CN105821376A - 一种铜锌锡硫靶材的制备方法 - Google Patents
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- WILFBXOGIULNAF-UHFFFAOYSA-N copper sulfanylidenetin zinc Chemical compound [Sn]=S.[Zn].[Cu] WILFBXOGIULNAF-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000010409 thin film Substances 0.000 claims abstract description 25
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 11
- 229910002475 Cu2ZnSnS4 Inorganic materials 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims description 27
- 238000000227 grinding Methods 0.000 claims description 15
- 238000005245 sintering Methods 0.000 claims description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 239000003708 ampul Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 239000010453 quartz Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 9
- 238000010792 warming Methods 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004570 mortar (masonry) Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 238000010532 solid phase synthesis reaction Methods 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000000462 isostatic pressing Methods 0.000 claims description 2
- 239000012071 phase Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 12
- 235000015895 biscuits Nutrition 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 229910052756 noble gas Inorganic materials 0.000 description 8
- 239000000126 substance Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000376 reactant Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 238000005987 sulfurization reaction Methods 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000053 physical method Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KYRUBSWVBPYWEF-UHFFFAOYSA-N copper;iron;sulfane;tin Chemical group S.S.S.S.[Fe].[Cu].[Cu].[Sn] KYRUBSWVBPYWEF-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Abstract
本发明制备一种铜锌锡硫薄膜太阳电池吸收层靶材,其特征在于,所述靶材中Cu:Zn:Sn:S的摩尔配比为2:1:1:4,其中,所述靶材为Cu2ZnSnS4相。本发明还提供所述靶材的制备方法,以及所述靶材在制备薄膜太阳电池吸收层中的应用,通过磁控溅射可直接制备得到Cu2ZnSnS4薄膜。本发明工艺简单、成本低、制成的靶材组分均匀、致密性好,为磁控溅射制备Cu2ZnSnS4薄膜太阳电池吸收层奠定基础。
Description
技术领域
本发明涉及一种薄膜太阳电池光电转换材料铜锌锡硫薄膜靶材的制备方法及应用,属光电功能材料领域。
背景技术
随着世界能源危机和全球气候变暖,世界对新能源的需求量逐渐增强。作为一种取之不尽、用之不绝的新型可再生能源,太阳能被称为最理想的新能源,而利用太阳能发电已成为全球新能源研究的热点。目前对太阳电池的研究已进入第三代薄膜太阳电池的研究,其研究主要集中在制备高效、廉价化合物半导体光吸收材料。目前薄膜太阳电池主要有硅薄膜电池、铜铟镓硒(CIGS)薄膜电池、碲化镉(CdTe)薄膜电池。其中CIGS太阳电池在薄膜电池中转换效率最高,小面积电池的转换效率已经超过22%,并且具有稳定性好、抗辐射能力强、对环境污染小等优点。但由于CIGS中In和Ga在地球上含量稀少,不足以支持大规模应用,限制了其今后的发展。
铜锌锡硫Cu2ZnSnS4(简称CZTS)为黝锡矿结构的四元化合物,其禁带宽度为1.51eV,与太阳电池所要求的最佳禁带宽度(1.5eV)十分接近。CZTS为直接带隙半导体材料,且具有较大的吸收系数(>104cm-1),因此电池中所需的CZTS薄膜厚度较小(约1μm);该材料中的各元素在地壳中蕴含量丰富,成分无毒且环境友好。以上诸多优点使其成为新一代太阳电池吸收层的最佳选择之一。据最新报道,美国IBM公司制备的CZTS薄膜太阳电池的转换效率已经达到12.6%,为全球最高水平,而这与理论计算的光电转换效率32.2%相比,CZTS薄膜太阳电池的转换效率还有很大的提升空间。CZTS薄膜太阳电池作为一种新型的薄膜太阳电池具有多层膜结构,其主要研究结构为:钠钙玻璃衬底(SLG)/背电极(Mo)/吸收层(CZTS)/缓冲层(CdS)/窗口层(ZnO)/正电极(Al)。其中CZTS吸收层是电池的核心部分,对电池的光电性能具有极其重要的作用。
各国研究人员先后对铜锌锡硫的制备工艺进行了深入而广泛的研究,发展了多种制备方法,主要分为化学方法和物理方法两大类。化学方法主要有热注人法和电沉积法,化学法的不足之处是制备成本高、产量低,同时对于制备条件的要求相对也较高。物理方法包括真空蒸镀法、磁控溅射CZT前驱体后硫化(或硒化)等,其中比较适合工业化生产的方法是磁控溅射法,该方法稳定性好、成膜质量均匀,有利于CZTS薄膜太阳电池大面积生产,但是后续硫化(或硒化)工艺用到有毒的硫化物(或硒化物),工艺参数控制复杂。基于此,利用磁控溅射铜锌锡硫四元化合物靶,一步得到CZTS薄膜,避免了化学法的缺点,也避免了后硫化工艺带来的污染及工艺复杂等难题,是目前最简单、最环保的方法。通过一步溅射成膜法的关键是制备铜锌锡硫靶材,目前有部分课题组开展了铜锌锡硫靶材的制备研究,他们多采用单质Cu、Zn、Sn作为反应物进行烧结,我们采用Cu2S、ZnS、SnS作为反应物。与单质反应物不同,采用三种二元化合物作为反应物可避免在高温烧结过程中靶材中金属元素的损失,有助于得到最佳原子比的CZTS靶材。
发明内容
本发明的目的在于克服现有技术之不足,提供一种铜锌锡硫薄膜太阳电池吸收层靶材的制作方法,所述靶材中Cu:Zn:Sn:S的摩尔配比为2:1:1:4,所述靶材只具有铜锌锡硫相。
本发明提供一种铜锌锡硫薄膜太阳电池吸收层靶材的制备方法,所述方法是将Cu2S粉(4N)、ZnS粉(4N)、SnS粉(4N)和S粉(4N)按摩尔比1:1:1:1.4混合好(在研钵中手工研磨60分钟,使之混合均匀)。然后按固相合成方法在一定温度下保持一段时间,得到CZTS粉体材料,经二次研磨、在氩气或氮气等保护气氛下高温加压烧结,得到靶材。
本发明中,所述固相合成法是将研磨后的Cu2S、ZnS、SnS和S混合粉末放入石英管中,抽真空密封,然后将密封的石英管在管式炉中以5℃/min的升温速率分别升温至400℃、450℃、500℃、550℃、600℃和650℃高温烧结,保温30小时后,等其断电自然冷却至室温,取出产物研磨得到CZTS粉体材料。
本发明中,所述加压成型是常压成型或是等静压成型。所述高温烧结是指常压烧结、热压烧结或等离子体放电烧结。
本发明的铜锌锡硫靶材,使用高纯度原料,配比如下:以Cu2S、ZnS、SnS和S粉末为原料,依据需要形成CZTS薄膜,该薄膜中的原子摩尔比为Cu:Zn:Sn:S=2:1:1:4。
按照CZTS薄膜的原子摩尔比进行原料配比,研磨均匀后的原料进行固相合成,得到CZTS粉体,二次研磨、加压成型后在保护气氛中进行高温烧结,获得CZTS靶材。
本发明的靶材制备的原料的混合配比可以根据实际需要进行调整。
本发明还提供一种所述靶材通过磁控溅射直接制备太阳电池吸收层薄膜的应用。使用本发明的靶材,可一步直接通过磁控溅射制备得到CZTS薄膜,即一步直接制备得到铜锌锡硫薄膜太阳电池吸收层薄膜。
本发明的最大优点是:直接制备的铜锌锡硫薄膜太阳电池吸收层靶材,满足磁控溅射的工艺要求,本发明的Cu2ZnSnS4靶材通过磁控溅射可直接制备CZTS薄膜吸收层,无需现有技术中后续的硫化或硒化退火工艺。本发明省去了传统的硫化或硒化工艺,既环保又节能,并且通过调整CZTS靶材的成分,可进一步实现CZTS薄膜成分的控制,从而提高铜锌锡硫薄膜太阳电池的转换效率。并且,本发明采用热压烧结制备的Cu2ZnSnS4靶材,具有较高的致密度,有利于后续过程的薄膜的制备。
附图说明:
图1为本发明制备的CZTS靶材XRD图谱,图谱表明CZTS靶材相为铜锌锡硫。
图2为采用本发明的CZTS靶材利用磁控溅射制备的CZTS薄膜的XRD图谱。
具体实施方式:
图谱表明利用本发明制得的CZTS靶材,可以沉积CZTS薄膜。下面通过具体实施范例对本发明作进一步说明。以下实施方式不是对本发明的限制,凡基于本发明做出的都应属于本发明的保护范围。
实施例1:
以Cu2S(4N)、ZnS(4N)、SnS(4N)和S(4N)粉末为原料,按摩尔比1:1:1:1.4称料,在研钵中手工研磨60分钟,使之混合均匀。将研磨均匀后的粉末放入石英管中,抽真空密封,然后将密封好的石英管放入管式炉中以5℃/min的升温速率升温至500℃,保温30小时后,等其断电自然冷却至室温,取出产物研磨得到CZTS粉体材料。将反应后的粉料研磨均匀备用。将经过高温合成的铜锌锡硫粉体置入钢模具中,进行轴向加压成型,制得素坯。最后,将压制成型的素坯放入烧结炉中,充入一个大气压的氩气或氮气等惰性气体,以4℃/分速率升温至750℃,并保温3小时,然后炉冷,待炉冷却到室温,关闭惰性气体,开炉取样,即得到所需靶材。
实施例2:
以Cu2S(4N)、ZnS(4N)、SnS(4N)和S(4N)粉末为原料,按摩尔比1:1:1:1.4进行称料,在研钵中手工研磨60分钟,使之混合均匀。将研磨均匀后的粉末放入石英管中,抽真空密封,然后将密封好的石英管放入管式炉中以5℃/min的升温速率升温至550℃,保温30小时后,等其断电自然冷却至室温,取出产物研磨得到CZTS粉体材料。将反应生成的铜锌锡硫粉体研磨均匀备用。将经过高温合成的铜锌锡硫粉体置入钢模具中,进行轴向加压成型,制得素坯。最后,将压制成型的素坯放入烧结炉中,充入一个大气压的氩气或氮气等惰性气体,以4℃/分速率升温至750℃,并保温3小时,然后炉冷,待炉冷却到室温,关闭惰性气体,开炉取样,即得到所需靶材。
实施例3:
以Cu2S(4N)、ZnS(4N)、SnS(4N)和S(4N)粉末为原料,按摩尔比1:1:1:1.4进行称料,在研钵中手工研磨60分钟,使之混合均匀。将研磨均匀后的粉末放入石英管中,抽真空密封,然后将密封好的石英管放入管式炉中以5℃/min的升温速率升温至600℃,保温30小时后,等其断电自然冷却至室温,取出产物研磨得到CZTS粉体材料。将反应后的铜锌锡硫粉体研磨均匀备用。将经过高温合成的铜锌锡硫粉体置入钢模具中,进行轴向加压成型,制得素坯。最后,将压制成型的素坯放入烧结炉中,充入一个大气压的氩气或氮气等惰性气体,以4℃/分速率升温至750℃,并保温3小时,然后炉冷,待炉冷却到室温,关闭惰性气体,开炉取样,即得到所需靶材。
实施例4:
以Cu2S(4N)、ZnS(4N)、SnS(4N)和S(4N)粉末为原料,按摩尔比1:1:1:1.4进行称料,在研钵中手工研磨60分钟,使之混合均匀。将研磨均匀后的粉末放入石英管中,抽真空密封,然后将密封好的石英管放入管式炉中以5℃/min的升温速率升温至650℃,保温30小时后,等其断电自然冷却至室温,取出产物研磨得到CZTS粉体材料。将反应生成的铜锌锡硫粉体研磨均匀备用。将经过高温合成的铜锌锡硫粉体置入钢模具中,进行轴向加压成型,制得素坯。最后,将压制成型的素坯放入烧结炉中,充入一个大气压的氩气或氮气等惰性气体,以4℃/分速率升温至750℃,并保温3小时,然后炉冷,待炉冷却到室温,关闭惰性气体,开炉取样,即得到所需靶材。
Claims (6)
1.一种铜锌锡硫靶材的制备方法,其特征在于,所述靶材中Cu:Zn:Sn:S的摩尔配比为2:1:1:4,其中,所述靶材为Cu2ZnSnS4相。
2.如权利要求1所述靶材的制备方法,其特征在于,以Cu2S(4N)、ZnS(4N)、SnS(4N)和S(4N)粉末为原料,按摩尔比1:1:1:1.4进行配比,在研钵中手工研磨60分钟,使之混合均匀;按固相合成方法得到铜锌锡硫粉体,将该粉体研磨均匀,加压成型,在氩气或氮气等保护气氛下高温加压烧结,得到所述靶材。
3.如权利要求2所述靶材的制备方法,其特征在于,所述固相合成方法是将研磨均匀后的Cu2S、ZnS、SnS和S粉末的原料混合物,放入石英管中,抽真空密封,然后将密封好的石英管放入管式炉中以5℃/min的升温速率分别升温至500℃、550℃、600℃、650℃,保温30小时后,等其断电自然冷却至室温,取出产物研磨得到CZTS粉体材料。
4.如权利要求2所述靶材的制备方法,其特征在于,所述加压成型是常压成型或是等静压成型。
5.如权利要求2所述靶材的制备方法,其特征在于,所述高温烧结是指常压烧结、热压烧结或等离子体放电烧结。
6.如权利要求1所述靶材在制备薄膜太阳电池吸收层中的应用,其特征在于,所述靶材通过磁控溅射,可一步直接制备得到Cu2ZnSnS4薄膜。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107385402A (zh) * | 2017-07-31 | 2017-11-24 | 华北理工大学 | 一种铜锌锡硫薄膜的制备方法 |
CN109704766A (zh) * | 2019-01-21 | 2019-05-03 | 江西科泰新材料有限公司 | 碲化锌掺碲化亚铜靶材的生产工艺 |
CN112210762A (zh) * | 2020-10-20 | 2021-01-12 | 北京圣阳科技发展有限公司 | 一种铜锌锡硒(CZTSe)或铜锌锡硫(CZTS)四元靶材的制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101805890A (zh) * | 2009-12-14 | 2010-08-18 | 中南大学 | 一种原位生长Cu2ZnSnS4光伏薄膜方法 |
CN101967624A (zh) * | 2009-12-14 | 2011-02-09 | 中南大学 | Cu2ZnSnS4光伏薄膜的制备方法 |
CN103225060A (zh) * | 2013-03-26 | 2013-07-31 | 无锡舒玛天科新能源技术有限公司 | 一种铜锌锡硫薄膜的制备方法 |
CN104404456A (zh) * | 2014-11-19 | 2015-03-11 | 北京四方继保自动化股份有限公司 | 一种铜锌锡硫四元靶材的制备方法 |
-
2015
- 2015-12-24 CN CN201510984086.0A patent/CN105821376A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101805890A (zh) * | 2009-12-14 | 2010-08-18 | 中南大学 | 一种原位生长Cu2ZnSnS4光伏薄膜方法 |
CN101967624A (zh) * | 2009-12-14 | 2011-02-09 | 中南大学 | Cu2ZnSnS4光伏薄膜的制备方法 |
CN103225060A (zh) * | 2013-03-26 | 2013-07-31 | 无锡舒玛天科新能源技术有限公司 | 一种铜锌锡硫薄膜的制备方法 |
CN104404456A (zh) * | 2014-11-19 | 2015-03-11 | 北京四方继保自动化股份有限公司 | 一种铜锌锡硫四元靶材的制备方法 |
Non-Patent Citations (1)
Title |
---|
杨海刚等: "无硫化过程磁控溅射制备Cu2 ZnSnS4薄膜及其结构和光学性质研究", 《真空科学与技术学报》 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107385402A (zh) * | 2017-07-31 | 2017-11-24 | 华北理工大学 | 一种铜锌锡硫薄膜的制备方法 |
CN109704766A (zh) * | 2019-01-21 | 2019-05-03 | 江西科泰新材料有限公司 | 碲化锌掺碲化亚铜靶材的生产工艺 |
CN112210762A (zh) * | 2020-10-20 | 2021-01-12 | 北京圣阳科技发展有限公司 | 一种铜锌锡硒(CZTSe)或铜锌锡硫(CZTS)四元靶材的制备方法 |
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