CN105848421A - 一种用于半加成法制备精细线路的差分蚀刻溶液 - Google Patents
一种用于半加成法制备精细线路的差分蚀刻溶液 Download PDFInfo
- Publication number
- CN105848421A CN105848421A CN201610260091.1A CN201610260091A CN105848421A CN 105848421 A CN105848421 A CN 105848421A CN 201610260091 A CN201610260091 A CN 201610260091A CN 105848421 A CN105848421 A CN 105848421A
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- Prior art keywords
- difference etching
- control
- etching solution
- difference
- additive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610260091.1A CN105848421A (zh) | 2016-04-18 | 2016-04-18 | 一种用于半加成法制备精细线路的差分蚀刻溶液 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610260091.1A CN105848421A (zh) | 2016-04-18 | 2016-04-18 | 一种用于半加成法制备精细线路的差分蚀刻溶液 |
Publications (1)
Publication Number | Publication Date |
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CN105848421A true CN105848421A (zh) | 2016-08-10 |
Family
ID=56589100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610260091.1A Pending CN105848421A (zh) | 2016-04-18 | 2016-04-18 | 一种用于半加成法制备精细线路的差分蚀刻溶液 |
Country Status (1)
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CN (1) | CN105848421A (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106488658A (zh) * | 2016-12-28 | 2017-03-08 | 华进半导体封装先导技术研发中心有限公司 | 高密度基板半加成工艺种子层快速蚀刻装置及蚀刻方法 |
CN111117626A (zh) * | 2019-12-28 | 2020-05-08 | 苏州天承化工有限公司 | 一种闪蚀药水及其制备方法和应用 |
CN113445052A (zh) * | 2021-07-28 | 2021-09-28 | 南通群安电子材料有限公司 | 适用于msap制程的差异性蚀刻药水 |
CN114686885A (zh) * | 2022-06-02 | 2022-07-01 | 深圳市板明科技股份有限公司 | 一种线路板用铜面超粗化溶液、制备方法及其应用 |
CN115087225A (zh) * | 2022-07-20 | 2022-09-20 | 深圳市板明科技股份有限公司 | 一种耐氯离子的印制线路板闪蚀添加剂和闪蚀方法 |
CN115354327A (zh) * | 2022-08-22 | 2022-11-18 | 上海天承化学有限公司 | 一种适用于sap制程的微蚀粗化液及其应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4767662A (en) * | 1986-09-15 | 1988-08-30 | Psi Star | Copper etching process and product |
CN103080382A (zh) * | 2010-08-16 | 2013-05-01 | 高级技术材料公司 | 用于铜或铜合金的蚀刻溶液 |
-
2016
- 2016-04-18 CN CN201610260091.1A patent/CN105848421A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4767662A (en) * | 1986-09-15 | 1988-08-30 | Psi Star | Copper etching process and product |
CN103080382A (zh) * | 2010-08-16 | 2013-05-01 | 高级技术材料公司 | 用于铜或铜合金的蚀刻溶液 |
Non-Patent Citations (1)
Title |
---|
陈苑明等: "电镀式半加成法制作精细线路的研究", 《电镀与精饰》 * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106488658A (zh) * | 2016-12-28 | 2017-03-08 | 华进半导体封装先导技术研发中心有限公司 | 高密度基板半加成工艺种子层快速蚀刻装置及蚀刻方法 |
CN106488658B (zh) * | 2016-12-28 | 2023-05-23 | 华进半导体封装先导技术研发中心有限公司 | 高密度基板半加成工艺种子层快速蚀刻方法 |
CN111117626A (zh) * | 2019-12-28 | 2020-05-08 | 苏州天承化工有限公司 | 一种闪蚀药水及其制备方法和应用 |
CN111117626B (zh) * | 2019-12-28 | 2021-06-22 | 苏州天承化工有限公司 | 一种闪蚀药水及其制备方法和应用 |
CN113445052A (zh) * | 2021-07-28 | 2021-09-28 | 南通群安电子材料有限公司 | 适用于msap制程的差异性蚀刻药水 |
CN114686885A (zh) * | 2022-06-02 | 2022-07-01 | 深圳市板明科技股份有限公司 | 一种线路板用铜面超粗化溶液、制备方法及其应用 |
CN115087225A (zh) * | 2022-07-20 | 2022-09-20 | 深圳市板明科技股份有限公司 | 一种耐氯离子的印制线路板闪蚀添加剂和闪蚀方法 |
CN115087225B (zh) * | 2022-07-20 | 2022-11-08 | 深圳市板明科技股份有限公司 | 一种耐氯离子的印制线路板闪蚀添加剂和闪蚀方法 |
CN115354327A (zh) * | 2022-08-22 | 2022-11-18 | 上海天承化学有限公司 | 一种适用于sap制程的微蚀粗化液及其应用 |
CN115354327B (zh) * | 2022-08-22 | 2024-01-02 | 上海天承化学有限公司 | 一种适用于sap制程的微蚀粗化液及其应用 |
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Effective date of registration: 20180507 Address after: 311305 Hangzhou, Hangzhou, Zhejiang, Ling'an, Qingshan Lake Science and Technology City, Hangzhou road 618, Hangzhou, Lok Fu new Mstar Technology Ltd Applicant after: Hangzhou Loeve Mstar Technology Ltd Address before: No. 39, canal road, Huqiu District, Suzhou, Jiangsu Applicant before: Wang Jing Applicant before: Zhang Bin Applicant before: Guo Yong |
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WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160810 |
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