CN105814979B - 使用一氧化钛(tio)基材料的电磁干扰(emi)屏蔽产品 - Google Patents

使用一氧化钛(tio)基材料的电磁干扰(emi)屏蔽产品 Download PDF

Info

Publication number
CN105814979B
CN105814979B CN201480068141.5A CN201480068141A CN105814979B CN 105814979 B CN105814979 B CN 105814979B CN 201480068141 A CN201480068141 A CN 201480068141A CN 105814979 B CN105814979 B CN 105814979B
Authority
CN
China
Prior art keywords
composition
loss tangent
tio
item
matrix material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480068141.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN105814979A (zh
Inventor
D·格霍施
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN105814979A publication Critical patent/CN105814979A/zh
Application granted granted Critical
Publication of CN105814979B publication Critical patent/CN105814979B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2289—Oxides; Hydroxides of metals of cobalt

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201480068141.5A 2013-12-18 2014-12-11 使用一氧化钛(tio)基材料的电磁干扰(emi)屏蔽产品 Active CN105814979B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361917661P 2013-12-18 2013-12-18
US61/917,661 2013-12-18
US201461985124P 2014-04-28 2014-04-28
US61/985,124 2014-04-28
PCT/US2014/069787 WO2015094915A1 (en) 2013-12-18 2014-12-11 Electromagnetic interference (emi) shielding products using titanium monoxide (tio) based materials

Publications (2)

Publication Number Publication Date
CN105814979A CN105814979A (zh) 2016-07-27
CN105814979B true CN105814979B (zh) 2020-01-10

Family

ID=52347407

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480068141.5A Active CN105814979B (zh) 2013-12-18 2014-12-11 使用一氧化钛(tio)基材料的电磁干扰(emi)屏蔽产品

Country Status (5)

Country Link
US (1) US10932398B2 (enExample)
EP (1) EP3085215B1 (enExample)
JP (1) JP2017502513A (enExample)
CN (1) CN105814979B (enExample)
WO (1) WO2015094915A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3019179B1 (fr) * 2014-03-28 2017-11-24 Saint Gobain Ct Recherches Composites polymere-ceramique
CN107736085B (zh) 2015-06-09 2019-11-29 3M创新有限公司 高频电磁干扰（emi）复合材料
US9807866B2 (en) * 2015-11-30 2017-10-31 Intel Corporation Shielding mold for electric and magnetic EMI mitigation
WO2017116656A1 (en) 2015-12-29 2017-07-06 3M Innovative Properties Company Composites for high frequency electromagnetic interference (emi) applications
US9820418B1 (en) * 2016-03-24 2017-11-14 Jose Machado Electromagnetic contamination neutralization composition, device, and method
WO2019161282A1 (en) * 2018-02-17 2019-08-22 Laird Technologies, Inc. Thermal interface materials having high dielectric losses and low dielectric constants
EP3776728A1 (en) * 2018-04-06 2021-02-17 3M Innovative Properties Company Radar standing wave dampnening components and systems
US12022642B2 (en) 2018-08-21 2024-06-25 Laird Technologies, Inc. Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes
WO2020041320A1 (en) * 2018-08-21 2020-02-27 Laird Technologies, Inc. Patterned materials and films and systems and methods for making the same
US11512180B2 (en) * 2018-11-14 2022-11-29 Eden Innovations Ltd. Method for fabricating carbon nanoparticle polymer matrix composites using electromagnetic irradiation
CN110157346B (zh) * 2019-05-06 2021-05-07 费植煌 一种含石墨烯的装饰膜
TWI744800B (zh) * 2020-02-13 2021-11-01 國立高雄科技大學 船舶電纜電磁干擾屏蔽改善分析系統
CN113772957B (zh) * 2021-08-17 2023-03-21 浙江理工大学 一种用于磁控超疏水表面构筑的改性羰基铁粉制备及其在蓝光固化超疏水薄膜中的应用
US20240107730A1 (en) * 2022-09-22 2024-03-28 International Business Machines Corporation Flexible conductive electromagnetic compatibility shield
KR102594352B1 (ko) * 2022-10-13 2023-10-26 주식회사 유라 전자파 차폐성능이 개선된 자동차용 고속통신 케이블 및 이의 제조방법
US20250087595A1 (en) * 2023-09-08 2025-03-13 Rockwell Collins, Inc. Mechanical mitigation of neutron see

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090101873A1 (en) * 2007-10-18 2009-04-23 General Electric Company Electromagnetic interference shielding polymer composites and methods of manufacture
CN102318460A (zh) * 2008-12-17 2012-01-11 3M创新有限公司 电磁屏蔽制品
CN103250478A (zh) * 2010-12-28 2013-08-14 美国圣戈班性能塑料公司 用于emi屏蔽的具有金属填充剂的聚合物

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671275A (en) 1969-12-12 1972-06-20 Hughes Aircraft Co Lossy dielectric structure for dissipating electrical microwave energy
US4568603A (en) 1984-05-11 1986-02-04 Oldham Susan L Fiber-reinforced syntactic foam composites prepared from polyglycidyl aromatic amine and polycarboxylic acid anhydride
US5019681A (en) * 1990-02-14 1991-05-28 The Pillsbury Company Reflective temperature compensating microwave susceptors
JPH04130682A (ja) * 1990-09-20 1992-05-01 Mitsubishi Kasei Corp アクチュエータ用圧電セラミック組成物
CA2060709C (en) * 1991-02-08 1996-06-04 Kiyotaka Komori Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material
US5691498A (en) 1992-02-07 1997-11-25 Trw Inc. Hermetically-sealed electrically-absorptive low-pass radio frequency filters and electromagnetically lossy ceramic materials for said filters
US20010051286A1 (en) * 1996-02-07 2001-12-13 Shigeto Oiri Magnetic recording medium having a magnetic layer and a coating thereunder
US6753277B2 (en) * 2000-02-29 2004-06-22 Kyocera Corporation Ceramics having excellent high-frequency characteristics and method of producing the same
JP2001330985A (ja) * 2000-05-22 2001-11-30 Fuji Xerox Co Ltd トリクル現像方式用現像剤及び画像形成方法
JP4115682B2 (ja) * 2000-05-25 2008-07-09 日本碍子株式会社 金属間化合物基複合材料の製造方法
JP3639773B2 (ja) * 2000-06-19 2005-04-20 キヤノン株式会社 半導電性ゴム組成物、帯電部材、電子写真装置、プロセスカートリッジ
WO2004067631A1 (ja) * 2002-12-27 2004-08-12 Tdk Corporation 樹脂組成物、樹脂硬化物、シート状樹脂硬化物、積層体、プリプレグ、電子部品及び多層基板
US7149466B2 (en) * 2004-02-12 2006-12-12 Sumitomo Rubber Industries, Ltd. Conductive rubber member
CN1926933B (zh) * 2004-03-01 2010-12-08 新田株式会社 电磁波吸收体
CN101390253B (zh) * 2004-10-01 2013-02-27 L.皮尔·德罗什蒙 陶瓷天线模块及其制造方法
EP1829933B1 (en) * 2004-12-17 2015-07-22 ASAHI FR R&D Co., Ltd. Method of controlling specific inductive capacity, dielectric material, mobile phone and human phantom model
CA2628003C (en) * 2005-11-02 2011-10-11 Ricoh Company, Ltd. Electrostatic image developing toner, toner kit and image forming apparatus
US20090010187A1 (en) * 2007-07-06 2009-01-08 Somesh Agarwal System and Method for an Adaptive Access Point Mode
EP2172811B1 (en) * 2007-07-19 2017-01-18 Canon Kabushiki Kaisha Non-magnetic toner
TWI405801B (zh) 2007-10-19 2013-08-21 Nat Univ Tsing Hua 具有電磁波干擾遮蔽效應之多壁碳奈米管／高分子奈米複合材之製備方法
WO2010027074A1 (ja) * 2008-09-05 2010-03-11 住友電気工業株式会社 セラミックス粉末、該セラミックス粉末を含有する誘電性複合材料、及び誘電体アンテナ
JP4681039B2 (ja) * 2008-12-04 2011-05-11 住友ゴム工業株式会社 導電性ロール
JP2011018873A (ja) 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc 電磁シールド方法および電磁シールド用フィルム
US20110014356A1 (en) 2009-06-12 2011-01-20 Lord Corporation Method for protecting a substrate from lightning strikes
EP2505618A1 (en) 2011-04-01 2012-10-03 Fábrica Nacional De Moneda Y Timbre Use of electromagnetic wave absorbing markers for the aunthentication of security documents
US8772188B2 (en) * 2012-03-12 2014-07-08 Schott Ag Glass-ceramic having at least two crystal phases, process for producing a glass-ceramic and its use
JP5701807B2 (ja) * 2012-03-29 2015-04-15 株式会社東芝 圧力センサ及びマイクロフォン
US9916998B2 (en) * 2012-12-04 2018-03-13 Applied Materials, Inc. Substrate support assembly having a plasma resistant protective layer
US9685356B2 (en) * 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
KR20150096719A (ko) 2012-12-20 2015-08-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 플로팅 커넥터 쉴드
US9704613B2 (en) 2013-02-21 2017-07-11 3M Innovative Properties Company Polymer composites with electromagnetic interference mitigation properties
JP5822146B2 (ja) * 2013-03-29 2015-11-24 パウダーテック株式会社 ノイズ抑制用複合磁性粉
JP6320206B2 (ja) * 2014-07-07 2018-05-09 キヤノン株式会社 印刷システム、画像処理装置、情報処理方法及びプログラム
WO2016149465A1 (en) * 2015-03-19 2016-09-22 Rogers Corporation Magneto-dielectric substrate, circuit material, and assembly having the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090101873A1 (en) * 2007-10-18 2009-04-23 General Electric Company Electromagnetic interference shielding polymer composites and methods of manufacture
CN102318460A (zh) * 2008-12-17 2012-01-11 3M创新有限公司 电磁屏蔽制品
CN103250478A (zh) * 2010-12-28 2013-08-14 美国圣戈班性能塑料公司 用于emi屏蔽的具有金属填充剂的聚合物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ELECTRICAL AND MAGNETIC PROPERTIES OF TiO AND VO;M.BANUS ET AL;《PHYSICAL REVIEW B》;19720415;2775-2784 *

Also Published As

Publication number Publication date
EP3085215B1 (en) 2019-09-04
JP2017502513A (ja) 2017-01-19
EP3085215A1 (en) 2016-10-26
WO2015094915A1 (en) 2015-06-25
US10932398B2 (en) 2021-02-23
CN105814979A (zh) 2016-07-27
US20160309628A1 (en) 2016-10-20

Similar Documents

Publication Publication Date Title
CN105814979B (zh) 使用一氧化钛(tio)基材料的电磁干扰(emi)屏蔽产品
Qin et al. Lightweight Ni foam‐based ultra‐broadband electromagnetic wave absorber
Xiang et al. Facile synthesis and enhanced microwave absorption properties of multiferroic Ni0. 4Co0. 2Zn0. 4Fe2O4/BaTiO3 composite fibers
Sambyal et al. Synergistic effect of polypyrrole/BST/RGO/Fe3O4 composite for enhanced microwave absorption and EMI shielding in X-Band
Anand et al. Electromagnetic interference shielding properties of BaCo2Fe16O27 nanoplatelets and RGO reinforced PVDF polymer composite flexible films
Dar et al. High magneto-crystalline anisotropic core–shell structured Mn0. 5Zn0. 5Fe2O4/polyaniline nanocomposites prepared by in situ emulsion polymerization
Yang et al. Controlled synthesis of core–shell iron–silica nanoparticles and their magneto-dielectricproperties in polymer composites
Reshi et al. Nanostructured La 0.7 Sr 0.3 MnO 3 compounds for effective electromagnetic interference shielding in the X-band frequency range
CN101208165B (zh) 磁性合成物及其制造和使用方法
Lakshmi et al. Enhanced microwave absorption properties of PMMA modified MnFe 2 O 4–polyaniline nanocomposites
Li et al. Synthesis and significantly enhanced microwave absorption properties of cobalt ferrite hollow microspheres with protrusions/polythiophene composites
KR20190015239A (ko) 페라이트 입자, 수지 조성물 및 전자파 쉴드 재료
KR101385823B1 (ko) 전자파 간섭 억제 시트, 고주파 신호용 플랫 케이블, 연성 인쇄 기판 및 전자파 간섭 억제 시트의 제조 방법
CN105950112B (zh) 一种纳米复合吸波材料及其制备方法
US11369050B2 (en) High frequency electromagnetic interference (EMI) composites
JP2006032929A5 (enExample)
JP2006032929A (ja) 電磁干渉抑制体、これを用いる電磁障害抑制方法、およびｒｆ‐ｉｄデバイス
KR100463593B1 (ko) 전자파 흡수체 및 그 제조방법
Bera et al. Electromagnetic interference shielding properties of PMMA modified-Co0. 5Zn0. 5Fe2O4− polyaniline composites
Reddy et al. A comprehensive review on the characterization of nanomaterials for the suppression of electromagnetic interference across diverse frequency bands
CN111712464A (zh) Mn铁氧体粉末、树脂组合物、电磁波屏蔽材料、电子材料及电子部件
JP4824621B2 (ja) 電波吸収体用組成物、電波吸収体及び電波吸収体の製造方法
Arabi et al. Microwave absorption property of GO–Fe/FeO–NiO HNFs: GO decorated Fe/FeO–NiO hexagonal flakes with a 2D/0D/2D structure
JP2008311255A (ja) 複合磁性体とその製造方法
KR102082810B1 (ko) 고성능 복합 전자파 차폐시트 및 이의 제조방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant