金焊料相比,无需焊前、焊后清洗,无残余杂质,环境友好;与现有的金属导电填料的导电胶相比,本发明加工条件温和,制备工艺简单,能耗低,易于实施推广并实现生产,实用性强。
Description
技术领域
本发明涉及导电胶及其制备领域,具体涉及一种无铅导电胶及其制备工艺。
背景技术
大量使用的Pb/Sn金属合金焊料强度高、熔点低、加工塑性好、成本低,广泛应用于汽车、数码产品、家电等领域。但是,采用Pb/Sn金属合金焊料存在有潜在的重金属污染问题,随着人们环保意识的提高及环保法律的制约,具有绿色、环保、无铅化的导电胶材料逐渐得到人们的认可。导电胶是一种固化或干燥后具有一定导电性能的胶黏剂。伴随着电子元器件的小型化、微型化以及印刷电路板的高度集成化和高密度化的迅速发展,导电胶以其可以制成浆料并可在适宜的固化温度进行粘接的特性,以实现很高的线分辨率,因此获得了快速发展。同时导电胶实施工艺简单、易于操作,可提高生产效率,所以导电胶是替代铅锡焊接,实现导电连接的理想选择。
现有的导电胶多为金、银、镍、铜等重金属导电填料和环氧树脂类聚合物粘料以及其他助剂组成,所用重金属填料一方面制造成本高、能耗高,另一方面具有污染环境的缺点;而环氧树脂粘料吸湿性较强,使用后易影响导电胶的电性能。
发明内容
针对现有技术不足,本发明提供了一种无铅、无重金属的电性能优良的导电胶材料及其制备工艺。
本发明解决上述技术问题采用的技术方案为:一种无铅导电胶,包括以下质量份数的原料:基础胶体30~50份、导电填料50~80份、无机填料5~10份、偶联剂2~8份、表面活性剂3~10份、增韧剂5~12份、阻燃剂1~3份、抗氧剂1~2份、溶剂6~12份及增塑剂3~8份;
所述的基础胶体为脂环族环氧树脂和聚异丁烯橡胶,其质量比为1~3:1;
所述的导电填料为乙炔黑和超导电炭黑,其质量比为1:1~2;
所述的无机填料为纳米羟基磷灰石粉和纳米二氧化硅,其质量比为1~4:1。
进一步地,所述偶联剂为苯基三甲氧基硅烷和硅烷偶联剂KH-602,其质量比为1:3~6。
进一步地,所述表面活性剂为单硬脂酸甘油酯、蔗糖醇、司盘、吐温中的一种。
进一步地,所述增韧剂为聚乙烯醇缩醛或丁腈橡胶。
进一步地,所述阻燃剂为三(2,3-二溴丙基)异三聚氰酸酯、四溴苯酐、氯化石蜡、硼酸锌、氢氧化铝辛酸亚锡、聚磷酸铵中的一种或几种。
进一步地,所述抗氧剂为水杨醛。
进一步地,所述增塑剂为环氧脂肪酸丁酯、石油磺酸苯酯、环氧脂肪酸辛酯、环氧四氢邻苯二甲酸二辛酯中的一种或几种。
进一步地,所述溶剂为乙醇、苯乙烯、己烷、三氯乙烯、三乙醇胺、油酸酰胺中的一种。
所述的一种无铅导电胶的制备工艺,包括以下步骤:按照所述的质量份数备取原料;浆备取好的原料置于搅拌釜中,进行加热搅拌,控制温度95℃搅拌4h,然后除泡、灌装制得导电胶。
与现有技术相比,本发明具备的优点:本发明采用脂环族环氧树脂和聚异丁烯橡胶作为基础胶体,所述脂环族环氧树脂具备较好的粘附性、耐热性、浸润性以及耐电弧性,但其具有一定的吸湿能力而且难以修复,而聚异丁烯橡胶虽然不易吸湿,但其粘附性不如脂环族环氧树脂,因此将脂环族环氧树脂与聚异丁烯橡胶复配,作为高性能导电胶的基础胶体,配合导电填料获得良好的电性能,同时无机填料的添加有助于增强导电胶的粘附性能,降低导电胶的体积电阻;本发明所得导电胶不含铅及其他有毒金属,具有优良的电性能、机械强度和抗冲击能力;与传统的Pb/Sn金属合金焊料相比,无需焊前、焊后清洗,无残余杂质,环境友好;与现有的金属导电填料的导电胶相比,本发明加工条件温和,制备工艺简单,能耗低,易于实施推广并实现生产,实用性强。
具体实施方式
下面结合具体实施例对本发明做进一步的说明。
实施例1:一种无铅导电胶,包括以下质量份数的原料:基础胶体40份、导电填料65份、无机填料8份、偶联剂5份、表面活性剂6份、增韧剂8份、阻燃剂2份、抗氧剂1份、溶剂9份及增塑剂5份;
所述的基础胶体为脂环族环氧树脂和聚异丁烯橡胶,其质量比为2:1;所述的导电填料为乙炔黑和超导电炭黑,其质量比为2:3;所述的无机填料为纳米羟基磷灰石粉和纳米二氧化硅,其质量比为2:1。
进一步地,所述偶联剂为苯基三甲氧基硅烷和硅烷偶联剂KH-602,其质量比为1:5;所述表面活性剂为单硬脂酸甘油酯;所述增韧剂为聚乙烯醇缩醛;所述阻燃剂为三(2,3-二溴丙基)异三聚氰酸酯和氯化石蜡的复合物;所述抗氧剂为水杨醛;所述增塑剂为环氧脂肪酸丁酯和石油磺酸苯酯的复合物;所述溶剂为乙醇。
所述的一种无铅导电胶的制备工艺,包括以下步骤:按照所述的质量份数备取原料;浆备取好的原料置于搅拌釜中,进行加热搅拌,控制温度95℃搅拌4h,然后除泡、灌装制得导电胶,经标准四探针测试,所得导电胶的为1.3×10-3Ω·cm。
实施例2:一种无铅导电胶,包括以下质量份数的原料:基础胶体30份、导电填料50份、无机填料5份、偶联剂2份、表面活性剂3份、增韧剂5份、阻燃剂1份、抗氧剂1份、溶剂6份及增塑剂3份;
所述的基础胶体为脂环族环氧树脂和聚异丁烯橡胶,其质量比为1:1;所述的导电填料为乙炔黑和超导电炭黑,其质量比为1:2;所述的无机填料为纳米羟基磷灰石粉和纳米二氧化硅,其质量比为1:1。
进一步地,所述偶联剂为苯基三甲氧基硅烷和硅烷偶联剂KH-602,其质量比为1:6;所述表面活性剂为蔗糖醇;所述增韧剂为丁腈橡胶;所述阻燃剂为四溴苯酐;所述抗氧剂为水杨醛;所述增塑剂为环氧脂肪酸辛酯和环氧四氢邻苯二甲酸二辛酯的复合物;所述溶剂为苯乙烯。
所述的一种无铅导电胶的制备工艺,其具体步骤同实施例1,经标准四探针测试,所得导电胶的为4.4×10-3Ω·cm。
实施例3:一种无铅导电胶,包括以下质量份数的原料:基础胶体50份、导电填料80份、无机填料10份、偶联剂8份、表面活性剂10份、增韧剂12份、阻燃剂3份、抗氧剂2份、溶剂12份及增塑剂8份;
所述的基础胶体为脂环族环氧树脂和聚异丁烯橡胶,其质量比为3:1;所述的导电填料为乙炔黑和超导电炭黑,其质量比为1:1;所述的无机填料为纳米羟基磷灰石粉和纳米二氧化硅,其质量比为4:1。
进一步地,所述偶联剂为苯基三甲氧基硅烷和硅烷偶联剂KH-602,其质量比为1:3;所述表面活性剂为司盘;所述增韧剂为丁腈橡胶;所述阻燃剂为三(2,3-二溴丙基)异三聚氰酸酯、四溴苯酐、氯化石蜡、硼酸锌、氢氧化铝辛酸亚锡和聚磷酸铵的复合物;所述抗氧剂为水杨醛;所述增塑剂为环氧脂肪酸丁酯、石油磺酸苯酯、环氧脂肪酸辛酯和环氧四氢邻苯二甲酸二辛酯的复合物;所述溶剂为己烷。
所述的一种无铅导电胶的制备工艺,其具体步骤同实施例1,经标准四探针测试,所得导电胶的为3.0×10-3Ω·cm。
实施例4:一种无铅导电胶,包括以下质量份数的原料:基础胶体30份、导电填料80份、无机填料5份、偶联剂8份、表面活性剂3份、增韧剂12份、阻燃剂1份、抗氧剂2份、溶剂6份及增塑剂8份;
所述的基础胶体为脂环族环氧树脂和聚异丁烯橡胶,其质量比为2:1;所述的导电填料为乙炔黑和超导电炭黑,其质量比为2:3;所述的无机填料为纳米羟基磷灰石粉和纳米二氧化硅,其质量比为5:2。
进一步地,所述偶联剂为苯基三甲氧基硅烷和硅烷偶联剂KH-602,其质量比为1:5;所述表面活性剂为吐温20;所述增韧剂为聚乙烯醇缩醛;所述阻燃剂为硼酸锌;所述抗氧剂为水杨醛;所述增塑剂为环氧脂肪酸丁酯;所述溶剂为三氯乙烯。
所述的一种无铅导电胶的制备工艺,其具体步骤同实施例1,经标准四探针测试,所得导电胶的为1.2×10-3Ω·cm。
实施例5:一种无铅导电胶,包括以下质量份数的原料:基础胶体45份、导电填料60份、无机填料6份、偶联剂6份、表面活性剂5份、增韧剂10份、阻燃剂2份、抗氧剂1份、溶剂10份及增塑剂5份;
所述的基础胶体为脂环族环氧树脂和聚异丁烯橡胶,其质量比为5:2;所述的导电填料为乙炔黑和超导电炭黑,其质量比为2:3;所述的无机填料为纳米羟基磷灰石粉和纳米二氧化硅,其质量比为3:1。
进一步地,所述偶联剂为苯基三甲氧基硅烷和硅烷偶联剂KH-602,其质量比为1:4;所述表面活性剂为单硬脂酸甘油酯;所述增韧剂为聚乙烯醇缩醛;所述阻燃剂为三(2,3-二溴丙基)异三聚氰酸酯、氢氧化铝辛酸亚锡和聚磷酸铵的复合物;所述抗氧剂为水杨醛;所述增塑剂为环氧四氢邻苯二甲酸二辛酯;所述溶剂为三乙醇胺。
所述的一种无铅导电胶的制备工艺,其具体步骤同实施例1,经标准四探针测试,所得导电胶的为3.5×10-3Ω·cm。
Claims (9)
1.一种无铅导电胶,其特征在于,包括以下质量份数的原料:基础胶体30~50份、导电填料50~80份、无机填料5~10份、偶联剂2~8份、表面活性剂3~10份、增韧剂5~12份、阻燃剂1~3份、抗氧剂1~2份、溶剂6~12份及增塑剂3~8份;
所述的基础胶体为脂环族环氧树脂和聚异丁烯橡胶,其质量比为1~3:1;
所述的导电填料为乙炔黑和超导电炭黑,其质量比为1:1~2;
所述的无机填料为纳米羟基磷灰石粉和纳米二氧化硅,其质量比为1~4:1。
2. 根据权利要求1所述的一种无铅导电胶,其特征在于:所述偶联剂为苯基三甲氧基硅烷和硅烷偶联剂KH-602,其质量比为1:3~6。
3. 根据权利要求1所述的一种无铅导电胶,其特征在于:所述表面活性剂为单硬脂酸甘油酯、蔗糖醇、司盘、吐温中的一种。
4. 根据权利要求1所述的一种无铅导电胶,其特征在于:所述增韧剂为聚乙烯醇缩醛或丁腈橡胶。
5. 根据权利要求1所述的一种无铅导电胶,其特征在于:所述阻燃剂为三(2,3-二溴丙基)异三聚氰酸酯、四溴苯酐、氯化石蜡、硼酸锌、氢氧化铝辛酸亚锡、聚磷酸铵中的一种或几种。
6. 根据权利要求1所述的一种无铅导电胶,其特征在于:所述抗氧剂为水杨醛。
7. 根据权利要求1所述的一种无铅导电胶,其特征在于:所述增塑剂为环氧脂肪酸丁酯、石油磺酸苯酯、环氧脂肪酸辛酯、环氧四氢邻苯二甲酸二辛酯中的一种或几种。
8. 根据权利要求1所述的一种无铅导电胶,其特征在于:所述溶剂为乙醇、苯乙烯、己烷、三氯乙烯、三乙醇胺、油酸酰胺中的一种。
9. 权利要求1-8任一所述的一种无铅导电胶的制备工艺,其特征在于,包括以下步骤:按照所述的质量份数备取原料;浆备取好的原料置于搅拌釜中,进行加热搅拌,控制温度95℃搅拌4h,然后除泡、灌装制得导电胶。
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